EP1863329A1 - EMC insulation - Google Patents

EMC insulation Download PDF

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Publication number
EP1863329A1
EP1863329A1 EP07010172A EP07010172A EP1863329A1 EP 1863329 A1 EP1863329 A1 EP 1863329A1 EP 07010172 A EP07010172 A EP 07010172A EP 07010172 A EP07010172 A EP 07010172A EP 1863329 A1 EP1863329 A1 EP 1863329A1
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EP
European Patent Office
Prior art keywords
foam structure
electrically conductive
housing wall
computer housing
emc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP07010172A
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German (de)
French (fr)
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EP1863329B1 (en
EP1863329B8 (en
Inventor
Wilhelm Neukam
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Fujitsu Technology Solutions GmbH
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Fujitsu Technology Solutions GmbH
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Publication date
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Publication of EP1863329A1 publication Critical patent/EP1863329A1/en
Publication of EP1863329B1 publication Critical patent/EP1863329B1/en
Application granted granted Critical
Publication of EP1863329B8 publication Critical patent/EP1863329B8/en
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/22—Installations of cables or lines through walls, floors or ceilings, e.g. into buildings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0018—Casings with provisions to reduce aperture leakages in walls, e.g. terminals, connectors, cables

Definitions

  • the invention relates to an EMC seal on a computer housing wall comprising a first foam structure having an electrically conductive surface, the computer housing wall and the first foam structure arranged thereon having at least one passage opening for an element.
  • EMC gaskets of the abovementioned type are essentially used for sealing against electromagnetic interference in electronic devices such as computers, and for this purpose are arranged on housing walls, in particular on housing walls with one or more housing leadthrough openings. Such housing walls are referred to in computers as an I / O shield. Such EMC seals are frequently used there.
  • the document D1 10143418 C1 shows a material for shielding electromagnetic radiation for electrical contacting of electrically conductive components.
  • a material is provided, which is formed by a flexible, preferably open-pore foam body made of plastic or rubber, which is provided with a metallic surface coating throughout.
  • a shielded housing for a distribution panel is known in which a for openings for the cable for shielding with at least two electrically conductive elastic Foam lips are provided to the inserted cable thick final.
  • Computers are electronic devices that are to a special degree to be sealed against electromagnetic interference. This is also due to the fact that computers operate in ever higher clock frequencies, and thus the requirements for the seals against electromagnetic interference and interference have also increased. With increasing clock frequencies, the wavelengths of the electromagnetic interference to be shielded are very short, so that alone an EMC seal with conductive surface is no longer sufficient. Nevertheless, to obtain satisfactory seals against electromagnetic interference is therefore accompanied by great technical and monetary effort.
  • an EMC seal of the aforementioned type is provided as a first foam structure, wherein a second foam structure, with an electrically conductive foam material, is arranged at the passage opening and the passage opening in cross-section so reduced that the second foam structure is applied to the element elastic or positive fit ,
  • FIG. 1 shows an EMC seal with first and second foam structures.
  • the EMC seal consists of a first foam structure 10.
  • the first foam structure 10 has an electrically conductive surface 20, is formed flat and is arranged on a computer housing wall 30.
  • the Computergekorusewandung 30 has through openings 40, which are adapted to carry out elements 60 such as switches, plug contacts, cables. Each of the elements carried out will be determined at the relevant implementation opening. This is done with screw or clamped connections so that the EMC seal is compressed by the element. Thus, a secure contact formation between the elements 60 and the EMC seal.
  • the passage openings 40 may have different shapes and dimensions.
  • the first foam structure 10 likewise comprises leadthrough openings 11, which are adapted to the passage openings 40 of the computer housing wall 30.
  • the passage openings 11 of the first foam structure 10 are greater than or equal to, but preferably larger than, the passage openings 40 in the computer housing wall 30 so that a second foam structure 50 can be inserted.
  • a second foam structure 50 is provided for each lead-through opening 30, which is designed such that it bears against the elements 60.
  • the cross section of the passage openings 51 in the second foam structure thus provides electrical contact to the elements 60, and also provides an electrical Contact with the electrically conductive surface 20 of the first foam structure 10.
  • An advantageous embodiment of the invention provides to form the electrically conductive surface 20 of the first foam structure 10 of an electrically conductive fabric.
  • An electrically non-conductive foam structure having an electrically conductive surface 20 is more economical to purchase than an electrically conductive foam structure.
  • a first foam structure 10, which is arranged on the computer housing wall 30, is arranged in its planar shape on the computer housing wall 30 such that the electrically conductive surface 20 is spaced from the electrically conductive computer housing wall 30.
  • the electrically conductive surface 20 continues over the outer edges 70 of the first foam structure 10.
  • the cross-sectional areas of the recesses 51 of the second foam structure 50 are slightly smaller in cross-section than the lead-through openings 11 of the first foam structure 10 and more particularly as the computer housing wall lead-through openings 40, but in particular smaller than the cross-sectional areas of the elements 60 passed through the foam structures. Thus, electrical contact between the elements and the second foam structure 50 is improved.
  • the second foam structure 50 is also formed flat, with two basic assembly forms offer for the second foam structure 50.
  • the first mounting form is to insert the second foam structure 50 in a recess of the first foam structure 10 in a form-fitting manner.
  • the second form of assembly is a simple overlying of the second foam structure 50 over the first foam structure 10. In both cases, there is electrical contact between the element 60 and the housing wall 30 formed over the first foam structure 10 and the second foam structure 50.

Abstract

The sealing has a foamed material structure (10) with an electrically conducting surface (20), which is arranged on a computer housing wall (30). A feed-through opening (11), which is larger than another feed-though opening (40) is arranged in the wall. Another foamed material structure (50) with an electrically conducting foamed material is positively insertable into the opening (11). A feed-though opening (51) in the structure (50) is reduced in cross section such that the structure (50) lies against a component (60) such as switch, in an elastic or positive manner.

Description

Die Erfindung betrifft eine EMV-Abdichtung an einer Computergehäusewandung umfassend eine erste Schaumstoffstruktur mit einer elektrisch leitfähigen Oberfläche, wobei die Computergehäusewandung und die darauf angeordnete erste Schaumstoffstruktur zumindest eine Durchführungsöffnung für ein Element aufweist.The invention relates to an EMC seal on a computer housing wall comprising a first foam structure having an electrically conductive surface, the computer housing wall and the first foam structure arranged thereon having at least one passage opening for an element.

EMV-Abdichtungen der oben genannten Art finden im Wesentlichen Verwendung zur Abdichtung gegenüber elektromagnetischen Störungen bei elektronischen Geräten wie Computern, und sind dazu an Gehäusewandungen angeordnet, insbesondere an Gehäusewandungen mit einer oder mehreren Gehäusedurchführungsöffnungen. Solche Gehäusewandungen werden bei Computern als I/O-Shield bezeichnet. Dort finden solche EMV-Abdichtungen häufig Verwendung.EMC gaskets of the abovementioned type are essentially used for sealing against electromagnetic interference in electronic devices such as computers, and for this purpose are arranged on housing walls, in particular on housing walls with one or more housing leadthrough openings. Such housing walls are referred to in computers as an I / O shield. Such EMC seals are frequently used there.

Die Druckschrift D1 10143418 C1 zeigt ein Material zur Abschirmung elektromagnetischer Strahlung zur elektrischen Kontaktierung von elektrisch leitenden Bauteilen. Dabei ist ein Material vorgesehen, dass durch einen flexiblen, vorzugsweise offenporigen Schaumkörper aus Kunststoff oder Gummi gebildet ist, welcher mit einer metallischen Oberflächenbeschichtung durchgängig versehen ist.The document D1 10143418 C1 shows a material for shielding electromagnetic radiation for electrical contacting of electrically conductive components. In this case, a material is provided, which is formed by a flexible, preferably open-pore foam body made of plastic or rubber, which is provided with a metallic surface coating throughout.

Weiter ist aus der Druckschrift DE 29620388 U1 ein abgeschirmtes Gehäuse für ein Verteilerfeld bekannt, bei dem ein für Öffnungen für die Kabel zur Abschirmung mit mindestens zwei elektrisch leitfähigen elastischen Schaumstofflippen um das eingeführte Kabel dick abschließend versehen sind.Next is from the document DE 29620388 U1 a shielded housing for a distribution panel is known in which a for openings for the cable for shielding with at least two electrically conductive elastic Foam lips are provided to the inserted cable thick final.

Durch die Durchführungsöffnungen der Gehäusewandung sind Bedienelemente, Stecker, Steckkontakte, Kabel, und ähnliches geführt, die zur Bedienung des elektrischen oder elektronischen Gerätes erforderlich sind. Nach außen sind diese Elemente selbst häufig durch eine Abschirmungsmaßnahme gegen elektromagnetische Störungen geschützt. Die EMV-Abdichtung mit der elektrisch leitfähigen Oberfläche kontaktiert mittels dieser die Abschirmungsmaßnahmen der Elemente und verbindet so das Computergehäuse mit den Abschirmungsmaßnahmen elektrisch. Durch die dauerelastischen Eigenschaften der EMV-Abdichtung wird eine Kontaktbildung und Abdichtung an Stellen erreicht, an denen sonst direkt Metall mit Metall kontaktieren würde.Through the passage openings of the housing wall controls, plugs, plug contacts, cables, and the like are performed, which are required to operate the electrical or electronic device. Outwardly, these elements themselves are often protected by a shielding measure against electromagnetic interference. The EMC seal with the electrically conductive surface contacted by this the shielding measures of the elements and thus connects the computer case with the shielding measures electrically. Due to the permanently elastic properties of the EMC seal, contact formation and sealing is achieved at locations where metal would otherwise contact metal directly.

Computer sind elektronische Geräte, die in einem besonderen Maß gegen elektromagnetische Störungen abzudichten sind. Dies ist auch dadurch begründet, dass Computer in immer höheren Taktfrequenzen arbeiten, und damit die Anforderungen an die Abdichtungen gegen elektromagnetische Beeinflussung und Störungen ebenfalls angestiegen sind. Mit steigenden Taktfrequenzen sind die Wellenlängen der abzuschirmenden elektromagnetischen Störungen sehr kurz, so dass alleine eine EMV-Abdichtung mit leitfähiger Oberfläche nicht mehr ausreicht. Dennoch zufrieden stellende Abdichtungen gegen elektromagnetische Störungen zu erwirken ist deshalb von großem technischem und monetärem Aufwand begleitet.Computers are electronic devices that are to a special degree to be sealed against electromagnetic interference. This is also due to the fact that computers operate in ever higher clock frequencies, and thus the requirements for the seals against electromagnetic interference and interference have also increased. With increasing clock frequencies, the wavelengths of the electromagnetic interference to be shielded are very short, so that alone an EMC seal with conductive surface is no longer sufficient. Nevertheless, to obtain satisfactory seals against electromagnetic interference is therefore accompanied by great technical and monetary effort.

Es ist demzufolge die Aufgabe der Erfindung, die Qualität der Abschirmung kostengünstig an die gestiegenen Anforderungen anzupassen.It is therefore the object of the invention to adapt the quality of the shield cost of the increased requirements.

Diese Aufgabe wird mit einer EMV-Abdichtung gemäß Patentanspruch 1 gelöst und in den folgenden untergeordneten Patentansprüchen 2 bis 9 in vorteilhafter Weise weitergebildet.This object is achieved with an EMC seal according to claim 1 and further developed in the following subordinate claims 2 to 9 in an advantageous manner.

Dabei ist eine EMV-Abdichtung der Eingangs genannten Art als erste Schaumstoffstruktur vorgesehen, wobei eine zweite Schaumstoffstruktur, mit einem elektrisch leitfähigen Schaumstoffwerkstoff, an der Durchführungsöffnung angeordnet ist und die Durchführungsöffnung im Querschnitt so verringert, dass die zweite Schaumstoffstruktur an dem Element elastisch oder formschlüssig anliegt.In this case, an EMC seal of the aforementioned type is provided as a first foam structure, wherein a second foam structure, with an electrically conductive foam material, is arranged at the passage opening and the passage opening in cross-section so reduced that the second foam structure is applied to the element elastic or positive fit ,

Diese Art der Abdichtung ist in vielerlei Hinsicht vorteilhaft. So ist der preislich höher liegende elektrisch leitfähige Schaumstoffwerkstoff nur für geringe Volumen notwendig, der preislich günstige Werkstoff eine Schaumstoffstruktur mit elektrisch leitfähiger Oberfläche wird über die große Fläche eingesetzt. Somit ist eine bessere Abdichtung gegen elektromagnetische Störungen erreicht ohne kostenintensive Werkstoffe in großen Mengen zu benötigen. Insbesondere bei Massenprodukten wie Computern ist dies vorteilhaft, denn durch die hohen Stückzahlen von produzierten Geräten ist das Einsparpotential auch bei kleinen Beträgen pro Gerät von beträchtlichem Ausmaß.This type of sealing is advantageous in many ways. Thus, the price higher electrically conductive foam material is necessary only for small volume, the cheap material priced a foam structure with an electrically conductive surface is used over the large area. Thus, a better seal against electromagnetic interference is achieved without requiring costly materials in large quantities. This is particularly advantageous in the case of mass-produced products such as computers, because the high number of pieces of equipment produced makes the potential for savings of considerable magnitude even for small amounts per device.

Im Folgenden ist die Erfindung unter Zuhilfenahme eines Ausführungsbeispiels und einer Figur näher erläutert.The invention is explained in more detail below with the aid of an embodiment and a figure.

Es zeigt die Figur 1 eine EMV-Abdichtung mit erster und zweiter Schaumstoffstruktur.FIG. 1 shows an EMC seal with first and second foam structures.

Die EMV-Abdichtung besteht aus einer ersten Schaumstoffstruktur 10. Die erste Schaumstoffstruktur 10 weist eine elektrisch leitfähige Oberfläche 20 auf, ist flächig ausgebildet und ist an einer Computergehäusewandung 30 angeordnet. Die Computergehäusewandung 30 weist Durchführungsöffnungen 40 auf, welche zur Durchführung von Elementen 60 wie zum Beispiel Schaltern, Steckkontakten, Kabeln eingerichtet sind. Jedes der durchgeführten Elemente wird an der jeweiligen Durchführungsöffnung festgelegt. Dies erfolgt mit Schraubverbindungen oder Klemmverbindungen, so dass die EMV-Abdichtung durch das Element zusammengepresst wird. Somit erfolgt eine sichere Kontaktbildung zwischen den Elementen 60 und der EMV-Abdichtung.The EMC seal consists of a first foam structure 10. The first foam structure 10 has an electrically conductive surface 20, is formed flat and is arranged on a computer housing wall 30. The Computergehäusewandung 30 has through openings 40, which are adapted to carry out elements 60 such as switches, plug contacts, cables. Each of the elements carried out will be determined at the relevant implementation opening. This is done with screw or clamped connections so that the EMC seal is compressed by the element. Thus, a secure contact formation between the elements 60 and the EMC seal.

Die Durchführungsöffnungen 40 können dazu verschiedene Formen und Abmessungen aufweisen. Die erste Schaumstoffstruktur 10 umfasst ebenfalls Durchführungsöffnungen 11, welche an die Durchführungsöffnungen 40 der Computergehäusewandung 30 angepasst sind. Die Durchführungsöffnungen 11 der ersten Schaumstoffstruktur 10 sind gegenüber den Durchführungsöffnungen 40 in der Computergehäusewandung 30 größer oder gleich, vorzugsweise aber größer, damit eine zweite Schaumstoffstruktur 50 einfügbar ist. Zur verbesserten Abdichtung gegen elektromagnetische Störungen ist gemäß dem Prinzip der Erfindung für jede Durchführungsöffnung 30 eine zweite Schaumstoffstruktur 50 vorgesehen, die so ausgebildet ist, dass sie an den Elementen 60 anliegt. Der Querschnitt der Durchführungsöffnungen 51 in der zweiten Schaumstoffstruktur bietet somit einen elektrischen Kontakt zu den Elementen 60, und bietet außerdem einen elektrischen Kontakt zu der elektrisch leitenden Oberfläche 20 der ersten Schaumstoffstruktur 10.The passage openings 40 may have different shapes and dimensions. The first foam structure 10 likewise comprises leadthrough openings 11, which are adapted to the passage openings 40 of the computer housing wall 30. The passage openings 11 of the first foam structure 10 are greater than or equal to, but preferably larger than, the passage openings 40 in the computer housing wall 30 so that a second foam structure 50 can be inserted. For improved sealing against electromagnetic interference, according to the principle of the invention, a second foam structure 50 is provided for each lead-through opening 30, which is designed such that it bears against the elements 60. The cross section of the passage openings 51 in the second foam structure thus provides electrical contact to the elements 60, and also provides an electrical Contact with the electrically conductive surface 20 of the first foam structure 10.

Eine vorteilhafte Ausführungsform der Erfindung sieht vor, die elektrische leitfähige Oberfläche 20 der ersten Schaumstoffstruktur 10 aus einem elektrisch leitfähigen Gewebe zu bilden. Eine elektrisch nicht leitende Schaumstoffstruktur mit einer elektrisch leitenden Oberfläche 20 ist günstiger in der Anschaffung als eine elektrisch leitende Schaumstoffstruktur. Eine an der Computergehäusewandung 30 angeordnete erste Schaumstoffstruktur 10 ist in ihrer flächigen Ausprägung so an der Computergehäusewandung 30 angeordnet, dass die elektrisch leitende Oberfläche 20 von der elektrisch leitenden Computergehäusewandung 30 beabstandet ist. Um eine elektrische Kontaktierung zur Computergehäusewandung 30 herzustellen ist die elektrisch leitende Oberfläche 20 über die äußeren Kanten 70 der ersten Schaumstoffstruktur 10 fortgesetzt. Somit ist eine gute Abschirmung gegenüber elektromagnetischen Störungen gegeben.An advantageous embodiment of the invention provides to form the electrically conductive surface 20 of the first foam structure 10 of an electrically conductive fabric. An electrically non-conductive foam structure having an electrically conductive surface 20 is more economical to purchase than an electrically conductive foam structure. A first foam structure 10, which is arranged on the computer housing wall 30, is arranged in its planar shape on the computer housing wall 30 such that the electrically conductive surface 20 is spaced from the electrically conductive computer housing wall 30. In order to produce an electrical contact with the computer housing wall 30, the electrically conductive surface 20 continues over the outer edges 70 of the first foam structure 10. Thus, a good shield against electromagnetic interference is given.

Die Querschnittsflächen der Aussparungen 51 der zweiten Schaumstoffstruktur 50 sind in ihrem Querschnitt etwas kleiner als die Durchführungsöffnungen 11 der ersten Schaumstoffstruktur 10 und insbesondere als die Durchführungsöffnungen 40 der Computergehäusewandung, aber im Besonderen kleiner als die Querschnittsflächen der Elemente 60, welche durch die Schaumstoffstrukturen geführt werden. Somit ist ein elektrischer Kontakt zwischen den Elementen und der zweiten Schaumstoffstruktur 50 verbessert.The cross-sectional areas of the recesses 51 of the second foam structure 50 are slightly smaller in cross-section than the lead-through openings 11 of the first foam structure 10 and more particularly as the computer housing wall lead-through openings 40, but in particular smaller than the cross-sectional areas of the elements 60 passed through the foam structures. Thus, electrical contact between the elements and the second foam structure 50 is improved.

Die zweite Schaumstoffstruktur 50 ist ebenfalls flächig ausgebildet, wobei sich zwei grundsätzliche Montageformen für die zweite Schaumstoffstruktur 50 anbieten. Die erste Montageform ist, die zweite Schaumstoffstruktur 50 in einer Ausnehmung der ersten Schaumstoffstruktur 10 formschlüssig einzufügen. Die zweite Montageform ist ein einfaches Darüberlegen der zweiten Schaumstoffstruktur 50 über die erste Schaumstoffstruktur 10. In beiden Fällen ergibt sich ein elektrischer Kontakt zwischen dem Element 60 und der Gehäusewandung 30, der über die erste Schaumstoffstruktur 10 und die zweite Schaumstoffstruktur 50 gebildet ist.The second foam structure 50 is also formed flat, with two basic assembly forms offer for the second foam structure 50. The first mounting form is to insert the second foam structure 50 in a recess of the first foam structure 10 in a form-fitting manner. The second form of assembly is a simple overlying of the second foam structure 50 over the first foam structure 10. In both cases, there is electrical contact between the element 60 and the housing wall 30 formed over the first foam structure 10 and the second foam structure 50.

BezugszeichenlisteLIST OF REFERENCE NUMBERS

1010
erste Schaumstoffstrukturfirst foam structure
2020
elektrisch leitfähige Oberflächeelectrically conductive surface
3030
ComputergehäusewandungComputergehäusewandung
4040
DurchführungsöffnungenThrough openings
5050
zweite Schaumstoffstruktursecond foam structure
6060
Elementelement
7070
Äußeren Kanten der ersten SchaumstoffstrukturOuter edges of the first foam structure

Claims (7)

EMV-Abdichtung an einer Computergehäusewandung mit einer Durchführungsöffnung (40) für ein Element (60), einer ersten Schaumstoffstruktur (10) mit
einer elektrisch leitfähigen Oberfläche (20), die auf der Computergehäusewandung (30) angeordnet ist,
und eine Durchführungsöffnung (11) aufweist, die größer als die Durchführungsöffnung (40) in der Computergehäusewandung (30) ist,
einer zweiten Schaumstoffstruktur (50), mit
einem elektrisch leitfähigen Schaumstoffwerkstoff, die in die Durchführungsöffnung (11) der ersten Schaumstoffstruktur (10) formschlüssig einfügbar ist, und eine Durchführungsöffnung (51) in der zweiten Schaumstoffstruktur (50), die im Querschnitt so verringert ist, dass die zweite Schaumstoffstruktur (50) an dem Element (60) elastisch oder formschlüssig anliegt.EMC seal on a computer housing wall having a passage opening (40) for an element (60), a first foam structure (10) with
an electrically conductive surface (20) disposed on the computer housing wall (30),
and a passage opening (11) which is larger than the passage opening (40) in the computer housing wall (30),
a second foam structure (50), with
an electrically conductive foam material which can be positively inserted into the leadthrough opening (11) of the first foam structure (10), and a leadthrough opening (51) in the second foam structure (50) which is reduced in cross-section such that the second foam structure (50) on the element (60) elastically or positively abuts. EMV-Abdichtung nach Patentanspruch 1
dadurch gekennzeichnet, dass
die erste Schaumstoffstruktur (10) elektrisch nichtleitend, dauerelastisch und flächig ausgebildet ist.EMC seal according to claim 1
characterized in that
the first foam structure (10) is electrically non-conductive, permanently elastic and has a planar design. EMV-Abdichtung nach einem der vorhergehenden Patenansprüche,
dadurch gekennzeichnet , dass
die elektrisch leitfähige Oberfläche (20) aus einem elektrisch leitfähigen Gewebe gebildet ist.EMC seal according to one of the preceding patent claims,
characterized in that
the electrically conductive surface (20) is formed from an electrically conductive fabric. EMV-Abdichtung nach einem der Patentansprüche 2 bis 3,
dadurch gekennzeichnet, dass
die flächig ausgebildete erste Schaumstoffstruktur (10) an der von der Computergehäusewandung (30) abgewandten Oberfläche die elektrisch leitende Oberfläche (20) aufweist, wobei über äußere Kanten (70) der ersten Schaumstoffstruktur (10) die leitfähige Oberfläche fortgesetzt ist, so dass ein elektrischer Kontakt mit der Computergehäusewandung (30) gebildet ist.EMC seal according to one of the claims 2 to 3,
characterized in that
the areally formed first foam structure (10) has the electrically conductive surface (20) on the surface facing away from the computer housing wall (30), the outer surface (70) of the first foam structure (10) continuing the conductive surface, so that an electrical Contact with the computer housing wall (30) is formed. EMV-Abdichtung nach einem der vorhergehenden Patentansprüche
dadurch gekennzeichnet, dass
das Element (60) einen elektrischen Anschluss, ein Schaltelement oder ein Kabel umfasst.EMC seal according to one of the preceding claims
characterized in that
the element (60) comprises an electrical connection, a switching element or a cable. EMV-Abdichtung nach einem der vorhergehenden Patentansprüche,
dadurch gekennzeichnet, dass
die zweite Schaumstoffstruktur (50) flächig ausgebildet ist.EMC seal according to one of the preceding claims,
characterized in that
the second foam structure (50) is formed flat. EMV-Abdichtung nach einem der vorhergehenden Patentansprüche,
dadurch gekennzeichnet, dass
die zweite Schaumstoffstruktur (50) in einer Ausnehmung der ersten Schaumstoffstruktur (10) formschlüssig einfügbar ist.EMC seal according to one of the preceding claims,
characterized in that
the second foam structure (50) can be inserted in a form-fitting manner in a recess of the first foam structure (10).
EP20070010172 2006-06-01 2007-05-22 EMC insulation Expired - Fee Related EP1863329B8 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200610025674 DE102006025674B3 (en) 2006-06-01 2006-06-01 Electromagnetic compatibility sealing for e.g. switch, has feed-through opening that is arranged in foamed material structure and is reduced in cross section such that material structure lies against component in elastic or positive manner

Publications (3)

Publication Number Publication Date
EP1863329A1 true EP1863329A1 (en) 2007-12-05
EP1863329B1 EP1863329B1 (en) 2009-07-29
EP1863329B8 EP1863329B8 (en) 2009-09-09

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EP20070010172 Expired - Fee Related EP1863329B8 (en) 2006-06-01 2007-05-22 EMC insulation

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EP (1) EP1863329B8 (en)
CN (1) CN101082829A (en)
DE (2) DE102006025674B3 (en)
TW (1) TW200814920A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101625576B (en) * 2008-07-11 2012-03-28 研祥智能科技股份有限公司 Special onboard computer

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29620388U1 (en) * 1996-11-25 1997-04-17 Dauba Herbert Shielded housing for a distribution panel
US6119305A (en) * 1997-06-17 2000-09-19 Ta Mfg Co. Sealing elements
US6320122B1 (en) * 1999-10-12 2001-11-20 Hewlett Packard Company Electromagnetic interference gasket
WO2003034800A1 (en) * 2001-10-02 2003-04-24 Stork Prints B.V. Radiation shielding gasket, as well as manufacturing method
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DE502007001158D1 (en) 2009-09-10
TW200814920A (en) 2008-03-16
EP1863329B1 (en) 2009-07-29
EP1863329B8 (en) 2009-09-09
CN101082829A (en) 2007-12-05
DE102006025674B3 (en) 2007-11-22

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