EP2143989A1 - Lighting unit, LED module and method - Google Patents

Lighting unit, LED module and method Download PDF

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Publication number
EP2143989A1
EP2143989A1 EP09165351A EP09165351A EP2143989A1 EP 2143989 A1 EP2143989 A1 EP 2143989A1 EP 09165351 A EP09165351 A EP 09165351A EP 09165351 A EP09165351 A EP 09165351A EP 2143989 A1 EP2143989 A1 EP 2143989A1
Authority
EP
European Patent Office
Prior art keywords
led module
lighting unit
housing
head
unit according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09165351A
Other languages
German (de)
French (fr)
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EP2143989B1 (en
Inventor
Jan Dr. Kostelnik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuerth Elektronik Rot am See GmbH and Co KG
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Wuerth Elektronik Rot am See GmbH and Co KG
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Publication of EP2143989A1 publication Critical patent/EP2143989A1/en
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00Lighting devices or systems using a string or strip of light sources
    • F21S4/20Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the invention relates to a lighting unit, an LED module and a method for mounting an LED module.
  • Lighting units with LEDs as light sources are known. Such lighting units serve, for example, as room lighting or for lighting artworks or billboards.
  • a flexible circuit board is mounted on a support, which has a plurality of LED areas. These LEDs are mounted on the flexible printed circuit board where they are electrically interconnected ( DE 103 50 913 ).
  • Another lighting unit with LED is off DE 10 2005 018175 known.
  • a device for contacting optoelectronic components, in particular light emitting diodes, on busbars consists of a pot-like holding element, which has on its underside latching elements for latching the retaining element on the busbar and at its top one or more through holes for the terminals of the device to be contacted.
  • the invention is based on the object to provide an improved lighting unit for at least one LED module, a corresponding LED module and a method for mounting an LED module to a lighting unit.
  • the invention proposes a lighting unit with the features mentioned in claim 1. Further developments of the invention are the subject of dependent claims.
  • the lighting unit thus contains at least one LED module, which is for example mounted on the outside of a housing.
  • busbar which is connectable to another power supply.
  • a contact element is mechanically and electrically connected for each pole of the LED module.
  • head element for each pole of the LED module, which produces the electrical connection with the LED module outside the housing wall and within the housing, the electrical and mechanical connection with the contact element.
  • a "head element” is understood in particular to be any fastening element for fastening the LED module to the outside of the housing, wherein the fastening element is designed to form an electrically conductive connection between the LED module and the busbar via a contact element that can be mounted on the fastening element ,
  • the bus bar can be made by methods known per se for the manufacture of printed circuit boards.
  • the bus bar has a carrier material, such as e.g. made of plastic, which carries a conductor track on one or both sides.
  • the busbar can be a length of z. B. 0, 25 to 1 m, in particular 0.5 m, and a width of e.g. 5 mm to 20mm, in particular 12mm.
  • the head element rests with the underside of its protruding over its shaft head on the housing facing away from the front of the LED module.
  • Another proposed by the invention mounting option is that the head element is pressed with at least one contact pin in a plated-through hole of the LED module.
  • the head element like the contact element, is a metallic or at least partially metallic element. It can therefore also be used to position the LED module and, if necessary, fix it mechanically.
  • the LED module When formed as a partial metallic element, it preferably has a sheath or coating of insulating material to isolate it from the edge of an opening of a metal housing.
  • connection between the head element and the contact element can be done in one of the usual way for the connection of metallic elements.
  • connection of metallic elements can be a connector that can make both a mechanical and an electrically secure connection.
  • connection is a screw connection.
  • head element is designed as a sleeve element, for example with a blind hole.
  • Such a bore or blind hole can be used to compress the head element with the contact element.
  • the opening of the formed as a sleeve member head member has an internal thread.
  • the head element can be screwed onto an external thread of the contact element.
  • This external thread can be advantageously formed on a threaded projection of the contact element. It is possible in this way that the head element connected to the contact element merges with its outer surface flush into the outer surface of the contact element.
  • the contact element is pressed with a plurality of contact pins in plated-through holes of the busbar. This pressing leads both to a mechanically secure and to an electrically good connection between the contact element and the busbar.
  • the contact element is connected to terminal pads in SMT.
  • the mechanical connection between the head element and the contact element is a spacer element forms, which defines a distance between the housing wall and the busbar defined.
  • the LED module is thermally conductively connected to the housing wall. In the operation of the LED module occurring heat can therefore be transferred to the housing wall and thus derived.
  • this can according to the invention have an opening with a closed edge for at least one head element.
  • the head element is thus guided from the front through this opening and then pushed through the opening of the wall of the housing inwardly, where it is then connected to the contact element.
  • the LED module for at least one head element has an outgoing from an edge of the LED module recess, which allows for appropriate dimensioning, the LED module laterally under the head of the head element to push.
  • the LED module can have several individual LEDs, which are also optically separated from one another.
  • the LED module has a large-area LED.
  • the LED module has a plurality of individual LEDs.
  • the LED module has a single large-area LED.
  • At least one contact element is connected to a connection pad of the busbar in SMT technology.
  • the bus bar can be inserted into the housing.
  • a groove is formed for this purpose in the housing, via which the busbar can be inserted into the housing until the busbar reaches an end position.
  • the end position can be given for example by an end stop or a latching connection to be formed in the end position.
  • the already mounted on the busbar contact elements are positioned below the openings of the housing, so that an LED module can be conveniently mounted from the outside of the lighting unit using the head elements.
  • the lighting unit with the preassembled busbar and mounted on the busbar contact elements is delivered to a customer. The customer can then even mount the LED modules requested by the customer on the lighting unit or dismantle an LED module to replace it with a new one.
  • the easy interchangeability of an LED module of the lighting unit has the particular advantage that an existing LED module can be replaced by a new, advanced LED module.
  • the invention makes it possible that the LED module is replaced by an organic LED module, ie an LED module with a so-called organic light emitting diode (OLED).
  • OLED organic light emitting diode
  • the lighting unit is modular, with a busbar defining a module.
  • a busbar for example, be designed to power eight to ten LED modules.
  • the bus bar must be dimensioned accordingly to supply the supply current for the multiple LED modules, the supply current may be in the range of a few amps.
  • the housing has at least a portion of a metallic material, which is thermally conductively connected to the LED module when the LED module is mounted on the illumination unit. This makes it possible to use the housing as a heat sink to dissipate power loss of the LED module.
  • the housing can be made entirely of a metallic material such. B. aluminum.
  • the invention relates to an LED module for mounting to an embodiment of a lighting unit according to the invention.
  • the one or more LEDs, which carries the carrier of the LED module, can be electrically connected to the carrier via per se known construction and connection technologies, in particular so-called. Bonding technologies, such. B. by SMD, flip-chip or chip-on-board techniques.
  • the LED module has an exemption, in particular a defined depth exemption, which is also referred to here as a cavity in which an LED of the LED module is implanted.
  • a defined depth exemption which is also referred to here as a cavity in which an LED of the LED module is implanted.
  • the invention relates to a method for mounting an LED module to an embodiment of a lighting unit according to the invention.
  • Embodiments of the method according to the invention are particularly advantageous since the customer can make the assembly itself as well as the disassembly, especially for the purpose of initial installation, the replacement of a defective LED module or to replace the LED module by an advanced LED module greater efficiency, especially an OLED module.
  • FIG. 1 shows a plan view of a busbar.
  • the busbar includes a busbar support 1, which is responsible for the mechanical stability of the busbar;
  • a conventional printed circuit board substrate can be used.
  • On the carrier 1 of the busbar are two printed conductors 2, which are insulated from each other. These interconnects 2 are connected to different potential.
  • the tracks are widened, with the left in FIG. 1 to be seen broadened sites with plated through holes 3 are provided. For example, each of the widened locations has a number of 4, 5 or 3 * 3 holes 3. As will be shown below, these widened locations of the conductor tracks 2 serve to connect contact elements, so-called power elements.
  • the FIG. 2 shows a plan view of an LED module 4.
  • the LED module 4 includes a flat support 5, on which in FIG. 2 three LEDs 6 are mounted.
  • the carrier 5 has the shape of an elongated rectangle, at both ends of which a hole 7 is formed in each case. In the in FIG. 2 It can not be seen that the carrier 5 is designed as a plate with parallel upper sides and lower sides.
  • the support 5 is again formed as an elongated rectangle with holes 7 in the region of its two ends.
  • the LED 6 has here but the shape of an elongated rectangle whose length is about the arrangement of the three LEDs 6 of the FIG. 2 equivalent.
  • FIG. 4 While in the embodiments according to FIG. 2 and FIG. 3 at the ends of the carrier 5 holes 7 are arranged with a closed edge shows FIG. 4 an LED module 4, at the two ends recesses 8 are present, which are open to the edge.
  • FIG. 5 shows how the individual parts are arranged to form a lighting unit.
  • a housing with a housing wall 9.
  • an LED module 4 is to be attached.
  • This LED module 4 runs in FIG. 5 with its longitudinal direction perpendicular to the plane of the drawing.
  • a through opening 11 is present.
  • the LED module 4 is arranged in the region of this opening 11.
  • a head element 12 with its shaft 13 is inserted through the hole 7 of the LED module 4 and through the opening 11 in the housing wall 9.
  • the head element 12 has a flat with respect to its shaft 13 radially projecting head 14.
  • the diameter of the shaft 13 of the head element 12 is smaller than the diameter of the hole 11 in the housing wall 9, so that there can be a clearance between the outside of the shaft 13 and the edge of the hole 11 on all sides.
  • the shaft 13 of the head element 12 is provided by the head 14 facing away from the front side with a blind hole having an internal thread.
  • the head element 12 is designed to cooperate with a contact element 15, which is also referred to as a power element.
  • This contact element 15, which consists of solid metal, points to his in FIG. 5 lower side a plurality of pins 16 on.
  • 4 contact pins 16 may be present on the contact element 15, depending on how the holes 3 in the conductor track 2 are arranged. These usually have a rectangular or square cross-section.
  • the arrangement of the contact pins 16 corresponds to the arrangement of the plated-through holes 3 in the conductor 2 on the carrier 1 of the busbar. This is so in FIG. 5 shown.
  • the contact element 15 is pressed with its contact pins 16 in the plated-through holes 3. The offset is determined by the concern of the body of the contact element 15 at the top of the conductor 2.
  • the contact element 15 has a projection 17 with an external thread. On this external thread, the head member 14 is screwed. In this case, the underside of the head 14 of the head element 12 comes to rest on the upper side of the carrier 5 of the LED module 4 and establishes an electrical connection there. The result of this process is in FIG. 6 shown.
  • the head member 12 engages with a widened head 14 at the top of the LED module 4.
  • a head element is pressed with an LED module.
  • FIG. 7 one of the FIG. 2 corresponding representation of a further LED module 4, in which for connection to a head element 12 'at both ends of the carrier 5 through holes 20 are provided, for example four such openings 20.
  • the associated head element 12' has at its the LED module 4 facing Side of the number of holes 20 corresponding number of pins 21, see FIG. 8 , For example, 4, 5 or 3 * 3 pins 21. With these pins 21, the head member 12 'is pressed into the holes 20. This is schematically in FIG. 8 shown.
  • the LED module 4 which now has at both ends in each case such a head piece 12 ', reversed and inserted with the head element 12' ahead through the opening 11 of the housing, see FIG. 9 .
  • the combination of head element 12' and contact element 15 with the Busbar 1 pressed this step is not from the intersection of the FIG. 6 different. It is of course also possible that the process of compression between the head piece 12 'and the contact element 15 on the one hand and the contact element 15 and the busbar 1 on the other hand, a different order.
  • FIG. 11 a busbar, in which there is a conductor track 2 with recesses on the upper side. With this existing on the top of conductor 2 groups of plated holes are connected. On the opposite side of the busbar 1, a conductor path is also present, which is connected to the other through-plated holes 3. As a result, more total space is available for each of the two tracks 2.
  • FIG. 12 schematically shows the arrangement of an LED module with a carrier 5 and an LED 6.
  • a head element 12 ' is used, which has on its underside a blind hole, the left in FIG. 12 indicated by dashed lines.
  • the associated contact element 15 has on its upper side a projection 17, which is adapted to the blind hole. The connection between the two parts is done by a compression.
  • the head element 12 "assigned to the other end of the carrier 5 of the LED module has a projection on its underside facing the contact element, while the upwardly directed end face of the contact element 15 has a blind hole which fits for this purpose.
  • contact elements 15 have contact pins 16 with different arrangement patterns on their undersides, which are intended for connection to the through-holes 3 of the busbar 1. This is in FIG. 12 represented by the fact that the two contact elements have a different number of contact pins.
  • FIG. 14 shows a perspective embodiment of a lighting unit according to the invention, wherein in this embodiment, both conductor tracks two are arranged on the same side of the carrier 1 of the busbar.
  • FIG. 15 shows a further embodiment, wherein at one end of the carrier 1 of the busbar, a connector 22 is located, via which the busbar can be connected to a power supply.

Abstract

The unit has an LED module (4) arranged at an outer side of a housing. A printed circuit board (1) with a printed circuit board carrier is provided for supplying current to the LED module. A head element (12) e.g. casing element, and another head element are connected with contact elements (15) by an opening (11) of the housing, where the head elements manufacture connections for the LED module at a front side of the housing. The head element exhibits a head with a lower side that lies at a front side of the carrier of the LED module.

Description

Die Erfindung betrifft eine Beleuchtungseinheit, ein LED-Modul und ein Verfahren zur Montage eines LED-Moduls.The invention relates to a lighting unit, an LED module and a method for mounting an LED module.

Beleuchtungseinheiten mit LEDs als Lichtquellen sind bekannt. Solche Beleuchtungseinheiten dienen z.B. als Raumbeleuchtung oder zur Beleuchtung von Kunstwerken oder Werbetafeln.Lighting units with LEDs as light sources are known. Such lighting units serve, for example, as room lighting or for lighting artworks or billboards.

Bei einem bekannten LED-Modul ist auf einem Träger eine flexible Leiterplatte angebracht, die eine Mehrzahl von LED-Bereichen aufweist. Diese LEDs sind auf die flexible Leiterplatte montiert und dort elektrisch verschaltet ( DE 103 50 913 ).In a known LED module, a flexible circuit board is mounted on a support, which has a plurality of LED areas. These LEDs are mounted on the flexible printed circuit board where they are electrically interconnected ( DE 103 50 913 ).

Eine weitere Beleuchtungseinheit mit LED ist aus DE 10 2005 018175 bekannt.Another lighting unit with LED is off DE 10 2005 018175 known.

Aus der DE 35 24 138 A1 ist ferner eine Vorrichtung zum Kontaktieren von optoelektronischen Bauelementen, insbesondere Leuchtdioden, auf Stromschienen bekannt. Sie besteht aus einem topfartigen Halteelement, das an seiner Unterseite Rastelemente zum Verrasten des Halteelements auf der Stromschiene und an seiner Oberseite eine oder mehrere Durchgangsöffnungen für die Anschlüsse des zu kontaktierenden Bauelementes aufweist.From the DE 35 24 138 A1 Furthermore, a device for contacting optoelectronic components, in particular light emitting diodes, on busbars is known. It consists of a pot-like holding element, which has on its underside latching elements for latching the retaining element on the busbar and at its top one or more through holes for the terminals of the device to be contacted.

Der Erfindung liegt die Aufgabe zu Grunde, eine verbesserte Beleuchtungseinheit fĂĽr zumindest ein LED-Modul, ein entsprechendes LED-Modul und ein Verfahren zur Montage eines LED-Moduls an einer Beleuchtungseinheit zu schaffen..The invention is based on the object to provide an improved lighting unit for at least one LED module, a corresponding LED module and a method for mounting an LED module to a lighting unit.

Zur Lösung dieser Aufgabe schlägt die Erfindung eine Beleuchtungseinheit mit den im Anspruch 1 genannten Merkmalen vor. Weiterbildungen der Erfindung sind Gegenstand von Unteransprüchen.To solve this problem, the invention proposes a lighting unit with the features mentioned in claim 1. Further developments of the invention are the subject of dependent claims.

Die Beleuchtungseinheit enthält also mindestens ein LED-Modul, das beispielsweise an der Außenseite eines Gehäuses angebracht ist. Zur Stromversorgung dient eine in dem Gehäuse angeordnete Stromschiene, die mit einer weiteren Stromversorgung verbindbar ist. Mit der Stromschiene ist für jeden Pol des LED-Moduls ein Kontaktelement mechanisch und elektrisch verbunden. Durch eine Öffnung der Gehäusewandung greift ein Kopfelement für jeden Pol des LED-Moduls hindurch, das außerhalb der Gehäusewand die elektrische Verbindung mit dem LED-Modul und innerhalb des Gehäuses die elektrische und mechanische Verbindung mit dem Kontaktelement herstellt.The lighting unit thus contains at least one LED module, which is for example mounted on the outside of a housing. To power a arranged in the housing busbar, which is connectable to another power supply. With the busbar a contact element is mechanically and electrically connected for each pole of the LED module. Through an opening of the housing wall engages a head element for each pole of the LED module, which produces the electrical connection with the LED module outside the housing wall and within the housing, the electrical and mechanical connection with the contact element.

Unter einem "Kopfelement" wird hier insbesondere jedes Befestigungselement zur Befestigung des LED-Moduls an der Außenseite des Gehäuses verstanden, wobei das Befestigungselement dazu ausgebildet ist, eine elektrisch leitende Verbindung zwischen dem LED-Modul und der Stromschiene über ein an dem Befestigungselement montierbares Kontaktelement auszubilden.In this case, a "head element" is understood in particular to be any fastening element for fastening the LED module to the outside of the housing, wherein the fastening element is designed to form an electrically conductive connection between the LED module and the busbar via a contact element that can be mounted on the fastening element ,

Die Stromschiene kann mit Hilfe von Verfahren hergestellt werden, die an sich für die Fertigung von Leiterplatten bekannt sind. Beispielsweise hat die Stromschiene ein Trägermaterial, wie z.B. aus Kunststoff, das einseitig oder beidseitig eine Leiterbahn trägt. Die Stromschiene kann eine Länge von z. B. 0, 25 bis 1 m, insbesondere 0,5 m, und eine Breite von z.B. 5 mm bis 20mm, insbesondere 12mm aufweisen.The bus bar can be made by methods known per se for the manufacture of printed circuit boards. For example, the bus bar has a carrier material, such as e.g. made of plastic, which carries a conductor track on one or both sides. The busbar can be a length of z. B. 0, 25 to 1 m, in particular 0.5 m, and a width of e.g. 5 mm to 20mm, in particular 12mm.

In Weiterbildung der Erfindung kann vorgesehen sein, dass das Kopfelement mit der Unterseite seines über seinen Schaft vorspringenden Kopfes an der dem Gehäuse abgewandten Vorderseite des LED-Moduls anliegt. Dieses Anliegen an einer mit jeweils einem Anschluss des LED-Moduls verbundenen Metallisierung kann zu einer großflächigen Anlage und damit zu geringen Übergangswiderständen führen.In a further development of the invention can be provided that the head element rests with the underside of its protruding over its shaft head on the housing facing away from the front of the LED module. This concern to one connected to one terminal of the LED module metallization can lead to a large-scale system and thus to low contact resistance.

Eine andere von der Erfindung vorgeschlagene Befestigungsmöglichkeit besteht darin, dass das Kopfelement mit mindestens einem Kontaktstift in eine durchkontaktierte Bohrung des LED-Moduls eingepresst ist.Another proposed by the invention mounting option is that the head element is pressed with at least one contact pin in a plated-through hole of the LED module.

Bei dem Kopfelement handelt es sich, ebenso wie bei dem Kontaktelement, um ein metallisches oder mindestens teilweise metallisches Element. Es kann daher auch dazu verwendet werden, das LED-Modul zu positionieren und gegebenenfalls auch mechanisch festzulegen. Wenn es als teilweise metallisches Element ausgebildet ist, so weist es vorzugsweise eine Hülle oder einen Überzug aus einem isolierendem Material auf, um es gegenüber dem Rand einer Öffnung eines aus Metall bestehenden Gehäuses zu isolieren.The head element, like the contact element, is a metallic or at least partially metallic element. It can therefore also be used to position the LED module and, if necessary, fix it mechanically. When formed as a partial metallic element, it preferably has a sheath or coating of insulating material to isolate it from the edge of an opening of a metal housing.

Die Verbindung zwischen dem Kopfelement und dem Kontaktelement kann auf eine der zur Verbindung von metallischen Elementen ĂĽblichen Weise geschehen. Beispielsweise kann es sich um eine Steckverbindung handeln, die sowohl eine mechanische als auch eine elektrisch sichere Verbindung herstellen kann.The connection between the head element and the contact element can be done in one of the usual way for the connection of metallic elements. For example It can be a connector that can make both a mechanical and an electrically secure connection.

Es ist aber ebenfalls möglich und liegt im Rahmen der Erfindung, dass es sich bei der Verbindung um eine Verschraubung handelt. Es kann insbesondere vorgesehen sein, dass das Kopfelement als Hülsenelement ausgebildet ist, beispielsweise mit einer Sacklochbohrung.However, it is also possible and within the scope of the invention that the connection is a screw connection. It can be provided in particular that the head element is designed as a sleeve element, for example with a blind hole.

Eine solche Bohrung oder Sacklochbohrung kann dazu verwendet werden, das Kopfelement mit dem Kontaktelement zu verpressen.Such a bore or blind hole can be used to compress the head element with the contact element.

Ebenfalls möglich ist es, dass die Öffnung des als Hülsenelement ausgebildeten Kopfelements ein Innengewinde aufweist. Mit diesem Innengewinde kann das Kopfelement auf ein Außengewinde des Kontaktelements aufgeschraubt werden. Dieses Außengewinde kann mit Vorteil an einem Gewindeansatz des Kontaktelements ausgebildet sein. Es ist auf diese Weise möglich, dass das mit dem Kontaktelement verbundene Kopfelement mit seiner Außenfläche bündig in die Außenfläche des Kontaktelements übergeht.It is also possible that the opening of the formed as a sleeve member head member has an internal thread. With this internal thread, the head element can be screwed onto an external thread of the contact element. This external thread can be advantageously formed on a threaded projection of the contact element. It is possible in this way that the head element connected to the contact element merges with its outer surface flush into the outer surface of the contact element.

Zur Verbindung des Kontaktelements mit den leitenden Bereichen der Stromschiene kann eine der üblichen Befestigungsmethoden verwendet werden, wie sie bei so genannten Powerelementen und Leiterplatten bekannt sind. Insbesondere schlägt die Erfindung vor, dass das Kontaktelement mit mehreren Kontaktstiften in durchkontaktierte Bohrungen der Stromschiene eingepresst ist. Dieses Einpressen führt sowohl zu einer mechanisch sicheren als auch zu einer elektrisch guten Verbindung zwischen dem Kontaktelement und der Stromschiene.To connect the contact element with the conductive regions of the busbar, one of the usual attachment methods can be used, as they are known in so-called power elements and printed circuit boards. In particular, the invention proposes that the contact element is pressed with a plurality of contact pins in plated-through holes of the busbar. This pressing leads both to a mechanically secure and to an electrically good connection between the contact element and the busbar.

Es ist aber ebenfalls möglich und wird von der Erfindung vorgeschlagen, dass das Kontaktelement mit Anschlusspads in SMT verbunden wird.However, it is also possible and is proposed by the invention that the contact element is connected to terminal pads in SMT.

In Weiterbildung der Erfindung kann vorgesehen sein, dass die mechanische Verbindung zwischen dem Kopfelement und dem Kontaktelement ein Abstandselement bildet, das einen Abstand zwischen der Gehäusewand und der Stromschiene definiert herstellt.In a development of the invention, it can be provided that the mechanical connection between the head element and the contact element is a spacer element forms, which defines a distance between the housing wall and the busbar defined.

In nochmaliger Weiterbildung der Erfindung kann vorgesehen sein, dass zwischen dem Kopfelement und dem Rand der Öffnung des Gehäuses, durch das das Kopfelement hindurchgreift, ein radialer Abstand vorhanden ist.In a further development of the invention it can be provided that between the head element and the edge of the opening of the housing through which the head element engages, a radial distance is present.

Erfindungsgemäß kann in Weiterbildung vorgesehen sein, dass das LED-Modul wärmeleitend mit der Gehäusewand verbunden ist. Bei dem Betrieb des LED-Moduls auftretende Wärme kann daher auf die Gehäusewand übertragen und damit abgeleitet werden.According to the invention may be provided in a development that the LED module is thermally conductively connected to the housing wall. In the operation of the LED module occurring heat can therefore be transferred to the housing wall and thus derived.

Damit das Kopfelement mit der Unterseite seines Kopfs an dem LED-Modul angreifen kann, kann dieses erfindungsgemäß eine Öffnung mit einem geschlossenen Rand für mindestens ein Kopfelement aufweisen. Das Kopfelement wird also von der Vorderseite her durch diese Öffnung hindurch geführt und dann durch die Öffnung der Wand des Gehäuses nach innen geschoben, wo es dann mit dem Kontaktelement verbunden wird.So that the head element can engage with the underside of its head on the LED module, this can according to the invention have an opening with a closed edge for at least one head element. The head element is thus guided from the front through this opening and then pushed through the opening of the wall of the housing inwardly, where it is then connected to the contact element.

Es ist aber ebenfalls möglich und wird von der Erfindung vorgeschlagen, dass das LED-Modul für mindestens ein Kopfelement eine von einem Rand des LED-Moduls ausgehende Ausnehmung aufweist, was es bei entsprechender Dimensionierung ermöglicht, das LED-Modul seitlich unter den Kopf des Kopfelements zu schieben.However, it is also possible and is proposed by the invention that the LED module for at least one head element has an outgoing from an edge of the LED module recess, which allows for appropriate dimensioning, the LED module laterally under the head of the head element to push.

Das LED-Modul kann, je nach dem gewĂĽnschten Anwendungsfall, mehrere einzelne auch optisch voneinander getrennte LEDs aufweisen.Depending on the desired application, the LED module can have several individual LEDs, which are also optically separated from one another.

Es ist aber ebenfalls möglich, dass das LED-Modul eine großflächige LED aufweist.But it is also possible that the LED module has a large-area LED.

Nach einer Ausführungsform der Erfindung ist zwischen dem Kopfelement und dem Rand der Öffnung des Gehäuses ein Abstand vorhanden.According to one embodiment of the invention, there is a gap between the head element and the edge of the opening of the housing.

Nach einer AusfĂĽhrungsform der Erfindung hat das LED-Modul mehrere einzelne LEDs.According to one embodiment of the invention, the LED module has a plurality of individual LEDs.

Nach einer Ausführungsform der Erfindung hat das LED-Modul eine einzige großflächige LED.According to one embodiment of the invention, the LED module has a single large-area LED.

Nach einer AusfĂĽhrungsform der Erfindung ist mindestens ein Kontaktelement mit einem Anschlusspad der Stromschiene in SMT Technik verbunden.According to one embodiment of the invention, at least one contact element is connected to a connection pad of the busbar in SMT technology.

Nach einer Ausführungsform der Erfindung ist die Stromschiene in das Gehäuse einschiebbar. Beispielsweise ist hierzu in dem Gehäuse eine Nut ausgebildet, über die die Stromschiene in das Gehäuse eingeschoben werden kann, bis die Stromschiene eine Endposition erreicht. Die Endposition kann zum Beispiel durch einen Endanschlag oder eine in der Endposition auszubildende Rastverbindung gegeben sein. Wenn sich die Stromschiene in deren Endposition befindet, so sind die an der Stromschiene bereits montierten Kontaktelemente unterhalb der Öffnungen des Gehäuses positioniert, so dass ein LED-Modul bequem von außen an der Beleuchtungseinheit mit Hilfe der Kopfelemente montiert werden kann. Beispielsweise wird die Beleuchtungseinheit mit der vormontierten Stromschiene und den an der Stromschiene montierten Kontaktelementen zu einem Kunden ausgeliefert. Der Kunde kann dann selbst die von dem Kunden gewünschten LED-Module an der Beleuchtungseinheit montieren, bzw. ein LED-Modul demontieren, um es durch ein neues zu ersetzen.According to one embodiment of the invention, the bus bar can be inserted into the housing. For example, a groove is formed for this purpose in the housing, via which the busbar can be inserted into the housing until the busbar reaches an end position. The end position can be given for example by an end stop or a latching connection to be formed in the end position. When the busbar is in its end position, the already mounted on the busbar contact elements are positioned below the openings of the housing, so that an LED module can be conveniently mounted from the outside of the lighting unit using the head elements. For example, the lighting unit with the preassembled busbar and mounted on the busbar contact elements is delivered to a customer. The customer can then even mount the LED modules requested by the customer on the lighting unit or dismantle an LED module to replace it with a new one.

Die leichte Austauschbarkeit eines LED-Moduls der Beleuchtungseinheit hat insbesondere den Vorteil, dass ein existentes LED-Modul durch ein neues, weiterentwickeltes LED-Modul ausgetauscht werden kann. Insbesondere ermöglicht es die Erfindung, dass das LED-Modul durch ein organisches LED-Modul ersetzt wird, d. h. ein LED-Modul mit einer so genannten organic light emitting diode (OLED). Bei zukünftig zu erwartenden Weiterentwicklungen der LED-Technik kann also der Kunde die Beleuchtungseinheit weiterverwenden und muss lediglich die LED-Module durch neue ersetzen.The easy interchangeability of an LED module of the lighting unit has the particular advantage that an existing LED module can be replaced by a new, advanced LED module. In particular, the invention makes it possible that the LED module is replaced by an organic LED module, ie an LED module with a so-called organic light emitting diode (OLED). For future developments in LED technology, the customer can continue to use the lighting unit and only has to replace the LED modules with new ones.

Nach einer Ausführungsform der Erfindung ist die Beleuchtungseinheit modular aufgebaut, wobei eine Stromschiene ein Modul definiert. Eine Stromschiene kann beispielsweise zur Energieversorgung von acht bis zehn LED-Modulen ausgebildet sein. In diesem Fall muss die Stromschiene entsprechend dimensioniert sein, um den Versorgungsstrom für die mehreren LED-Module zuführen zu können, wobei der Versorgungsstrom im Bereich von einigen Ampere liegen kann.According to one embodiment of the invention, the lighting unit is modular, with a busbar defining a module. A busbar, for example, be designed to power eight to ten LED modules. In this case, the bus bar must be dimensioned accordingly to supply the supply current for the multiple LED modules, the supply current may be in the range of a few amps.

Nach einer Ausführungsform der Erfindung hat das Gehäuse zumindest einen Abschnitt aus einem metallischen Material, der mit dem LED-Modul wärmeleitend verbunden ist, wenn das LED-Modul an der Beleuchtungseinheit montiert ist. Dies ermöglicht es, das Gehäuse als Kühlkörper zur Abfuhr von Verlustleistung des LED-Moduls zu verwenden. Insbesondere kann das Gehäuse insgesamt aus einem metallischen Material wie z. B. Aluminium bestehen.According to one embodiment of the invention, the housing has at least a portion of a metallic material, which is thermally conductively connected to the LED module when the LED module is mounted on the illumination unit. This makes it possible to use the housing as a heat sink to dissipate power loss of the LED module. In particular, the housing can be made entirely of a metallic material such. B. aluminum.

In einem weiteren Aspekt betrifft die Erfindung ein LED-Modul zur Montage an einer Ausführungsform einer erfindungsgemäßen Beleuchtungseinheit. Die eine oder mehreren LEDs, die der Träger des LED-Moduls trägt, können elektrisch mit dem Träger über an sich bekannte Aufbau- und Verbindungstechnologien, insbesondere sog. Bonding-Technologien, verbunden sein, wie z. B. mittels SMD, Flip-Chip oder Chip-on-Board Techniken.In another aspect, the invention relates to an LED module for mounting to an embodiment of a lighting unit according to the invention. The one or more LEDs, which carries the carrier of the LED module, can be electrically connected to the carrier via per se known construction and connection technologies, in particular so-called. Bonding technologies, such. B. by SMD, flip-chip or chip-on-board techniques.

Nach einer Ausführungsform der Erfindung hat das LED-Modul eine Freistellung, insbesondere eine definierte Tiefenfreistellung, die hier auch als Kavität bezeichnet wird, in der eine LED des LED-Moduls implantiert ist. Durch die Implantation der LED in die Freistellung wird der Abstand zwischen der LED und dem Gehäuse und damit der Wärmeübergangswiderstand zwischen der LED und dem Gehäuse reduziert, so dass die Verlustleistung entsprechend effizient abgeführt werden kann.According to one embodiment of the invention, the LED module has an exemption, in particular a defined depth exemption, which is also referred to here as a cavity in which an LED of the LED module is implanted. By implanting the LED in the clearance, the distance between the LED and the housing and thus the heat transfer resistance between the LED and the housing is reduced, so that the power dissipation can be correspondingly efficiently dissipated.

In einem weiteren Aspekt betrifft die Erfindung ein Verfahren zur Montage eines LED-Moduls an einer Ausführungsform einer erfindungsgemäßen Beleuchtungseinheit. Ausführungsformen des erfindungsgemäßen Verfahrens sind besonders vorteilhaft, da der Kunde selbst die Montage sowie auch die Demontage vornehmen kann, insbesondere für die Zwecke der Erstmontage, des Austausches eines defekten LED-Moduls oder zum Ersatz des LED-Moduls durch ein weiterentwickeltes LED-Modul größerer Effizienz, insbesondere eines OLED-Moduls.In a further aspect, the invention relates to a method for mounting an LED module to an embodiment of a lighting unit according to the invention. Embodiments of the method according to the invention are particularly advantageous since the customer can make the assembly itself as well as the disassembly, especially for the purpose of initial installation, the replacement of a defective LED module or to replace the LED module by an advanced LED module greater efficiency, especially an OLED module.

Weitere Merkmale, Einzelheiten und VorzĂĽge der Erfindung ergeben sich aus den AnsprĂĽchen, deren Wortlaut durch Bezugnahme zum Inhalt der Beschreibung gemacht wird, der folgenden Beschreibung bevorzugter AusfĂĽhrungsformen der Erfindung sowie anhand der Zeichnung. Hierbei zeigen:

Figur 1
eine Draufsicht auf eine Stromschiene mit zwei getrennte Leiterbahnen;
Figur 2
eine Draufsicht auf ein erstes LED-Modul;
Figur 3
eine Draufsicht auf ein zweites LED-Modul;
Figur 4
eine Draufsicht auf ein drittes LED-Modul;
Figur 5
einen schematischen Schnitt durch eine Gehäusewandung mit den zur Befestigung des LED-Moduls dienenden Einzelteilen in auseinander ge zogenem Zustand;
Figur 6
das Ergebnis der Zusammensetzung der Einzelteile der Figur 5;
Figur 7
eine der Figur zwei entsprechende Darstellung eines weiteren LED-Moduls;
Figur 8
die Anbringung eines Kopfelements an einem LED-Modul;
Figur 9
eine der Figur 5 entsprechende Darstellung;
Figur 10
eine der Figur 6 entsprechende Darstellung;
Figur 11
eine der Figur 1 entsprechende Darstellung einer Stromschiene;
Figur 12
schematisch die Anbringung eines LED-Moduls aus einer Richtung quer zur Darstellung der Figuren 9 und 10;
Figur 13
stark vereinfacht eine Art der Ausbildung von Kontaktelementen;
Figur 14
eine perspektische Ansicht eines Abschnitts einer erfindungsgemäßen Beleuchtungseinheit;
Figur 15
einen Abschnitt einer Ausführungsform einer erfindungsgemäßen Strom schiene mit montierten Kontaktelementen.
Further features, details and advantages of the invention will become apparent from the claims, the wording of which is incorporated by reference into the content of the description, the following description of preferred embodiments of the invention and from the drawing. Hereby show:
FIG. 1
a plan view of a busbar with two separate tracks;
FIG. 2
a plan view of a first LED module;
FIG. 3
a plan view of a second LED module;
FIG. 4
a plan view of a third LED module;
FIG. 5
a schematic section through a housing with the serving for mounting the LED module items in auseinanderge pulled state;
FIG. 6
the result of the composition of the items FIG. 5 ;
FIG. 7
one of the figure two corresponding representation of another LED module;
FIG. 8
the attachment of a header to an LED module;
FIG. 9
one of the FIG. 5 corresponding representation;
FIG. 10
one of the FIG. 6 corresponding representation;
FIG. 11
one of the FIG. 1 corresponding representation of a busbar;
FIG. 12
schematically the attachment of an LED module from a direction transverse to the representation of FIGS. 9 and 10 ;
FIG. 13
greatly simplifies a type of training of contact elements;
FIG. 14
a perspective view of a portion of a lighting unit according to the invention;
FIG. 15
a section of an embodiment of a power rail according to the invention with mounted contact elements.

Figur 1 zeigt eine Draufsicht auf eine Stromschiene. Die Stromschiene enthält einen Stromschienenträger 1, der für die mechanische Stabilität der Stromschiene zuständig ist; zur Realisierung des Stromschienenträgers 1 kann ein übliches Leiterplattenträgermaterial verwendet werden. Auf dem Träger 1 der Stromschiene befinden sich zwei Leiterbahnen 2, die voneinander isoliert sind. Diese Leiterbahnen 2 stehen mit unterschiedlichem Potential in Verbindung. An mehreren Stellen sind die Leiterbahnen verbreitert, wobei die links in Figur 1 zu sehenden verbreiterten Stellen mit durchkontaktierten Löchern 3 versehen sind. Beispielsweise hat jeder der verbreiterten Stellen eine Anzahl von 4, 5 oder 3*3 Löchern 3. Wie im Folgenden noch gezeigt werden wird, dienen diese verbreiterten Stellen der Leiterbahnen 2 zum Anschluss von Kontaktelementen, so genannten Powerelementen. FIG. 1 shows a plan view of a busbar. The busbar includes a busbar support 1, which is responsible for the mechanical stability of the busbar; For the realization of the busbar support 1, a conventional printed circuit board substrate can be used. On the carrier 1 of the busbar are two printed conductors 2, which are insulated from each other. These interconnects 2 are connected to different potential. In several places, the tracks are widened, with the left in FIG. 1 to be seen broadened sites with plated through holes 3 are provided. For example, each of the widened locations has a number of 4, 5 or 3 * 3 holes 3. As will be shown below, these widened locations of the conductor tracks 2 serve to connect contact elements, so-called power elements.

Die Figur 2 zeigt eine Draufsicht auf ein LED-Modul 4. Das LED-Modul 4 enthält einen flachen Träger 5, an dem in Figur 2 drei LEDs 6 angebracht sind. Der Träger 5 weist die Form eines lang gestreckten Rechtecks auf, an dessen beiden Enden jeweils ein Loch 7 ausgebildet ist. In der in Figur 2 dargestellten Draufsicht ist nicht zu sehen, dass der Träger 5 als Platte mit parallelen Oberseiten und Unterseiten ausgebildet ist.The FIG. 2 shows a plan view of an LED module 4. The LED module 4 includes a flat support 5, on which in FIG. 2 three LEDs 6 are mounted. The carrier 5 has the shape of an elongated rectangle, at both ends of which a hole 7 is formed in each case. In the in FIG. 2 It can not be seen that the carrier 5 is designed as a plate with parallel upper sides and lower sides.

Bei der Ausführungsform der Figur 3 ist der Träger 5 wiederum als langgestrecktes Rechteck mit Löchern 7 im Bereich seiner beiden Enden ausgebildet. Die LED 6 weist hier aber die Form eines langgestreckten Rechtecks auf, dessen Länge etwa der Anordnung der drei LEDs 6 der Figur 2 entspricht.In the embodiment of the FIG. 3 the support 5 is again formed as an elongated rectangle with holes 7 in the region of its two ends. The LED 6 has here but the shape of an elongated rectangle whose length is about the arrangement of the three LEDs 6 of the FIG. 2 equivalent.

Während bei den Ausführungsformen nach Figur 2 und Figur 3 an den Enden des Trägers 5 Löcher 7 mit geschlossenem Rand angeordnet sind, zeigt Figur 4 ein LED-Modul 4, an dessen beiden Enden Ausnehmungen 8 vorhanden sind, die zum Rand hin offen sind.While in the embodiments according to FIG. 2 and FIG. 3 at the ends of the carrier 5 holes 7 are arranged with a closed edge shows FIG. 4 an LED module 4, at the two ends recesses 8 are present, which are open to the edge.

Die Figur 5 zeigt, wie die einzelnen Teile angeordnet werden, um eine Beleuchtungseinheit zu bilden. Es ist ein Gehäuse mit einer Gehäusewand 9 vorhanden. An der in Figur 5 oben dargestellten Außenseite 10 des Gehäuses soll ein LED-Modul 4 angebracht werden. Dieses LED-Modul 4 verläuft in Figur 5 mit seiner Längsrichtung senkrecht zur Zeichnungsebene. In der Gehäusewand 9 ist eine durchgehende Öffnung 11 vorhanden. Das LED-Modul 4 wird im Bereich dieser Öffnung 11 angeordnet. Von der Außenseite her wird ein Kopfelement 12 mit seinem Schaft 13 durch das Loch 7 des LED-Moduls 4 hindurch und durch die Öffnung 11 in der Gehäusewandung 9 hindurch gesteckt. Das Kopfelement 12 weist einen flachen gegenüber seinem Schaft 13 radial vorspringenden Kopf 14 auf. Der Durchmesser des Schafts 13 des Kopfelements 12 ist kleiner als der Durchmesser des Lochs 11 in der Gehäusewandung 9, so dass allseits ein Abstand zwischen der Außenseite des Schafts 13 und dem Rand des Lochs 11 vorhanden sein kann. Der Schaft 13 des Kopfelements 12 ist von der dem Kopf 14 abgewandten Stirnseite her mit einem Sackloch versehen, das ein Innengewinde aufweist.The FIG. 5 shows how the individual parts are arranged to form a lighting unit. There is a housing with a housing wall 9. At the in FIG. 5 shown outside 10 of the housing, an LED module 4 is to be attached. This LED module 4 runs in FIG. 5 with its longitudinal direction perpendicular to the plane of the drawing. In the housing wall 9, a through opening 11 is present. The LED module 4 is arranged in the region of this opening 11. From the outside, a head element 12 with its shaft 13 is inserted through the hole 7 of the LED module 4 and through the opening 11 in the housing wall 9. The head element 12 has a flat with respect to its shaft 13 radially projecting head 14. The diameter of the shaft 13 of the head element 12 is smaller than the diameter of the hole 11 in the housing wall 9, so that there can be a clearance between the outside of the shaft 13 and the edge of the hole 11 on all sides. The shaft 13 of the head element 12 is provided by the head 14 facing away from the front side with a blind hole having an internal thread.

Das Kopfelement 12 ist zum Zusammenwirken mit einem Kontaktelement 15 ausgebildet, das auch als Powerelement bezeichnet wird. Dieses Kontaktelement 15, das aus massivem Metall besteht, weist auf seiner in Figur 5 unteren Seite mehrere Kontaktstifte 16 auf. Beispielsweise können 4, 5 oder 3*3 Kontaktstifte 16 an dem Kontaktelement 15 vorhanden sein, je nachdem, wie die Bohrungen 3 in der Leiterbahn 2 angeordnet sind. Diese haben üblicherweise einen rechteckigen oder quadratischen Querschnitt. Der Anordnung der Kontaktstifte 16 entspricht die Anordnung der durchkontaktierten Bohrungen 3 in der Leiterbahn 2 auf den Träger 1 der Stromschiene. Dies ist so in Figur 5 dargestellt. Das Kontaktelement 15 wird mit seinen Kontaktstiften 16 in die durchkontaktierten Bohrungen 3 eingepresst. Die Einpresstiefe wird durch das Anliegen des Korpus des Kontaktelements 15 an der Oberseite der Leiterbahn 2 bestimmt.The head element 12 is designed to cooperate with a contact element 15, which is also referred to as a power element. This contact element 15, which consists of solid metal, points to his in FIG. 5 lower side a plurality of pins 16 on. For example, 4, 5 or 3 * 3 contact pins 16 may be present on the contact element 15, depending on how the holes 3 in the conductor track 2 are arranged. These usually have a rectangular or square cross-section. The arrangement of the contact pins 16 corresponds to the arrangement of the plated-through holes 3 in the conductor 2 on the carrier 1 of the busbar. This is so in FIG. 5 shown. The contact element 15 is pressed with its contact pins 16 in the plated-through holes 3. The offset is determined by the concern of the body of the contact element 15 at the top of the conductor 2.

An der den Kontaktstiften 16 abgewandten Seite enthält das Kontaktelement 15 einen Vorsprung 17 mit einem Außengewinde. Auf dieses Außengewinde wird das Kopfelement 14 aufgeschraubt. Dabei kommt die Unterseite des Kopfs 14 des Kopfelements 12 auf der Oberseite des Trägers 5 des LED-Moduls 4 zur Anlage und stellt dort eine elektrische Verbindung her. Das Ergebnis dieses Vorgangs ist in Figur 6 dargestellt.At the side facing away from the contact pins 16, the contact element 15 has a projection 17 with an external thread. On this external thread, the head member 14 is screwed. In this case, the underside of the head 14 of the head element 12 comes to rest on the upper side of the carrier 5 of the LED module 4 and establishes an electrical connection there. The result of this process is in FIG. 6 shown.

Bei der bislang behandelten Ausführungsform greift das Kopfelement 12 mit einem verbreiterten Kopf 14 an der Oberseite des LED-Moduls 4 an. Es ist aber ebenfalls möglich, dass ein Kopfelement mit einem LED-Modul verpresst wird. Hierzu zeigt Figur 7 eine der Figur 2 entsprechende Darstellung eines weiteren LED-Moduls 4, bei dem zur Verbindung mit einem Kopfelement 12' an beiden Enden des Trägers 5 durchkontaktierte Bohrungen 20 vorhanden sind, beispielsweise vier solche Öffnungen 20. Das zugehörige Kopfelement 12' weist an seiner dem LED-Modul 4 zugewandten Seite eine der Zahl der Bohrungen 20 entsprechende Zahl von Kontaktstiften 21 auf, siehe Figur 8, beispielsweise 4, 5 oder 3*3 Kontaktstifte 21. Mit diesen Kontaktstiften 21 wird das Kopfelement 12' in die Bohrungen 20 eingepresst. Dies ist schematisch in Figur 8 dargestellt.In the embodiment discussed so far, the head member 12 engages with a widened head 14 at the top of the LED module 4. But it is also possible that a head element is pressed with an LED module. This shows FIG. 7 one of the FIG. 2 corresponding representation of a further LED module 4, in which for connection to a head element 12 'at both ends of the carrier 5 through holes 20 are provided, for example four such openings 20. The associated head element 12' has at its the LED module 4 facing Side of the number of holes 20 corresponding number of pins 21, see FIG. 8 , For example, 4, 5 or 3 * 3 pins 21. With these pins 21, the head member 12 'is pressed into the holes 20. This is schematically in FIG. 8 shown.

Anschließend wird das LED-Modul 4, das nun an beiden Enden jeweils ein solches Kopfstück 12' aufweist, umgedreht und mit dem Kopfelement 12' voran durch die Öffnung 11 des Gehäuses hindurchgesteckt, siehe Figur 9. Dann erfolgt eine Verpressung zwischen dem Kopfelement 12' und dem Kontaktelement 15. Anschließend wird die Kombination aus Kopfelement 12' und Kontaktelement 15 mit der Stromschiene 1 verpresst, wobei dieser Schritt sich nicht von dem Schnitt der Figur 6 unterscheidet. Es ist natürlich auch möglich, dass der Vorgang des Verpressens zwischen dem Kopfstück 12' und dem Kontaktelement 15 einerseits und dem Kontaktelement 15 und der Stromschiene 1 andererseits einer anderen Reihenfolge erfolgt.Subsequently, the LED module 4, which now has at both ends in each case such a head piece 12 ', reversed and inserted with the head element 12' ahead through the opening 11 of the housing, see FIG. 9 , Then there is a compression between the head element 12 'and the contact element 15. Subsequently, the combination of head element 12' and contact element 15 with the Busbar 1 pressed, this step is not from the intersection of the FIG. 6 different. It is of course also possible that the process of compression between the head piece 12 'and the contact element 15 on the one hand and the contact element 15 and the busbar 1 on the other hand, a different order.

Während bei der Stromschiene 1, die in Figur 1 dargestellt ist, beide Leiterbahnen 2 auf der Oberseite angeordnet sind, zeigt Figur 11 eine Stromschiene, bei der auf der Oberseite eine Leiterbahn 2 mit Ausnehmungen vorhanden ist. Mit dieser auf der Oberseite vorhandenen Leiterbahn 2 sind Gruppen von durchkontaktierten Bohrungen verbunden. Auf der gegenüberliegenden Seite der Stromschiene 1 ist ebenfalls eine Leiterbahn vorhanden, die mit den anderen durchkontaktierten Bohrungen 3 verbunden ist. Dadurch steht für jede der beiden Leiterbahnen 2 insgesamt mehr Platz zur Verfügung.While at the busbar 1, the in FIG. 1 is shown, both tracks 2 are arranged on the top, shows FIG. 11 a busbar, in which there is a conductor track 2 with recesses on the upper side. With this existing on the top of conductor 2 groups of plated holes are connected. On the opposite side of the busbar 1, a conductor path is also present, which is connected to the other through-plated holes 3. As a result, more total space is available for each of the two tracks 2.

Es wurde eingangs erwähnt, dass die Kopfelemente 12 auf verschiedene Arten mit den Kontaktelementen 15 verbunden werden können. Ein solches Anwendungsbeispiel, wo dies besonders sinnvoll ist, zeigt die Figur 12. Die Figur 12 zeigt schematisch die Anordnung eines LED-Moduls mit einem Träger 5 und einer LED 6. Für das eine Ende des Trägers 5 wird ein Kopfelement 12' verwendet, das an seiner Unterseite eine Sacklochbohrung aufweist, die links in Figur 12 gestrichelt angedeutet ist. Das zugeordnete Kontaktelement 15 weist auf seiner Oberseite einen Ansatz 17 auf, der an die Sacklochbohrung angepasst ist. Die Verbindung zwischen beiden Teilen geschieht durch eine Verpressung.It was mentioned in the beginning that the head elements 12 can be connected to the contact elements 15 in various ways. Such an application example, where this is particularly useful, shows the FIG. 12 , The FIG. 12 schematically shows the arrangement of an LED module with a carrier 5 and an LED 6. For one end of the carrier 5, a head element 12 'is used, which has on its underside a blind hole, the left in FIG. 12 indicated by dashed lines. The associated contact element 15 has on its upper side a projection 17, which is adapted to the blind hole. The connection between the two parts is done by a compression.

Das dem anderen Ende des Trägers 5 des LED-Moduls zugeordnete Kopfelement 12" weist an seiner dem Kontaktelement zugewandten Unterseite einen Vorsprung auf, während die nach oben gerichtete Stirnfläche des Kontaktelements 15 eine hierzu passende Sacklochbohrung aufweist. Auch hier geschieht die Verbindung durch eine Verpressung. Durch diese an beiden Enden des Trägers 5 des LED-Moduls unterschiedliche Arten des Kopfelements 12 kann eine falsche Verbindung mit den Kontaktelementen 15 vermieden werden. Hierdurch wird also ein Verdrehschutz ermöglicht.The head element 12 "assigned to the other end of the carrier 5 of the LED module has a projection on its underside facing the contact element, while the upwardly directed end face of the contact element 15 has a blind hole which fits for this purpose. By this at both ends of the carrier 5 of the LED module different types of the head member 12 may be a wrong connection be avoided with the contact elements 15. As a result, a twist protection is thus possible.

Eine weitere Sicherung gegen falsche Verbindung könnte auch dadurch geschehen, dass die Kontaktelemente 15 an ihrer zur Verbindung mit den durchkontaktierten Bohrungen 3 der Stromschiene 1 bestimmten Unterseiten Kontaktstifte 16 mit unterschiedlichem Anordnungsbild aufweisen. Dies ist in Figur 12 dadurch dargestellt, dass die beiden Kontaktelemente eine unterschiedliche Zahl von Kontaktstiften aufweisen.A further safeguard against incorrect connection could also be achieved in that the contact elements 15 have contact pins 16 with different arrangement patterns on their undersides, which are intended for connection to the through-holes 3 of the busbar 1. This is in FIG. 12 represented by the fact that the two contact elements have a different number of contact pins.

Diese Art eines Verdrehschutzes kann natürlich nicht nur mit den Kopfelementen 12 geschehen, die in den Träger 5 des LED-Moduls eingepresst werden, sondern auch mit den Kopfelementen 12 der Ausführungsform nach Figur 5 und 6. Dies ist in Figur 13 dargestellt.Of course, this type of torsion protection can not only be done with the head elements 12, which are pressed into the carrier 5 of the LED module, but also with the head elements 12 of the embodiment according to FIGS. 5 and 6 , This is in FIG. 13 shown.

Die Figur 14 zeigt eine perspektivische Ausführungsform einer erfindungsgemäßen Beleuchtungseinheit, wobei bei dieser Ausführungsform beide Leiterbahnen zwei auf derselben Seite des Trägers 1 der Stromschiene angeordnet sind.The FIG. 14 shows a perspective embodiment of a lighting unit according to the invention, wherein in this embodiment, both conductor tracks two are arranged on the same side of the carrier 1 of the busbar.

Die Figur 15 zeigt eine weitere Ausführungsform, wobei sich an einem Ende des Trägers 1 der Stromschiene ein Konnektor 22 befindet, über den die Stromschiene mit einer Stromversorgung verbunden werden kann.The FIG. 15 shows a further embodiment, wherein at one end of the carrier 1 of the busbar, a connector 22 is located, via which the busbar can be connected to a power supply.

Claims (15)

Beleuchtungseinheit, mit einem Gehäuse,
zumindest einem an der Außenseite des Gehäuses angeordneten LED-Modul (4),
einer in dem Gehäuse angeordneten Stromschiene (1) zur Stromversorgung des LED-Moduls (4),
zwei mit der Stromschiene (1) elektrisch und mechanisch verbundenen Kontaktelementen (15), sowie mit
zwei durch je eine Öffnung (11) des Gehäuses hindurch greifenden mit den Kontaktelementen (15) verbundenen Kopfelementen (12, 12'), die an der Vorderseite des Gehäuses die Anschlüsse für das LED-Modul (4) herstellen.
Lighting unit, with a housing,
at least one LED module (4) arranged on the outside of the housing,
a bus bar (1) arranged in the housing for supplying power to the LED module (4),
two with the busbar (1) electrically and mechanically connected contact elements (15), as well as with
two head elements (12, 12 ') which engage with the contact elements (15) and each engage through an opening (11) of the housing, which make the connections for the LED module (4) on the front side of the housing.
Beleuchtungseinheit nach Anspruch 1, bei der das Kopfelement (12) einen Kopf (14) mit einer Unterseite aufweist und mit dieser Unterseite an der Vorderseite eines Trägers (5) des LED-Moduls (4) anliegt.Lighting unit according to claim 1, wherein the head element (12) has a head (14) with a bottom and rests with this underside on the front side of a support (5) of the LED module (4). Beleuchtungseinheit nach Anspruch 1, bei der das Kopfelement (12') mit Kontaktstiften (21) in durchkontaktierte Bohrungen (20) des LED-Moduls (4) eingepresst ist.Lighting unit according to claim 1, wherein the head element (12 ') with contact pins (21) in through-contacted holes (20) of the LED module (4) is pressed. Beleuchtungseinheit nach einem der vorhergehenden Ansprüche, bei der das Kopfelement (12, 12') das LED-Modul (4) mechanisch positioniert und/oder festlegt.Lighting unit according to one of the preceding claims, in which the head element (12, 12 ') mechanically positions and / or fixes the LED module (4). Beleuchtungseinheit nach einem der vorhergehenden Ansprüche, bei der das Kopfelement (12) mit dem Kontaktelement (15) verschraubt oder verpresst ist.Lighting unit according to one of the preceding claims, in which the head element (12) is screwed or pressed to the contact element (15). Beleuchtungseinheit nach einem der vorhergehenden Ansprüche, bei der das Kopfelement (12, 12') als Hülsenelement ausgebildet ist , bei der das Hülsenelement ein Gewinde an seiner Innenseite aufweist, das mit einem Gewindeansatz (17) des Kontaktelements (15) in Eingriff steht.Lighting unit according to one of the preceding claims, wherein the head element (12, 12 ') is formed as a sleeve member, wherein the sleeve member has a thread on its inner side, which is in engagement with a threaded projection (17) of the contact element (15). Beleuchtungseinheit nach einem der vorhergehenden Ansprüche, bei der das Kontaktelement (15) in durchkontaktierte Bohrungen (3) der Stromschiene (1) eingepresst ist.Lighting unit according to one of the preceding claims, wherein the contact element (15) in through-contacted holes (3) of the busbar (1) is pressed. Beleuchtungseinheit nach einem der vorhergehenden Ansprüche,
bei der das Kontaktelement (15) zusammen mit dem Kopfelement (12, 12') ein Abstandselement zwischen dem Gehäuse und der Stromschiene darstellt.
Lighting unit according to one of the preceding claims,
in which the contact element (15) together with the head element (12, 12 ') constitutes a spacer element between the housing and the busbar.
Beleuchtungseinheit nach einem der vorhergehenden Ansprüche, bei der das LED-Modul (4) wärmeleitend mit der Gehäusewand (9) verbunden ist.Lighting unit according to one of the preceding claims, wherein the LED module (4) is thermally conductively connected to the housing wall (9). Beleuchtungseinheit nach einem der vorhergehenden Ansprüche, bei der das LED-Modul (4) für mindestens ein Kopfelement (12) eine Öffnung (7) mit einem geschlossenen Rand aufweist und/oder bei der das LED-Modul (4) für mindestens ein Kopfelement (12) eine von einem Rand des LED-Moduls (4) ausgehende den Schaft (13) des Kopfelements (12) aufnehmende Ausnehmung (8) aufweist.Lighting unit according to one of the preceding claims, wherein the LED module (4) for at least one head element (12) has an opening (7) with a closed edge and / or in which the LED module (4) for at least one head element ( 12) has one of an edge of the LED module (4) outgoing the shaft (13) of the head element (12) receiving recess (8). Beleuchtungseinheit nach einem der vorhergehenden Ansprüche, bei der die an den beiden Enden des Trägers (5) eines LED-Moduls (4) angeordneten Kopfelemente (12) eine unterschiedliche Verbindungsart mit den zugeordneten Kontaktelementen (15) aufweisen und/oder bei der die an den beiden Enden des Trägers (5) eines LED-Moduls (4) mithilfe der Kopfelemente (12) angebrachten Kontaktelemente (15) eine unterschiedliche Verbindungsart mit den Leiterbahnen (2) der Stromschiene (1) aufweisen.Lighting unit according to one of the preceding claims, in which the head elements (12) arranged at the two ends of the support (5) of an LED module (4) have a different type of connection with the associated contact elements (15) and / or in which they are connected to the Both ends of the carrier (5) of an LED module (4) by means of the head elements (12) attached contact elements (15) have a different connection with the tracks (2) of the busbar (1). Beleuchtungseinheit nach einem der vorhergehenden Ansprüche, wobei die Stromschiene in das Gehäuse bis zu einer Endposition einschiebbar ist, wobei die Kontaktelemente (15) unterhalb der Öffnungen (11) des Gehäuses positioniert sind, wenn die Endposition erreicht ist, sodass das zumindest eine LED-Modul (4) mit Hilfe der Kopfelemente an den Kontaktelementen montierbar, bzw. von den Kontaktelementen demontierbar ist.Lighting unit according to one of the preceding claims, wherein the bus bar is inserted into the housing to an end position, wherein the contact elements (15) are positioned below the openings (11) of the housing when the end position is reached, so that the at least one LED module (4) can be mounted on the contact elements with the aid of the head elements, or can be removed from the contact elements. Beleuchtungseinheit nach einem der vorhergehenden Ansprüche, wobei zumindest ein Abschnitt des Gehäuses aus einem metallischen Material besteht, wobei der Abschnitt des Gehäuses wärmeleitend über die Kopfelemente mit dem LED-Modul verbunden ist, sodass der Abschnitt des Gehäuses einen Kühlkörper zur Abfuhr von Verlustleistung des LED-Moduls bildet.Lighting unit according to one of the preceding claims, wherein at least a portion of the housing consists of a metallic material, wherein the portion of the housing is thermally conductively connected via the head elements with the LED module, so that the portion of the housing a heat sink to dissipate power loss of the LED Module forms. LED-Modul für eine Beleuchtungseinheit nach einem der vorhergehenden Ansprüche, wobei das LED-Modul Befestigungsmittel zur Aufnahme der Kopfelemente (12, 12;) hat, über die das LED-Modul an der Beleuchtungseinheit mechanisch zu befestigen ist, und über die eine elektrisch leitende Verbindung zur Stromversorgung der LED-Module und eine wärmeleitende Verbindung zur Abfuhr von Verlustleistung über das Gehäuse der Beleuchtungseinheit ausbildbar sind.LED module for a lighting unit according to one of the preceding claims, wherein the LED module has fastening means for receiving the head elements (12, 12;), via which the LED module is mechanically fastened to the lighting unit, and via which an electrically conductive Connection to the power supply of the LED modules and a thermally conductive connection to dissipate power loss on the housing of the lighting unit can be formed. Verfahren zur Montage eines LED-Moduls (4) an einer Beleuchtungseinheit nach einem der vorhergehenden Ansprüche 1 bis 13, mit folgenden Schritten: - Positionierung des LED-Moduls über den Öffnungen (11) des Gehäuses, - Verbindung des LED-Moduls mit den Kontaktelementen mit Hilfe der Kopfelemente. Method for mounting an LED module (4) on a lighting unit according to one of the preceding claims 1 to 13, with the following steps: Positioning of the LED module over the openings (11) of the housing, - Connection of the LED module with the contact elements by means of the head elements.
EP09165351A 2008-07-11 2009-07-13 Lighting unit, LED module and method Active EP2143989B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE202008009589U DE202008009589U1 (en) 2008-07-11 2008-07-11 lighting unit

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EP2143989A1 true EP2143989A1 (en) 2010-01-13
EP2143989B1 EP2143989B1 (en) 2011-05-18

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3348896A1 (en) * 2017-01-16 2018-07-18 OSRAM GmbH Mounting profile, separable signage module capable of emitting light, and illumination system

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009042615B4 (en) * 2009-09-23 2015-08-27 Bjb Gmbh & Co. Kg Connection element for the electrical connection of an LED
DE102012216665B4 (en) 2012-09-18 2014-05-15 WĂĽrth Elektronik GmbH & Co. KG lighting unit

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030218417A1 (en) * 2002-05-22 2003-11-27 Unity Opto Technology Co., Ltd. Light emitting diode lamp with light emitting diode module having improved heat dissipation
WO2006122392A1 (en) * 2005-05-20 2006-11-23 Tir Systems Ltd. Cove illumination module and system
EP1760392A1 (en) * 2005-08-29 2007-03-07 Patent-Treuhand-Gesellschaft fĂĽr elektrische GlĂĽhlampen mbH A mounting structure for LED lighting systems

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10350913B4 (en) 2003-10-31 2005-11-03 Osram Opto Semiconductors Gmbh Light-emitting diode module and method for its production
DE102005018175A1 (en) 2005-04-19 2006-10-26 Patent-Treuhand-Gesellschaft fĂĽr elektrische GlĂĽhlampen mbH LED module and LED lighting device with several LED modules

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030218417A1 (en) * 2002-05-22 2003-11-27 Unity Opto Technology Co., Ltd. Light emitting diode lamp with light emitting diode module having improved heat dissipation
WO2006122392A1 (en) * 2005-05-20 2006-11-23 Tir Systems Ltd. Cove illumination module and system
EP1760392A1 (en) * 2005-08-29 2007-03-07 Patent-Treuhand-Gesellschaft fĂĽr elektrische GlĂĽhlampen mbH A mounting structure for LED lighting systems

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3348896A1 (en) * 2017-01-16 2018-07-18 OSRAM GmbH Mounting profile, separable signage module capable of emitting light, and illumination system

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ATE510166T1 (en) 2011-06-15
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