EP1507604A1 - Method and device for local treatment of substrates - Google Patents
Method and device for local treatment of substratesInfo
- Publication number
- EP1507604A1 EP1507604A1 EP03720014A EP03720014A EP1507604A1 EP 1507604 A1 EP1507604 A1 EP 1507604A1 EP 03720014 A EP03720014 A EP 03720014A EP 03720014 A EP03720014 A EP 03720014A EP 1507604 A1 EP1507604 A1 EP 1507604A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- fluid
- substrate
- local
- local area
- suction force
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0493—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases using vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/18—Solid state diffusion of only metal elements or silicon into metallic material surfaces using liquids, e.g. salt baths, liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/123—Spraying molten metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/40—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using liquids, e.g. salt baths, liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/20—Light-sensitive devices
- H01G9/2027—Light-sensitive devices comprising an oxide semiconductor electrode
- H01G9/2031—Light-sensitive devices comprising an oxide semiconductor electrode comprising titanium oxide, e.g. TiO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/20—Light-sensitive devices
- H01G9/2068—Panels or arrays of photoelectrochemical cells, e.g. photovoltaic modules based on photoelectrochemical cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0229—Suction chambers for aspirating the sprayed liquid
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
- H10K71/236—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers using printing techniques, e.g. applying the etch liquid using an ink jet printer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/542—Dye sensitized solar cells
Definitions
- This invention relates to methods and devices for treatment of substrates (cleaning, priming, etc).
- Substrates described in this invention may have one or more layers deposited over their surfaces before the treatment.
- the invention relates to the methods of manufacturing Dye Solar Cells (DSC) and modules.
- DSC Dye Solar Cells
- Methods for treatment of substrates with fluids usually comprise the 3 following stages:
- Examples of removal of fluid from the substrate include: • Dipping in or spraying with another fluid,
- the present invention is based on realisation that local treatment of substrates with fluids can be achieved in a continuous process that comprises simultaneous delivery of a fluid to and removal of the fluid from the local preselected areas of a substrate.
- One aspect of the present invention provides for directing a fine jet of fluid towards the local areas of a substrate and simultaneously applying vacuum suction force to the said areas. Both said fine jet of fluid and said vacuum suction force are tuned in such a way that:
- the fluid is allowed to interact with the said local preselected area of the substrate;
- said vacuum suction force is applied to any of the said preselected local areas in such a way that the said fluid is removed from the said local preselected area in a direction perpendicular to that area in a close proximity from the substrate.
- further displacement of the said fluid is not necessarily perpendicular to that local preselected area.
- the said fluid jet is directed perpendicularly to any of the said preselected local areas.
- the said interaction between said fluid and substrate results in dissolution of undesirable compounds on the surface of the substrate in the said fluid.
- chemical composition of the said fluid is adjusted to ensure effective dissolution when prior knowledge of the chemical composition(s) of the said undesirable compounds is available.
- the said interaction between said fluid and substrate results in mixing of the said fluid with undesirable small solid particles on surface of the substrate, thus the said particles are effectively removed from the substrate along with the said fluid. This describes local cleaning by mixing.
- the said interaction between said fluid and substrate results in dissolution of material that forms the surface of the substrate. In this way local etching or grooving is achieved.
- the said interaction between said fluid and substrate results in changing chemical properties of surface of the substrate, thus in preparation of the said local preselected areas of the substrate for further processing
- the said interaction between said fluid and substrate results in formation of an additional layer on surface of the substrate.
- part of the said fluid remains on the local preselected area of substrate to form an additional layer (for example, by sol-gel process), whereas excess of the fluid is removed by action of the said vacuum suction force.
- the said fluid is the dye removal solution (e.g. ammonium hydroxide solution in water)
- said substrate is a glass substrate coated by a transparent electronic conductor (TEC) to be used in deposition of electrodes for Dye Solar Cells (DSC), some areas of the substrate having subsequently been coated by one or more layers at least one of which is a nanoporous layer of titanium dioxide or other semiconducting material, and the whole area of the substrate having been coated by dye ; local preselected areas of the substrate are those that are coated by dye, but are not coated by other layers. Removal of the dye from the local preselected areas and possible treatment of these areas creates conditions for subsequent application of further layers of DSC, such as, for example interconnecting and sealing material.
- DSC Dye Solar Cells
- the said fluid comprises liquid phase or gas phase or a mixture thereof.
- the said fluid comprises vapour that condenses on to the said local preselected areas.
- said fluid is delivered in gas phase, but the interaction between said fluid and said local preselected area of substrate takes place when the said fluid is in liquid phase.
- two or more jets of different fluids directed towards local preselected areas of the substrate.
- the said interaction in this case is between 1 st fluid, 2 nd fluid, etc, and the substrate. Excess of the fluids and products of interaction (where applicable) are removed from the said local areas by action of the said vacuum suction force.
- the invention can be utilised in both static and dynamic mode.
- static mode size and shape of said fluid jet resemble that of the said local area.
- Application of the said jet to the said local area under simultaneous action of said vacuum suction force allows for precise treatment of the said local area.
- dynamic mode size of the said fluid jet is smaller than that of the said local area.
- the said fluid jet is applied only to a portion of said local preselected area. Treatment of the whole local area is achieved by movement of said fluid jet with respect to the said local area.
- the fluid jet acts within the area to which the vacuum suction force is applied.
- the invention also provides for the fluid jet to be followed by the vacuum suction force. The following parameters can be adjusted to ensure effective treatment in the static mode:
- Another aspect of the present invention provides for a device for local treatment of substrates; the device comprises means for creation of fluid jet(s) and means for removing fluid from the local preselected area of the substrate by action of a vacuum suction force.
- the said means for creation of fluid jet(s) comprise container(s) with fluid(s), source of pressure, fluid delivery pipes and nozzle(s) for release of fluid jet(s).
- the said means for removing fluid comprise vacuum pump, vacuum pipes and vacuum nozzle for precise application of the said vacuum suction force to the said local areas of substrate.
- said device contains additional means for precise positioning of the said vacuum and fluid nozzles with respect to the local preselected areas of the substrate.
- the said precise positioning include positioning in X-Y direction, where X-Y is a plane that approximates a local preselected area of the substrates; and in Z- direction, perpendicular to the local preselected area of the substrate.
- said device additionally contains means for uniform movement of said jet and vacuum nozzles with respect to the substrate. For 2-D substrates this movement takes place in one plane, for 3-D substrate this movement takes place in 3-D.
- the said device additionally contains valves in both fluid delivery and fluid removal lines to commence/terminate fluid jet(s) and/or application of vacuum suction force in accordance with position of the said vacuum and fluid nozzles with respect to the local preselected area of the substrate.
- size of the said vacuum nozzle is larger than that of the fluid nozzle
- the fluid nozzle is placed within the said vacuum nozzle
- space inside the said liquid nozzle is used to create the said fluid jet
- space between fluid and vacuum nozzle is used to transfer said vacuum suction force to the said local preselected areas of a substrate.
- the shape of said vacuum nozzle is similar to that of the fluid nozzle and both nozzles are concentric.
- the said fluid delivery means comprise 2 or more concentric fluid nozzles for delivery of 2 or more fluids.
- the said device additionally comprise means for in-situ controlling treatment of said local preselected areas.
- said in-situ control means comprise a stable light source and a light detector; light emitted by the said light source is focused on part of the local preselected area, light detector measures the intensity of light reflected from the said part (or alternatively, the light transmitted through the said part), electrical signal generated by the said light detector serves as a measure of effectiveness and completeness of the said treatment and as a control signal for in-situ adjustment of the process parameters (such as for example, distance between nozzles and substrate, speed of motion of the nozzles with respect to the substrate, vacuum suction, fluid pressure).
- said in-situ controls means comprise a sensor to monitor chemical composition of the removed fluid; said sensor being positioned in the said fluid removal line. Deviation of the said chemical composition from predetermined reference value serves as a measure of effectiveness and completeness of the said treatment.
- Figure 1 Demonstrates a principle for the local treatment of substrates
- Figure 2 is a cross sectional view of device that includes optical in-situ monitoring
- Figure 3 is a cross sectional view of the device with dual fluid supply
- Figure 4a is a schematic representation of an electrode for Dye Solar cell to be treated using this invention
- Figure 4b is a schematic representation of an electrode for Dye Solar cell after local dye removal.
- Figure 5 is a schematic representation of fluid supply and fluid removal systems of the device
- Figure 6 is a schematic representation of an electronic control system of the device.
- this diagram demonstrates the principle of the local treatment of substrates.
- a fluid nozzle 2 creates a fine fluid jet 1 directed perpendicularly to a substrate 4.
- Surface of the substrate 4 contains an undesirable compound 5, which is to be removed from a local preselected area 10.
- the undesirable compound 5 is dissolved in fluid delivered to the local preselected area 10 by the fluid jet.
- the fluid and products of interaction 8 are removed from the area 10 by action of the vacuum suction force 9 created by a vacuum nozzle 3.
- the fluid is delivered from a fluid supply system 6 and finally removed to a fluid removal system 7.
- this diagram demonstrates removal of an undesirable compound 5 from a substrate 4 in a dynamic mode along a thin straight line.
- the substrate is moved in direction 11, thus the left hand side 12 of the substrate surface has already been treated, whereas the right hand side 5 is to be treated.
- the cleaning process is controlled by two optical sensors 13.
- Each optical sensor comprises a stable light source 14 and a light detector 15.
- Each light source generates a standard light ray 16 incident to the substrate. Intensity of light reflected from the treated area 18 is higher than that reflected from the untreated area 17.
- Each light detector converts light intensity into an electrical signal.
- the electrical signals from the detectors are transmitted to a comparator 19.
- the comparator compares electrical signals from the light detectors and generates a control signal 20.
- the control signal is used by a process control system to adjust the process parameters (speed of substrate, pressure in fluid supply, etc%) in situ in order to maintain quality of the local treatment.
- the system comprises a first fluid nozzle 2 to create a first fluid jet 1, a vacuum nozzle 3 to create a vacuum suction force 9 and a second fluid nozzle 21 to create a second fluid jet 22.
- the first fluid is supplied from the first fluid supply system 6 and the second - from the second fluid supply system 23.
- Both fluids are delivered to a local preselected area of a substrate 4, where the fluids interact between each other and with the surface of the substrate. This interaction results in treatment of the local preselected area of the substrate. Products of the interaction 8 are removed from the substrate by the action of vacuum suction force 9 through the vacuum nozzle 3 to a fluid removal system 7.
- the electrode comprises a glass substrate 24, Transparent Electronic Conductor (TEC) layer 25 and a nanoporous layer of titanium dioxide 26.
- TEC Transparent Electronic Conductor
- the whole area of the electrode is covered by dye 27.
- Local preselected areas of the substrate are those that are coated by dye, but are not coated by titanium dioxide.
- FIG. 4b cross-sectional and planar views of the working electrode for DSC (refer to Fig. 4a) after process of local dye removal are presented.
- Required pattern of a local preselected area 28 (2 mm wide) is now clean and ready for subsequent application of further layers of DSC, such as, for example interconnecting and sealing material.
- the fluid supply sytem 29 comprises compressed gas supply 30, compressed gas gauge 31, container with the fluid 32, fluid supply pipe 33 and fluid supply electromagnetic valve 34.
- the fluid removal system 35 comprises vacuum pump 36, vacuum gauge 37, removed fluid tank 38, scrubbing tank 39 and fluid removal electromagnetic valve 40.
- the system comprises a computer 41, a comparator 19, X-stage 42, Y- stage 43.
- the computer progam drives X-Y stages in accordance with a pattern of the local preselected areas on a substrate.
- the computer also controls supply and removal of the fluids by opening and closing electromagnetic valves 34 and 40.
- the comparator 19 generates a differential electrical signal that is used by the computer to adjust treatment parameters.
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10004817A EP2218522B1 (en) | 2002-05-07 | 2003-05-07 | Method and device for local treatment of substrates |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AUPS2125A AUPS212502A0 (en) | 2002-05-07 | 2002-05-07 | Method and device for local treatment of substrates with fluids |
AUPS212502 | 2002-05-07 | ||
PCT/AU2003/000532 WO2003095115A1 (en) | 2002-05-07 | 2003-05-07 | Method and device for local treatment of substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1507604A1 true EP1507604A1 (en) | 2005-02-23 |
EP1507604A4 EP1507604A4 (en) | 2007-07-04 |
Family
ID=3835698
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10004817A Expired - Lifetime EP2218522B1 (en) | 2002-05-07 | 2003-05-07 | Method and device for local treatment of substrates |
EP03720014A Withdrawn EP1507604A4 (en) | 2002-05-07 | 2003-05-07 | Method and device for local treatment of substrates |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10004817A Expired - Lifetime EP2218522B1 (en) | 2002-05-07 | 2003-05-07 | Method and device for local treatment of substrates |
Country Status (4)
Country | Link |
---|---|
EP (2) | EP2218522B1 (en) |
AT (1) | ATE530265T1 (en) |
AU (1) | AUPS212502A0 (en) |
WO (1) | WO2003095115A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2472608B (en) * | 2009-08-12 | 2013-09-04 | M Solv Ltd | Method and Apparatus for making a solar panel that is partially transparent |
NO20100616A1 (en) * | 2010-04-28 | 2011-10-31 | Innotech Solar Asa | Method and apparatus for removing a defect from a solar cell |
KR101434658B1 (en) * | 2011-12-28 | 2014-08-29 | 코오롱인더스트리 주식회사 | Manufacturing for polymer solar cell |
CN202725553U (en) * | 2012-07-09 | 2013-02-13 | 深圳市华星光电技术有限公司 | Cleaning device |
CN104550157B (en) * | 2014-12-24 | 2016-08-17 | 深圳市华星光电技术有限公司 | Clean device |
EP3811400A4 (en) * | 2018-06-20 | 2022-03-23 | Veeco Instruments Inc. | System and method for self-cleaning wet treatment process |
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US5224235A (en) * | 1991-06-28 | 1993-07-06 | Digital Equipment Corporation | Electronic component cleaning apparatus |
WO1994012349A1 (en) * | 1992-11-25 | 1994-06-09 | Sjoeberg Staffan | Apparatus for cleaning objects in movement |
US5443653A (en) * | 1994-06-01 | 1995-08-22 | Hughes Missile Systems Company | System for cleaning contaminants from small areas with minimal incontained waste |
DE19651693A1 (en) * | 1996-12-12 | 1998-06-18 | Fidor Vermoegensverwaltung Gmb | Automatic window cleaning system |
WO2002097402A2 (en) * | 2001-05-31 | 2002-12-05 | Ian Robert Fothergill | Analysis or disposal of surface adherents |
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US3915739A (en) * | 1974-07-12 | 1975-10-28 | Montreal | Method of cleaning foreign matter from a cavity in a semiconductor |
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US5608943A (en) * | 1993-08-23 | 1997-03-11 | Tokyo Electron Limited | Apparatus for removing process liquid |
FR2719788B1 (en) * | 1994-05-13 | 1996-07-19 | Interblast | Pickling installation. |
JPH09235895A (en) * | 1996-03-04 | 1997-09-09 | Tokyu Constr Co Ltd | Washing, peeling, crushing device for concrete surface |
ES2169805T3 (en) * | 1996-06-24 | 2002-07-16 | Sundwig Gmbh | DEVICE FOR ELIMINATING LIQUID FROM THE SURFACE OF A BAND. |
JP2000325903A (en) * | 1999-05-25 | 2000-11-28 | Sumitomo Electric Ind Ltd | Method for removing soil adherent to long strip |
US6479745B2 (en) * | 2000-01-26 | 2002-11-12 | Sharp Kabushiki Kaisha | Dye-sensitized solar cell and method of manufacturing the same |
DE10053198C2 (en) * | 2000-10-26 | 2003-01-02 | Infineon Technologies Ag | Local etching process |
DE10065265A1 (en) * | 2000-12-29 | 2002-07-04 | Hans G Platsch | Device for dusting products |
-
2002
- 2002-05-07 AU AUPS2125A patent/AUPS212502A0/en not_active Abandoned
-
2003
- 2003-05-07 AT AT10004817T patent/ATE530265T1/en not_active IP Right Cessation
- 2003-05-07 EP EP10004817A patent/EP2218522B1/en not_active Expired - Lifetime
- 2003-05-07 WO PCT/AU2003/000532 patent/WO2003095115A1/en not_active Application Discontinuation
- 2003-05-07 EP EP03720014A patent/EP1507604A4/en not_active Withdrawn
Patent Citations (5)
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US5224235A (en) * | 1991-06-28 | 1993-07-06 | Digital Equipment Corporation | Electronic component cleaning apparatus |
WO1994012349A1 (en) * | 1992-11-25 | 1994-06-09 | Sjoeberg Staffan | Apparatus for cleaning objects in movement |
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DE19651693A1 (en) * | 1996-12-12 | 1998-06-18 | Fidor Vermoegensverwaltung Gmb | Automatic window cleaning system |
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Also Published As
Publication number | Publication date |
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EP2218522A1 (en) | 2010-08-18 |
AUPS212502A0 (en) | 2002-06-06 |
EP2218522B1 (en) | 2011-10-26 |
ATE530265T1 (en) | 2011-11-15 |
EP1507604A4 (en) | 2007-07-04 |
WO2003095115A1 (en) | 2003-11-20 |
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