EP1528315A2 - Light set with heat dissipation means - Google Patents

Light set with heat dissipation means Download PDF

Info

Publication number
EP1528315A2
EP1528315A2 EP05000381A EP05000381A EP1528315A2 EP 1528315 A2 EP1528315 A2 EP 1528315A2 EP 05000381 A EP05000381 A EP 05000381A EP 05000381 A EP05000381 A EP 05000381A EP 1528315 A2 EP1528315 A2 EP 1528315A2
Authority
EP
European Patent Office
Prior art keywords
light
thermoconductor
casing
light source
light set
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP05000381A
Other languages
German (de)
French (fr)
Other versions
EP1528315B1 (en
EP1528315A3 (en
Inventor
Jeffrey Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NeoBulb Technologies Inc
Original Assignee
NeoBulb Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NeoBulb Technologies Inc filed Critical NeoBulb Technologies Inc
Priority to DE602005015778T priority Critical patent/DE602005015778D1/en
Priority to EP05000381A priority patent/EP1528315B1/en
Priority to AT05000381T priority patent/ATE438828T1/en
Priority to ES05000381T priority patent/ES2331077T3/en
Publication of EP1528315A2 publication Critical patent/EP1528315A2/en
Publication of EP1528315A3 publication Critical patent/EP1528315A3/en
Application granted granted Critical
Publication of EP1528315B1 publication Critical patent/EP1528315B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21L—LIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00—Electric lighting devices with self-contained electric batteries or cells
    • F21L4/02—Electric lighting devices with self-contained electric batteries or cells characterised by the provision of two or more light sources
    • F21L4/022—Pocket lamps
    • F21L4/027—Pocket lamps the light sources being a LED
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S9/00—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply
    • F21S9/02—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a light set and more particularly, to a light set with heat dissipation means that has a heat dissipation module mounted inside the casing to dissipate heat during the operation of the light source thereof.
  • FIG. 1 illustrates a conventional LED type light set.
  • the light set comprises a solid metal plate, for example, aluminum plate 10 , a LED (light emitting diode) or LEDs 12 mounted on the aluminum plate 10 , and a circuit 14 provided around the border area of the aluminum plate 10 for controlling the operation of the LED(s) 12 .
  • the aluminum plate 10 is adapted to dissipate heat from the LED(s) 12 .
  • the low heat dissipation working efficiency of the aluminum plate 10 is insufficient to carry heat away from the LED(s) 12 .
  • FIG. 2 shows a pipe shape Vapor Chamber according to the prior art.
  • the Vapor Chamber 2 comprises a hollow body 20 that is kept in a vacuum status, a capillary structure 22 formed inside the hollow body 20 , and a working fluid (not shown) filled in the hollow body 20 .
  • the heat source power-consuming chip, CPU, or LCD
  • the working fluid in the hollow body 20 is heated into steam by heat energy from the heat source 26 .
  • Produced steam passes (transport) from the hot side of the hollow body 20 to the other side, namely, the cold side where steam is condensed into fluid, which is then guided back to the hot side of the hollow body 20 by the capillary structure 22 .
  • the thermal could be quickly carried away from the heat source.
  • thermoconductor With a light source to carry heat from the light source during its operation, so that the working efficiency of the light source can be greatly improved.
  • the present invention has been accomplished under the circumstances in view. It is one object of the present invention to provide a light set, which is equipped with radiation fins to dissipate heat efficient during the operation of the light source thereof, so as to improve the working efficiency of the light source and prolongs its service life. It is another object of the present invention to provide a light set, which has air vents formed in the casing thereof for quick dissipation of heat during the operation of the light source thereof.
  • the light set comprises a casing that admits light; a thermoconductor mounted inside the casing, the thermoconductor having a flat end portion; at least one radiation fin fastened to the periphery of the thermoconductor inside the casing; a light source installed in the flat end portion of the thermoconductor; and a power unit mounted inside the casing and electrically connected to the light source to provide the light source with the necessary working voltage.
  • a light set 3 comprising a casing 30 that admits light, a thermoconductor 32 that can be a heat pipe or heat column mounted inside the casing 30 and has one end, namely, the top end thereof flatted, a plurality of radiation fins 324 arranged around the periphery of the thermoconductor 32 for dissipation of heat from the thermoconductor 32 to the outside space, a light source 34 mounted on the flat top end of the thermoconductor 32 for producing light through the casing 30 , a circuit board 36 mounted inside the casing 30 and provided at the other end, namely, the bottom end of the thermoconductor 32 , and power unit that can be a battery set or AC adapter 37 mounted inside the casing 30 and electrically connected to the circuit board 36 and the light source 34 to provide the necessary working voltage to the light source 34 through the circuit board 36 .
  • the thermoconductor 32 comprises a hollow body 320 formed of copper and kept in a vacuum status, a capillary structure (not shown) formed inside the hollow body 320 , and a working fluid (not shown) filled in the hollow body 320 .
  • the hollow body 320 of the thermoconductor 32 has a cold side and a hot side.
  • the working fluid is distributed in the capillary structure of the hollow body 320 of the thermoconductor 32 .
  • the working fluid in the hot side is evaporated into steam and travel toward the cold side of the hollow body 320 of thermoconductor 32 by thermal adsorbed from the light source 34 , and the steam is then condensed into fluid status by the cold side of the hollow body 320 of thermoconductor 32 and guided back to the hot side of the hollow body 320 of thermoconductor 32 by the capillary structure.
  • the aforesaid radiation fins 324 are provided at the cold side of the hollow body 320 of thermoconductor 32 for transferring heat energy from the cold side of the of the hollow body 320 of thermoconductor 32 to the outside space during changing of the work fluid between steam status and fluid status.
  • the light source 34 comprises a substrate 340 , an array of light emitting devices, for example, LEDs (light emitting diodes) 342 arranged on the substrate 340 , a positive electrode 344 and a negative electrode 346 mounted in the substrate 340 and respectively electrically connected to the positive and negative terminals of each of the LEDs 342 .
  • the substrate 340 is preferably a silicon base material.
  • the LEDs 342 of the light source 34 can be directly arranged on the flat top end of the hollow body 320 of thermoconductor 32 (see FIG. 7).
  • the LEDs 342 can be installed in the substrate 340 (see FIG. 6) or the flat top end of the hollow body 320 of thermoconductor 32 (see FIG. 7) by wire bonding or flip chip.
  • the aforesaid radiation fins 324 may be variously embodied. According to the embodiment shown in FIG. 8, the radiation fins 324 have an annular shape and are arranged around the periphery of the hollow body 320 of thermoconductor 32 . According to the embodiment shown in FIG. 9, the radiation fins 324 are shaped like a fourfold petal and arranged around the periphery of the hollow body 320 of the thermoconductor 32 inside the casing 30 (see also FIG. 3). According to the embodiment shown in FIG. 10, the radiation fins 324 are flat fins radially arranged around the periphery of the hollow body 320 of the thermoconductor 32 inside the casing 30 (see also FIG. 3). The radiation fins 324 can be made of copper or aluminum.
  • the radiation fins 324 each have two through holes 326 symmetrically disposed at two sides through which the positive and negative electrodes of the light source 34 connect to the circuit board 36 .
  • the casing 30 has a plurality of air vents 302 corresponding to the radiation fins 324 for ventilation so that heat energy can quickly be transfered by air to the outside of the light set.
  • a fan 38 is provided below the circuit board 36 for causing currents of air to carry heat energy out of the light set.
  • the fan 38 and light source 34 obtains the necessary working voltage (or current) from the power unit 37 .
  • the circuit board 36 can design a temperature detection and fan control circuit (not shown) that detects the ambient temperature around the light source and controls ON/OFF status of the fan 38 subject to the detection result, i.e., the temperature detection and fan control circuit turns on the fan 38 when the ambient temperature surpassed a predetermined value, or turns off the fan 38 when the ambient temperature dropped below the predetermined value.
  • the present invention provides a light set with heat dissipation means, which has a thermoconductor with radiation fins and a fan mounted inside the casing thereof for quick dissipation of heat from the light source, thereby improving the working efficiency of the light source and prolonging its service life.
  • a prototype of light set with heat dissipation means has been constructed with the features of FIGS. 3 ⁇ 13.
  • the light set with heat dissipation means functions smoothly to provide all of the features discussed earlier.

Abstract

Disclosed is a light source, which includes a light-permeable casing, a thermoconductor, which is mounted inside the casing and has a flat end portion, a plurality of radiation fins fastened to the periphery of the thermoconductor inside the casing, a light source formed of an array of LEDs and installed in the flat end portion of the thermoconductor inside the casing, and a power unit mounted inside the casing to provide the light source with the necessary working voltage.

Description

    BACKGROUND OF THE INVENTION 1. Field of the Invention:
  • The present invention relates to a light set and more particularly, to a light set with heat dissipation means that has a heat dissipation module mounted inside the casing to dissipate heat during the operation of the light source thereof.
    • 2. Description of the Related Art:
  • Since the invention of incandescent lamp by Thomas Alva Edison (1847 - 1931), electric lighting has greatly improved our living style. Nowadays, a variety of lighting fixtures have been developed for different applications, for example, home and office illumination or for use in motor vehicles.
  • FIG. 1 illustrates a conventional LED type light set. The light set comprises a solid metal plate, for example, aluminum plate 10, a LED (light emitting diode) or LEDs 12 mounted on the aluminum plate 10, and a circuit 14 provided around the border area of the aluminum plate 10 for controlling the operation of the LED(s) 12. The aluminum plate 10 is adapted to dissipate heat from the LED(s) 12. However, the low heat dissipation working efficiency of the aluminum plate 10 is insufficient to carry heat away from the LED(s) 12.
  • Vapor Chambers are commonly used in cooling modules for electronic apparatus. FIG. 2 shows a pipe shape Vapor Chamber according to the prior art. According to this design, the Vapor Chamber 2 comprises a hollow body 20 that is kept in a vacuum status, a capillary structure 22 formed inside the hollow body 20, and a working fluid (not shown) filled in the hollow body 20. When in use, one side, namely, the hot side of the hollow body 20 of the Vapor Chamber 2 is maintained closely attached to the heat source (power-consuming chip, CPU, or LCD) 26. During operation of the heat source 26, the working fluid in the hollow body 20 is heated into steam by heat energy from the heat source 26. Produced steam passes (transport) from the hot side of the hollow body 20 to the other side, namely, the cold side where steam is condensed into fluid, which is then guided back to the hot side of the hollow body 20 by the capillary structure 22. By means of interchange between fluid state and steam state, the thermal could be quickly carried away from the heat source.
  • It is practical to use the aforesaid thermoconductor with a light source to carry heat from the light source during its operation, so that the working efficiency of the light source can be greatly improved.
    • SUMMARY OF THE INVENTION
  • The present invention has been accomplished under the circumstances in view. It is one object of the present invention to provide a light set, which is equipped with radiation fins to dissipate heat efficient during the operation of the light source thereof, so as to improve the working efficiency of the light source and prolongs its service life. It is another object of the present invention to provide a light set, which has air vents formed in the casing thereof for quick dissipation of heat during the operation of the light source thereof.
  • To achieve these and other objects of the present invention, the light set comprises a casing that admits light; a thermoconductor mounted inside the casing, the thermoconductor having a flat end portion; at least one radiation fin fastened to the periphery of the thermoconductor inside the casing; a light source installed in the flat end portion of the thermoconductor; and a power unit mounted inside the casing and electrically connected to the light source to provide the light source with the necessary working voltage.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an elevational view of a LED type light set according to the prior art.
  • FIG. 2 is a schematic drawing showing the working of a conventional pipe shape Vapor Chamber.
  • FIG. 3 is a longitudinal view in section of a light set constructed according to the present invention.
  • FIG. 4 is an elevational view of a part of the present invention, showing the radiation fins arranged around the periphery of the hollow body of the thermoconductor and the light source at the flat top end of the hollow body.
  • FIG. 5 is a side plain view of a part of the present invention, showing the radiation fins arranged around the periphery of the hollow body of the thermoconductor.
  • FIG. 6 is a top view of a part of the present invention, showing the structure of the light source.
  • FIG. 7 is an elevational view of a part of the present invention, showing the light source provided at the flat top end of the hollow body of the thermoconductor.
  • FIG. 8 is a top view of the present invention, showing one form of the radiation fins.
  • FIG. 9 is a top view of the present invention, showing an alternate form of the radiation fins.
  • FIG. 10 is an elevational view showing another alternate form of the radiation fins according to the present invention.
  • FIG. 11 is an elevational view of the present invention, showing the appearance of assembled lighting module.
  • FIG. 12 is another longitudinal view in section of the present invention, showing air vents formed in the casing of the light set.
  • FIG. 13 is still another longitudinal view in section of the present invention, showing a fan provided inside the light and spaced between the circuit board and the power unit.
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Referring to FIG. 3, a light set 3 is shown comprising a casing 30 that admits light, a thermoconductor 32 that can be a heat pipe or heat column mounted inside the casing 30 and has one end, namely, the top end thereof flatted, a plurality of radiation fins 324 arranged around the periphery of the thermoconductor 32 for dissipation of heat from the thermoconductor 32 to the outside space, a light source 34 mounted on the flat top end of the thermoconductor 32 for producing light through the casing 30, a circuit board 36 mounted inside the casing 30 and provided at the other end, namely, the bottom end of the thermoconductor 32, and power unit that can be a battery set or AC adapter 37 mounted inside the casing 30 and electrically connected to the circuit board 36 and the light source 34 to provide the necessary working voltage to the light source 34 through the circuit board 36.
  • Referring to FIGS. 4 and 5, the thermoconductor 32 comprises a hollow body 320 formed of copper and kept in a vacuum status, a capillary structure (not shown) formed inside the hollow body 320, and a working fluid (not shown) filled in the hollow body 320. The hollow body 320 of the thermoconductor 32 has a cold side and a hot side. The working fluid is distributed in the capillary structure of the hollow body 320 of the thermoconductor 32. During operation of the light set 3, the working fluid in the hot side is evaporated into steam and travel toward the cold side of the hollow body 320 of thermoconductor 32 by thermal adsorbed from the light source 34, and the steam is then condensed into fluid status by the cold side of the hollow body 320 of thermoconductor 32 and guided back to the hot side of the hollow body 320 of thermoconductor 32 by the capillary structure. The aforesaid radiation fins 324 are provided at the cold side of the hollow body 320 of thermoconductor 32 for transferring heat energy from the cold side of the of the hollow body 320 of thermoconductor 32 to the outside space during changing of the work fluid between steam status and fluid status.
  • Referring to FIG. 6, the light source 34 comprises a substrate 340, an array of light emitting devices, for example, LEDs (light emitting diodes) 342 arranged on the substrate 340, a positive electrode 344 and a negative electrode 346 mounted in the substrate 340 and respectively electrically connected to the positive and negative terminals of each of the LEDs 342. The substrate 340 is preferably a silicon base material. (light source 34 could also be an assembled LEDs package) Alternatively, the LEDs 342 of the light source 34 can be directly arranged on the flat top end of the hollow body 320 of thermoconductor 32 (see FIG. 7). The LEDs 342 can be installed in the substrate 340 (see FIG. 6) or the flat top end of the hollow body 320 of thermoconductor 32 (see FIG. 7) by wire bonding or flip chip.
  • The aforesaid radiation fins 324 may be variously embodied. According to the embodiment shown in FIG. 8, the radiation fins 324 have an annular shape and are arranged around the periphery of the hollow body 320 of thermoconductor 32. According to the embodiment shown in FIG. 9, the radiation fins 324 are shaped like a fourfold petal and arranged around the periphery of the hollow body 320 of the thermoconductor 32 inside the casing 30 (see also FIG. 3). According to the embodiment shown in FIG. 10, the radiation fins 324 are flat fins radially arranged around the periphery of the hollow body 320 of the thermoconductor 32 inside the casing 30 (see also FIG. 3). The radiation fins 324 can be made of copper or aluminum.
  • Referring to FIG. 11, the radiation fins 324 each have two through holes 326 symmetrically disposed at two sides through which the positive and negative electrodes of the light source 34 connect to the circuit board 36.
  • Referring to FIG. 12, the casing 30 has a plurality of air vents 302 corresponding to the radiation fins 324 for ventilation so that heat energy can quickly be transfered by air to the outside of the light set.
  • Referring to FIG. 13, a fan 38 is provided below the circuit board 36 for causing currents of air to carry heat energy out of the light set. The fan 38 and light source 34 obtains the necessary working voltage (or current) from the power unit 37. The circuit board 36 can design a temperature detection and fan control circuit (not shown) that detects the ambient temperature around the light source and controls ON/OFF status of the fan 38 subject to the detection result, i.e., the temperature detection and fan control circuit turns on the fan 38 when the ambient temperature surpassed a predetermined value, or turns off the fan 38 when the ambient temperature dropped below the predetermined value.
  • As indicated above, the present invention provides a light set with heat dissipation means, which has a thermoconductor with radiation fins and a fan mounted inside the casing thereof for quick dissipation of heat from the light source, thereby improving the working efficiency of the light source and prolonging its service life.
  • A prototype of light set with heat dissipation means has been constructed with the features of FIGS. 3~13. The light set with heat dissipation means functions smoothly to provide all of the features discussed earlier.
  • Although particular embodiments of the invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention.

Claims (15)

  1. A light set comprising:
    a casing that admits light;
    a thermoconductor mounted inside said casing, said thermoconductor having a flat end portion;
    at least one radiation fin fastened to the periphery of said thermoconductor inside said casing;
    a light source installed in said flat end portion of said thermoconductor; and
    a power unit mounted inside said casing and electrically connected to said light source to provide said light source with the necessary working power.
  2. The light set as claimed in claim 1, wherein said casing has at least one air vent for ventilation.
  3. The light set as claimed in claim 1, wherein each said radiation fin has an annular shape extended around the periphery of said thermoconductor.
  4. The light set as claimed in claim 1, further comprising a circuit board mounted inside said casing at one end of said thermoconductor remote from said flat end portion and electrically connected in series between said power unit and said light source by electric conductor means for controlling the operation of said light source.
  5. The light set as claimed in claim 4, wherein said at least one radiation fin each has at least one through hole for the passing of electric conductor means connecting said circuit board and said light source.
  6. The light set as claimed in claim 4, further comprising fan means mounted inside said casing below said circuit board.
  7. The light set as claimed in claim 6, wherein said fan means is electrically connected to said circuit board and controlled by a temperature detection and fan control circuit of said circuit board that detects ambient temperature level and controls on/off of said fan means subject to the detection result.
  8. The light set as claimed in claim 1, wherein said light source comprises a substrate, at least one light emitting device mounted on said substrate, and a positive electrode and a negative electrode mounted on said substrate at two sides and respectively electrically connected between positive and negative terminals of each said light emitting device and positive and negative terminals of said circuit board.
  9. The light set as claimed in claim 8, wherein said substrate is made of silicon.
  10. The light set as claimed in claim 8, wherein each said light emitting device is a light emitting diode or LEDs package.
  11. The light set as claimed in claim 1, wherein said light source is comprised of at least one light emitting diode.
  12. The light set as claimed in claim 1, wherein said power unit is a battery set.
  13. The light set as claimed in claim 1, wherein said power unit is an AC adapter.
  14. The light set as claimed in claim 1, wherein said thermoconductor is a heat pipe.
  15. The light set as claimed in claim 1, wherein said thermoconductor is a heat column.
EP05000381A 2005-01-11 2005-01-11 Light set with heat dissipation means Not-in-force EP1528315B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE602005015778T DE602005015778D1 (en) 2005-01-11 2005-01-11 Lighting device with device for heat dissipation
EP05000381A EP1528315B1 (en) 2005-01-11 2005-01-11 Light set with heat dissipation means
AT05000381T ATE438828T1 (en) 2005-01-11 2005-01-11 LIGHTING DEVICE WITH HEAT DISSIPATION DEVICE
ES05000381T ES2331077T3 (en) 2005-01-11 2005-01-11 LIGHTING DEVICE WITH MEANS OF HEAT DISSIPATION.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05000381A EP1528315B1 (en) 2005-01-11 2005-01-11 Light set with heat dissipation means

Publications (3)

Publication Number Publication Date
EP1528315A2 true EP1528315A2 (en) 2005-05-04
EP1528315A3 EP1528315A3 (en) 2005-07-06
EP1528315B1 EP1528315B1 (en) 2009-08-05

Family

ID=34400650

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05000381A Not-in-force EP1528315B1 (en) 2005-01-11 2005-01-11 Light set with heat dissipation means

Country Status (4)

Country Link
EP (1) EP1528315B1 (en)
AT (1) ATE438828T1 (en)
DE (1) DE602005015778D1 (en)
ES (1) ES2331077T3 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006119582A1 (en) * 2005-05-13 2006-11-16 Tama Berkeljon Lighting apparatus
EP1783421A1 (en) * 2005-10-26 2007-05-09 Spectral Gesellschaft für Lichttechnik mit beschränkter Haftung Lampe
WO2007056541A2 (en) * 2005-11-08 2007-05-18 Young Garrett J Apparatus and method for generating light from multi - primary colors
WO2007028397A3 (en) * 2005-09-09 2007-05-31 Wiseled Aps A torch
EP1933085A1 (en) * 2005-05-25 2008-06-18 NeoBulb Technologies, Inc. Light-emitting diode cluster lamp
WO2009039907A1 (en) 2007-09-24 2009-04-02 Ledon Lighting Gmbh Cooling body and cooling system for an led module
WO2010100289A1 (en) * 2009-03-06 2010-09-10 Kokoh Investigación, S.L. Lighting device
WO2011079387A1 (en) * 2009-12-30 2011-07-07 Lumenpulse Lighting Inc. High powered light emitting diode lighting unit
WO2012168845A1 (en) * 2011-06-06 2012-12-13 Koninklijke Philips Electronics N.V. Remote heat sink
EP2538133A1 (en) * 2011-06-23 2012-12-26 Koninklijke Philips Electronics N.V. Remote heat sink

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009044388A1 (en) 2009-11-02 2011-05-05 Semperlux Aktiengesellschaft - Lichttechnische Werke - Outdoor light and high pressure lamp replacement

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040120148A1 (en) * 2002-12-18 2004-06-24 Morris Garron K. Integral ballast lamp thermal management method and apparatus
US20040212991A1 (en) * 2001-12-10 2004-10-28 Galli Robert D. LED lighting assembly with improved heat management
US20040213016A1 (en) * 2003-04-25 2004-10-28 Guide Corporation Automotive lighting assembly cooling system
WO2004100220A2 (en) * 2003-05-05 2004-11-18 Optolum, Inc Light emitting diode light source

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040212991A1 (en) * 2001-12-10 2004-10-28 Galli Robert D. LED lighting assembly with improved heat management
US20040120148A1 (en) * 2002-12-18 2004-06-24 Morris Garron K. Integral ballast lamp thermal management method and apparatus
US20040213016A1 (en) * 2003-04-25 2004-10-28 Guide Corporation Automotive lighting assembly cooling system
WO2004100220A2 (en) * 2003-05-05 2004-11-18 Optolum, Inc Light emitting diode light source

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006119582A1 (en) * 2005-05-13 2006-11-16 Tama Berkeljon Lighting apparatus
EP1933085A4 (en) * 2005-05-25 2011-01-19 Neobulb Technologies Inc Light-emitting diode cluster lamp
EP1933085A1 (en) * 2005-05-25 2008-06-18 NeoBulb Technologies, Inc. Light-emitting diode cluster lamp
EP2410234A3 (en) * 2005-09-09 2013-02-13 Wise Innovations Technology Sarl A torch
WO2007028397A3 (en) * 2005-09-09 2007-05-31 Wiseled Aps A torch
CN101300450B (en) * 2005-09-09 2011-08-10 威斯莱兹公司 Torch
US7938556B2 (en) 2005-09-09 2011-05-10 Wiseled Aps Torch
EP1783421A1 (en) * 2005-10-26 2007-05-09 Spectral Gesellschaft für Lichttechnik mit beschränkter Haftung Lampe
WO2007056541A3 (en) * 2005-11-08 2007-10-25 Garrett J Young Apparatus and method for generating light from multi - primary colors
US7859554B2 (en) 2005-11-08 2010-12-28 Young Garrett J Apparatus, methods, and systems for multi-primary display or projection
WO2007056541A2 (en) * 2005-11-08 2007-05-18 Young Garrett J Apparatus and method for generating light from multi - primary colors
US8624941B2 (en) 2005-11-08 2014-01-07 Prism Projection, Inc. Apparatus, methods, and systems for multi-primary display or projection
US10008178B2 (en) 2005-11-08 2018-06-26 Prism Projection, Inc Apparatus, methods, and systems for multi-primary display or projection
WO2009039907A1 (en) 2007-09-24 2009-04-02 Ledon Lighting Gmbh Cooling body and cooling system for an led module
WO2010100289A1 (en) * 2009-03-06 2010-09-10 Kokoh Investigación, S.L. Lighting device
WO2011079387A1 (en) * 2009-12-30 2011-07-07 Lumenpulse Lighting Inc. High powered light emitting diode lighting unit
WO2012168845A1 (en) * 2011-06-06 2012-12-13 Koninklijke Philips Electronics N.V. Remote heat sink
EP2538133A1 (en) * 2011-06-23 2012-12-26 Koninklijke Philips Electronics N.V. Remote heat sink

Also Published As

Publication number Publication date
EP1528315B1 (en) 2009-08-05
DE602005015778D1 (en) 2009-09-17
ES2331077T3 (en) 2009-12-21
EP1528315A3 (en) 2005-07-06
ATE438828T1 (en) 2009-08-15

Similar Documents

Publication Publication Date Title
US7438448B2 (en) Light set with heat dissipation means
EP1528315B1 (en) Light set with heat dissipation means
US7914184B2 (en) LED illuminating device and light engine thereof
US7513653B1 (en) LED lamp having heat sink
US7654699B2 (en) LED lamp having heat dissipation structure
US7824075B2 (en) Method and apparatus for cooling a lightbulb
US7841752B2 (en) LED lighting device having heat convection and heat conduction effects dissipating assembly therefor
JP5011494B2 (en) Thermal conduction / dissipation unit integrated semiconductor light emitting device
JP6170784B2 (en) Light emitting device for vehicle lamp
US20080316755A1 (en) Led lamp having heat dissipation structure
EP2397753A1 (en) Led lamp and a heat sink thereof having a wound heat pipe
US20080024067A1 (en) LED lighting device
US20100207573A1 (en) Thermoelectric feedback circuit
WO2006128318A1 (en) A high power led illuminating equipment having high thermal diffusivity
US20140043815A1 (en) Light emitting diode bulb structure for enhancing heat dissipation efficiency
WO2006125375A1 (en) Light-emitting diode cluster lamp
WO2006102785A1 (en) An efficient high-power led lamp
CN101382273B (en) LED lamp with heat radiation structure
KR200451042Y1 (en) Led lighting device having heat convection and heat conduction effects and heat dissipating assembly therefor
US20170211790A1 (en) Light-emitting module and lighting device including the same
WO2007019733A1 (en) Led illumination device with high power and high heat dissipation rate
KR101231658B1 (en) LED lamp provided an improved capability of discharging heat
TWM311844U (en) Heat dissipation devices for LED lamps
KR101023177B1 (en) A high power led illuminating equipment having high thermal diffusivity
KR101094109B1 (en) Led lamp

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR LV MK YU

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR LV MK YU

17P Request for examination filed

Effective date: 20051013

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: NEOBULB TECHNOLOGIES, INC.

RIN1 Information on inventor provided before grant (corrected)

Inventor name: JEFFREY CHEN

AKX Designation fees paid

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

17Q First examination report despatched

Effective date: 20061110

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

RIN1 Information on inventor provided before grant (corrected)

Inventor name: CHEN, JEFFREY

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 602005015778

Country of ref document: DE

Date of ref document: 20090917

Kind code of ref document: P

REG Reference to a national code

Ref country code: RO

Ref legal event code: EPE

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2331077

Country of ref document: ES

Kind code of ref document: T3

LTIE Lt: invalidation of european patent or patent extension

Effective date: 20090805

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090805

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090805

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090805

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20091205

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090805

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090805

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090805

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20091205

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20091105

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090805

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090805

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090805

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090805

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090805

26N No opposition filed

Effective date: 20100507

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20100131

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20100131

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20091106

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20100131

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20100111

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090805

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20120213

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: RO

Payment date: 20120111

Year of fee payment: 8

Ref country code: GB

Payment date: 20120217

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20120202

Year of fee payment: 8

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090805

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20100206

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20100111

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090805

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: ES

Payment date: 20120130

Year of fee payment: 8

REG Reference to a national code

Ref country code: NL

Ref legal event code: V1

Effective date: 20130801

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20130111

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20130930

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20130801

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20130131

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20130111

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RO

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20130111

REG Reference to a national code

Ref country code: ES

Ref legal event code: FD2A

Effective date: 20140321

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20130112

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20150210

Year of fee payment: 11

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602005015778

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20160802