EP1448336A1 - Method of laser milling using constant tool path algorithm - Google Patents
Method of laser milling using constant tool path algorithmInfo
- Publication number
- EP1448336A1 EP1448336A1 EP02782385A EP02782385A EP1448336A1 EP 1448336 A1 EP1448336 A1 EP 1448336A1 EP 02782385 A EP02782385 A EP 02782385A EP 02782385 A EP02782385 A EP 02782385A EP 1448336 A1 EP1448336 A1 EP 1448336A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- tool path
- laser
- workpiece
- operable
- radius
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000003801 milling Methods 0.000 title claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 31
- 238000005553 drilling Methods 0.000 claims description 22
- 238000002679 ablation Methods 0.000 claims description 16
- 238000000608 laser ablation Methods 0.000 claims description 5
- 230000003247 decreasing effect Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 16
- 230000003287 optical effect Effects 0.000 description 15
- 238000005459 micromachining Methods 0.000 description 12
- 239000011295 pitch Substances 0.000 description 9
- 238000013459 approach Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000002085 persistent effect Effects 0.000 description 5
- 238000009987 spinning Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000002940 repellent Effects 0.000 description 2
- 239000005871 repellent Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000004624 confocal microscopy Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000012886 linear function Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000847 optical profilometry Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
Claims
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US266934 | 1994-06-27 | ||
US33474601P | 2001-11-30 | 2001-11-30 | |
US334746P | 2001-11-30 | ||
US10/266,934 US6897405B2 (en) | 2001-11-30 | 2002-10-08 | Method of laser milling using constant tool path algorithm |
PCT/US2002/037962 WO2003047805A1 (en) | 2001-11-30 | 2002-11-27 | Method of laser milling using constant tool path algorithm |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1448336A1 true EP1448336A1 (en) | 2004-08-25 |
EP1448336A4 EP1448336A4 (en) | 2006-03-15 |
Family
ID=26952122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP02782385A Withdrawn EP1448336A4 (en) | 2001-11-30 | 2002-11-27 | Method of laser milling using constant tool path algorithm |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1448336A4 (en) |
JP (1) | JP4455884B2 (en) |
CN (1) | CN1295052C (en) |
AU (1) | AU2002348254A1 (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7259354B2 (en) * | 2004-08-04 | 2007-08-21 | Electro Scientific Industries, Inc. | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
WO2007088795A1 (en) | 2006-02-03 | 2007-08-09 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of memory element, laser irradiation apparatus, and laser irradiation method |
JP5178022B2 (en) * | 2006-02-03 | 2013-04-10 | 株式会社半導体エネルギー研究所 | Method for manufacturing memory element |
US8580700B2 (en) | 2006-02-17 | 2013-11-12 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
US7532378B2 (en) | 2006-02-21 | 2009-05-12 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus, method of laser irradiation, and method for manufacturing semiconductor device |
JP4833773B2 (en) * | 2006-08-31 | 2011-12-07 | 本田技研工業株式会社 | Micro drilling method |
JP5122833B2 (en) * | 2007-02-20 | 2013-01-16 | ファナック株式会社 | Laser processing method and laser processing apparatus |
US8481887B2 (en) * | 2007-05-03 | 2013-07-09 | Electro Scientific Industries, Inc. | Method for machining tapered micro holes |
EP2163339B1 (en) * | 2008-09-11 | 2016-11-02 | Bystronic Laser AG | Laser cutting assembly for cutting a work piece with a laser beam with a variable cutting speed |
CN101811229B (en) * | 2009-02-19 | 2013-12-25 | 株式会社日立高科技 | Laser processing method, laser processing apparatus and method for manufacturing solar panel |
US9289858B2 (en) * | 2011-12-20 | 2016-03-22 | Electro Scientific Industries, Inc. | Drilling holes with minimal taper in cured silicone |
DE102012111771B4 (en) * | 2012-12-04 | 2020-12-03 | Ewag Ag | Method for machining a workpiece using a laser machining device for manufacturing a cutting tool |
CN104439716A (en) * | 2014-11-17 | 2015-03-25 | 深圳锜宏伟科技有限公司 | Laser processing system and laser processing method |
CN104985329B (en) * | 2015-06-16 | 2016-09-21 | 沈阳飞机工业(集团)有限公司 | Hyperbolicity solid milling part laser incising type processing method |
CN113427137A (en) * | 2020-03-06 | 2021-09-24 | 大族激光科技产业集团股份有限公司 | Hole machining method |
CN111822887B (en) * | 2020-07-14 | 2022-04-26 | 深圳中科光子科技有限公司 | Processing system and method for laser drilling thick glass |
JP7001215B1 (en) | 2021-01-05 | 2022-01-19 | コニカミノルタ株式会社 | Nozzle plate for inkjet head, its manufacturing method, inkjet head and inkjet recording device |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1425340A (en) * | 1972-08-25 | 1976-02-18 | Europ Rotogravure Ass | Method of engraving a printing member by means of a beam of energy |
US4718418A (en) * | 1983-11-17 | 1988-01-12 | Lri L.P. | Apparatus for ophthalmological surgery |
EP0308512A1 (en) * | 1987-02-24 | 1989-03-29 | Nippon Steel Corporation | Apparatus for dull finish of roll with pulse laser |
US5237148A (en) * | 1990-10-04 | 1993-08-17 | Brother Kogyo Kabushiki | Device for manufacturing a nozzle and its manufacturing method |
US5798927A (en) * | 1995-03-20 | 1998-08-25 | Electro Scientific Industries, Inc. | Apparatus and method for coordinating the movements of stages in a multi-stage multi-rate positioner system |
US6231566B1 (en) * | 1998-08-12 | 2001-05-15 | Katana Research, Inc. | Method for scanning a pulsed laser beam for surface ablation |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2829851A1 (en) * | 1978-07-07 | 1980-01-24 | Precitec Gmbh | ARRANGEMENT FOR MEASURING THE DISTANCE BETWEEN A METAL WORKPIECE AND A MACHINING TOOL |
US4270421A (en) * | 1979-03-22 | 1981-06-02 | The United States Of America As Represented By The United States Department Of Energy | Apparatus for correcting precision errors in slide straightness in machine tools |
US4754208A (en) * | 1986-11-17 | 1988-06-28 | Nippon Kokan Kabushiki Kaisha | Circular path control apparatus and method for multi-axis servomechanisms |
JPH11281814A (en) * | 1998-03-30 | 1999-10-15 | Sekisui Chem Co Ltd | Manufacture of color filter |
-
2002
- 2002-11-27 CN CNB028073002A patent/CN1295052C/en not_active Expired - Fee Related
- 2002-11-27 EP EP02782385A patent/EP1448336A4/en not_active Withdrawn
- 2002-11-27 JP JP2003549039A patent/JP4455884B2/en not_active Expired - Fee Related
- 2002-11-27 AU AU2002348254A patent/AU2002348254A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1425340A (en) * | 1972-08-25 | 1976-02-18 | Europ Rotogravure Ass | Method of engraving a printing member by means of a beam of energy |
US4718418A (en) * | 1983-11-17 | 1988-01-12 | Lri L.P. | Apparatus for ophthalmological surgery |
EP0308512A1 (en) * | 1987-02-24 | 1989-03-29 | Nippon Steel Corporation | Apparatus for dull finish of roll with pulse laser |
US5237148A (en) * | 1990-10-04 | 1993-08-17 | Brother Kogyo Kabushiki | Device for manufacturing a nozzle and its manufacturing method |
US5798927A (en) * | 1995-03-20 | 1998-08-25 | Electro Scientific Industries, Inc. | Apparatus and method for coordinating the movements of stages in a multi-stage multi-rate positioner system |
US6231566B1 (en) * | 1998-08-12 | 2001-05-15 | Katana Research, Inc. | Method for scanning a pulsed laser beam for surface ablation |
Non-Patent Citations (1)
Title |
---|
See also references of WO03047805A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP4455884B2 (en) | 2010-04-21 |
CN1596172A (en) | 2005-03-16 |
AU2002348254A1 (en) | 2003-06-17 |
CN1295052C (en) | 2007-01-17 |
JP2005511312A (en) | 2005-04-28 |
EP1448336A4 (en) | 2006-03-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 20030728 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR |
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AX | Request for extension of the european patent |
Extension state: AL LT LV MK RO SI |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: LIU, XINBING Inventor name: CHENG, CHEN-HSIUNG |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: 7B 23K 26/067 B Ipc: 7B 41J 2/16 B Ipc: 7B 23K 26/36 B Ipc: 7B 23K 26/38 B Ipc: 7B 23K 26/08 B Ipc: 7B 23K 26/00 A |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20060126 |
|
17Q | First examination report despatched |
Effective date: 20060622 |
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RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: PANASONIC CORPORATION |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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18D | Application deemed to be withdrawn |
Effective date: 20120411 |