EP1419529A2 - Three-dimensional electronic device and relative manufacture method - Google Patents

Three-dimensional electronic device and relative manufacture method

Info

Publication number
EP1419529A2
EP1419529A2 EP02733231A EP02733231A EP1419529A2 EP 1419529 A2 EP1419529 A2 EP 1419529A2 EP 02733231 A EP02733231 A EP 02733231A EP 02733231 A EP02733231 A EP 02733231A EP 1419529 A2 EP1419529 A2 EP 1419529A2
Authority
EP
European Patent Office
Prior art keywords
contact pad
electronic circuit
electronic device
spacer member
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02733231A
Other languages
German (de)
French (fr)
Inventor
Mario Palazzetti
Eugenio Faggioli
Riccardo Groppo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centro Ricerche Fiat SCpA
Original Assignee
Centro Ricerche Fiat SCpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centro Ricerche Fiat SCpA filed Critical Centro Ricerche Fiat SCpA
Publication of EP1419529A2 publication Critical patent/EP1419529A2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/0651—Wire or wire-like electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06551—Conductive connections on the side of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06572—Auxiliary carrier between devices, the carrier having an electrical connection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06575—Auxiliary carrier between devices, the carrier having no electrical connection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a three-dimensional electronic device and relative manufacture method.
  • a three-dimensional electronic device is formed by a number of integrated electronic circuits stacked and housed in a package made of plastic material, typically epoxy resin, and from which connecting pins project.
  • Figure 1 shows a number of steps in a method of manufacturing a three-dimensional electronic device.
  • the manufacture method comprises stacking a number of , integrated electronic circuits 1 - only three of which ' are shown in Figure 1 for the sake of simplicity. More specifically, each integrated electronic circuit 1 comprises a so-called die 2 glued or soldered to a flexible support 3 having a structure similar to that of a printed circuit board, and on which are formed leads 4 connected electrically at one end to respective test pads 5 equally spaced along a peripheral portion of flexible support 3, and, at the other end, to respective regions of die 2 by means of connecting wires .
  • the stacking operation is followed by a molding operation, in which a substantially parallelepiped-shaped package 7 made of epoxy ' resin and enclosing integrated electronic circuits 1 is formed.
  • Package 7 is then sawed to expose leads 4.
  • a plating operation is then performed, in which the lateral walls of package 7 are plated with conducting material, e.g. a nickel and gold alloy.
  • the plating operation is followed by a connecting operation, in which a laser beam defines, on the conducting plating, conducting tracks 8 electrically connecting leads 4 as required, so as to obtain the three-dimensional electronic device indicated as a whole by 9.
  • Figure 1 shows a known method of manufacturing a three-dimensional electronic device
  • Figure 2 shows a three-dimensional electronic device manufactured in accordance with a first embodiment of the present invention
  • Figure 3 shows a group of conducting spacer members used in the Figure 2 three-dimensional electronic device
  • Figure 4 shows a three-dimensional electronic device manufactured in accordance with a second embodiment of the present invention
  • Figure 5 shows a three-dimensional electronic device manufactured in accordance with a third embodiment of the present invention.
  • Three-dimensional electronic device 10 indicates as a whole a three- dimensional electronic device in accordance with a first embodiment of the present invention. More specifically, three-dimensional electronic device 10 comprises a number of stacked integrated electronic circuits, only two of which, indicated 12 and 14, are shown in Figure 2 for the sake of simplicity, and each of which comprises a die 16 glued or soldered to a flexible support 18 having a structure similar to that of a printed circuit board, and on which are formed leads 20 connected electrically, at one end, to respective contact pads 22 equally spaced along a peripheral, portion of flexible support 18, and, at the other end, to respective regions of die 16 by means of soldering wires 24.
  • Figure 2 also shows, schematically, how a contact pad 22a of integrated electronic circuit 12 can be connected electrically to a corresponding contact pad 22b, i.e. aligned vertically with contact pad 22a, of integrated electronic circuit 14.
  • the two corresponding contact pads 22a, 22b are connected electrically to each other by a conducting spacer member 26 made of relatively rigid conducting polymer material and extending between, and at respective edges of, the two integrated electronic circuits . ⁇ 12, 14.
  • conducting spacer member 26 is substantially C-shaped, and comprises a first and a second substantially parallelepiped-shaped contact portion 26a, 26b parallel to each other; and a substantially parallelepiped-shaped connecting portion 26c connecting, and extending transversely between, contact portions 26a, 26b.
  • first and second contact portions 26a, 26b contact contact pads 22a, 22b of integrated electronic circuits 12, 14 respectively, and connecting portion 26c electrically connects first and second contact portions 26a, 26b, and therefore contact pads 22a, 22b.
  • connecting portion 26c By extending between the two integrated electronic circuits 12, 14, and being made of relatively rigid conducting polymer material, connecting portion 26c also keeps the two integrated electronic circuits 12 , 14 spaced apart by a distance substantially equal to the length of connecting portion 26c.
  • Stable electric connection of contact portions 26a, 26b of conducting spacer member 26 to respective contact pads 22a, 22b of the two integrated electronic circuits 12, 14 is made when packaging integrated electronic circuits 12, 14, which comprises a first step, in which integrated electronic circuits 12, 14 are compressed axially, so that contact portions 26a, 26b of spacer member 26 adhere to and grip relative contact pads 22a, 22b; an intermediate step, in which the stacked, axially compressed integrated electronic circuits 12, 14 are glued or soldered to a leadframe (not shown) and connected electrically to the leads on the leadframe; and a final step, in which the plastic package (not shown) , for securing the two integrated electronic circuits 12, 14 in the connection position established at the axial compression step, is formed in conventional manner.
  • At least two conducting spacer members 26 must obviously be provided on two opposite sides of integrated electronic circuits
  • Conducting spacer member 26 as described above and shown in Figure 2 may be used for electrically connecting corresponding contact pads 22 of both adjacent and non- adjacent integrated electronic circuits.
  • the respective conducting spacer members 26 may conveniently alternate with insulating spacer members 28, made of relatively rigid dielectric polymer material and having the same structure as conducting spacer members 26, to form a compact structure of the type shown in Figure 3, and at least two of which, as stated, must be provided on two opposite sides of the integrated electronic circuits .
  • Figure 4 shows a three-dimensional electronic device in accordance with a second embodiment of the present invention. More specifically, Figure 4 shows, schematically, how a contact pad 22a of integrated electronic circuit 12 can be connected electrically to a non-corresponding contact pad 22c of integrated electronic circuit 14. More specifically, as shown in Figure 4, the two non-corresponding contact pads 22a, 22c are connected electrically to each other by combining, as described in detail below, a first and a second conducting spacer member 30, 32, having the same structure, and a connection redistribution matrix 34 interposed between the two integrated electronic circuits 12, 14.
  • redistribution matrix 34 is substantially defined by a layer of insulating material, on which are formed electrically conducting contact pads and through openings, between which extend conducting tracks of the type used on conventional printed circuits .
  • redistribution matrix 34 comprises a contact pad 36 made of electrically conducting material and formed on the layer of insulating material 38 at (i.e. aligned vertically with) contact pad 22a; a through opening 40 formed in insulating layer 38 at (i.e. aligned vertically with) contact pad 22c and having lateral walls coated with electrically conducting material; and a conducting track 42 extending from contact pad 36 to the edge of through opening 40.
  • First conducting spacer member 30 has a first and second contact portion 30a, 30b respectively contacting contact pad 22a of integrated electronic circuit 12 and contact pad 36 of redistribution matrix 34; and a connecting portion 30c connecting contact portions 30a, 30b.
  • Second conducting spacer member 32 has a first contact portion 32a interposed between through opening 40 of redistribution matrix 34 and contact pad 22c of integrated electronic circuit 14, and contacting contact pad 22c; and a second contact portion (not shown) connected to first contact portion 32a by a connecting portion 32c ' More specifically, the second contact portion may contact a contact pad, corresponding to contact pad 22c, of a further integrated electronic circuit (not shown) , or an electrically conducting contact pad of a further redistribution matrix (not shown) to connect contact pad 22c to a non-corresponding contact pad of another integrated electronic circuit, or to contact a non-conducting area of the further redistribution matrix.
  • contact pads 22a and 22c are connected electrically when packaging integrated electronic circuits 12, 14.
  • first contact portion 32a of second conducting spacer member 32 adheres stably to contact pad 22c of integrated electronic circuit 14; part of contact portion 32a is deformed and penetrates through opening 40 of redistribution matrix 34; second contact portion 30b of first conducting spacer member 30 adheres stably to contact pad 36 of redistribution matrix 34; and first contact portion 30a of first conducting spacer member 30 adheres stably to first contact pad 22a of integrated electronic circuit 12.
  • Penetration of through opening 40 by part of contact portion 32a of second conducting spacer member 32 electrically connects contact pad 22c of integrated electronic circuit 14 and contact pad 36 of redistribution matrix 34 by means of conducting track 42; and first conducting spacer member 30 electrically connects contact pad 36 of redistribution matrix 34 to contact pad 22a of integrated electronic circuit 12.
  • Contact pad 22b of integrated electronic circuit 14, corresponding to contact pad 22a of integrated electronic circuit 12 and located beneath contact pad 36 of redistribution matrix 34, may be connected to a corresponding contact pad of another integrated electronic circuit by means of a conducting spacer member, or to a non-corresponding contact pad by combining two conducting spacer members and a redistribution matrix in the same way as described above.
  • Figure 5 shows a third embodiment of the present invention, which is similar to the Figure 4 embodiment, except that, as opposed to through opening 40, redistribution matrix 34 comprises a further contact pad 44 of electrically conducting material.
  • second conducting spacer member 32 has the first contact portion 32a contacting contact pad 44 of redistribution matrix 34, and the second contact portion 32b contacting contact pad 22c of integrated electronic circuit 14 .
  • any two contact pads may therefore be connected electrically by appropriately combining conducting spacer members and redistribution matrixes as described above. ⁇ More specifically, by appropriately combining conducting spacer members and redistribution matrixes, the contact pads of the integrated electronic circuits which must be made accessible from outside the three- dimensional electronic device are redistributed on integrated electronic circuits closer and closer to the leadframe, until the integrated electronic circuit directly contacting the leadframe is reached, and are then connected to the leads by connecting wires .
  • the manufacture method is simpler, and therefore cheaper, than the known manufacture methods described previously.
  • the manufacture method according to the present invention involves no sawing of the package to expose the leads on the leadframe, no coating of the s lateral walls of the package with electrically conducting material, and no definition of the conducting tracks on the conducting coating to connect the leads, and simply involves appropriately combining conducting spacer members and redistribution matrixes .
  • the cost of the three-dimensional electronic device according to the invention is further reduced by requiring only one leadframe.

Abstract

There is described a three-dimensional electronic device (10) having a first and a second electronic circuit (12, 14) stacked one on top of the other and having respective contact pads (22); and a substantially C-shaped spacer member (26) made of electrically conducting material and extending between the first and second electronic circuit (12, 14) to connect a first contact pad (22a) of the first integrated circuit (12) electrically to a second contact pad (22b) of the second integrated circuit (14).

Description

THREE-DIMENSIONAL ELECTRONIC DEVICE AND RELATIVE MANUFACTURE METHOD
TECHNICAL FIELD
The present invention relates to a three-dimensional electronic device and relative manufacture method. BACKGROUND ART
As is known, a three-dimensional electronic device is formed by a number of integrated electronic circuits stacked and housed in a package made of plastic material, typically epoxy resin, and from which connecting pins project.
Figure 1 shows a number of steps in a method of manufacturing a three-dimensional electronic device.
As shown in Figure 1, the manufacture method comprises stacking a number of , integrated electronic circuits 1 - only three of which' are shown in Figure 1 for the sake of simplicity. More specifically, each integrated electronic circuit 1 comprises a so-called die 2 glued or soldered to a flexible support 3 having a structure similar to that of a printed circuit board, and on which are formed leads 4 connected electrically at one end to respective test pads 5 equally spaced along a peripheral portion of flexible support 3, and, at the other end, to respective regions of die 2 by means of connecting wires . The stacking operation is followed by a molding operation, in which a substantially parallelepiped-shaped package 7 made of epoxy' resin and enclosing integrated electronic circuits 1 is formed.
Package 7 is then sawed to expose leads 4. A plating operation is then performed, in which the lateral walls of package 7 are plated with conducting material, e.g. a nickel and gold alloy.
The plating operation is followed by a connecting operation, in which a laser beam defines, on the conducting plating, conducting tracks 8 electrically connecting leads 4 as required, so as to obtain the three-dimensional electronic device indicated as a whole by 9.
Though widely used, the above manufacture method is prevented from being fully exploited by being fairly complex and expensive; which drawback is a serious obstacle to rapid diffusion , of three-dimensional
{ electronics, particularly in the automotive industry. DISCLOSURE OF THE INVENTION It is an object of the present invention to provide a three-dimensional electronic device and relative manufacture method, designed to at least partly eliminate the aforementioned drawbacks . According to the present invention, there is provided a three-dimensional electronic device as claimed in Claim 1.
According to the present invention, there is also provided a method of manufacturing a three-dimensional electronic device, as claimed in Claim 11.
BRIEF DESCRIPTION OF THE DRAWINGS
A number of preferred, non-limiting embodiments of the invention will be described, purely by way of example, with reference to the accompanying drawings, in which:
Figure 1 shows a known method of manufacturing a three-dimensional electronic device;
Figure 2 shows a three-dimensional electronic device manufactured in accordance with a first embodiment of the present invention;
Figure 3 shows a group of conducting spacer members used in the Figure 2 three-dimensional electronic device;
Figure 4 shows a three-dimensional electronic device manufactured in accordance with a second embodiment of the present invention;
Figure 5 shows a three-dimensional electronic device manufactured in accordance with a third embodiment of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION
Number 10 in Figure 2 indicates as a whole a three- dimensional electronic device in accordance with a first embodiment of the present invention. More specifically, three-dimensional electronic device 10 comprises a number of stacked integrated electronic circuits, only two of which, indicated 12 and 14, are shown in Figure 2 for the sake of simplicity, and each of which comprises a die 16 glued or soldered to a flexible support 18 having a structure similar to that of a printed circuit board, and on which are formed leads 20 connected electrically, at one end, to respective contact pads 22 equally spaced along a peripheral, portion of flexible support 18, and, at the other end, to respective regions of die 16 by means of soldering wires 24.
Figure 2 also shows, schematically, how a contact pad 22a of integrated electronic circuit 12 can be connected electrically to a corresponding contact pad 22b, i.e. aligned vertically with contact pad 22a, of integrated electronic circuit 14.
More specifically, as shown in Figure 2, the two corresponding contact pads 22a, 22b are connected electrically to each other by a conducting spacer member 26 made of relatively rigid conducting polymer material and extending between, and at respective edges of, the two integrated electronic circuits .^12, 14.
More specifically, conducting spacer member 26 is substantially C-shaped, and comprises a first and a second substantially parallelepiped-shaped contact portion 26a, 26b parallel to each other; and a substantially parallelepiped-shaped connecting portion 26c connecting, and extending transversely between, contact portions 26a, 26b.
More specifically, first and second contact portions 26a, 26b contact contact pads 22a, 22b of integrated electronic circuits 12, 14 respectively, and connecting portion 26c electrically connects first and second contact portions 26a, 26b, and therefore contact pads 22a, 22b.
By extending between the two integrated electronic circuits 12, 14, and being made of relatively rigid conducting polymer material, connecting portion 26c also keeps the two integrated electronic circuits 12 , 14 spaced apart by a distance substantially equal to the length of connecting portion 26c.
Stable electric connection of contact portions 26a, 26b of conducting spacer member 26 to respective contact pads 22a, 22b of the two integrated electronic circuits 12, 14 is made when packaging integrated electronic circuits 12, 14, which comprises a first step, in which integrated electronic circuits 12, 14 are compressed axially, so that contact portions 26a, 26b of spacer member 26 adhere to and grip relative contact pads 22a, 22b; an intermediate step, in which the stacked, axially compressed integrated electronic circuits 12, 14 are glued or soldered to a leadframe (not shown) and connected electrically to the leads on the leadframe; and a final step, in which the plastic package (not shown) , for securing the two integrated electronic circuits 12, 14 in the connection position established at the axial compression step, is formed in conventional manner.
For the internal structure of three-dimensional electronic device 10 to be made stable, at least two conducting spacer members 26 must obviously be provided on two opposite sides of integrated electronic circuits
12, 14.
Conducting spacer member 26 as described above and shown in Figure 2 may be used for electrically connecting corresponding contact pads 22 of both adjacent and non- adjacent integrated electronic circuits.
When connecting a number of adjacent, successive contact pads 22 on one integrated electronic circuit to respective corresponding contact pads 22 on another integrated electronic circuit, the respective conducting spacer members 26 may conveniently alternate with insulating spacer members 28, made of relatively rigid dielectric polymer material and having the same structure as conducting spacer members 26, to form a compact structure of the type shown in Figure 3, and at least two of which, as stated, must be provided on two opposite sides of the integrated electronic circuits .
Figure 4 shows a three-dimensional electronic device in accordance with a second embodiment of the present invention. More specifically, Figure 4 shows, schematically, how a contact pad 22a of integrated electronic circuit 12 can be connected electrically to a non-corresponding contact pad 22c of integrated electronic circuit 14. More specifically, as shown in Figure 4, the two non-corresponding contact pads 22a, 22c are connected electrically to each other by combining, as described in detail below, a first and a second conducting spacer member 30, 32, having the same structure, and a connection redistribution matrix 34 interposed between the two integrated electronic circuits 12, 14.
More specifically, redistribution matrix 34 is substantially defined by a layer of insulating material, on which are formed electrically conducting contact pads and through openings, between which extend conducting tracks of the type used on conventional printed circuits .
More specifically, in the Figure 4 example, to make the above electric connection, redistribution matrix 34 comprises a contact pad 36 made of electrically conducting material and formed on the layer of insulating material 38 at (i.e. aligned vertically with) contact pad 22a; a through opening 40 formed in insulating layer 38 at (i.e. aligned vertically with) contact pad 22c and having lateral walls coated with electrically conducting material; and a conducting track 42 extending from contact pad 36 to the edge of through opening 40.
First conducting spacer member 30 has a first and second contact portion 30a, 30b respectively contacting contact pad 22a of integrated electronic circuit 12 and contact pad 36 of redistribution matrix 34; and a connecting portion 30c connecting contact portions 30a, 30b. Second conducting spacer member 32, on the other hand, has a first contact portion 32a interposed between through opening 40 of redistribution matrix 34 and contact pad 22c of integrated electronic circuit 14, and contacting contact pad 22c; and a second contact portion (not shown) connected to first contact portion 32a by a connecting portion 32c' More specifically, the second contact portion may contact a contact pad, corresponding to contact pad 22c, of a further integrated electronic circuit (not shown) , or an electrically conducting contact pad of a further redistribution matrix (not shown) to connect contact pad 22c to a non-corresponding contact pad of another integrated electronic circuit, or to contact a non-conducting area of the further redistribution matrix.
In this case, too, contact pads 22a and 22c are connected electrically when packaging integrated electronic circuits 12, 14.
More specifically, when the two integrated electronic circuits 12, 14 are compressed axially, the following occur simultaneously: first contact portion 32a of second conducting spacer member 32 adheres stably to contact pad 22c of integrated electronic circuit 14; part of contact portion 32a is deformed and penetrates through opening 40 of redistribution matrix 34; second contact portion 30b of first conducting spacer member 30 adheres stably to contact pad 36 of redistribution matrix 34; and first contact portion 30a of first conducting spacer member 30 adheres stably to first contact pad 22a of integrated electronic circuit 12.
Penetration of through opening 40 by part of contact portion 32a of second conducting spacer member 32 electrically connects contact pad 22c of integrated electronic circuit 14 and contact pad 36 of redistribution matrix 34 by means of conducting track 42; and first conducting spacer member 30 electrically connects contact pad 36 of redistribution matrix 34 to contact pad 22a of integrated electronic circuit 12.
Contact pad 22b of integrated electronic circuit 14, corresponding to contact pad 22a of integrated electronic circuit 12 and located beneath contact pad 36 of redistribution matrix 34, may be connected to a corresponding contact pad of another integrated electronic circuit by means of a conducting spacer member, or to a non-corresponding contact pad by combining two conducting spacer members and a redistribution matrix in the same way as described above. Figure 5 shows a third embodiment of the present invention, which is similar to the Figure 4 embodiment, except that, as opposed to through opening 40, redistribution matrix 34 comprises a further contact pad 44 of electrically conducting material. In this embodiment, second conducting spacer member 32 has the first contact portion 32a contacting contact pad 44 of redistribution matrix 34, and the second contact portion 32b contacting contact pad 22c of integrated electronic circuit 14 .
Any two contact pads may therefore be connected electrically by appropriately combining conducting spacer members and redistribution matrixes as described above. ■ More specifically, by appropriately combining conducting spacer members and redistribution matrixes, the contact pads of the integrated electronic circuits which must be made accessible from outside the three- dimensional electronic device are redistributed on integrated electronic circuits closer and closer to the leadframe, until the integrated electronic circuit directly contacting the leadframe is reached, and are then connected to the leads by connecting wires .
The three-dimensional electronic device described above has the following advantages :
Firstly, the manufacture method is simpler, and therefore cheaper, than the known manufacture methods described previously.
That is , unlike known manufacture methods , the manufacture method according to the present invention involves no sawing of the package to expose the leads on the leadframe, no coating of thes lateral walls of the package with electrically conducting material, and no definition of the conducting tracks on the conducting coating to connect the leads, and simply involves appropriately combining conducting spacer members and redistribution matrixes .
Secondly, as compared with known three-dimensional electronic devices, the cost of the three-dimensional electronic device according to the invention is further reduced by requiring only one leadframe.
Clearly, changes may be made to the three- dimensional electronic device as described herein without, however, departing from the scope of the present invention.

Claims

1) A three-dimensional electronic device (10) comprising at least a first and a second electronic circuit (12, 14) stacked one on top of the other and having respective contact pads (22) ; and connecting means
(26; 30; 32; 34) for connecting at least a first contact pad (22a) of said first electronic circuit (12) to a second contact pad (22b; 22c) of said second electronic circuit (14) ; characterized in that said connecting means (26; 30; 32; 34) comprise at least a first spacer member (26; 30) made of electrically conducting material and extending between said first and said second electronic circuit (12, 14) to connect said first and said second contact pad (22a, 22b; 22a, 22c) electrically to each other.
2) A three-dimensional electronic device as claimed in Claim 1, characterized in that said first spacer member (26; 30) is made of conducting polymer material. 3) A three-dimensional electronic device as claimed in Claim 1 or 2, characterized in that said first spacer member (26; 30) extends at respective edges of said first and said second electronic circuit (12, 14), and supports the first and second electronic circuit (12, 14) a given distance apart.
4) A three-dimensional electronic device as claimed in any one of the foregoing Claims, characterized in that said first spacer member (26) is substantially C-shaped. 5) A three-dimensional electronic device as claimed in any one of the foregoing Claims, characterized in that said first spacer member (26) comprises at least a first contact portion (26a) contacting said first contact pad (22a) ,- at least a second contact portion (26b) contacting said second contact pad (22b) ; and at least a connecting portion (26c) connecting said first and said second contact portion (26a, 26b) .
6) A three-dimensional electronic device as claimed in any one of the foregoing Claims, characterized in that said connecting means (26; 30; 32; 34) comprise a number of said first spacer members (26; 30) made of electrically conducting material, connecting respective pairs of contact pads (22) of said first and said second electronic circuit (12, 14), and alternating with spacer members (28) made of electrically insulating material.
7) A three-dimensional electronic device as claimed in any one of Claims 1 to 3 , characterized in that said connecting means (26; 30; 32; 34) also comprise a second spacer member (32) of electrically conducting material; and a connection redistribution matrix (34) interposed between said first and said second electronic circuit
(12, 14) and between said first and said second spacer member (30, 32) to connect said first and said second contact pad (22a, 22b) to each other.
8) A three-dimensional electronic device as claimed in Claim 7, characterized in that said redistribution matrix (34) is defined by a layer (38) of electrically insulating material, on which are formed an electrically conducting area (36) located at said first contact pad (22a) , a through opening (40) located at said second contact pad (22c) , and a conducting track (42) extending between said electrically conducting area (36) and said through opening (40) ; said first spacer member (30) extending between said first contact pad (22a) of said first electronic circuit (12) and said electrically conducting area (36) of said redistribution matrix (34) , and having a first and a second contact portion (30a, 30b) contacting said first contact pad (22a) and said electrically conducting area (36) respectively; and said second spacer member (32) having a first contact portion (32a) interposed between said through opening (40) of said redistribution matrix (34) and said second contact pad (22c) , and contacting said second contact pad (22c) .
9) A three-dimensional electronic device as claimed in Claim 7, characterized in that said redistribution matrix (34) is defined by a layer (38) of electrically insulating material, on which are formed a first electrically conducting area (36) located at said first contact pad (22a) , a second electrically conducting area i
(44) located at said second contact pad (22c) , and a conducting track (42) extending between said first and said second electrically conducting area (36 , 44) ; said first spacer member (30) extending between said first contact pad (22a) of said first electronic circuit (12) and said first electrically conducting area (36) of said redistribution matrix (34) , and having a first and a second contact portion (30a, 30b) contacting said first contact pad (22a) and said first electrically conducting area (36) respectively; and said second spacer member (32) extending between said second electrically conducting area (44) of said redistribution matrix (34) and said second contact pad (22b) of said second electronic circuit (14) , and having a first and a second contact portion (32a, 32b) contacting said second electrically conducting area (44) and said second contact pad (22c) respectively.
10) A three-dimensional electronic device as claimed in any one of the foregoing Claims, characterized in that said first and said second electronic circuit (12, 14) are integrated electronic circuits.
11) A method of manufacturing a three-dimensional electronic device (10), comprising the steps of: stacking a first and at least a second electronic circuit (12, 14) having respective contact pads (22) ; and connecting at least a first contact pad (22a) of said first electronic circuit (12) to a second contact pad (22b; 22c) of said second electronic circuit (14) ; .characterized in that s said step of connecting said first and said second contact pad (22a, 22b; 22a, 22c) comprises the step of using a first spacer member (26; 30) made of electrically conducting material and extending between said first and said second electronic circuit (12, 14) .
12) A method as claimed in Claim 11, characterized in that said step of connecting said first and said second contact pad (22a, 22b; 22a, 22c) also comprises the step of using a second spacer member (32) of electrically conducting material, and a connection redistribution matrix (34) interposed between said first and said second electronic circuit (12, 14) and between said first and said second spacer member (30, 32) .
EP02733231A 2001-05-08 2002-05-07 Three-dimensional electronic device and relative manufacture method Withdrawn EP1419529A2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ITTO20010433 2001-05-08
IT2001TO000433A ITTO20010433A1 (en) 2001-05-08 2001-05-08 THREE-DIMENSIONAL ELECTRONIC DEVICE AND RELATED MANUFACTURING PROCESS.
PCT/IT2002/000304 WO2002091469A2 (en) 2001-05-08 2002-05-07 Three-dimensional electronic device and relative manufacture method

Publications (1)

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EP1419529A2 true EP1419529A2 (en) 2004-05-19

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EP (1) EP1419529A2 (en)
IT (1) ITTO20010433A1 (en)
WO (1) WO2002091469A2 (en)

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US4551629A (en) * 1980-09-16 1985-11-05 Irvine Sensors Corporation Detector array module-structure and fabrication
JP2816244B2 (en) * 1990-07-11 1998-10-27 株式会社日立製作所 Stacked multi-chip semiconductor device and semiconductor device used therefor
US5657206A (en) * 1994-06-23 1997-08-12 Cubic Memory, Inc. Conductive epoxy flip-chip package and method
US5568356A (en) * 1995-04-18 1996-10-22 Hughes Aircraft Company Stacked module assembly including electrically interconnected switching module and plural electronic modules
US5673478A (en) * 1995-04-28 1997-10-07 Texas Instruments Incorporated Method of forming an electronic device having I/O reroute
US5818107A (en) * 1997-01-17 1998-10-06 International Business Machines Corporation Chip stacking by edge metallization

Non-Patent Citations (1)

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Title
See references of WO02091469A3 *

Also Published As

Publication number Publication date
ITTO20010433A1 (en) 2002-11-08
ITTO20010433A0 (en) 2001-05-08
WO2002091469A3 (en) 2004-03-04
WO2002091469A2 (en) 2002-11-14

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