EP1086484A4 - Slurry for chemical-mechanical polishing metal surfaces - Google Patents
Slurry for chemical-mechanical polishing metal surfacesInfo
- Publication number
- EP1086484A4 EP1086484A4 EP99916387A EP99916387A EP1086484A4 EP 1086484 A4 EP1086484 A4 EP 1086484A4 EP 99916387 A EP99916387 A EP 99916387A EP 99916387 A EP99916387 A EP 99916387A EP 1086484 A4 EP1086484 A4 EP 1086484A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- slurry
- chemical
- mechanical polishing
- metal surfaces
- polishing metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002184 metal Substances 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
- 239000002002 slurry Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5861898A | 1998-04-10 | 1998-04-10 | |
US58618 | 1998-04-10 | ||
US27745499A | 1999-03-26 | 1999-03-26 | |
US277454 | 1999-03-26 | ||
PCT/US1999/007482 WO1999053532A1 (en) | 1998-04-10 | 1999-04-05 | Slurry for chemical-mechanical polishing metal surfaces |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1086484A1 EP1086484A1 (en) | 2001-03-28 |
EP1086484A4 true EP1086484A4 (en) | 2003-08-06 |
Family
ID=26737823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99916387A Withdrawn EP1086484A4 (en) | 1998-04-10 | 1999-04-05 | Slurry for chemical-mechanical polishing metal surfaces |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1086484A4 (en) |
JP (1) | JP2002511650A (en) |
KR (1) | KR20010042616A (en) |
WO (1) | WO1999053532A1 (en) |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1107097C (en) * | 1999-07-28 | 2003-04-30 | 长兴化学工业股份有限公司 | Chemicomechanically grinding composition and method |
ATE405618T1 (en) * | 1999-08-13 | 2008-09-15 | Cabot Microelectronics Corp | CHEMICAL-MECHANICAL POLISHING SYSTEMS AND METHODS OF USE THEREOF |
US6435944B1 (en) | 1999-10-27 | 2002-08-20 | Applied Materials, Inc. | CMP slurry for planarizing metals |
US6468910B1 (en) | 1999-12-08 | 2002-10-22 | Ramanathan Srinivasan | Slurry for chemical mechanical polishing silicon dioxide |
US6491843B1 (en) | 1999-12-08 | 2002-12-10 | Eastman Kodak Company | Slurry for chemical mechanical polishing silicon dioxide |
US6881674B2 (en) | 1999-12-28 | 2005-04-19 | Intel Corporation | Abrasives for chemical mechanical polishing |
US6471884B1 (en) * | 2000-04-04 | 2002-10-29 | Cabot Microelectronics Corporation | Method for polishing a memory or rigid disk with an amino acid-containing composition |
US6451697B1 (en) | 2000-04-06 | 2002-09-17 | Applied Materials, Inc. | Method for abrasive-free metal CMP in passivation domain |
US6468913B1 (en) * | 2000-07-08 | 2002-10-22 | Arch Specialty Chemicals, Inc. | Ready-to-use stable chemical-mechanical polishing slurries |
US6872329B2 (en) | 2000-07-28 | 2005-03-29 | Applied Materials, Inc. | Chemical mechanical polishing composition and process |
US6541384B1 (en) | 2000-09-08 | 2003-04-01 | Applied Materials, Inc. | Method of initiating cooper CMP process |
US6702954B1 (en) | 2000-10-19 | 2004-03-09 | Ferro Corporation | Chemical-mechanical polishing slurry and method |
US6508953B1 (en) | 2000-10-19 | 2003-01-21 | Ferro Corporation | Slurry for chemical-mechanical polishing copper damascene structures |
JP3825246B2 (en) * | 2000-11-24 | 2006-09-27 | Necエレクトロニクス株式会社 | Chemical mechanical polishing slurry |
JP3816743B2 (en) * | 2000-11-24 | 2006-08-30 | Necエレクトロニクス株式会社 | Chemical mechanical polishing slurry |
US6740589B2 (en) | 2000-11-30 | 2004-05-25 | Showa Denko Kabushiki Kaisha | Composition for polishing semiconductor wafer, semiconductor circuit wafer, and method for producing the same |
US20020068454A1 (en) * | 2000-12-01 | 2002-06-06 | Applied Materials, Inc. | Method and composition for the removal of residual materials during substrate planarization |
US6783432B2 (en) | 2001-06-04 | 2004-08-31 | Applied Materials Inc. | Additives for pressure sensitive polishing compositions |
KR100458756B1 (en) * | 2001-06-27 | 2004-12-03 | 제일모직주식회사 | CMP Slurry for Polishing Metal Wirings of Semiconductor Devices |
US6592742B2 (en) | 2001-07-13 | 2003-07-15 | Applied Materials Inc. | Electrochemically assisted chemical polish |
US7121943B2 (en) | 2001-09-26 | 2006-10-17 | Igt | Gaming device with an increasing goal advancement game |
US7077880B2 (en) | 2004-01-16 | 2006-07-18 | Dupont Air Products Nanomaterials Llc | Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization |
US6743267B2 (en) * | 2001-10-15 | 2004-06-01 | Dupont Air Products Nanomaterials Llc | Gel-free colloidal abrasive polishing compositions and associated methods |
JP3692066B2 (en) | 2001-11-28 | 2005-09-07 | 株式会社東芝 | CMP slurry and method of manufacturing semiconductor device |
US6730592B2 (en) | 2001-12-21 | 2004-05-04 | Micron Technology, Inc. | Methods for planarization of metal-containing surfaces using halogens and halide salts |
US6884723B2 (en) | 2001-12-21 | 2005-04-26 | Micron Technology, Inc. | Methods for planarization of group VIII metal-containing surfaces using complexing agents |
US7049237B2 (en) | 2001-12-21 | 2006-05-23 | Micron Technology, Inc. | Methods for planarization of Group VIII metal-containing surfaces using oxidizing gases |
US7121926B2 (en) | 2001-12-21 | 2006-10-17 | Micron Technology, Inc. | Methods for planarization of group VIII metal-containing surfaces using a fixed abrasive article |
US6620215B2 (en) * | 2001-12-21 | 2003-09-16 | Dynea Canada, Ltd. | Abrasive composition containing organic particles for chemical mechanical planarization |
US6830503B1 (en) | 2002-01-11 | 2004-12-14 | Cabot Microelectronics Corporation | Catalyst/oxidizer-based CMP system for organic polymer films |
US20030162398A1 (en) | 2002-02-11 | 2003-08-28 | Small Robert J. | Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same |
US7513920B2 (en) | 2002-02-11 | 2009-04-07 | Dupont Air Products Nanomaterials Llc | Free radical-forming activator attached to solid and used to enhance CMP formulations |
WO2003072672A1 (en) * | 2002-02-26 | 2003-09-04 | Applied Materials, Inc. | Method and composition for polishing a substrate |
US6604987B1 (en) | 2002-06-06 | 2003-08-12 | Cabot Microelectronics Corporation | CMP compositions containing silver salts |
TWI244498B (en) * | 2003-11-20 | 2005-12-01 | Eternal Chemical Co Ltd | Chemical mechanical abrasive slurry and method of using the same |
KR20060016498A (en) | 2004-08-18 | 2006-02-22 | 삼성전자주식회사 | Slurry composition, method for forming the slurry composition and method for polishing an object using the slurry composition |
US8038752B2 (en) | 2004-10-27 | 2011-10-18 | Cabot Microelectronics Corporation | Metal ion-containing CMP composition and method for using the same |
CN101180379B (en) | 2005-03-25 | 2013-07-24 | 气体产品与化学公司 | Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers |
CN1854236B (en) * | 2005-04-21 | 2011-08-03 | 安集微电子(上海)有限公司 | Polished sizing material and its use |
US7691287B2 (en) | 2007-01-31 | 2010-04-06 | Dupont Air Products Nanomaterials Llc | Method for immobilizing ligands and organometallic compounds on silica surface, and their application in chemical mechanical planarization |
KR100943020B1 (en) * | 2007-06-29 | 2010-02-17 | 제일모직주식회사 | CMP slurry composition for the phase change memory materials and polishing method using the same |
JP5263484B2 (en) * | 2008-02-27 | 2013-08-14 | Jsr株式会社 | Chemical mechanical polishing aqueous dispersion, polishing method for chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method for polishing a wiring layer made of copper or copper alloy provided on a substrate for an electro-optical display device |
KR100949255B1 (en) * | 2009-05-21 | 2010-03-25 | 제일모직주식회사 | CMP slurry composition for the phase change memory materials |
CN102373014A (en) * | 2010-08-24 | 2012-03-14 | 安集微电子(上海)有限公司 | Chemical-mechanical polishing solution |
KR101833219B1 (en) * | 2016-08-05 | 2018-04-13 | 주식회사 케이씨텍 | Slurry composition for tungsten barrier layer polishing |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5575885A (en) * | 1993-12-14 | 1996-11-19 | Kabushiki Kaisha Toshiba | Copper-based metal polishing solution and method for manufacturing semiconductor device |
EP0846742A2 (en) * | 1996-12-09 | 1998-06-10 | Cabot Corporation | Chemical mechanical polishing slurry useful for copper substrates |
US5770095A (en) * | 1994-07-12 | 1998-06-23 | Kabushiki Kaisha Toshiba | Polishing agent and polishing method using the same |
US5783489A (en) * | 1996-09-24 | 1998-07-21 | Cabot Corporation | Multi-oxidizer slurry for chemical mechanical polishing |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3930870A (en) * | 1973-12-28 | 1976-01-06 | International Business Machines Corporation | Silicon polishing solution preparation |
-
1999
- 1999-04-05 KR KR1020007011294A patent/KR20010042616A/en not_active Application Discontinuation
- 1999-04-05 JP JP2000544000A patent/JP2002511650A/en not_active Withdrawn
- 1999-04-05 WO PCT/US1999/007482 patent/WO1999053532A1/en not_active Application Discontinuation
- 1999-04-05 EP EP99916387A patent/EP1086484A4/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5575885A (en) * | 1993-12-14 | 1996-11-19 | Kabushiki Kaisha Toshiba | Copper-based metal polishing solution and method for manufacturing semiconductor device |
US5770095A (en) * | 1994-07-12 | 1998-06-23 | Kabushiki Kaisha Toshiba | Polishing agent and polishing method using the same |
US5783489A (en) * | 1996-09-24 | 1998-07-21 | Cabot Corporation | Multi-oxidizer slurry for chemical mechanical polishing |
EP0846742A2 (en) * | 1996-12-09 | 1998-06-10 | Cabot Corporation | Chemical mechanical polishing slurry useful for copper substrates |
Non-Patent Citations (1)
Title |
---|
See also references of WO9953532A1 * |
Also Published As
Publication number | Publication date |
---|---|
KR20010042616A (en) | 2001-05-25 |
EP1086484A1 (en) | 2001-03-28 |
JP2002511650A (en) | 2002-04-16 |
WO1999053532A1 (en) | 1999-10-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20001005 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE ES FR GB IT |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20030620 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: 7H 01L 21/321 B Ipc: 7C 09K 3/14 B Ipc: 7C 09G 1/02 B Ipc: 7C 09G 1/00 B Ipc: 7B 44C 1/22 B Ipc: 7H 01L 21/00 A |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20041102 |