EP1358021A4 - Inverted pressure vessel with shielded closure mechanism - Google Patents

Inverted pressure vessel with shielded closure mechanism

Info

Publication number
EP1358021A4
EP1358021A4 EP01907022A EP01907022A EP1358021A4 EP 1358021 A4 EP1358021 A4 EP 1358021A4 EP 01907022 A EP01907022 A EP 01907022A EP 01907022 A EP01907022 A EP 01907022A EP 1358021 A4 EP1358021 A4 EP 1358021A4
Authority
EP
European Patent Office
Prior art keywords
pressure vessel
closure mechanism
inverted pressure
shielded closure
shielded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01907022A
Other languages
German (de)
French (fr)
Other versions
EP1358021A1 (en
Inventor
Robert Farmer
Heiko Moritz
Jonathan Talbot
Mohan Chandra
James Tseronis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SC Fluids Inc
Original Assignee
SC Fluids Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/632,770 external-priority patent/US6508259B1/en
Application filed by SC Fluids Inc filed Critical SC Fluids Inc
Publication of EP1358021A1 publication Critical patent/EP1358021A1/en
Publication of EP1358021A4 publication Critical patent/EP1358021A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/008—Processes carried out under supercritical conditions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
EP01907022A 2000-08-04 2001-02-05 Inverted pressure vessel with shielded closure mechanism Withdrawn EP1358021A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/632,770 US6508259B1 (en) 1999-08-05 2000-08-04 Inverted pressure vessel with horizontal through loading
US632770 2000-08-04
PCT/US2001/003796 WO2002011911A1 (en) 2000-08-04 2001-02-05 Inverted pressure vessel with shielded closure mechanism

Publications (2)

Publication Number Publication Date
EP1358021A1 EP1358021A1 (en) 2003-11-05
EP1358021A4 true EP1358021A4 (en) 2004-03-31

Family

ID=24536872

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01907022A Withdrawn EP1358021A4 (en) 2000-08-04 2001-02-05 Inverted pressure vessel with shielded closure mechanism

Country Status (7)

Country Link
EP (1) EP1358021A4 (en)
JP (1) JP2004506313A (en)
KR (1) KR20030026333A (en)
CN (1) CN1446127A (en)
AU (1) AU2001234856A1 (en)
IL (1) IL154095A0 (en)
WO (1) WO2002011911A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602004032435D1 (en) * 2003-06-13 2011-06-09 Sophia Wen DEVICE FOR THE CHEMICAL TREATMENT OF THIN LAYERS OF SEMICONDUCTORS
US7941039B1 (en) 2005-07-18 2011-05-10 Novellus Systems, Inc. Pedestal heat transfer and temperature control
US7960297B1 (en) 2006-12-07 2011-06-14 Novellus Systems, Inc. Load lock design for rapid wafer heating
US8052419B1 (en) 2007-11-08 2011-11-08 Novellus Systems, Inc. Closed loop temperature heat up and control utilizing wafer-to-heater pedestal gap modulation
US8033771B1 (en) 2008-12-11 2011-10-11 Novellus Systems, Inc. Minimum contact area wafer clamping with gas flow for rapid wafer cooling
US8371567B2 (en) 2011-04-13 2013-02-12 Novellus Systems, Inc. Pedestal covers
KR20190132561A (en) 2012-01-06 2019-11-27 노벨러스 시스템즈, 인코포레이티드 Adaptive heat transfer methods and systems for uniform heat transfer
US10347547B2 (en) 2016-08-09 2019-07-09 Lam Research Corporation Suppressing interfacial reactions by varying the wafer temperature throughout deposition

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0623948A1 (en) * 1992-11-13 1994-11-09 Asm Japan K.K. Load lock chamber for vertical type heat treatment apparatus
US5621982A (en) * 1992-07-29 1997-04-22 Shinko Electric Co., Ltd. Electronic substrate processing system using portable closed containers and its equipments
US5979306A (en) * 1997-03-26 1999-11-09 Kabushiki Kaisha Kobe Seiko Sho Heating pressure processing apparatus
US6067728A (en) * 1998-02-13 2000-05-30 G.T. Equipment Technologies, Inc. Supercritical phase wafer drying/cleaning system
WO2001010733A1 (en) * 1999-08-05 2001-02-15 S. C. Fluids, Inc. Inverted pressure vessel with horizontal through loading
WO2001022016A1 (en) * 1999-09-20 2001-03-29 S. C. Fluids, Inc. Supercritical fluid drying system
WO2001087505A1 (en) * 2000-05-18 2001-11-22 S. C. Fluids, Inc. Supercritical fluid cleaning process for precision surfaces

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3968885A (en) * 1973-06-29 1976-07-13 International Business Machines Corporation Method and apparatus for handling workpieces
DE2940201A1 (en) * 1979-10-04 1981-05-07 Claas Ohg, 4834 Harsewinkel FIELD CHOPPER WITH METAL DETECTOR
US4522788A (en) * 1982-03-05 1985-06-11 Leco Corporation Proximate analyzer
JPS58180631A (en) * 1982-04-16 1983-10-22 日産自動車株式会社 Comber frame of loom
US4626509A (en) * 1983-07-11 1986-12-02 Data Packaging Corp. Culture media transfer assembly
JPH0765197B2 (en) * 1983-11-04 1995-07-12 株式会社日立製作所 Vacuum processing device
US4827867A (en) * 1985-11-28 1989-05-09 Daikin Industries, Ltd. Resist developing apparatus
JPH01246835A (en) * 1988-03-29 1989-10-02 Toshiba Corp Wafer processor
US5224504A (en) * 1988-05-25 1993-07-06 Semitool, Inc. Single wafer processor
US4879431A (en) * 1989-03-09 1989-11-07 Biomedical Research And Development Laboratories, Inc. Tubeless cell harvester
US5169408A (en) * 1990-01-26 1992-12-08 Fsi International, Inc. Apparatus for wafer processing with in situ rinse
US5071485A (en) * 1990-09-11 1991-12-10 Fusion Systems Corporation Method for photoresist stripping using reverse flow
JPH0613361A (en) * 1992-06-26 1994-01-21 Tokyo Electron Ltd Processing apparatus
JPH09213772A (en) * 1996-01-30 1997-08-15 Dainippon Screen Mfg Co Ltd Board holder
JPH1194085A (en) * 1997-09-26 1999-04-09 Kobe Steel Ltd Safety device for sealed chamber in high pressure treating device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5621982A (en) * 1992-07-29 1997-04-22 Shinko Electric Co., Ltd. Electronic substrate processing system using portable closed containers and its equipments
EP0623948A1 (en) * 1992-11-13 1994-11-09 Asm Japan K.K. Load lock chamber for vertical type heat treatment apparatus
US5979306A (en) * 1997-03-26 1999-11-09 Kabushiki Kaisha Kobe Seiko Sho Heating pressure processing apparatus
US6067728A (en) * 1998-02-13 2000-05-30 G.T. Equipment Technologies, Inc. Supercritical phase wafer drying/cleaning system
WO2001010733A1 (en) * 1999-08-05 2001-02-15 S. C. Fluids, Inc. Inverted pressure vessel with horizontal through loading
WO2001022016A1 (en) * 1999-09-20 2001-03-29 S. C. Fluids, Inc. Supercritical fluid drying system
WO2001087505A1 (en) * 2000-05-18 2001-11-22 S. C. Fluids, Inc. Supercritical fluid cleaning process for precision surfaces

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO0211911A1 *

Also Published As

Publication number Publication date
KR20030026333A (en) 2003-03-31
AU2001234856A1 (en) 2002-02-18
CN1446127A (en) 2003-10-01
WO2002011911A1 (en) 2002-02-14
IL154095A0 (en) 2003-07-31
JP2004506313A (en) 2004-02-26
EP1358021A1 (en) 2003-11-05

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20030203

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Extension state: AL LT LV MK RO SI

A4 Supplementary search report drawn up and despatched

Effective date: 20040218

17Q First examination report despatched

Effective date: 20041102

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20060927