EP1472017A4 - Method for cleaning an article - Google Patents

Method for cleaning an article

Info

Publication number
EP1472017A4
EP1472017A4 EP03729378A EP03729378A EP1472017A4 EP 1472017 A4 EP1472017 A4 EP 1472017A4 EP 03729378 A EP03729378 A EP 03729378A EP 03729378 A EP03729378 A EP 03729378A EP 1472017 A4 EP1472017 A4 EP 1472017A4
Authority
EP
European Patent Office
Prior art keywords
article
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03729378A
Other languages
German (de)
French (fr)
Other versions
EP1472017A1 (en
Inventor
John Fredric Billingham
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Praxair Technology Inc
Original Assignee
Praxair Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Praxair Technology Inc filed Critical Praxair Technology Inc
Publication of EP1472017A1 publication Critical patent/EP1472017A1/en
Publication of EP1472017A4 publication Critical patent/EP1472017A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/06—Hydroxides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/08—Acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/28—Organic compounds containing halogen
    • C11D7/30—Halogenated hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D2111/22—
EP03729378A 2002-01-07 2003-01-07 Method for cleaning an article Withdrawn EP1472017A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US34650702P 2002-01-07 2002-01-07
US346507P 2002-01-07
PCT/US2003/000529 WO2003057377A1 (en) 2002-01-07 2003-01-07 Method for cleaning an article

Publications (2)

Publication Number Publication Date
EP1472017A1 EP1472017A1 (en) 2004-11-03
EP1472017A4 true EP1472017A4 (en) 2007-03-21

Family

ID=23359727

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03729378A Withdrawn EP1472017A4 (en) 2002-01-07 2003-01-07 Method for cleaning an article

Country Status (8)

Country Link
EP (1) EP1472017A4 (en)
JP (1) JP2005515619A (en)
KR (1) KR20040073548A (en)
CN (1) CN1741863A (en)
AU (1) AU2003235748A1 (en)
CA (1) CA2472478A1 (en)
TW (1) TWI291200B (en)
WO (1) WO2003057377A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6905555B2 (en) * 2001-02-15 2005-06-14 Micell Technologies, Inc. Methods for transferring supercritical fluids in microelectronic and other industrial processes
JP2004363404A (en) * 2003-06-05 2004-12-24 Nippon Telegr & Teleph Corp <Ntt> Method for supercritical drying
DE102004029077B4 (en) * 2003-06-26 2010-07-22 Samsung Electronics Co., Ltd., Suwon Apparatus and method for removing a photoresist from a substrate
US20050288485A1 (en) * 2004-06-24 2005-12-29 Mahl Jerry M Method and apparatus for pretreatment of polymeric materials utilized in carbon dioxide purification, delivery and storage systems
JP5521193B2 (en) * 2010-01-20 2014-06-11 学校法人千葉工業大学 Method for extracting hydrogen from gas fossil fuel
CN103068496B (en) * 2010-08-06 2016-04-13 英派尔科技开发有限公司 Overcritical inert gas and cleaning method
KR101395225B1 (en) * 2010-11-25 2014-05-15 세메스 주식회사 Method for treating substrate
KR101187375B1 (en) 2011-01-27 2012-10-05 부경대학교 산학협력단 Apparatus for etching silicon oxide layer of semiconductor substrate
US10525416B2 (en) * 2017-05-16 2020-01-07 Tokyo Electron Limited Method of liquid filter wetting
CN108598019A (en) * 2018-04-17 2018-09-28 德淮半导体有限公司 Wafer cleaning equipment and its cleaning method
CN111744870A (en) * 2020-06-24 2020-10-09 中国科学院苏州纳米技术与纳米仿生研究所广东(佛山)研究院 Cleaning method for semiconductor device after gold-tin soldering
CN114078692B (en) * 2022-01-07 2024-02-20 浙江大学杭州国际科创中心 Wafer cleaning method and wafer cleaning equipment
CN114798602B (en) * 2022-04-26 2024-01-23 四川博腾创达智能科技有限公司 Method for cleaning particle pollutants

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4899767A (en) * 1984-05-21 1990-02-13 Cfm Technologies, Inc. Method and system for fluid treatment of semiconductor wafers
US5267455A (en) * 1992-07-13 1993-12-07 The Clorox Company Liquid/supercritical carbon dioxide dry cleaning system
WO1994001227A1 (en) * 1992-07-13 1994-01-20 The Clorox Company Liquid/supercritical cleaning with decreased polymer damage
EP0726099A2 (en) * 1995-01-26 1996-08-14 Texas Instruments Incorporated Method of removing surface contamination
US5556479A (en) * 1994-07-15 1996-09-17 Verteq, Inc. Method and apparatus for drying semiconductor wafers

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5783082A (en) * 1995-11-03 1998-07-21 University Of North Carolina Cleaning process using carbon dioxide as a solvent and employing molecularly engineered surfactants
KR19980018262A (en) * 1996-08-01 1998-06-05 윌리엄 비.켐플러 I / O port and RAM memory addressing technology
US6306564B1 (en) * 1997-05-27 2001-10-23 Tokyo Electron Limited Removal of resist or residue from semiconductors using supercritical carbon dioxide
AU742586B2 (en) * 1997-05-30 2002-01-10 Micell Technologies Surface treatment
US6454869B1 (en) * 2001-06-27 2002-09-24 International Business Machines Corporation Process of cleaning semiconductor processing, handling and manufacturing equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4899767A (en) * 1984-05-21 1990-02-13 Cfm Technologies, Inc. Method and system for fluid treatment of semiconductor wafers
US5267455A (en) * 1992-07-13 1993-12-07 The Clorox Company Liquid/supercritical carbon dioxide dry cleaning system
WO1994001227A1 (en) * 1992-07-13 1994-01-20 The Clorox Company Liquid/supercritical cleaning with decreased polymer damage
US5556479A (en) * 1994-07-15 1996-09-17 Verteq, Inc. Method and apparatus for drying semiconductor wafers
EP0726099A2 (en) * 1995-01-26 1996-08-14 Texas Instruments Incorporated Method of removing surface contamination

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO03057377A1 *

Also Published As

Publication number Publication date
CA2472478A1 (en) 2003-07-17
WO2003057377A1 (en) 2003-07-17
JP2005515619A (en) 2005-05-26
EP1472017A1 (en) 2004-11-03
CN1741863A (en) 2006-03-01
TWI291200B (en) 2007-12-11
TW200412631A (en) 2004-07-16
AU2003235748A1 (en) 2003-07-24
KR20040073548A (en) 2004-08-19

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