US1526644A - Process of electroplating and apparatus therefor - Google Patents

Process of electroplating and apparatus therefor Download PDF

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Publication number
US1526644A
US1526644A US596730A US59673022A US1526644A US 1526644 A US1526644 A US 1526644A US 596730 A US596730 A US 596730A US 59673022 A US59673022 A US 59673022A US 1526644 A US1526644 A US 1526644A
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article
anode
source
electric energy
connection
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US596730A
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George H Pinney
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WILLIAMS BROTHERS Manufacturing Co
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WILLIAMS BROTHERS Manufacturing Co
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007Current directing devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00Chemistry: electrical and wave energy
    • Y10S204/07Current distribution within the bath

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  • This invention relates to the electroplating of articles. more especially spoons, forks, and the like, and an object of the invention, among others, is the production of means and of a process whereby different thicknesses of plate may be. applied to articles ina particularly etlicient manner.
  • a spoon 7 is suspended within the electrolyte, as from a support 8, this support being suspended from an insulating bar 9.
  • This support is electrically connected with a source of electric energy, as with one pole of a battery 10, and in making this connection I preferably employ a variable resistance 11.
  • An anode 12 composed, in the usual manner, of the metal that is to be deposited upon the article to be pl'ated, is suspended from a bar 13 and this anode is connected with the opposite pole of the battery 10 from that with which the support 8 is connected, a variable resistance 14 being comprised in the connection between the anode and the battery.
  • an ammeter 15 may be interposed in the connection between the anode and the battery by means of which the amount of silver being deposited by this anode may be measured.
  • This improved means comprises a supporting bar 16 of insulating material sccured to the insulating bar 9 and having secured at its lower end an anode housim 17 containing a secondary anode 18.
  • This housing is preferably composed of insulating material and the anode 18 is preferably located within and at some distance from the edge of the open side of the housing.
  • An electrical conductor 19 extends from this housing through a tube 20, this conductor being connected with the opposite pole of the battery 10 from that with which the support 8 is connected, and in making this connection a variable resistance 21 is preferably employed and an ammeter 22 may also be used if desired to measure the amount of silver being deposited from the secondary anode.
  • the resistances 1i and 21 may be so adjusted as to cause either the secondary anode 18 or the primary anode 12 to deposit the plating metal in quantities as may be desired.
  • An electroplating apparatus comprising a .support for an article to be plated, a primary anode, a secondary anode located in active relation to said article, a connection between each of said anodes and a source of electric energy, and a connection between said article and a source of electric energy.
  • An electroplating apparatus comprising a support for an article to be plated, a primary anode, a secondary anode located in active relation to said article, means for directing the activities of the secondary anode with respect to said article, a connection between each of said anodes and a source of electric energy, and a con-. nection between said article and the source of electric energy.
  • An electroplating apparatus comprising a su port for an article to be plated, an anode located in active relation to said article, means for-directing the activity of said anode with res ect to said article, an electrical connection between said anode and a source of electric energy, and an electrical connection between said article and said source of electric energy.
  • An electroplating apparatus comprising a support for an article to be plated
  • an electrolyte within which said article is supported an anode, an insulated housing located within said electrolyte to receive said anode, an electrical connection extending from said housing to a source of electric energy, and a connection between said article and said source of electric energy.
  • An electroplating apparatus comprising a support for an article to be plated,
  • a primary anode a secondary anode located between said article and said primary anode, both of. said anodes being located in active relation with respect to said article, a housing within which said secondary anode is inclosed, said housing being open at one side, an electrical connection between the anode in said housi and a source of electric energy, an electrical connection between the primary anode and the source of electric ener and an electrical connection between sald article and said source of electric energy.
  • An electroplating apparatus comprising a support for an article tobe plated, a primary anode, a secondary anode located in active relation to said article, a connection between each of said anodes and a source of electric energy, one of said connections comprising a variable resistance,
  • An electroplating apparatus comprising a support for an article to be plated, a primary anode, a secondary anode located in active relation to said article, a connection between each of said anodes and a source of electric energy, and a connection between said article and said source of electric energy, the latter connection embodying a variable resistance.
  • An electro lating apparatus comprising a support or an article to be plated, a primary anode and a secondary anode located in active relation to said article, an electrical connection between each of said anodes and a source of electric energy, each of said connections comprising a variable resistance, and a connection between said article and said source of electric energy.
  • An electroplating apparatus comprising a support for an article to be plated, means for depositing a plating material upon said article, an anode located in active relation to said article, a connection between said anode and a source of electric energy, and a connection between said article and a source of electric energy.

Description

Feb. 17. 19.25. 1,526,644
' G. H. \PINNEY PROCESS OF ELECTROPLATING ANDAPPARATUS THEREFOR Filed Oct. 25, 1922 THRIVE) Patented Feb. 17, 1925.
1 UNITED STATES PATENT OFFICE.
GEORGE H. PINNEY, OF SOUTH MANCHESTER, CONNECTICUT, ASSIGNOR TO THE WILLIAMS BROTHERS MANUFACTURING COMPANY, OF GLASTONIBURY, CONNECTL CUT, A CORPORATION OF CONNECTICUT.
PROCESS OF ELECTROPLATING AND APPARATUS THEREFOR.
Application filed October 25, 1922. Serial No. 596,730.
To all whom it may concern Be it known that I, Gnonon H. PINNEY, a citizen of the United States, and a resident of South Manchester, in the county of Hartford and State of Connecticut, have invented a new and Improved Process of Electroplating and Apparatus Therefor, of which the following is a specification.
This invention relates to the electroplating of articles. more especially spoons, forks, and the like, and an object of the invention, among others, is the production of means and of a process whereby different thicknesses of plate may be. applied to articles ina particularly etlicient manner.
A process and apparatus therefor by means of which the objects herein set out, as well as others, may be attained, i's illustrated in the accompanying drawings, in which- The figure is a view in section through a plating tank supplied with apparatus for carrying this invention into effect.
In the use of tableware, such as spoons, forks and the like, the bottoms of the bowls and backs of the curves of the handles are subjected to the greatest wear, and it has, therefore, for a long time, been the practice to supply such articles with a greater thickness of the plating metal at these points. By the use of this invention, illustrated and described herein, means are provided whereby this extra plate may be applied in a particularly eflicient manner, the numeral 5 indicating a tank of ordinary construction 7 containing an electrolyte 6. An article, as
a spoon 7, is suspended within the electrolyte, as from a support 8, this support being suspended from an insulating bar 9. This support is electrically connected with a source of electric energy, as with one pole of a battery 10, and in making this connection I preferably employ a variable resistance 11.
An anode 12 composed, in the usual manner, of the metal that is to be deposited upon the article to be pl'ated, is suspended from a bar 13 and this anode is connected with the opposite pole of the battery 10 from that with which the support 8 is connected, a variable resistance 14 being comprised in the connection between the anode and the battery.
If desired an ammeter 15 may be interposed in the connection between the anode and the battery by means of which the amount of silver being deposited by this anode may be measured.
The apparatus thus far described will deposit the plating material upon the spoons 1n manner common to devices of this kind. but in order to deposit the extra plate I have )rovided the means now to be described.
This improved means comprises a supporting bar 16 of insulating material sccured to the insulating bar 9 and having secured at its lower end an anode housim 17 containing a secondary anode 18. This housing is preferably composed of insulating material and the anode 18 is preferably located within and at some distance from the edge of the open side of the housing. An electrical conductor 19 extends from this housing through a tube 20, this conductor being connected with the opposite pole of the battery 10 from that with which the support 8 is connected, and in making this connection a variable resistance 21 is preferably employed and an ammeter 22 may also be used if desired to measure the amount of silver being deposited from the secondary anode. The resistances 1i and 21 may be so adjusted as to cause either the secondary anode 18 or the primary anode 12 to deposit the plating metal in quantities as may be desired.
\Vhile the ammeters and resistances are illustrated in the drawings herein as forming a part of the apparatus, and with which extremely satisfactory results are obtained, it is not essential to the broad spirit of the invention that such shall be employed, as satisfactory results may be gained without them.
The operation of the device itself will be obvious to those skilled in the art from an inspection of the drawing, it being noted that the metal is simultaneously deposited from the primary and secondary anodes, the housing directing the activities of the secondary anode to the locality desired. This will deposit an extra amount of metal upon the outer surfaces of the bowls of the articles, and while mention is made herein of such an extra coatim of metal on the outer surfaces of the bends at the ends of the handles, devices for doing this are not.
shown in the drawings herein, but when used may be attached to the support 16 and located in a housing similar to. the housing 17, and may be operated simultaneously.
In accordance with the provisions of the patent statutes I have'described the principles of operation of my invention, to gether with the apparatus which I now consider to represent the best embodiment thereof; butI desire to have it understood that the apparatus shown is only illustrative, and that the invention may be carried out by other means.
I claim 1. An electroplating apparatus comprising a .support for an article to be plated, a primary anode, a secondary anode located in active relation to said article, a connection between each of said anodes and a source of electric energy, and a connection between said article and a source of electric energy.
2. An electroplating apparatus comprising a support for an article to be plated, a primary anode, a secondary anode located in active relation to said article, means for directing the activities of the secondary anode with respect to said article, a connection between each of said anodes and a source of electric energy, and a con-. nection between said article and the source of electric energy.
3. An electroplating apparatus comprising a su port for an article to be plated, an anode located in active relation to said article, means for-directing the activity of said anode with res ect to said article, an electrical connection between said anode and a source of electric energy, and an electrical connection between said article and said source of electric energy.
4. An electroplating apparatus comprising a support for an article to be plated,
an electrolyte within which said article is supported, an anode, an insulated housing located within said electrolyte to receive said anode, an electrical connection extending from said housing to a source of electric energy, and a connection between said article and said source of electric energy.
5. An electroplating apparatus compris ing a support for an article to be plated,
a primary anode, a secondary anode located between said article and said primary anode, both of. said anodes being located in active relation with respect to said article, a housing within which said secondary anode is inclosed, said housing being open at one side, an electrical connection between the anode in said housi and a source of electric energy, an electrical connection between the primary anode and the source of electric ener and an electrical connection between sald article and said source of electric energy.
6. An electroplating apparatus comprising a support for an article tobe plated, a primary anode, a secondary anode located in active relation to said article, a connection between each of said anodes and a source of electric energy, one of said connections comprising a variable resistance,
and a connection between said articlev and said source of electric energy.
7. An electroplating apparatus comprising a support for an article to be plated, a primary anode, a secondary anode located in active relation to said article, a connection between each of said anodes and a source of electric energy, and a connection between said article and said source of electric energy, the latter connection embodying a variable resistance. Y
8. An electro lating apparatus comprising a support or an article to be plated, a primary anode and a secondary anode located in active relation to said article, an electrical connection between each of said anodes and a source of electric energy, each of said connections comprising a variable resistance, and a connection between said article and said source of electric energy.
9. The process of plating an article that consists in subjecting said article simultaneously to the plating action of a plu rality of anodes supported in active plating relation to said article.
10. The process of plating an article that consists in subjecting said article simultaneously to the unequal and unrestricted actlon of a primary anode and to the re stricted action of a secondary anode.
11. The process of plating that consists in subjecting an article simultaneously to the unequal and unrestricted action of a primary anode and to the direct restricted action of a secondary anode.
12. The process of electroplating that consists in subjecting an article to the action of an anode confined and directed to a'certain locality upon said article.
13. An electroplating apparatus comprising a support for an article to be plated, means for depositing a plating material upon said article, an anode located in active relation to said article, a connection between said anode and a source of electric energy, and a connection between said article and a source of electric energy.
GEORGE H. PINNEY.
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Cited By (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2472786A (en) * 1943-08-21 1949-06-14 Sylvania Electric Prod Method of pickling metal contact surfaces
US2696466A (en) * 1949-10-14 1954-12-07 Jr John F Beaver Method of electroplating
US2739937A (en) * 1952-09-05 1956-03-27 Clarence W Forestek Aligned anode apparatus
US2744859A (en) * 1951-02-20 1956-05-08 Robert H Rines Electroplating method and system
US2847376A (en) * 1954-11-05 1958-08-12 Republic Steel Corp Apparatus for electrocleaning welds in internal corners
US3065153A (en) * 1958-10-15 1962-11-20 Gen Motors Corp Electroplating method and apparatus
US3082160A (en) * 1958-09-15 1963-03-19 Rolland C Sabins Electrolytic method
US3437578A (en) * 1965-05-13 1969-04-08 Buckbee Mears Co Robber control for electroplating
US3549506A (en) * 1968-11-05 1970-12-22 Harold E Willingham Method of making an electroconductive roller
US3880725A (en) * 1974-04-10 1975-04-29 Rca Corp Predetermined thickness profiles through electroplating
US4297175A (en) * 1980-02-21 1981-10-27 Wurttembergische Metallwarenfabrik Process for partially electroplating flat silver
US4411041A (en) * 1980-12-04 1983-10-25 Renato Braga Silver-plated tooth brush
US4678545A (en) * 1986-06-12 1987-07-07 Galik George M Printed circuit board fine line plating
US5441620A (en) * 1993-02-10 1995-08-15 Yamaha Corporation Electroplating apparatus
WO2000061498A2 (en) * 1999-04-13 2000-10-19 Semitool, Inc. System for electrochemically processing a workpiece
US20010032788A1 (en) * 1999-04-13 2001-10-25 Woodruff Daniel J. Adaptable electrochemical processing chamber
US20020053509A1 (en) * 1996-07-15 2002-05-09 Hanson Kyle M. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
US20020084183A1 (en) * 2000-03-21 2002-07-04 Hanson Kyle M. Apparatus and method for electrochemically processing a microelectronic workpiece
US20020125141A1 (en) * 1999-04-13 2002-09-12 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US20020139678A1 (en) * 1999-04-13 2002-10-03 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US20030020928A1 (en) * 2000-07-08 2003-01-30 Ritzdorf Thomas L. Methods and apparatus for processing microelectronic workpieces using metrology
US20030062258A1 (en) * 1998-07-10 2003-04-03 Woodruff Daniel J. Electroplating apparatus with segmented anode array
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US20030127337A1 (en) * 1999-04-13 2003-07-10 Hanson Kayle M. Apparatus and methods for electrochemical processing of microelectronic workpieces
US20030159277A1 (en) * 2002-02-22 2003-08-28 Randy Harris Method and apparatus for manually and automatically processing microelectronic workpieces
US20030159921A1 (en) * 2002-02-22 2003-08-28 Randy Harris Apparatus with processing stations for manually and automatically processing microelectronic workpieces
US6623609B2 (en) 1999-07-12 2003-09-23 Semitool, Inc. Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same
US20030217929A1 (en) * 2002-05-08 2003-11-27 Peace Steven L. Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids
US20040007467A1 (en) * 2002-05-29 2004-01-15 Mchugh Paul R. Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces
US20040049911A1 (en) * 2002-07-16 2004-03-18 Harris Randy A. Apparatuses and method for transferring and/or pre-processing microelectronic workpieces
US6749391B2 (en) 1996-07-15 2004-06-15 Semitool, Inc. Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces
US6749390B2 (en) 1997-12-15 2004-06-15 Semitool, Inc. Integrated tools with transfer devices for handling microelectronic workpieces
US6752584B2 (en) 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
US20050084987A1 (en) * 1999-07-12 2005-04-21 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US20050087439A1 (en) * 1999-04-13 2005-04-28 Hanson Kyle M. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US20050092611A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Bath and method for high rate copper deposition
US20050139478A1 (en) * 1998-03-20 2005-06-30 Semitool, Inc. Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
US20050183959A1 (en) * 2000-04-13 2005-08-25 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece
US20050189215A1 (en) * 1999-04-13 2005-09-01 Hanson Kyle M. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7090751B2 (en) 2001-08-31 2006-08-15 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US11618951B2 (en) 2020-05-27 2023-04-04 Global Circuit Innovations Incorporated Chemical evaporation control system

Cited By (100)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2472786A (en) * 1943-08-21 1949-06-14 Sylvania Electric Prod Method of pickling metal contact surfaces
US2696466A (en) * 1949-10-14 1954-12-07 Jr John F Beaver Method of electroplating
US2744859A (en) * 1951-02-20 1956-05-08 Robert H Rines Electroplating method and system
US2739937A (en) * 1952-09-05 1956-03-27 Clarence W Forestek Aligned anode apparatus
US2847376A (en) * 1954-11-05 1958-08-12 Republic Steel Corp Apparatus for electrocleaning welds in internal corners
US3082160A (en) * 1958-09-15 1963-03-19 Rolland C Sabins Electrolytic method
US3065153A (en) * 1958-10-15 1962-11-20 Gen Motors Corp Electroplating method and apparatus
US3437578A (en) * 1965-05-13 1969-04-08 Buckbee Mears Co Robber control for electroplating
US3549506A (en) * 1968-11-05 1970-12-22 Harold E Willingham Method of making an electroconductive roller
US3880725A (en) * 1974-04-10 1975-04-29 Rca Corp Predetermined thickness profiles through electroplating
US4297175A (en) * 1980-02-21 1981-10-27 Wurttembergische Metallwarenfabrik Process for partially electroplating flat silver
US4411041A (en) * 1980-12-04 1983-10-25 Renato Braga Silver-plated tooth brush
US4678545A (en) * 1986-06-12 1987-07-07 Galik George M Printed circuit board fine line plating
US5441620A (en) * 1993-02-10 1995-08-15 Yamaha Corporation Electroplating apparatus
US6752584B2 (en) 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
US6749391B2 (en) 1996-07-15 2004-06-15 Semitool, Inc. Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces
US20020053509A1 (en) * 1996-07-15 2002-05-09 Hanson Kyle M. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
US20040228719A1 (en) * 1996-07-15 2004-11-18 Woodruff Daniel J. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
US6921467B2 (en) 1996-07-15 2005-07-26 Semitool, Inc. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
US6749390B2 (en) 1997-12-15 2004-06-15 Semitool, Inc. Integrated tools with transfer devices for handling microelectronic workpieces
US7332066B2 (en) 1998-03-20 2008-02-19 Semitool, Inc. Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
US20040031693A1 (en) * 1998-03-20 2004-02-19 Chen Linlin Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
US20100116671A1 (en) * 1998-03-20 2010-05-13 Semitool, Inc. Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US20050173252A1 (en) * 1998-03-20 2005-08-11 Semitool, Inc. Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
US20050245083A1 (en) * 1998-03-20 2005-11-03 Semitool, Inc. Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
US7115196B2 (en) 1998-03-20 2006-10-03 Semitool, Inc. Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
US20050150770A1 (en) * 1998-03-20 2005-07-14 Semitool, Inc. Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
US20050139478A1 (en) * 1998-03-20 2005-06-30 Semitool, Inc. Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
US20050161336A1 (en) * 1998-07-10 2005-07-28 Woodruff Daniel J. Electroplating apparatus with segmented anode array
US20050109611A1 (en) * 1998-07-10 2005-05-26 Woodruff Daniel J. Electroplating apparatus with segmented anode array
US7147760B2 (en) 1998-07-10 2006-12-12 Semitool, Inc. Electroplating apparatus with segmented anode array
US20050109612A1 (en) * 1998-07-10 2005-05-26 Woodruff Daniel J. Electroplating apparatus with segmented anode array
US7357850B2 (en) 1998-07-10 2008-04-15 Semitool, Inc. Electroplating apparatus with segmented anode array
US20030062258A1 (en) * 1998-07-10 2003-04-03 Woodruff Daniel J. Electroplating apparatus with segmented anode array
US20030127337A1 (en) * 1999-04-13 2003-07-10 Hanson Kayle M. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7267749B2 (en) 1999-04-13 2007-09-11 Semitool, Inc. Workpiece processor having processing chamber with improved processing fluid flow
US20040055877A1 (en) * 1999-04-13 2004-03-25 Wilson Gregory J. Workpiece processor having processing chamber with improved processing fluid flow
WO2000061498A2 (en) * 1999-04-13 2000-10-19 Semitool, Inc. System for electrochemically processing a workpiece
US20040188259A1 (en) * 1999-04-13 2004-09-30 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7566386B2 (en) 1999-04-13 2009-07-28 Semitool, Inc. System for electrochemically processing a workpiece
US20090114533A9 (en) * 1999-04-13 2009-05-07 Hanson Kyle M Chambers, systems, and methods for electrochemically processing microfeature workpieces
US20050087439A1 (en) * 1999-04-13 2005-04-28 Hanson Kyle M. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US20080217165A9 (en) * 1999-04-13 2008-09-11 Hanson Kyle M Apparatus and methods for electrochemical processing of microelectronic workpieces
US20050109629A1 (en) * 1999-04-13 2005-05-26 Wilson Gregory J. System for electrochemically processing a workpiece
US20050109625A1 (en) * 1999-04-13 2005-05-26 Wilson Gregory J. System for electrochemically processing a workpiece
US20050109633A1 (en) * 1999-04-13 2005-05-26 Wilson Gregory J. System for electrochemically processing a workpiece
US6660137B2 (en) 1999-04-13 2003-12-09 Semitool, Inc. System for electrochemically processing a workpiece
US20050109628A1 (en) * 1999-04-13 2005-05-26 Wilson Gregory J. System for electrochemically processing a workpiece
US20080217167A9 (en) * 1999-04-13 2008-09-11 Hanson Kyle M Apparatus and methods for electrochemical processing of microelectronic workpieces
US20080217166A9 (en) * 1999-04-13 2008-09-11 Hanson Kyle M Apparatus and methods for electrochemical processsing of microelectronic workpieces
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
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US20050155864A1 (en) * 1999-04-13 2005-07-21 Woodruff Daniel J. Adaptable electrochemical processing chamber
US20010032788A1 (en) * 1999-04-13 2001-10-25 Woodruff Daniel J. Adaptable electrochemical processing chamber
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