EP1220332A3 - A light permeable fluorescent cover for light emitting diode - Google Patents

A light permeable fluorescent cover for light emitting diode Download PDF

Info

Publication number
EP1220332A3
EP1220332A3 EP01130432A EP01130432A EP1220332A3 EP 1220332 A3 EP1220332 A3 EP 1220332A3 EP 01130432 A EP01130432 A EP 01130432A EP 01130432 A EP01130432 A EP 01130432A EP 1220332 A3 EP1220332 A3 EP 1220332A3
Authority
EP
European Patent Office
Prior art keywords
light
peak
emitting diode
cover
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01130432A
Other languages
German (de)
French (fr)
Other versions
EP1220332A2 (en
Inventor
Sano c/o Sanken Electric Co Ltd Takeshi
Kawae c/o Sanken Electric Co Ltd Hiroyuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Publication of EP1220332A2 publication Critical patent/EP1220332A2/en
Publication of EP1220332A3 publication Critical patent/EP1220332A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • H01L33/504Elements with two or more wavelength conversion materials
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774Aluminates
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7783Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
    • C09K11/7792Aluminates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/505Wavelength conversion elements characterised by the shape, e.g. plate or foil

Abstract

A light permeable fluorescent cover 6 is provided that comprises a fluorescent material 7 contained in the cover 6 attached on a light emitting diode for emitting a first light with a first peak in blue wavelength range of 420 nm to 480 nm. The fluorescent material 7 emits a second light with a second peak in green wavelength range of 480 nm to 580 nm separated from the first peak and a third light with a third peak in red wavelength range of 580 nm to 750 nm separated from the second peak to synthesize lights in a wide chromaticity area by mixing three primary blue, green and red lights and to irradiate them to outside of the cover 6 in colorful expression.
EP01130432A 2000-12-22 2001-12-20 A light permeable fluorescent cover for light emitting diode Withdrawn EP1220332A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000391457 2000-12-22
JP2000391457A JP2002190622A (en) 2000-12-22 2000-12-22 Transmissive fluorescent cover for light emitting diode

Publications (2)

Publication Number Publication Date
EP1220332A2 EP1220332A2 (en) 2002-07-03
EP1220332A3 true EP1220332A3 (en) 2005-10-12

Family

ID=18857591

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01130432A Withdrawn EP1220332A3 (en) 2000-12-22 2001-12-20 A light permeable fluorescent cover for light emitting diode

Country Status (5)

Country Link
US (1) US7906904B2 (en)
EP (1) EP1220332A3 (en)
JP (1) JP2002190622A (en)
KR (1) KR100587126B1 (en)
TW (1) TW535304B (en)

Cited By (1)

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US8362695B2 (en) 2002-08-30 2013-01-29 GE Lighting Solutions, LLC Light emitting diode component

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JP2003152227A (en) * 2001-11-14 2003-05-23 Citizen Electronics Co Ltd Means and method for correcting color of led
KR100497339B1 (en) * 2002-01-08 2005-06-23 주식회사 이츠웰 Light emitting diode device and illuminator, display, and back light using the same
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US7224000B2 (en) 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
US6744077B2 (en) * 2002-09-27 2004-06-01 Lumileds Lighting U.S., Llc Selective filtering of wavelength-converted semiconductor light emitting devices
JP2004138958A (en) * 2002-10-21 2004-05-13 Semiconductor Energy Lab Co Ltd Display device
US7015636B2 (en) * 2002-10-23 2006-03-21 Charles Bolta Balanced blue spectrum therapy lighting
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WO2012061985A1 (en) * 2010-11-10 2012-05-18 Chang Kuo-Kuang Method for manufacturing cover plate and method for manufacturing encapsulated light-emitting diode using the cover plate
US20120134161A1 (en) * 2010-11-30 2012-05-31 Nobuo Kawamura Lighting apparatus
CN102544302A (en) * 2010-12-17 2012-07-04 郑榕彬 Direct liquid cooling method for light emitting didoes and light emitting diode package utilizing method
JP5899507B2 (en) * 2011-04-27 2016-04-06 パナソニックIpマネジメント株式会社 LIGHT EMITTING DEVICE AND LIGHTING DEVICE USING THE SAME
CN202371641U (en) * 2011-10-14 2012-08-08 郑榕彬 Light-emitting diode (LED) lamp with double-layer fluorescent powder
JP5751154B2 (en) * 2011-12-14 2015-07-22 豊田合成株式会社 Light emitting device and manufacturing method thereof
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
JP5945867B2 (en) * 2012-05-11 2016-07-05 パナソニックIpマネジメント株式会社 Lighting device
JP6853614B2 (en) * 2013-03-29 2021-03-31 株式会社朝日ラバー LED lighting device, its manufacturing method and LED lighting method
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EP3121246A4 (en) * 2014-03-18 2017-11-22 UBE Industries, Ltd. Ceramic composite material for optical conversion, production method therefor, and light-emitting device provided with same
JP6925100B2 (en) * 2015-05-21 2021-08-25 日亜化学工業株式会社 Light emitting device
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Cited By (2)

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Publication number Priority date Publication date Assignee Title
US8362695B2 (en) 2002-08-30 2013-01-29 GE Lighting Solutions, LLC Light emitting diode component
US8436380B2 (en) 2002-08-30 2013-05-07 GE Lighting Solutions, LLC Light emitting diode component

Also Published As

Publication number Publication date
US7906904B2 (en) 2011-03-15
US20020080501A1 (en) 2002-06-27
TW535304B (en) 2003-06-01
KR100587126B1 (en) 2006-06-07
EP1220332A2 (en) 2002-07-03
JP2002190622A (en) 2002-07-05
KR20020051845A (en) 2002-06-29

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