EP2312197A1 - Illumination device - Google Patents
Illumination device Download PDFInfo
- Publication number
- EP2312197A1 EP2312197A1 EP10187284A EP10187284A EP2312197A1 EP 2312197 A1 EP2312197 A1 EP 2312197A1 EP 10187284 A EP10187284 A EP 10187284A EP 10187284 A EP10187284 A EP 10187284A EP 2312197 A1 EP2312197 A1 EP 2312197A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- illumination device
- heat sink
- circuit board
- printed circuit
- support portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the present disclosure relates to illumination devices, and more particularly to an illumination device providing efficient heat dissipation.
- a LED lamp includes a heat sink, a printed circuit board and a plurality of LEDs.
- the printed circuit board is mounted on a central portion of the heat sink.
- the LEDs are mounted on the printed circuit board. Because the heat transfer coefficient of the printed circuit board is poor it is difficult for the heat sink to dissipate the heat from the LEDs in a timely manner.
- FIG. 1 is a schematic view of an illumination device in accordance with a first embodiment.
- FIG. 2 is a schematic view of an illumination device in accordance with a second embodiment.
- FIG. 3 is a schematic view of an illumination device in accordance with a third embodiment.
- an illumination device 100 includes a heat sink 10, a heat transfer member 20, a printed circuit board 30, at least one solid-state light source 40, a connecting member 50 electrically connecting to a power source (not shown), and a transparent or translucent envelope 60 which is glass or plastic.
- the heat sink 10 includes a support portion 11, a connecting portion 13 and a plurality of fins 12.
- the fms 12 are radially aligned about an outer circumferential surface of the heat sink 10 to dissipate the heat therefrom.
- the support portion 11 of the heat sink 10 is a flat surface to support the heat transfer member 20 thereon.
- the heat sink 10 is made of aluminum or copper.
- the heat transfer member 20 is mounted on the support portion 11 of the heat sink 10.
- the heat transfer member 20 is made of thermal conductive adhesive.
- the printed circuit board 30 is mounted on the heat transfer member 20. In this embodiment, a gap is provided between the printed circuit board 30 and the support portion 11 of the heat sink 10.
- the solid-state light source 40 is mounted on the printed circuit board 30.
- the solid-state light source 40 is a LED.
- the connecting member 50 is mounted on the connecting portion 13 of the heat sink 10.
- the connecting member 50 is electrically connected with the printed circuit board 30 by a wire (not shown).
- the connecting member 50 is a standard element with a thread formed thereon, so the illumination device 100 can be directly connected to a standard socket matching the standard connecting member 50 to electrically connect with the power source.
- the illumination device 100 thus can replace an incandescent lamp or a compact lamp having a connector configuration matching that of the connecting member 50.
- the envelope 60 includes a receiving space 62 and an open end 64.
- the open end 64 of the envelope 60 is mounted on the support portion 11 of the heat sink 10 and covers the solid-state light source 40.
- the envelope 60 is hollow, substantially hemispherical, and of a light permeable material.
- the envelope 60 is an optical element, which can be used to adjust the illumination pattern from the solid-state light source 40.
- the heat transfer member 20 is interposed between the printed circuit board 30 and the support portion 11 of the heat sink 10, whereby the printed circuit board 30 is securely and directly mounted on the support portion 11 and thermally connects therewith.
- the solid-state light source 40 and the printed circuit board 30 easily dissipate heat to the heat sink 10 through the heat transfer member 20. Thus, efficiency of heat dissipation is enhanced and lifespan of the illumination device 100 is increased in daily use.
- FIG. 2 illustrates an illumination device 100a of a second embodiment of the disclosure, differing from the first embodiment only in that a plurality of heat transfer members 20a is interposed between the printed circuit board 30a and the support portion 11 of the heat sink 10.
- a plurality of solid-state light sources 40a is mounted on the printed circuit board 30a corresponding the heat transfer members 20a. Each electrode of the solid-state light sources 40a is electrically connected with a circuit on the printed circuit board 30a.
- FIG. 3 illustrates an illumination device 100b of a third embodiment of the disclosure, differing from the second embodiment only in that the support portion 11 includes two angled planes 14 and 16.
- Each heat transfer members 20b is connected with a corresponding one of the angled planes 14 and 16 of the heat sink 10.
- the shape of the printed circuit board 30b is corresponding to the angled planes 14 and 16 of the heat sink 10.
- the printed circuit board 30b is mounted on the heat transfer members 20b.
- the solid-state light sources 40b are mounted on the printed circuit board 30b corresponding the heat transfer members 20b.
Abstract
An illumination device (100) includes a heat sink (10), at least one heat transfer member (20), at least one solid-state light source (40) and a printed circuit board (30). The heat sink (10) includes a support portion (11). The heat transfer member (20) is mounted on the support portion (11) of the heat sink (10). The printed circuit board (30) is mounted on the heat transfer member (20). The printed circuit board (30) is thermally connected with the heat transfer member (20). The solid-state light source (40) is mounted on the printed circuit board (30). The circuit of the printed circuit board (30) is electrically connected to an electrode of the solid-state light source (40).
Description
- The present disclosure relates to illumination devices, and more particularly to an illumination device providing efficient heat dissipation.
- A LED lamp includes a heat sink, a printed circuit board and a plurality of LEDs. The printed circuit board is mounted on a central portion of the heat sink. The LEDs are mounted on the printed circuit board. Because the heat transfer coefficient of the printed circuit board is poor it is difficult for the heat sink to dissipate the heat from the LEDs in a timely manner.
- It is thus desirable to provide an illumination device which can overcome the described limitations.
- Many aspects of the present disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is a schematic view of an illumination device in accordance with a first embodiment. -
FIG. 2 is a schematic view of an illumination device in accordance with a second embodiment. -
FIG. 3 is a schematic view of an illumination device in accordance with a third embodiment. - Referring to
FIG. 1 , anillumination device 100 according to a first embodiment includes aheat sink 10, aheat transfer member 20, a printedcircuit board 30, at least one solid-state light source 40, a connectingmember 50 electrically connecting to a power source (not shown), and a transparent ortranslucent envelope 60 which is glass or plastic. - The
heat sink 10 includes asupport portion 11, a connectingportion 13 and a plurality offins 12. Thefms 12 are radially aligned about an outer circumferential surface of theheat sink 10 to dissipate the heat therefrom. Thesupport portion 11 of theheat sink 10 is a flat surface to support theheat transfer member 20 thereon. Theheat sink 10 is made of aluminum or copper. - The
heat transfer member 20 is mounted on thesupport portion 11 of theheat sink 10. Theheat transfer member 20 is made of thermal conductive adhesive. - The printed
circuit board 30 is mounted on theheat transfer member 20. In this embodiment, a gap is provided between the printedcircuit board 30 and thesupport portion 11 of theheat sink 10. - The solid-
state light source 40 is mounted on the printedcircuit board 30. In this embodiment, the solid-state light source 40 is a LED. - The connecting
member 50 is mounted on the connectingportion 13 of theheat sink 10. The connectingmember 50 is electrically connected with the printedcircuit board 30 by a wire (not shown). The connectingmember 50 is a standard element with a thread formed thereon, so theillumination device 100 can be directly connected to a standard socket matching the standard connectingmember 50 to electrically connect with the power source. Theillumination device 100 thus can replace an incandescent lamp or a compact lamp having a connector configuration matching that of the connectingmember 50. - The
envelope 60 includes areceiving space 62 and anopen end 64. Theopen end 64 of theenvelope 60 is mounted on thesupport portion 11 of theheat sink 10 and covers the solid-state light source 40. Theenvelope 60 is hollow, substantially hemispherical, and of a light permeable material. Theenvelope 60 is an optical element, which can be used to adjust the illumination pattern from the solid-state light source 40. - The
heat transfer member 20 is interposed between the printedcircuit board 30 and thesupport portion 11 of theheat sink 10, whereby the printedcircuit board 30 is securely and directly mounted on thesupport portion 11 and thermally connects therewith. The solid-state light source 40 and the printedcircuit board 30 easily dissipate heat to theheat sink 10 through theheat transfer member 20. Thus, efficiency of heat dissipation is enhanced and lifespan of theillumination device 100 is increased in daily use. -
FIG. 2 illustrates anillumination device 100a of a second embodiment of the disclosure, differing from the first embodiment only in that a plurality ofheat transfer members 20a is interposed between the printedcircuit board 30a and thesupport portion 11 of theheat sink 10. A plurality of solid-state light sources 40a is mounted on the printedcircuit board 30a corresponding theheat transfer members 20a. Each electrode of the solid-state light sources 40a is electrically connected with a circuit on the printedcircuit board 30a. -
FIG. 3 illustrates anillumination device 100b of a third embodiment of the disclosure, differing from the second embodiment only in that thesupport portion 11 includes twoangled planes heat transfer members 20b is connected with a corresponding one of theangled planes heat sink 10. The shape of the printedcircuit board 30b is corresponding to theangled planes heat sink 10. The printedcircuit board 30b is mounted on theheat transfer members 20b. The solid-state light sources 40b are mounted on the printedcircuit board 30b corresponding theheat transfer members 20b. - It is to be understood, however, that even though numerous characteristics and advantages of various embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only; and that changes may be made in detail, especially in matters of arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (11)
- An illumination device comprising:a heat sink comprising a support portion;at least one heat transfer member mounted on the support portion of the heat sink;a printed circuit board mounted on the at least one heat transfer member, the printed circuit board thermally connecting with the heat transfer member;at least one solid-state light source mounted on the printed circuit board, the at least one solid-state light source electrically connected with the printed circuit board.
- The illumination device of claim 1, wherein the heat sink comprises a plurality of fins radially aligned about an outer circumferential surface of the heat sink.
- The illumination device of claim 1, wherein the heat sink is made of aluminum or copper.
- The illumination device of claim 1, wherein the support portion of the heat sink is a flat surface.
- The illumination device of claim 1, wherein the support portion comprises an angled plane on which the at least one heat transfer member is mounted.
- The illumination device of claim 1, further comprising a connecting member mounted on a connecting portion of the heat sink and electrically connected to the printed circuit board.
- The illumination device of claim 1, further comprising an envelope comprising a receiving space and an open end, the open end of the envelope mounted on the support portion of the heat sink and covering the at least one solid-state light source.
- The illumination device of claim 7, wherein the envelope is made of a light permeable material and acts as an optical element for adjusting illumination pattern of the at least one solid-state light source.
- The illumination device of claim 1, wherein the at least one heat transfer member is made of a thermally conductive adhesive.
- The illumination device of claim 1, wherein a gap is defined between the printed circuit board and the support portion of the heat sink.
- The illumination device of claim 1, wherein the at least one solid-state light source is a LED.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009103083471A CN102042517A (en) | 2009-10-16 | 2009-10-16 | Lighting device |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2312197A1 true EP2312197A1 (en) | 2011-04-20 |
Family
ID=43127826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10187284A Withdrawn EP2312197A1 (en) | 2009-10-16 | 2010-10-12 | Illumination device |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2312197A1 (en) |
JP (1) | JP2011086615A (en) |
KR (1) | KR20110041992A (en) |
CN (1) | CN102042517A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015082573A (en) * | 2013-10-22 | 2015-04-27 | 住友電気工業株式会社 | Epitaxial wafer and method of manufacturing the same |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040066142A1 (en) * | 2002-10-03 | 2004-04-08 | Gelcore, Llc | LED-based modular lamp |
US20060193130A1 (en) * | 2005-02-28 | 2006-08-31 | Kazuo Ishibashi | LED lighting system |
EP1914470A1 (en) * | 2006-10-20 | 2008-04-23 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Semiconductor lamp |
WO2008093978A1 (en) * | 2007-01-31 | 2008-08-07 | Zalman Tech Co., Ltd. | Led assembly including cooler having heat pipe |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001243809A (en) * | 2000-02-28 | 2001-09-07 | Mitsubishi Electric Lighting Corp | Led electric bulb |
CN101660739B (en) * | 2005-04-08 | 2012-01-18 | 东芝照明技术株式会社 | Lamp |
JP3133586U (en) * | 2007-04-02 | 2007-07-19 | 禎圖 謝 | LED lamp heat dissipation structure |
JP5063187B2 (en) * | 2007-05-23 | 2012-10-31 | シャープ株式会社 | Lighting device |
JP3139851U (en) * | 2007-12-11 | 2008-03-06 | 呉祖耀 | LED light |
JP2009170114A (en) * | 2008-01-10 | 2009-07-30 | Toshiba Lighting & Technology Corp | Led bulb and luminaire |
-
2009
- 2009-10-16 CN CN2009103083471A patent/CN102042517A/en active Pending
-
2010
- 2010-09-13 JP JP2010204269A patent/JP2011086615A/en active Pending
- 2010-09-16 KR KR1020100090986A patent/KR20110041992A/en not_active Application Discontinuation
- 2010-10-12 EP EP10187284A patent/EP2312197A1/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040066142A1 (en) * | 2002-10-03 | 2004-04-08 | Gelcore, Llc | LED-based modular lamp |
US20060193130A1 (en) * | 2005-02-28 | 2006-08-31 | Kazuo Ishibashi | LED lighting system |
EP1914470A1 (en) * | 2006-10-20 | 2008-04-23 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Semiconductor lamp |
WO2008093978A1 (en) * | 2007-01-31 | 2008-08-07 | Zalman Tech Co., Ltd. | Led assembly including cooler having heat pipe |
Also Published As
Publication number | Publication date |
---|---|
CN102042517A (en) | 2011-05-04 |
JP2011086615A (en) | 2011-04-28 |
KR20110041992A (en) | 2011-04-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8092043B2 (en) | LED lamp tube with heat distributed uniformly | |
US6864513B2 (en) | Light emitting diode bulb having high heat dissipating efficiency | |
US8267549B2 (en) | Illumination device | |
US20110001417A1 (en) | LED bulb with heat removal device | |
JP2010526438A (en) | LED connector assembly with heat sink | |
CN102032481A (en) | Lamp with base and lighting equipment | |
EP2392851A1 (en) | LED lighting device | |
US20120075858A1 (en) | Led bulb | |
EP2077415B1 (en) | LED bulb with heat removal device | |
JP2016518015A (en) | LIGHTING DEVICE AND METHOD FOR MANUFACTURING LIGHTING DEVICE | |
TWM437919U (en) | Light emission device | |
WO2011138363A1 (en) | Led lamp assembly | |
US9568154B2 (en) | Apparatus, method and system for a modular light-emitting diode circuit assembly | |
US8622589B2 (en) | LED lighting device | |
US20130039064A1 (en) | Light emitting diode bulb | |
US20120043885A1 (en) | Led lamp with circling led modules and encapsulation | |
US20240011627A1 (en) | Light emitting device having improved illumination and manufacturing flexibility | |
US8882306B2 (en) | Lighting device | |
CN105588025B (en) | LED lighting device | |
EP2312918A1 (en) | Illumination Device | |
EP2312197A1 (en) | Illumination device | |
US20110006679A1 (en) | LED bulb with an enlarged irradiation range by arranging led elements in three-dimension | |
CN202769315U (en) | Lamp bulb | |
TW201441527A (en) | Lamp | |
CN108302344A (en) | Light emitting diode bulb and car light module |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20101012 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
17Q | First examination report despatched |
Effective date: 20120903 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20130115 |