US20010013647A1 - Flexible substrate based ball grid array (BGA) package - Google Patents
Flexible substrate based ball grid array (BGA) package Download PDFInfo
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- US20010013647A1 US20010013647A1 US09/839,212 US83921201A US2001013647A1 US 20010013647 A1 US20010013647 A1 US 20010013647A1 US 83921201 A US83921201 A US 83921201A US 2001013647 A1 US2001013647 A1 US 2001013647A1
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- flexible film
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
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- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
Definitions
- This invention generally relates to flexible substrate based ball grid array (BGA) packages, and more particularly to flexible film substrates for use in forming flexible substrate based BGA packages and manufacturing methods thereof.
- BGA ball grid array
- FIG. 1 depicts a conventional flexible substrate based BGA package 100 typically utilizing a flexible film substrate 110 (see FIG. 2) for carrying a semiconductor chip 120 .
- the flexible film substrate 110 is provided with a plurality of chip connection pads 110 a arranged about the periphery of the semiconductor chip 120 .
- the semiconductor chip 120 is securely attached onto the flexible film substrate 110 through a nonconductive adhesive (e.g., epoxy resin) 122 and electrically connected to the chip connection pads 110 a through a plurality of bonding wires 130 .
- the chip connection pads 110 a are electrically connected to a plurality of solder pads 110 b through conductive traces 110 d .
- the flexible film substrate 110 has a plurality of through-hole 110 c disposed corresponding to solder pads 110 b . Each solder pad 110 b has a portion exposed within the corresponding through-hole 110 c for mounting a solder ball 140 .
- the upper surface of the flexible film substrate 110 , the semiconductor chip 120 and the bonding wires 130 are encapsulated in a package body 150 .
- the package body 150 is formed from insulating material such as epoxy.
- the flexible substrate based BGA package 100 is mounted to a substrate (not shown), such as a printed circuit board, through the solder balls 140 .
- the surfaces of the chip connection pads 110 a and solder pads 110 b are plated with a layer of metal (not shown) such as gold which bonds well with conventional bonding wire material.
- a layer of metal such as gold which bonds well with conventional bonding wire material.
- gold does not bond well with the nonconductive adhesive 122 , so the central part of the chip attaching area is not provided with solder pads in order to enhance the adhesion between the flexible film substrate 110 and the nonconductive adhesive 122 , whereby the semiconductor chip 120 is more securely attached onto the flexible film substrate 110 .
- solder pads 110 b are not evenly distributed on the chip attaching area 160 of the flexible film substrate 110 , the central part thereof is prone to be deformed by the stress due to CTE (coefficient of thermal expansion) mismatch between the central part and other part of the chip attaching area 160 . This may create problems of delamination between the chip and the substrate or die cracking.
- It is a primary object of the present invention to provide a flexible substrate based BGA package comprising a flexible film substrate having a die attaching area for carrying a semiconductor chip, wherein the flexible film substrate is provided with at least a dummy pad disposed centrally on the chip attaching area, thereby reducing problems of delamination between the chip and the substrate or die cracking.
- It is another object of the present invention to provide a flexible substrate based BGA package comprising a semiconductor chip securely attached onto a die attaching area of a flexible film substrate through a nonconductive adhesive, wherein the flexible film substrate is provided with at least a dummy pad disposed centrally on the chip attaching area, and the dummy pad has a cupric oxide coating formed thereon for enhancing its adhesion with the nonconductive adhesive.
- a flexible substrate based BGA package in accordance with a preferred embodiment of the present invention generally comprises a semiconductor chip securely attached onto a flexible film substrate through a nonconductive adhesive.
- the flexible film substrate includes a flexible film having a chip attaching area for carrying the semiconductor chip.
- the upper surface of the flexible film is provided with a plurality of chip connection pads, a plurality of solder pads, and at least a dummy pad which is disposed centrally on the chip attaching area.
- the surface of the dummy pad has a cupric oxide coating for enhancing its adhesion with the nonconductive adhesive.
- the chip connection pads are arranged about the periphery of the chip attaching area.
- the solder pads are disposed about the dummy pad(s) and electrically connected to the corresponding chip connection pads.
- the flexible film has a plurality of through-holes formed corresponding to the solder pads such that each solder pad has a portion exposed within the corresponding through-hole for mounting a solder ball.
- a package body is formed over the semiconductor chip and the upper surface of the flexible film substrate.
- the flexible substrate based BGA package of the present invention since at least a dummy pad is disposed centrally on the chip attaching area of the flexible film substrate, the central part of the chip attaching area of the substrate has a better rigidity and strength to resist external forces thereby reducing the problems of die cracking or delamination.
- the cupric oxide coating on the surface of the dummy pad has a contour of roughness, so the bonding mechanism of the interface between the cupric oxide coating and the nonconductive adhesive includes chemical bonding as well as mechanical interlock thereby greatly enhancing the adhesion between the dummy pad and the nonconductive adhesive thereby reducing the occurrence of delamination.
- the present invention further provides a method for producing a flexible film substrate comprising the steps of: (A) providing a flexible film having opposing upper and lower surfaces, the upper surface of the flexible film has a chip attaching area adapted for carrying a semiconductor chip; (B) forming a plurality of through-holes in the flexible film; (C) laminating a metal layer on the upper surface of the flexible film; and (D) etching the metal layer to form a plurality of solder pads, chip connection pads, conductive traces, and at least a dummy pad, wherein the solder pads are disposed corresponding to the through-holes and electrically connected to the chip connection pads through the conductive traces, and the dummy pad is disposed centrally on the chip attaching area.
- FIG. 1 is a cross sectional view of a conventional flexible substrate based BGA package
- FIG. 2 is a top plan view of a flexible film substrate employed in the flexible substrate based BGA package of FIG. 1;
- FIG. 3 is a cross sectional view of a flexible substrate based BGA package according to a preferred embodiment of the present invention.
- FIGS. 4 - 6 are cross sectional views for illustrating a method for producing a flexible film substrate in accordance with the present invention.
- FIG. 7 is a top plan view of a flexible film substrate according to a first embodiment of the present invention.
- FIG. 8 is a top plan view of a flexible film substrate according to a second embodiment of the present invention.
- FIG. 9 is a top plan view of a flexible film substrate according to a third embodiment of the present invention.
- FIG. 3 illustrates a flexible substrate based BGA package 200 according to a preferred embodiment of the present invention mainly comprising a semiconductor chip 210 securely attached onto the upper surface of a flexible film substrate 220 by a nonconductive adhesive (e.g. epoxy resin) 212 .
- a nonconductive adhesive e.g. epoxy resin
- the flexible film substrate 220 is mainly formed from a flexible film 220 a having a chip attaching area 220 b adapted for carrying the semiconductor chip 210 .
- the upper surface of flexible film 220 a is provided with a plurality of chip connection pads 220 c electrically connected to the corresponding solder pads 220 d through conductive traces 220 e formed on the upper surface of the flexible film 220 a .
- the chip connection pads 220 c are arranged about the periphery of the chip attaching area 220 b and electrically connected to the semiconductor chip 210 through a plurality of bonding wires 230 .
- the flexible film 220 a has a plurality of through-holes formed corresponding to the solder pads 220 d such that each solder pad 220 d has at least a portion exposed within the corresponding through-hole for mounting a solder ball 222 .
- a package body 240 is formed over the semiconductor chip 210 and the upper surface of the flexible film substrate 220 .
- the solder balls 222 are provided on the lower surface of the flexible film substrate 220 for making external electrical connection.
- the present invention is characterized in that the flexible film substrate 220 is provided with at least a dummy pad disposed centrally on the chip attaching area 220 b .
- the dummy pads 220 f are formed as a discontinuous pattern and evenly distributed on the central part of the chip attaching area (see FIGS. 6 - 9 ), whereby optimum reinforcing effect can be achieved without interfering the flow of the nonconductive adhesive 212 .
- the dummy pad 220 f in accordance with the present invention may be bar-like, oval-shaped or circular as shown in FIGS. 7 - 9 . It will be appreciated that the number and shapes of the dummy pads are not limited to the embodiments of FIGS. 6 - 9 as long as the flow of the nonconductive adhesive 212 is not interfered and the central part of the chip attaching area of the substrate is reinforced.
- FIGS. 4 - 6 show a method for producing a flexible film substrate in accordance with the present invention.
- a plurality of through-holes are formed in the flexible film 220 a by conventional techniques such as punching or laser drilling.
- the through-holes are formed at locations corresponding to the solder pads 220 d disposed at the bottom section of the package 200 (see FIG. 3).
- the flexible film 220 a is made of polyimide such that the flexible film is given properties that allow it to pass reliability tests.
- a metal layer such as a copper foil 221 is laminated on the flexible film 220 a by conventional methods such as thermocompression.
- the chip connection pads 220 c , the solder pads 220 d , conductive traces 220 e (not shown in FIG. 6), and the dummy pads 220 f are formed by photolithography and etching which comprise the steps of: (A) applying a photoresist layer on the surface of the metal layer; (B) pattern (referring to FIG. 7) transferring by photolithography; (C) removing the unprotected portions of the metal layer to form the corresponding chip connection pads 220 c , solder pads 220 d , conductive traces 220 e , and dummy pads 220 f by etching; and (D) removing the remaining photoresist layer.
- the chip connection pads 220 c , the solder pads 220 d , and conductive traces 220 e are provided with a metal coating formed on the surfaces thereof which are not covered by the flexible film 220 a .
- the metal coating may be plated by conventional techniques.
- a layer of nickel is plated thereon and then a layer of gold is plated on the nickel layer. Since the metal coating is also formed on the connection pads adapted for electrical connecting to the chip, the metal coating should be formed of materials that allow a good bond to the conventional bonding wire material.
- the dummy pads 220 f are provided with a cupric oxide coating formed on the surface thereof.
- the cupric oxide coating 220 a is preferably formed by the method of anodic oxidation: (A) Areas on the flexible film substrate at which it is undesired to form a cupric oxide coating are protected by tapes, e.g., the chip connection pads 220 c , the solder pads 220 d , and conductive traces 220 e ; (B) The flexible film substrate with protective tapes is electrolyzed as the anode in an alkaline solution such as sodium hydroxide electrolytic solution, thereby forming a cupric oxide coating on the surface of the flexible film substrate without protection of tapes.
- an alkaline solution such as sodium hydroxide electrolytic solution
- the principal crystal structure of the cupric oxide coating layer is composed of acicular crystals which are black in color and densely packed; hence, the cupric oxide coating has a rough appearance with a color of black.
- the cupric oxide coating on the dummy pads according to the present invention can be formed by the method of chemical oxidation: the step (A) is identical to the method described above; (B′) The flexible film substrate with protective tapes is immersed in a chemical oxidation solution (such as water solution of 3% sodium chloride, 1% sodium hydroxide and 1% sodium phosphate by weight) and heated at 85° C.
- a chemical oxidation solution such as water solution of 3% sodium chloride, 1% sodium hydroxide and 1% sodium phosphate by weight
- the central part of the chip attaching area of the substrate since at least a dummy pad is disposed centrally on the chip attaching area of the flexible film substrate, the central part of the chip attaching area of the substrate has a better rigidity and strength to resist external forces. Further, since the dummy pads of the present invention are evenly distributed on the central part of the chip attaching area, the central part of the chip attaching area has a CTE substantially equal to other part thereof thereby reducing the stress due to CTE mismatch therebetween. Thus, the flexible film substrate in accordance with the present invention greatly reduces the problems of die cracking or delamination.
- the cupric oxide coating on the surface of the dummy pads is composed of acicular crystals which are black in color and densely packed
- the gaps among the acicular crystals will be filled by the nonconductive adhesive (e.g., epoxy resin) employed in the die attaching process.
- the nonconductive adhesive will provide mechanical interlock mechanism to enhance the adhesion between the cupric oxide coating and the nonconductive adhesive, thereby reducing the occurrence of delamination between the flexible film substrate and the nonconductive adhesive.
Abstract
A flexible substrate based BGA package mainly comprises a semiconductor chip securely attached onto a flexible film substrate through a nonconductive adhesive. The flexible film substrate is formed from a flexible film having a chip attaching area for carrying the semiconductor chip. The upper surface of the flexible film is provided with a plurality of chip connection pads, a plurality of solder pads, and at least a dummy pad which is disposed centrally on the chip attaching area. The purpose of the dummy pad is to increase the rigidity and strength of the central part of the chip attaching area. The chip connection pads are arranged about the periphery of the chip attaching area for electrically connected to the semiconductor chip. The solder pads are disposed about the dummy pad(s) and electrically connected to the corresponding chip connection pads. The flexible film has a plurality of through-holes formed corresponding to the solder pads such that each solder pad has a portion exposed within the corresponding through-hole for mounting a solder ball. A package body is formed over the semiconductor chip and the upper surface of the flexible film substrate.
Description
- 1. Field of the Invention
- This invention generally relates to flexible substrate based ball grid array (BGA) packages, and more particularly to flexible film substrates for use in forming flexible substrate based BGA packages and manufacturing methods thereof.
- 2. Description of the Related Art
- FIG. 1 depicts a conventional flexible substrate based BGA
package 100 typically utilizing a flexible film substrate 110 (see FIG. 2) for carrying asemiconductor chip 120. Theflexible film substrate 110 is provided with a plurality ofchip connection pads 110 a arranged about the periphery of thesemiconductor chip 120. Thesemiconductor chip 120 is securely attached onto theflexible film substrate 110 through a nonconductive adhesive (e.g., epoxy resin) 122 and electrically connected to thechip connection pads 110 a through a plurality ofbonding wires 130. Thechip connection pads 110 a are electrically connected to a plurality ofsolder pads 110 b throughconductive traces 110 d. Theflexible film substrate 110 has a plurality of through-hole 110 c disposed corresponding tosolder pads 110 b. Eachsolder pad 110 b has a portion exposed within the corresponding through-hole 110 c for mounting asolder ball 140. The upper surface of theflexible film substrate 110, thesemiconductor chip 120 and thebonding wires 130 are encapsulated in apackage body 150. Thepackage body 150 is formed from insulating material such as epoxy. The flexible substrate based BGApackage 100 is mounted to a substrate (not shown), such as a printed circuit board, through thesolder balls 140. - Typically, the surfaces of the
chip connection pads 110 a andsolder pads 110 b are plated with a layer of metal (not shown) such as gold which bonds well with conventional bonding wire material. However, gold does not bond well with thenonconductive adhesive 122, so the central part of the chip attaching area is not provided with solder pads in order to enhance the adhesion between theflexible film substrate 110 and thenonconductive adhesive 122, whereby thesemiconductor chip 120 is more securely attached onto theflexible film substrate 110. However, since thesolder pads 110 b are not evenly distributed on thechip attaching area 160 of theflexible film substrate 110, the central part thereof is prone to be deformed by the stress due to CTE (coefficient of thermal expansion) mismatch between the central part and other part of thechip attaching area 160. This may create problems of delamination between the chip and the substrate or die cracking. - It is a primary object of the present invention to provide a flexible substrate based BGA package comprising a flexible film substrate having a die attaching area for carrying a semiconductor chip, wherein the flexible film substrate is provided with at least a dummy pad disposed centrally on the chip attaching area, thereby reducing problems of delamination between the chip and the substrate or die cracking.
- It is another object of the present invention to provide a flexible substrate based BGA package comprising a semiconductor chip securely attached onto a die attaching area of a flexible film substrate through a nonconductive adhesive, wherein the flexible film substrate is provided with at least a dummy pad disposed centrally on the chip attaching area, and the dummy pad has a cupric oxide coating formed thereon for enhancing its adhesion with the nonconductive adhesive.
- A flexible substrate based BGA package in accordance with a preferred embodiment of the present invention generally comprises a semiconductor chip securely attached onto a flexible film substrate through a nonconductive adhesive. The flexible film substrate includes a flexible film having a chip attaching area for carrying the semiconductor chip. The upper surface of the flexible film is provided with a plurality of chip connection pads, a plurality of solder pads, and at least a dummy pad which is disposed centrally on the chip attaching area. Preferably, the surface of the dummy pad has a cupric oxide coating for enhancing its adhesion with the nonconductive adhesive. The chip connection pads are arranged about the periphery of the chip attaching area. The solder pads are disposed about the dummy pad(s) and electrically connected to the corresponding chip connection pads. The flexible film has a plurality of through-holes formed corresponding to the solder pads such that each solder pad has a portion exposed within the corresponding through-hole for mounting a solder ball. A package body is formed over the semiconductor chip and the upper surface of the flexible film substrate.
- According to the flexible substrate based BGA package of the present invention, since at least a dummy pad is disposed centrally on the chip attaching area of the flexible film substrate, the central part of the chip attaching area of the substrate has a better rigidity and strength to resist external forces thereby reducing the problems of die cracking or delamination. Further, the cupric oxide coating on the surface of the dummy pad has a contour of roughness, so the bonding mechanism of the interface between the cupric oxide coating and the nonconductive adhesive includes chemical bonding as well as mechanical interlock thereby greatly enhancing the adhesion between the dummy pad and the nonconductive adhesive thereby reducing the occurrence of delamination.
- The present invention further provides a method for producing a flexible film substrate comprising the steps of: (A) providing a flexible film having opposing upper and lower surfaces, the upper surface of the flexible film has a chip attaching area adapted for carrying a semiconductor chip; (B) forming a plurality of through-holes in the flexible film; (C) laminating a metal layer on the upper surface of the flexible film; and (D) etching the metal layer to form a plurality of solder pads, chip connection pads, conductive traces, and at least a dummy pad, wherein the solder pads are disposed corresponding to the through-holes and electrically connected to the chip connection pads through the conductive traces, and the dummy pad is disposed centrally on the chip attaching area.
- Other objects, advantages, and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
- FIG. 1 is a cross sectional view of a conventional flexible substrate based BGA package;
- FIG. 2 is a top plan view of a flexible film substrate employed in the flexible substrate based BGA package of FIG. 1;
- FIG. 3 is a cross sectional view of a flexible substrate based BGA package according to a preferred embodiment of the present invention;
- FIGS.4-6 are cross sectional views for illustrating a method for producing a flexible film substrate in accordance with the present invention;
- FIG. 7 is a top plan view of a flexible film substrate according to a first embodiment of the present invention;
- FIG. 8 is a top plan view of a flexible film substrate according to a second embodiment of the present invention; and
- FIG. 9 is a top plan view of a flexible film substrate according to a third embodiment of the present invention.
- FIG. 3 illustrates a flexible substrate based BGA package200 according to a preferred embodiment of the present invention mainly comprising a
semiconductor chip 210 securely attached onto the upper surface of aflexible film substrate 220 by a nonconductive adhesive (e.g. epoxy resin) 212. - Referring to FIG. 3 and FIG. 7, the
flexible film substrate 220 is mainly formed from aflexible film 220 a having achip attaching area 220 b adapted for carrying thesemiconductor chip 210. The upper surface offlexible film 220 a is provided with a plurality ofchip connection pads 220 c electrically connected to thecorresponding solder pads 220 d throughconductive traces 220 e formed on the upper surface of theflexible film 220 a. Thechip connection pads 220 c are arranged about the periphery of thechip attaching area 220 b and electrically connected to thesemiconductor chip 210 through a plurality ofbonding wires 230. Theflexible film 220 a has a plurality of through-holes formed corresponding to thesolder pads 220 d such that eachsolder pad 220 d has at least a portion exposed within the corresponding through-hole for mounting asolder ball 222. Apackage body 240 is formed over thesemiconductor chip 210 and the upper surface of theflexible film substrate 220. Thesolder balls 222 are provided on the lower surface of theflexible film substrate 220 for making external electrical connection. - Referring to FIG. 3 and FIG. 7 again, the present invention is characterized in that the
flexible film substrate 220 is provided with at least a dummy pad disposed centrally on thechip attaching area 220 b. Preferably, thedummy pads 220 f are formed as a discontinuous pattern and evenly distributed on the central part of the chip attaching area (see FIGS. 6-9), whereby optimum reinforcing effect can be achieved without interfering the flow of thenonconductive adhesive 212. Thedummy pad 220 f in accordance with the present invention may be bar-like, oval-shaped or circular as shown in FIGS. 7-9. It will be appreciated that the number and shapes of the dummy pads are not limited to the embodiments of FIGS. 6-9 as long as the flow of thenonconductive adhesive 212 is not interfered and the central part of the chip attaching area of the substrate is reinforced. - FIGS.4-6 show a method for producing a flexible film substrate in accordance with the present invention.
- Referring to FIG. 4, a plurality of through-holes are formed in the
flexible film 220 a by conventional techniques such as punching or laser drilling. The through-holes are formed at locations corresponding to thesolder pads 220 d disposed at the bottom section of the package 200 (see FIG. 3). Preferably, theflexible film 220 a is made of polyimide such that the flexible film is given properties that allow it to pass reliability tests. - Referring to FIG. 5, a metal layer such as a
copper foil 221 is laminated on theflexible film 220 a by conventional methods such as thermocompression. - Referring to FIG. 6, the
chip connection pads 220 c, thesolder pads 220 d,conductive traces 220 e (not shown in FIG. 6), and thedummy pads 220 f are formed by photolithography and etching which comprise the steps of: (A) applying a photoresist layer on the surface of the metal layer; (B) pattern (referring to FIG. 7) transferring by photolithography; (C) removing the unprotected portions of the metal layer to form the correspondingchip connection pads 220 c,solder pads 220 d,conductive traces 220 e, anddummy pads 220 f by etching; and (D) removing the remaining photoresist layer. Preferably, thechip connection pads 220 c, thesolder pads 220 d, andconductive traces 220 e are provided with a metal coating formed on the surfaces thereof which are not covered by theflexible film 220 a. The metal coating may be plated by conventional techniques. Preferably, a layer of nickel is plated thereon and then a layer of gold is plated on the nickel layer. Since the metal coating is also formed on the connection pads adapted for electrical connecting to the chip, the metal coating should be formed of materials that allow a good bond to the conventional bonding wire material. - Preferably, the
dummy pads 220 f are provided with a cupric oxide coating formed on the surface thereof. Thecupric oxide coating 220 a is preferably formed by the method of anodic oxidation: (A) Areas on the flexible film substrate at which it is undesired to form a cupric oxide coating are protected by tapes, e.g., thechip connection pads 220 c, thesolder pads 220 d, andconductive traces 220 e; (B) The flexible film substrate with protective tapes is electrolyzed as the anode in an alkaline solution such as sodium hydroxide electrolytic solution, thereby forming a cupric oxide coating on the surface of the flexible film substrate without protection of tapes. The principal crystal structure of the cupric oxide coating layer is composed of acicular crystals which are black in color and densely packed; hence, the cupric oxide coating has a rough appearance with a color of black. Alternatively, the cupric oxide coating on the dummy pads according to the present invention can be formed by the method of chemical oxidation: the step (A) is identical to the method described above; (B′) The flexible film substrate with protective tapes is immersed in a chemical oxidation solution (such as water solution of 3% sodium chloride, 1% sodium hydroxide and 1% sodium phosphate by weight) and heated at 85° C. - According to one aspect of the present invention, since at least a dummy pad is disposed centrally on the chip attaching area of the flexible film substrate, the central part of the chip attaching area of the substrate has a better rigidity and strength to resist external forces. Further, since the dummy pads of the present invention are evenly distributed on the central part of the chip attaching area, the central part of the chip attaching area has a CTE substantially equal to other part thereof thereby reducing the stress due to CTE mismatch therebetween. Thus, the flexible film substrate in accordance with the present invention greatly reduces the problems of die cracking or delamination.
- According to another aspect of the present invention, since the cupric oxide coating on the surface of the dummy pads is composed of acicular crystals which are black in color and densely packed, the gaps among the acicular crystals will be filled by the nonconductive adhesive (e.g., epoxy resin) employed in the die attaching process. After curing, the nonconductive adhesive will provide mechanical interlock mechanism to enhance the adhesion between the cupric oxide coating and the nonconductive adhesive, thereby reducing the occurrence of delamination between the flexible film substrate and the nonconductive adhesive.
- Although the invention has been explained in relation to its preferred embodiment, it is to be understood that many other possible modifications and variations can be made without departing from the spirit and scope of the invention as hereinafter claimed.
Claims (15)
1. A flexible substrate based ball grid array (BGA) package comprising:
a flexible film substrate comprising a flexible film having opposing upper and lower surfaces, the upper surface of the flexible film has a chip attaching area; at least a dummy pad disposed centrally on the chip attaching area; a plurality of chip connection pads arranged about the periphery of the chip attaching area; and a plurality of solder pads on the upper surface of the flexible film electrically connected to the corresponding chip connection pads, wherein the flexible film has a plurality of through-holes formed corresponding to the solder pads;
a plurality of solder balls mounted to the solder pads of the flexible film substrate for making external electrical connection;
a semiconductor chip securely attached onto the chip attaching area of the flexible film substrate, the chip having a plurality of bonding pads electrically connected to the corresponding chip connection pads; and
a package body formed over the semiconductor chip and the upper surface of the flexible film substrate.
2. The flexible substrate based BGA package as claimed in , wherein the flexible film is made of polyimide.
claim 1
3. The flexible substrate based BGA package as claimed in , wherein the dummy pad is made of copper.
claim 1
4. The flexible substrate based BGA package as claimed in , further comprising a cupric oxide coating formed on the dummy pad.
claim 3
5. A flexible film substrate for use in forming a flexible substrate based BGA package, the flexible film substrate comprising:
a flexible film having opposing upper and lower surfaces, the upper surface of the flexible film has a chip attaching area adapted for supporting a semiconductor chip;
at least a dummy pad disposed centrally on the chip attaching area;
a plurality of chip connection pads arranged about the periphery of the chip attaching area for electrically connected to the semiconductor chip; and
a plurality of solder pads on the upper surface of the flexible film electrically connected to the corresponding chip connection pads, wherein the flexible film has a plurality of through-holes formed corresponding to the solder pads.
6. The flexible film substrate as claimed in , wherein the flexible film is made of polyimide.
claim 5
7. The flexible film substrate as claimed in , wherein the dummy pad is made of copper.
claim 5
8. The flexible film substrate as claimed in , further comprising a cupric oxide coating formed on the dummy pad.
claim 7
9. The flexible film substrate as claimed in , wherein the substrate is one of a plurality of substrates formed in a strip configuration for use in forming a plurality of substrate-based semiconductor chip package.
claim 5
10. A method for manufacturing a flexible film substrate comprising the steps of:
providing a flexible film having opposing upper and lower surfaces, the upper surface of the flexible film has a chip attaching area adapted for supporting a semiconductor chip;
forming a plurality of through-holes in the flexible film;
laminating a metal layer on the upper surface of the flexible film; and
etching the metal layer to form a plurality of solder pads, chip connection pads, conductive traces, and at least a dummy pad, wherein the solder pads are disposed corresponding to the through-holes and electrically connected to the chip connection pads through the conductive traces, and the dummy pad is disposed centrally on the chip attaching area.
11. The method as claimed in , wherein the flexible film is made of polyimide.
claim 10
12. The method as claimed in , wherein the metal layer is a copper foil.
claim 10
13. The method as claimed in , further comprising a step of forming a cupric oxide coating on the surface of the dummy pad.
claim 12
14. The method as claimed in , wherein the cupric oxide coating is formed by means of anodic oxidation.
claim 13
15. The method as claimed in , wherein the cupric oxide coating is formed by means of chemical oxidation.
claim 13
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US09/839,212 US6380002B2 (en) | 1999-12-07 | 2001-04-23 | Method for fabricating a flexible substrate based ball grid array (BGA) package |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US09/455,918 US6242815B1 (en) | 1999-12-07 | 1999-12-07 | Flexible substrate based ball grid array (BGA) package |
US09/839,212 US6380002B2 (en) | 1999-12-07 | 2001-04-23 | Method for fabricating a flexible substrate based ball grid array (BGA) package |
Related Parent Applications (1)
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US09/455,918 Division US6242815B1 (en) | 1999-12-07 | 1999-12-07 | Flexible substrate based ball grid array (BGA) package |
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US20010013647A1 true US20010013647A1 (en) | 2001-08-16 |
US6380002B2 US6380002B2 (en) | 2002-04-30 |
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US09/839,212 Expired - Lifetime US6380002B2 (en) | 1999-12-07 | 2001-04-23 | Method for fabricating a flexible substrate based ball grid array (BGA) package |
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US09/455,918 Expired - Lifetime US6242815B1 (en) | 1999-12-07 | 1999-12-07 | Flexible substrate based ball grid array (BGA) package |
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US20080006949A1 (en) * | 2006-06-19 | 2008-01-10 | Samsung Electronics Co., Ltd. | Semiconductor package and method of fabricating the same |
US7612450B2 (en) * | 2006-06-19 | 2009-11-03 | Samsung Electronics Co., Ltd. | Semiconductor package including dummy board and method of fabricating the same |
US20110182042A1 (en) * | 2007-07-05 | 2011-07-28 | Occam Portfolio Llc | Electronic Assemblies without Solder and Methods for their Manufacture |
US20110074037A1 (en) * | 2009-09-29 | 2011-03-31 | Elpida Memory, Inc. | Semiconductor device |
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CN107801291A (en) * | 2016-09-06 | 2018-03-13 | 奕力科技股份有限公司 | Electrostatic discharge protection device and electrostatic discharge protection method |
Also Published As
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US6242815B1 (en) | 2001-06-05 |
US6380002B2 (en) | 2002-04-30 |
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