EP1535697A4 - Method and device for processing inside of transparent material - Google Patents
Method and device for processing inside of transparent materialInfo
- Publication number
- EP1535697A4 EP1535697A4 EP03755268A EP03755268A EP1535697A4 EP 1535697 A4 EP1535697 A4 EP 1535697A4 EP 03755268 A EP03755268 A EP 03755268A EP 03755268 A EP03755268 A EP 03755268A EP 1535697 A4 EP1535697 A4 EP 1535697A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- shape
- transparent material
- laser light
- section
- advance direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/55—Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
- C03C4/04—Compositions for glass with special properties for photosensitive glass
Abstract
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002149931A JP3559827B2 (en) | 2002-05-24 | 2002-05-24 | Method and apparatus for processing inside transparent material |
JP2002149931 | 2002-05-24 | ||
PCT/JP2003/006039 WO2003099507A1 (en) | 2002-05-24 | 2003-05-15 | Method and device for processing inside of transparent material |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1535697A1 EP1535697A1 (en) | 2005-06-01 |
EP1535697A4 true EP1535697A4 (en) | 2007-06-13 |
Family
ID=29561221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03755268A Withdrawn EP1535697A4 (en) | 2002-05-24 | 2003-05-15 | Method and device for processing inside of transparent material |
Country Status (4)
Country | Link |
---|---|
US (1) | US7411151B2 (en) |
EP (1) | EP1535697A4 (en) |
JP (1) | JP3559827B2 (en) |
WO (1) | WO2003099507A1 (en) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005033033A1 (en) * | 2003-10-06 | 2005-04-14 | Hoya Corporation | Glass component having through hole and production method therefor |
DE102004037949B4 (en) * | 2004-08-05 | 2009-04-02 | Forschungszentrum Karlsruhe Gmbh | Process for the preparation of photonic crystals |
BE1016782A3 (en) * | 2005-09-22 | 2007-06-05 | Laser Engineering Applic | METHOD FOR INTERNAL LASER MARKING IN TRANSPARENT AND LASER MATERIALS AND DEVICE USED FOR THE APPLICATION OF SAID METHOD |
JP5002808B2 (en) * | 2006-03-07 | 2012-08-15 | 国立大学法人北海道大学 | Laser processing apparatus and laser processing method |
EP1964822A1 (en) * | 2007-02-27 | 2008-09-03 | Cristales Curvados S.A. | Method for manufacturing decorated glass and glass thus obtained |
CA2622937A1 (en) * | 2007-03-23 | 2008-09-23 | Nec Corporation | Marked body and manufacturing method thereof |
US20090045179A1 (en) * | 2007-08-15 | 2009-02-19 | Ellen Marie Kosik Williams | Method and system for cutting solid materials using short pulsed laser |
WO2011089592A1 (en) * | 2010-01-20 | 2011-07-28 | Moshe Finarov | A method of laser processing |
TWI426298B (en) * | 2010-12-27 | 2014-02-11 | Univ Nat Taiwan Science Tech | Optical device and laser processing method |
JP5379172B2 (en) * | 2011-01-11 | 2013-12-25 | 東山 亨 | Femtosecond laser processing machine |
EP2656961A1 (en) * | 2011-02-08 | 2013-10-30 | Fujikura Ltd. | Method for manufacturing substrate having micropore, and substrate |
WO2012161317A1 (en) * | 2011-05-25 | 2012-11-29 | 株式会社フジクラ | Method of manufacturing base substance disposed with fine hole, and base substance disposed with fine hole |
EP2754524B1 (en) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Method of and apparatus for laser based processing of flat substrates being wafer or glass element using a laser beam line |
EP2781296B1 (en) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Device and method for cutting out contours from flat substrates using a laser |
JP6401248B2 (en) * | 2013-05-15 | 2018-10-10 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | LED having scattering mechanism in substrate |
FR3006068B1 (en) * | 2013-05-24 | 2015-04-24 | Saint Gobain | PROCESS FOR OBTAINING A SUBSTRATE |
JP5744991B2 (en) * | 2013-09-12 | 2015-07-08 | 東山 亨 | Femtosecond laser processing machine |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
CN103949772B (en) * | 2014-04-22 | 2016-01-13 | 上海大学 | Femtosecond laser prepares the method for three-dimensional rotatable nanometer body grating in transparent material |
EP3164828B1 (en) | 2014-07-01 | 2018-08-29 | Qiova | Micromachining method and system for patterning a material, and method for using one such micromachining system |
CN106687419A (en) | 2014-07-08 | 2017-05-17 | 康宁股份有限公司 | Methods and apparatuses for laser processing materials |
US11648623B2 (en) | 2014-07-14 | 2023-05-16 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
CN107922237B (en) | 2015-03-24 | 2022-04-01 | 康宁股份有限公司 | Laser cutting and processing of display glass compositions |
LT6428B (en) * | 2015-10-02 | 2017-07-25 | Uab "Altechna R&D" | Method and device for laser processing of transparent materials |
KR102078294B1 (en) | 2016-09-30 | 2020-02-17 | 코닝 인코포레이티드 | Apparatus and method for laser machining transparent workpieces using non-axisymmetric beam spots |
US10067291B2 (en) | 2016-10-13 | 2018-09-04 | Stmicroelectronics Sa | Method of manufacturing a waveguide |
EP3848333A1 (en) | 2016-10-24 | 2021-07-14 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
EP4076827A4 (en) * | 2019-12-20 | 2024-01-17 | Avava Inc | Systems and methods for formation of continuous channels within transparent materials |
CN111408856B (en) * | 2020-04-15 | 2022-11-22 | 华东师范大学重庆研究院 | Method and device for manufacturing micro-fluidic chip by femtosecond plasma grating |
CN111474622B (en) * | 2020-04-16 | 2022-08-16 | 华东师范大学 | Method for preparing three-dimensional optical waveguide and photonic device structure in transparent material |
CN112756819B (en) * | 2020-12-24 | 2022-02-08 | 清华大学 | System and method for processing micro-channel by femtosecond laser assisted by alternating electric field |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5948172A (en) * | 1996-08-12 | 1999-09-07 | Neiheisel; Gary L. | Descaling metal with a laser having a very short pulse width and high average power |
US20010050312A1 (en) * | 2000-02-03 | 2001-12-13 | Jun Koide | Laser processing method and laser processing apparatus |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5794482A (en) * | 1980-12-05 | 1982-06-11 | Hitachi Ltd | Pattern forming device by laser |
JPH02165881A (en) * | 1988-12-15 | 1990-06-26 | Nec Corp | Shadow mask for laser marking device |
US5410125A (en) * | 1990-10-11 | 1995-04-25 | Harry Winston, S.A. | Methods for producing indicia on diamonds |
FR2673557A1 (en) * | 1991-03-08 | 1992-09-11 | Ugine Aciers | METHOD AND STATIC OPTICAL DEVICE FOR LASER IRRADIATION OF A MOLECULAR METAL PRODUCT AND ITS APPLICATION TO THE TREATMENT OF MAGNETIC TOLES. |
JPH11269683A (en) | 1998-03-18 | 1999-10-05 | Armco Inc | Method and apparatus for removing oxide from metal surface |
US6285002B1 (en) * | 1999-05-10 | 2001-09-04 | Bryan Kok Ann Ngoi | Three dimensional micro machining with a modulated ultra-short laser pulse |
US6977137B2 (en) * | 1999-07-29 | 2005-12-20 | Corning Incorporated | Direct writing of optical devices in silica-based glass using femtosecond pulse lasers |
US6573026B1 (en) * | 1999-07-29 | 2003-06-03 | Corning Incorporated | Femtosecond laser writing of glass, including borosilicate, sulfide, and lead glasses |
JP3522671B2 (en) * | 2000-01-27 | 2004-04-26 | 住友重機械工業株式会社 | Marking method, apparatus, and marked optical member |
JP3754857B2 (en) | 2000-02-03 | 2006-03-15 | キヤノン株式会社 | Laser processing method |
TW503188B (en) * | 2000-08-29 | 2002-09-21 | Sumitomo Heavy Industries | Marking method, device the optical member marked |
JP3736791B2 (en) * | 2000-08-31 | 2006-01-18 | シャープ株式会社 | Laser processing method |
-
2002
- 2002-05-24 JP JP2002149931A patent/JP3559827B2/en not_active Expired - Fee Related
-
2003
- 2003-05-15 WO PCT/JP2003/006039 patent/WO2003099507A1/en active Application Filing
- 2003-05-15 US US10/514,649 patent/US7411151B2/en not_active Expired - Fee Related
- 2003-05-15 EP EP03755268A patent/EP1535697A4/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5948172A (en) * | 1996-08-12 | 1999-09-07 | Neiheisel; Gary L. | Descaling metal with a laser having a very short pulse width and high average power |
US20010050312A1 (en) * | 2000-02-03 | 2001-12-13 | Jun Koide | Laser processing method and laser processing apparatus |
Non-Patent Citations (1)
Title |
---|
See also references of WO03099507A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP1535697A1 (en) | 2005-06-01 |
JP3559827B2 (en) | 2004-09-02 |
US20060124618A1 (en) | 2006-06-15 |
JP2003340579A (en) | 2003-12-02 |
US7411151B2 (en) | 2008-08-12 |
WO2003099507A1 (en) | 2003-12-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20041130 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL LT LV MK |
|
DAX | Request for extension of the european patent (deleted) | ||
RBV | Designated contracting states (corrected) |
Designated state(s): DE FR GB |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20070516 |
|
17Q | First examination report despatched |
Effective date: 20071004 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20131203 |