EP1148402A4 - Semiconductor manufacturing apparatus and method for controlling the operating condition parameter - Google Patents
Semiconductor manufacturing apparatus and method for controlling the operating condition parameterInfo
- Publication number
- EP1148402A4 EP1148402A4 EP00953556A EP00953556A EP1148402A4 EP 1148402 A4 EP1148402 A4 EP 1148402A4 EP 00953556 A EP00953556 A EP 00953556A EP 00953556 A EP00953556 A EP 00953556A EP 1148402 A4 EP1148402 A4 EP 1148402A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- controlling
- manufacturing apparatus
- operating condition
- semiconductor manufacturing
- condition parameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/41835—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by programme execution
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/41845—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by system universality, reconfigurability, modularity
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/36—Nc in input of data, input key till input tape
- G05B2219/36088—Machining parameters, overide
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/36—Nc in input of data, input key till input tape
- G05B2219/36089—Machining parameters, modification during operation
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/36—Nc in input of data, input key till input tape
- G05B2219/36271—Enter, edit workpiece data
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45026—Circuit board, pcb
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24746499A JP4545252B2 (en) | 1999-09-01 | 1999-09-01 | Semiconductor manufacturing equipment |
JP24746499 | 1999-09-01 | ||
PCT/JP2000/005611 WO2001016659A1 (en) | 1999-09-01 | 2000-08-22 | Semiconductor manufacturing apparatus and method for controlling the operating condition parameter |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1148402A1 EP1148402A1 (en) | 2001-10-24 |
EP1148402A4 true EP1148402A4 (en) | 2002-08-14 |
Family
ID=17163847
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00953556A Withdrawn EP1148402A4 (en) | 1999-09-01 | 2000-08-22 | Semiconductor manufacturing apparatus and method for controlling the operating condition parameter |
Country Status (6)
Country | Link |
---|---|
US (1) | US6514345B1 (en) |
EP (1) | EP1148402A4 (en) |
JP (1) | JP4545252B2 (en) |
KR (1) | KR100453777B1 (en) |
TW (1) | TW530428B (en) |
WO (1) | WO2001016659A1 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002252161A (en) * | 2001-02-23 | 2002-09-06 | Hitachi Ltd | Semiconductor manufacturing system |
KR100395697B1 (en) * | 2001-04-07 | 2003-08-25 | (주)지우텍 | Method for controling parameter using a process of semiconductor production |
JP4126189B2 (en) * | 2002-04-10 | 2008-07-30 | 株式会社日立ハイテクノロジーズ | Inspection condition setting program, inspection apparatus and inspection system |
JP4277100B2 (en) * | 2002-11-14 | 2009-06-10 | 東京エレクトロン株式会社 | Reference position correction apparatus and reference position correction method for transport mechanism |
US7162317B2 (en) * | 2005-02-25 | 2007-01-09 | Lam Research Corporation | Methods and apparatus for configuring plasma cluster tools |
US7353379B2 (en) * | 2005-02-25 | 2008-04-01 | Lam Research Corporation | Methods for configuring a plasma cluster tool |
CN100585607C (en) * | 2005-02-25 | 2010-01-27 | 朗姆研究公司 | Methods for configuring plasma cluster tools |
US7536538B1 (en) | 2005-03-31 | 2009-05-19 | Lam Research Corporation | Cluster tools for processing substrates using at least a key file |
JP4841183B2 (en) * | 2005-06-28 | 2011-12-21 | 東京エレクトロン株式会社 | Substrate processing apparatus, transfer apparatus, and control method of transfer apparatus |
KR101057530B1 (en) * | 2005-12-20 | 2011-08-17 | 어플라이드 머티어리얼스, 인코포레이티드 | Enlarged Body for Semiconductor Device Manufacturing Equipment |
JP5091413B2 (en) * | 2006-03-08 | 2012-12-05 | 東京エレクトロン株式会社 | Substrate processing apparatus and method for controlling substrate processing apparatus |
JP4697896B2 (en) * | 2007-03-24 | 2011-06-08 | 東京エレクトロン株式会社 | Semiconductor manufacturing apparatus, apparatus operating parameter management method, and program |
WO2010119808A1 (en) * | 2009-04-15 | 2010-10-21 | シャープ株式会社 | Method and system for manufacturing product |
JP6111980B2 (en) * | 2013-10-29 | 2017-04-12 | 株式会社安川電機 | Industrial equipment management system, industrial equipment management server, industrial equipment management method, program, and information storage medium |
JP6806601B2 (en) * | 2017-03-17 | 2021-01-06 | アズビル株式会社 | Device information management system |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4951190A (en) * | 1985-04-30 | 1990-08-21 | Prometrix Corporation | Multilevel menu and hierarchy for selecting items and performing tasks thereon in a computer system |
US4967381A (en) * | 1985-04-30 | 1990-10-30 | Prometrix Corporation | Process control interface system for managing measurement data |
US5469361A (en) * | 1991-08-08 | 1995-11-21 | The Board Of Regents Acting For And On Behalf Of The University Of Michigan | Generic cell controlling method and apparatus for computer integrated manufacturing system |
EP0877308A2 (en) * | 1997-05-06 | 1998-11-11 | Tokyo Electron Limited | Control apparatus and control method |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5844784A (en) * | 1981-09-11 | 1983-03-15 | Nippon Sekigaisen Kogyo Kk | Laser device |
JPH06222819A (en) * | 1993-01-26 | 1994-08-12 | Fanuc Ltd | Machining program executing method for nc device |
JPH08129407A (en) * | 1994-10-28 | 1996-05-21 | Tokyo Electron Ltd | Controller, and program loading method for the controller, and processing equipment |
JPH08161013A (en) * | 1994-12-09 | 1996-06-21 | Canon Inc | Device and method for device manufacture |
JPH0962323A (en) * | 1995-08-24 | 1997-03-07 | Mitsubishi Electric Corp | Numerical controller and its system parameter setting method |
US5838565A (en) | 1997-05-15 | 1998-11-17 | Vanguard International Semiconductor Corporation | Manufacturing control method for IC plant batch sequential machine |
JPH113117A (en) * | 1997-06-10 | 1999-01-06 | Dainippon Screen Mfg Co Ltd | Alarm device for processing system |
-
1999
- 1999-09-01 JP JP24746499A patent/JP4545252B2/en not_active Expired - Fee Related
-
2000
- 2000-08-22 EP EP00953556A patent/EP1148402A4/en not_active Withdrawn
- 2000-08-22 KR KR10-2001-7005297A patent/KR100453777B1/en not_active IP Right Cessation
- 2000-08-22 WO PCT/JP2000/005611 patent/WO2001016659A1/en not_active Application Discontinuation
- 2000-08-25 TW TW089117213A patent/TW530428B/en not_active IP Right Cessation
- 2000-09-21 US US09/667,001 patent/US6514345B1/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4951190A (en) * | 1985-04-30 | 1990-08-21 | Prometrix Corporation | Multilevel menu and hierarchy for selecting items and performing tasks thereon in a computer system |
US4967381A (en) * | 1985-04-30 | 1990-10-30 | Prometrix Corporation | Process control interface system for managing measurement data |
US5469361A (en) * | 1991-08-08 | 1995-11-21 | The Board Of Regents Acting For And On Behalf Of The University Of Michigan | Generic cell controlling method and apparatus for computer integrated manufacturing system |
EP0877308A2 (en) * | 1997-05-06 | 1998-11-11 | Tokyo Electron Limited | Control apparatus and control method |
Non-Patent Citations (1)
Title |
---|
See also references of WO0116659A1 * |
Also Published As
Publication number | Publication date |
---|---|
TW530428B (en) | 2003-05-01 |
EP1148402A1 (en) | 2001-10-24 |
KR100453777B1 (en) | 2004-10-20 |
US6514345B1 (en) | 2003-02-04 |
JP2001075628A (en) | 2001-03-23 |
WO2001016659A1 (en) | 2001-03-08 |
KR20010080917A (en) | 2001-08-25 |
JP4545252B2 (en) | 2010-09-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 20010201 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
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AX | Request for extension of the european patent |
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A4 | Supplementary search report drawn up and despatched |
Effective date: 20020702 |
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AK | Designated contracting states |
Kind code of ref document: A4 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
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RIC1 | Information provided on ipc code assigned before grant |
Free format text: 7G 05B 19/418 A, 7H 01L 21/00 B |
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17Q | First examination report despatched |
Effective date: 20021030 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
RBV | Designated contracting states (corrected) |
Designated state(s): DE FR GB NL |
|
18D | Application deemed to be withdrawn |
Effective date: 20031120 |