EP1717352A3 - Electroplating apparatus - Google Patents

Electroplating apparatus Download PDF

Info

Publication number
EP1717352A3
EP1717352A3 EP06005414A EP06005414A EP1717352A3 EP 1717352 A3 EP1717352 A3 EP 1717352A3 EP 06005414 A EP06005414 A EP 06005414A EP 06005414 A EP06005414 A EP 06005414A EP 1717352 A3 EP1717352 A3 EP 1717352A3
Authority
EP
European Patent Office
Prior art keywords
plate
solution tank
solution
electroplating
electroplating apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06005414A
Other languages
German (de)
French (fr)
Other versions
EP1717352A2 (en
Inventor
Wataru Yamamoto-Ms Co Ltd Yamamoto
Katsunori Yamamoto-Ms Co Ltd Akiyama
Tokiko Yamamoto-Ms Co Ltd Katsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamamoto MS Co Ltd
Original Assignee
Yamamoto MS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamamoto MS Co Ltd filed Critical Yamamoto MS Co Ltd
Publication of EP1717352A2 publication Critical patent/EP1717352A2/en
Publication of EP1717352A3 publication Critical patent/EP1717352A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Abstract

An electroplating apparatus is provided which includes a solution tank which has at least a bottom plate and a side plate and inside which electroplating solution is poured and a cathode plate and an anode plate which are horizontally placed so as to face each other in the electroplating solution in the solution tank, in which one plate of the cathode plate and the anode plate is an object to be electroplated and placed in a lower position than the other plate, in which an opening through which the cathode plate and the anode plate are inserted into the solution tank is provided in the side plate of the solution tank, and in which a shield plate which is detachable shields the opening of the solution tank.
EP06005414A 2005-04-22 2006-03-16 Electroplating apparatus Withdrawn EP1717352A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005125538A JP2006299367A (en) 2005-04-22 2005-04-22 Electroplating tester

Publications (2)

Publication Number Publication Date
EP1717352A2 EP1717352A2 (en) 2006-11-02
EP1717352A3 true EP1717352A3 (en) 2007-01-17

Family

ID=36809576

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06005414A Withdrawn EP1717352A3 (en) 2005-04-22 2006-03-16 Electroplating apparatus

Country Status (6)

Country Link
US (1) US20060237304A1 (en)
EP (1) EP1717352A3 (en)
JP (1) JP2006299367A (en)
KR (1) KR20060111385A (en)
CN (1) CN1865519B (en)
TW (1) TW200637935A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009006282A1 (en) * 2009-01-27 2010-07-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Process for the production of metallic crystalline surface structures by means of galvanic metal deposition
EP2246460A1 (en) * 2009-04-28 2010-11-03 Golden Eagle Trading Ltd Installation for the treatment of part surfaces
JP6226229B2 (en) * 2013-08-19 2017-11-08 株式会社山本鍍金試験器 Plating apparatus and sensor apparatus using the same
KR102373893B1 (en) * 2018-03-13 2022-03-11 가부시키가이샤 야마모토메키시켄키 Plating equipment and plating system
CN110565154A (en) * 2019-09-06 2019-12-13 陕西汉和新材料科技有限公司 novel copper foil anti-oxidation electroplating anode plate
JP7316908B2 (en) * 2019-10-30 2023-07-28 株式会社荏原製作所 anode assembly
CN112853445B (en) * 2021-01-08 2022-08-26 上海戴丰科技有限公司 Horizontal electroplating pool with laterally-pulled anode for wafer and horizontal electroplating device for wafer

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5312532A (en) * 1993-01-15 1994-05-17 International Business Machines Corporation Multi-compartment eletroplating system
US6077412A (en) * 1997-08-22 2000-06-20 Cutek Research, Inc. Rotating anode for a wafer processing chamber
US6416647B1 (en) * 1998-04-21 2002-07-09 Applied Materials, Inc. Electro-chemical deposition cell for face-up processing of single semiconductor substrates
US20040037682A1 (en) * 2002-08-13 2004-02-26 Junichiro Yoshioka Substrate holder, plating apparatus, and plating method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE7603626L (en) * 1975-03-27 1977-01-04 Otto Alfred Becker DEVICE FOR GALVANIZING METAL SURFACES, SEPARATELY AT CUTTING EDGE WITH STACKING CUTTING PLATES
US4129494A (en) * 1977-05-04 1978-12-12 Norman Telfer E Electrolytic cell for electrowinning of metals
US4459194A (en) * 1983-03-10 1984-07-10 At&T Technologies, Inc. Electroplating apparatus
US5039381A (en) * 1989-05-25 1991-08-13 Mullarkey Edward J Method of electroplating a precious metal on a semiconductor device, integrated circuit or the like
US5242563A (en) * 1992-03-12 1993-09-07 The United States Of America As Represented By The Secretary Of The Navy Molten salt reactor for potentiostatic electroplating
DE19729893C2 (en) * 1997-07-12 1999-04-29 Mc Micro Compact Car Ag Steering column in a motor vehicle
US6143146A (en) * 1998-08-25 2000-11-07 Strom; Doug Filter system
US6217727B1 (en) * 1999-08-30 2001-04-17 Micron Technology, Inc. Electroplating apparatus and method
US6627052B2 (en) * 2000-12-12 2003-09-30 International Business Machines Corporation Electroplating apparatus with vertical electrical contact
JP3588777B2 (en) 2002-04-12 2004-11-17 株式会社山本鍍金試験器 Cathode cartridge for electroplating tester
US20050189228A1 (en) * 2004-02-27 2005-09-01 Taiwan Semiconductor Manufacturing Co., Ltd. Electroplating apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5312532A (en) * 1993-01-15 1994-05-17 International Business Machines Corporation Multi-compartment eletroplating system
US6077412A (en) * 1997-08-22 2000-06-20 Cutek Research, Inc. Rotating anode for a wafer processing chamber
US6416647B1 (en) * 1998-04-21 2002-07-09 Applied Materials, Inc. Electro-chemical deposition cell for face-up processing of single semiconductor substrates
US20040037682A1 (en) * 2002-08-13 2004-02-26 Junichiro Yoshioka Substrate holder, plating apparatus, and plating method

Also Published As

Publication number Publication date
KR20060111385A (en) 2006-10-27
CN1865519A (en) 2006-11-22
CN1865519B (en) 2010-08-11
JP2006299367A (en) 2006-11-02
US20060237304A1 (en) 2006-10-26
TW200637935A (en) 2006-11-01
EP1717352A2 (en) 2006-11-02

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