EP1220332A3 - A light permeable fluorescent cover for light emitting diode - Google Patents
A light permeable fluorescent cover for light emitting diode Download PDFInfo
- Publication number
- EP1220332A3 EP1220332A3 EP01130432A EP01130432A EP1220332A3 EP 1220332 A3 EP1220332 A3 EP 1220332A3 EP 01130432 A EP01130432 A EP 01130432A EP 01130432 A EP01130432 A EP 01130432A EP 1220332 A3 EP1220332 A3 EP 1220332A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- light
- peak
- emitting diode
- cover
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
- C09K11/7792—Aluminates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000391457 | 2000-12-22 | ||
JP2000391457A JP2002190622A (en) | 2000-12-22 | 2000-12-22 | Transmissive fluorescent cover for light emitting diode |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1220332A2 EP1220332A2 (en) | 2002-07-03 |
EP1220332A3 true EP1220332A3 (en) | 2005-10-12 |
Family
ID=18857591
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01130432A Withdrawn EP1220332A3 (en) | 2000-12-22 | 2001-12-20 | A light permeable fluorescent cover for light emitting diode |
Country Status (5)
Country | Link |
---|---|
US (1) | US7906904B2 (en) |
EP (1) | EP1220332A3 (en) |
JP (1) | JP2002190622A (en) |
KR (1) | KR100587126B1 (en) |
TW (1) | TW535304B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8362695B2 (en) | 2002-08-30 | 2013-01-29 | GE Lighting Solutions, LLC | Light emitting diode component |
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US7091656B2 (en) | 2001-04-20 | 2006-08-15 | Nichia Corporation | Light emitting device |
WO2002086978A1 (en) | 2001-04-20 | 2002-10-31 | Nichia Corporation | Light emitting device |
JP2002374007A (en) * | 2001-06-15 | 2002-12-26 | Toyoda Gosei Co Ltd | Light-emitting apparatus |
JP2003152227A (en) * | 2001-11-14 | 2003-05-23 | Citizen Electronics Co Ltd | Means and method for correcting color of led |
KR100497339B1 (en) * | 2002-01-08 | 2005-06-23 | 주식회사 이츠웰 | Light emitting diode device and illuminator, display, and back light using the same |
TW507853U (en) * | 2002-01-25 | 2002-10-21 | Shi-Huang Lin | Series type lamp |
JP4016724B2 (en) * | 2002-05-31 | 2007-12-05 | 住友化学株式会社 | Phosphor for vacuum ultraviolet light-emitting device |
US7224000B2 (en) | 2002-08-30 | 2007-05-29 | Lumination, Llc | Light emitting diode component |
US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
US6744077B2 (en) * | 2002-09-27 | 2004-06-01 | Lumileds Lighting U.S., Llc | Selective filtering of wavelength-converted semiconductor light emitting devices |
JP2004138958A (en) * | 2002-10-21 | 2004-05-13 | Semiconductor Energy Lab Co Ltd | Display device |
US7015636B2 (en) * | 2002-10-23 | 2006-03-21 | Charles Bolta | Balanced blue spectrum therapy lighting |
AU2002952652A0 (en) * | 2002-11-14 | 2002-11-28 | University Of Technology, Sydney | A hybrid lighting system |
KR20040046516A (en) * | 2002-11-27 | 2004-06-05 | 이경득 | Lighting cover and method for manufacturing thereof |
JP2004228065A (en) * | 2002-11-29 | 2004-08-12 | Ngk Insulators Ltd | Electronic pulse emission device |
JP2004207341A (en) * | 2002-12-24 | 2004-07-22 | Sanken Electric Co Ltd | Emitted light wavelength converting semiconductor light emitting device and its manufacturing method |
JP2004296830A (en) * | 2003-03-27 | 2004-10-21 | Solidlite Corp | Method of manufacturing white light-emitting diode |
US20050006659A1 (en) * | 2003-07-09 | 2005-01-13 | Ng Kee Yean | Light emitting diode utilizing a discrete wavelength-converting layer for color conversion |
US7029935B2 (en) * | 2003-09-09 | 2006-04-18 | Cree, Inc. | Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same |
US20050099808A1 (en) * | 2003-11-12 | 2005-05-12 | Cheng Tzu C. | Light-emitting device |
WO2005067064A1 (en) * | 2003-11-25 | 2005-07-21 | Shichao Ge | Light emitting diode and light emitting diode lamp |
US7518158B2 (en) * | 2003-12-09 | 2009-04-14 | Cree, Inc. | Semiconductor light emitting devices and submounts |
US20050227394A1 (en) * | 2004-04-03 | 2005-10-13 | Bor-Jen Wu | Method for forming die protecting layer |
US7372198B2 (en) * | 2004-09-23 | 2008-05-13 | Cree, Inc. | Semiconductor light emitting devices including patternable films comprising transparent silicone and phosphor |
DE102004047727B4 (en) * | 2004-09-30 | 2018-01-18 | Osram Opto Semiconductors Gmbh | Luminescence diode chip with a converter layer and method for producing a luminescence diode chip with a converter layer |
ATE398836T1 (en) * | 2004-11-18 | 2008-07-15 | Koninkl Philips Electronics Nv | LIGHT EMITTING DEVICE WITH CONVERSION STRUCTURE |
KR100588209B1 (en) | 2005-01-19 | 2006-06-08 | 엘지전자 주식회사 | White light emitting device and method for fabricating the same |
DE102005009066A1 (en) | 2005-02-28 | 2006-09-07 | Osram Opto Semiconductors Gmbh | Method for producing an optical and a radiation-emitting component and optical and radiation-emitting component |
US7501659B2 (en) * | 2005-04-12 | 2009-03-10 | Japan Cash Machine Co., Ltd. | LED device and optical detector therewith for bill validator |
JP4799341B2 (en) * | 2005-10-14 | 2011-10-26 | 株式会社東芝 | Lighting device |
US20070152309A1 (en) * | 2005-12-29 | 2007-07-05 | Para Light Electronics Co., Ltd. | Light emitting diode |
KR100746749B1 (en) * | 2006-03-15 | 2007-08-09 | (주)케이디티 | Photoluminescent diffusion sheet |
CN101225931A (en) * | 2007-01-19 | 2008-07-23 | 童国钧 | LED lamp string devices which LED lamp body irradiation brightness is approximately same with each other and implementing method thereof |
WO2009094063A1 (en) * | 2008-01-24 | 2009-07-30 | Quad/Graphics, Inc. | Printing using color changeable material |
CN101946337B (en) * | 2008-03-28 | 2012-12-05 | 松下电器产业株式会社 | Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product |
US7888691B2 (en) | 2008-08-29 | 2011-02-15 | Koninklijke Philips Electronics N.V. | Light source including a wavelength-converted semiconductor light emitting device and a filter |
US8900921B2 (en) | 2008-12-11 | 2014-12-02 | Stats Chippac, Ltd. | Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV |
CN102020819A (en) * | 2009-09-16 | 2011-04-20 | 大连路明发光科技股份有限公司 | Plastic light-conversion fluorescent granules and application thereof |
US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
JP2011192598A (en) * | 2010-03-16 | 2011-09-29 | Stanley Electric Co Ltd | White led light source module |
US8297767B2 (en) | 2010-09-07 | 2012-10-30 | Xicato, Inc. | LED-based illumination modules with PTFE color converting surfaces |
TWI447969B (en) * | 2010-10-20 | 2014-08-01 | Interlight Optotech Corp | Light-emitting diode package structure |
WO2012061985A1 (en) * | 2010-11-10 | 2012-05-18 | Chang Kuo-Kuang | Method for manufacturing cover plate and method for manufacturing encapsulated light-emitting diode using the cover plate |
US20120134161A1 (en) * | 2010-11-30 | 2012-05-31 | Nobuo Kawamura | Lighting apparatus |
CN102544302A (en) * | 2010-12-17 | 2012-07-04 | 郑榕彬 | Direct liquid cooling method for light emitting didoes and light emitting diode package utilizing method |
JP5899507B2 (en) * | 2011-04-27 | 2016-04-06 | パナソニックIpマネジメント株式会社 | LIGHT EMITTING DEVICE AND LIGHTING DEVICE USING THE SAME |
CN202371641U (en) * | 2011-10-14 | 2012-08-08 | 郑榕彬 | Light-emitting diode (LED) lamp with double-layer fluorescent powder |
JP5751154B2 (en) * | 2011-12-14 | 2015-07-22 | 豊田合成株式会社 | Light emitting device and manufacturing method thereof |
US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
JP5945867B2 (en) * | 2012-05-11 | 2016-07-05 | パナソニックIpマネジメント株式会社 | Lighting device |
JP6853614B2 (en) * | 2013-03-29 | 2021-03-31 | 株式会社朝日ラバー | LED lighting device, its manufacturing method and LED lighting method |
US9683169B2 (en) * | 2013-10-11 | 2017-06-20 | Performance Indicator, Llc | Smoothing phosphors for AC LED lighting |
USD747228S1 (en) * | 2013-11-04 | 2016-01-12 | Fibar Group S.A. | Door/window sensor |
CA3028775C (en) * | 2014-03-04 | 2020-01-07 | Novadaq Technologies Inc. | Spatial and spectral filtering apertures and optical imaging systems including the same |
EP3121246A4 (en) * | 2014-03-18 | 2017-11-22 | UBE Industries, Ltd. | Ceramic composite material for optical conversion, production method therefor, and light-emitting device provided with same |
JP6925100B2 (en) * | 2015-05-21 | 2021-08-25 | 日亜化学工業株式会社 | Light emitting device |
EP3345024B1 (en) | 2015-08-31 | 2023-05-31 | Stryker European Operations Limited | Imaging system comprising a polarization filter and method of filtering polarized light in an imaging system |
WO2017069206A1 (en) * | 2015-10-20 | 2017-04-27 | 京セラ株式会社 | Indoor light source and illumination device |
CN109140252A (en) * | 2018-08-27 | 2019-01-04 | 佛山市顺德区蚬华多媒体制品有限公司 | Lamps and lanterns, LED light source and its manufacturing method |
CN111638613A (en) * | 2019-03-01 | 2020-09-08 | 鸿富锦精密工业(深圳)有限公司 | Display device |
KR102035972B1 (en) * | 2019-04-29 | 2019-10-29 | 셀바이오코리아 주식회사 | Mask pack having a phototherapy function |
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GB2039517A (en) * | 1978-11-21 | 1980-08-13 | Philips Nv | Luminescent materials |
WO1998006793A1 (en) * | 1996-08-08 | 1998-02-19 | Kabushiki Kaisha Tokyo Kagaku Kenkyusho | Process for the preparaiton of aluminate-base phosphor |
JP2000022216A (en) * | 1998-06-26 | 2000-01-21 | Sanken Electric Co Ltd | Resin sealed type semiconductor light emitting device having fluorescent cover |
US6066861A (en) * | 1996-09-20 | 2000-05-23 | Siemens Aktiengesellschaft | Wavelength-converting casting composition and its use |
EP1013740A2 (en) * | 1998-12-25 | 2000-06-28 | Konica Corporation | Electroluminescent material, electroluminescent element and color conversion filter |
EP1045458A2 (en) * | 1996-07-29 | 2000-10-18 | Nichia Chemical Industries, Ltd. | Light source system and display device |
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KR100372834B1 (en) * | 2000-05-25 | 2003-02-19 | 에이프로시스템즈 (주) | Light emitting semiconductor device for emitting lights having complex wavelengths through fluorescent material thereof |
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-
2000
- 2000-12-22 JP JP2000391457A patent/JP2002190622A/en active Pending
-
2001
- 2001-12-20 KR KR1020010081578A patent/KR100587126B1/en not_active IP Right Cessation
- 2001-12-20 EP EP01130432A patent/EP1220332A3/en not_active Withdrawn
- 2001-12-21 TW TW090131893A patent/TW535304B/en not_active IP Right Cessation
- 2001-12-21 US US10/026,871 patent/US7906904B2/en not_active Expired - Fee Related
Patent Citations (7)
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---|---|---|---|---|
GB2039517A (en) * | 1978-11-21 | 1980-08-13 | Philips Nv | Luminescent materials |
EP1045458A2 (en) * | 1996-07-29 | 2000-10-18 | Nichia Chemical Industries, Ltd. | Light source system and display device |
WO1998006793A1 (en) * | 1996-08-08 | 1998-02-19 | Kabushiki Kaisha Tokyo Kagaku Kenkyusho | Process for the preparaiton of aluminate-base phosphor |
US6066861A (en) * | 1996-09-20 | 2000-05-23 | Siemens Aktiengesellschaft | Wavelength-converting casting composition and its use |
JP2000022216A (en) * | 1998-06-26 | 2000-01-21 | Sanken Electric Co Ltd | Resin sealed type semiconductor light emitting device having fluorescent cover |
US6472765B1 (en) * | 1998-06-26 | 2002-10-29 | Sanken Electric Co., Ltd. | Plastic encapsulated semiconductor light emitting device with a cover of fluorescent particles |
EP1013740A2 (en) * | 1998-12-25 | 2000-06-28 | Konica Corporation | Electroluminescent material, electroluminescent element and color conversion filter |
Non-Patent Citations (1)
Title |
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PATENT ABSTRACTS OF JAPAN vol. 2000, no. 04 31 August 2000 (2000-08-31) * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8362695B2 (en) | 2002-08-30 | 2013-01-29 | GE Lighting Solutions, LLC | Light emitting diode component |
US8436380B2 (en) | 2002-08-30 | 2013-05-07 | GE Lighting Solutions, LLC | Light emitting diode component |
Also Published As
Publication number | Publication date |
---|---|
US7906904B2 (en) | 2011-03-15 |
US20020080501A1 (en) | 2002-06-27 |
TW535304B (en) | 2003-06-01 |
KR100587126B1 (en) | 2006-06-07 |
EP1220332A2 (en) | 2002-07-03 |
JP2002190622A (en) | 2002-07-05 |
KR20020051845A (en) | 2002-06-29 |
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