EP1054417A1 - Microcomponents of microinductance or microtransformer type and manufacturing process - Google Patents
Microcomponents of microinductance or microtransformer type and manufacturing process Download PDFInfo
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- EP1054417A1 EP1054417A1 EP00420093A EP00420093A EP1054417A1 EP 1054417 A1 EP1054417 A1 EP 1054417A1 EP 00420093 A EP00420093 A EP 00420093A EP 00420093 A EP00420093 A EP 00420093A EP 1054417 A1 EP1054417 A1 EP 1054417A1
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 16
- 239000010949 copper Substances 0.000 claims abstract description 16
- 238000000151 deposition Methods 0.000 claims description 14
- 238000005868 electrolysis reaction Methods 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 6
- 230000001939 inductive effect Effects 0.000 claims description 6
- 238000002161 passivation Methods 0.000 claims description 6
- 239000003302 ferromagnetic material Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
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- 238000004804 winding Methods 0.000 abstract description 16
- 230000005291 magnetic effect Effects 0.000 description 26
- 230000008878 coupling Effects 0.000 description 7
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- 230000008021 deposition Effects 0.000 description 5
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- 229910052751 metal Inorganic materials 0.000 description 4
- 238000004377 microelectronic Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000008030 elimination Effects 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
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- 230000015572 biosynthetic process Effects 0.000 description 1
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- 238000002955 isolation Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/042—Printed circuit coils by thin film techniques
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
Definitions
- the invention relates to the field of microelectronics, and more specifically for the micro-component manufacturing sector, especially for to be used in radio frequency applications. It concerns more particularly micro-components such as micro-inductors or micro transformers. It also relates to a process for manufacturing such micro-components providing components with high value inductive, and minimal resistive and magnetic losses.
- the electronic circuits used in applications radio frequencies include oscillating circuits formed by the association of a capacity and inductance.
- inductive components are asked to present optimal electrical characteristics at increasingly higher frequencies, and on increasingly wide frequency ranges.
- the invention proposes to solve several problems, namely the influence of resistance on the value of the quality factor of an inductance, as well as the limitation of the self-inductance coefficient imposed by the geometries existing.
- micro-components including windings inductive made by micro-machining techniques.
- Such micro-components, surface mounted, are made by winding a copper wire around a core of ferrite or ferromagnetic material, then an assembly with outdoor contact pads.
- Micro-transformers have also been produced by the same techniques with additional problems inherent in the packaging plastic. Such components are very difficult to miniaturize, which results in limiting the possibility of reducing their electrical consumption, and footprint which remains high, which limits their use in devices portable.
- the invention therefore proposes to solve the congestion problems of micro-inductance or micro-transformer, while retaining very good electrical characteristics, either in inductance value and quality factor, or in magnetic coupling.
- Another problem which the invention proposes to solve is that of the complexity of the manufacturing processes for such micro-components.
- the invention therefore relates in particular to a method of manufacturing a micro-component electric, such as micro-inductance or micro-transformer, including at least one coil, and comprising a substrate layer.
- a micro-component electric such as micro-inductance or micro-transformer
- the substrate serves as a mechanical support, stiffening the base of the component.
- the substrate used has good dielectric properties, the parasitic capacitance between the different segments forming the base of the micro-component is relatively small.
- these micro-components include three-dimensional turns, substantially helical in shape closest to of the ideal shape, namely for the inductors, of the circular section, which by completed tour has the slightest perimeter.
- the upper part of the turns is carried out in the manner of a bridge which spans the core which will serve as a circuit magnetic.
- Such inductors therefore operate in wide frequency ranges with a significant quality coefficient.
- the core is made of a material ferromagnetic. In this way, magnetic coupling is ensured between the different turns of the winding. So, if we realize a micro inductance, the use of a magnetic core further increases the value of self-inductance.
- the magnetic core has a loop geometry
- an insulating layer is deposited, before deposition of the layer intended to form the magnetic core.
- the invention relates not only to the method of manufacturing, but also electrical micro-components of the micro-inductance type or micro-transformer including at least one inductive winding, and comprising a substrate layer.
- the winding of such a micro component has a shape solenoid of high rigidity, since firmly anchored in a layer of substrate, and on the other hand having optimal electrical properties, by the monolithic bridge or arch shape of the upper part of the turns.
- the micro component can include a core made of ferromagnetic material, crossing the turns and disposed between the segments and the arches.
- the micro-component can have a second winding wound on said core, so as to form the micro transformer.
- the magnetic core has a shape of bar.
- the space between the arches of the adjacent coils is filled with air, which greatly limits the value of the capacity parasite existing between turns and allows the use of such a micro inductance to high frequencies.
- At least the arches are covered with a layer passivation made of a material chosen from the group containing gold and gold-based alloys.
- Figures 1 to 3, 5 and 6 are median longitudinal sectional views of a inductance carried out in accordance with the invention, as and when the sequence of steps in its manufacturing process.
- Figure 4 is a top view of the same inductor after the step of core engraving.
- Figure 7 is a top view of an inductor according to the invention.
- FIG. 8 is a sectional view along the plane marked VIII-VIII in FIG. 7.
- FIG. 9 is a sectional view along the plane marked IX-IX in FIG. 7.
- FIG. 10 is a view in median longitudinal section of a transformer or an inductor illustrated at the time of the deposition of the magnetic layer.
- Figure 11 is a top view of a winding of an inductor or a transformer fitted with a magnetic core.
- Figure 12 is a sectional view along the plane marked XII-XII in the figure 11.
- Figure 13 is a sectional view along the plane marked XIII-XIII in the figure 11.
- Figure 14 is a schematic top view of a transformer made according to the invention.
- the invention relates to a method of producing a microphone electrical component such as micro-inductance or micro-transformer which can in particular include a magnetic core.
- one of the first steps in the process is to producing, in a substrate layer (1) preferably made of quartz, a plurality of channels (2).
- these different channels (2) have a depth between 1 and 30 microns, width between 1 and 30 microns, and a length of the order of 5 to several tens of microns.
- each of these channels (2) is distant from each other others by a distance of the order of half a channel width.
- These different channels (2) are arranged in an orderly fashion along a strip (3) as shown in dotted lines in Figure 7, and which corresponds to the general direction of the axis (4) of the winding of the micro-inductance or the micro-transformer.
- these channels (2) are perpendicular to the direction of the strip (3), but other geometries can be adopted in which by example each channel has a fixed orientation relative to the axis of the strip.
- a metal deposition is carried out, advantageously copper, inside the channels (2), by electrolysis.
- the copper segments (7) present inside the channels (2) are also planarized, and their upper face (8) is at the same level than the upper face (10) of the substrate (1).
- the copper segments (7) are flush but do not protrude not from the upper face (10) of the substrate (1).
- the process differs depending on whether an inductance is carried out in the air or a micro transformer or an inductor having a magnetic core.
- polymer resin (12) is a resin of the photosensitive type commonly used in this kind of application microelectronics. In this way, it is easy to define its geometry in the form of bars, then by creep to achieve a semicircular type without resorting to other process, as shown in Figure 4.
- a metal growth underlay (13) is deposited over the entire surface (10) of the substrate (1) and of the nucleus (s) thus formed.
- a resin photosensitive (14) is then deposited on this growth sublayer metallic (13).
- the photosensitive resin (14) is exposed using a mask allowing to open patterns (16) connecting two segments (7) anchored in the substrate.
- the pattern (16) thus opened is filled of metal deposited by electrolysis, so as to form a bridge (17) between two ends of adjacent segments (7). These bridges (17) are obtained in a single electrolysis step.
- the sides of the patterns (16), made in resin, allow to obtain arches (17) whose walls are relatively flat.
- an etching step is carried out which makes it possible to remove the resin (14) and the metal underlay (13) used for growth to obtain a plurality of arches forming the upper part of the turns, resting on the core.
- an inductor comprising rectilinear segments (7) forming the lower part of each turn and arches (18) monolithic connecting adjacent segments (7).
- Such turns have a shape substantially elliptical, approaching the ideal circular shape, which has per turn made the smallest perimeter.
- a passivation layer is typically deposited made of gold or a gold-based alloy to protect copper from oxidation.
- This layer has a thickness of the order of a few hundred angstroms.
- the inductance thus obtained has turns which are, in their for the most part, separated from the following turns by a layer of air, which limits very strongly the parasitic capacity between turns.
- the only parts of the turns not being separated by air are the straight segments (7), which are separated by an area quartz substrate, whose dielectric properties are also favorable in parasitic capacity terms.
- the invention also makes it possible to produce inductors incorporating a magnetic core, or micro-transformers.
- the process according to the invention follows the steps of etching the substrate, depositing copper for form the segments, and planarization as illustrated in Figures 1 to 3.
- a layer is deposited insulator (21) made flat over the entire surface of the plate, that is to say above substrate (1) and segments (7).
- this insulating layer (21) is minimized, typically by the order of a few tenths of a micron, so as to limit the distance separating the magnetic core and the copper coils to improve the magnetic coupling.
- the materials used to make this magnetic layer are alloys of iron and nickel generally called permalloy, or others laminated compounds.
- the magnetic material layer is etched (22) to keep it only in the area corresponding to the location of the magnetic core itself.
- the magnetic material is for example engraved by a photolithography process known elsewhere.
- a thin film of material is deposited above it insulator (24), with a typical thickness of the order of a few tenths of a micron.
- the upper insulating film (24) extends over the magnetic core (22) and over the first insulating film (21) deposited on the substrate (2).
- the gold-based passivation layer is subsequently deposited or gold alloy.
- turns (28) comprise rectilinear segments (7) anchored in the substrate and arches (29) connecting the ends of two adjacent segments (7) arranged on one side and on the other of the core (22).
- the thinness of the insulating films (21, 24) allows optimal magnetic coupling.
- inductances in a range ranging from nanoHenry to a few dozen microHenry.
- Such inductances in the version without magnetic core, may have a quality factor of several tens at frequencies of a few gigaHertz.
- the process according to the invention makes it possible, by combination of two windings (30, 31) and a closed loop core (32), a micro transformer as illustrated in figure 14.
- Such transformers are used for galvanic isolation between input and output of circuits, or even for signal transformation applications.
- Micro-components produced according to the process of the invention can be used in many applications, including those related to mobile telephony, signal processing and miniaturization.
- Such components can in particular be mounted by the known technique under the name of "flip-chip" directly on integrated circuits.
Abstract
Description
L'invention se rattache au domaine de la micro-électronique, et plus précisément au secteur de la fabrication de micro-composants, notamment destinés à être utilisés dans des applications radiofréquence. Elle concerne plus particulièrement des micro-composants tels que des micro-inductances ou des micro-transformateurs. Elle vise également un procédé de fabrication de tels micro-composants permettant d'obtenir des composants présentant une forte valeur inductive, et des pertes résistives et magnétiques minimales.The invention relates to the field of microelectronics, and more specifically for the micro-component manufacturing sector, especially for to be used in radio frequency applications. It concerns more particularly micro-components such as micro-inductors or micro transformers. It also relates to a process for manufacturing such micro-components providing components with high value inductive, and minimal resistive and magnetic losses.
Comme on le sait, les circuits électroniques utilisés dans les applications radiofréquence incluent des circuits oscillants formés par l'association d'une capacité et d'une inductance.As we know, the electronic circuits used in applications radio frequencies include oscillating circuits formed by the association of a capacity and inductance.
La tendance à la miniaturisation des appareils tels que notamment les téléphones portables, nécessite de réaliser de tels composants dans un encombrement de plus en plus réduit.The trend towards miniaturization of devices such as in particular mobile phones, requires carrying out such components in a increasingly reduced dimensions.
Par ailleurs, il est demandé à ces composants inductifs de présenter des caractéristiques électriques optimales à des fréquences de plus en plus élevées, et sur des gammes de fréquence de plus en plus larges.Furthermore, these inductive components are asked to present optimal electrical characteristics at increasingly higher frequencies, and on increasingly wide frequency ranges.
Ainsi, s'agissant du facteur de qualité caractérisant les inductances, un problème qui se pose est celui des capacités parasites existant entre les spires formant un bobinage inductif.Thus, with regard to the quality factor characterizing the inductors, a problem which arises is that of the parasitic capacities existing between the turns forming an inductive coil.
En outre, pour des considérations d'autonomie et de consommation électrique il importe également de limiter la résistance électrique de ces inductances, qui a également une influence sur la valeur du facteur de qualité. In addition, for considerations of autonomy and power consumption it is also important to limit the electrical resistance of these inductors, which has also influence the value of the quality factor.
Ainsi, l'invention propose de résoudre plusieurs problèmes, à savoir l'influence de la résistance sur la valeur du facteur de la qualité d'une inductance, ainsi que la limitation du coefficient de self-inductance imposée par les géométries existantes.Thus, the invention proposes to solve several problems, namely the influence of resistance on the value of the quality factor of an inductance, as well as the limitation of the self-inductance coefficient imposed by the geometries existing.
Par ailleurs, dans les applications radiofréquence, on utilise également des micro-transformateurs de signal ou de courant, qui doivent répondre aux mêmes contraintes d'encombrement que celles identifiées pour les inductances.Furthermore, in radiofrequency applications, use is also made of signal or current micro-transformers, which must respond to the same space constraints than those identified for the inductors.
En outre, le problème se pose d'obtenir un couplage magnétique aussi parfait que possible entre les deux enroulements d'un transformateur.In addition, the problem arises of obtaining such a perfect magnetic coupling. as possible between the two windings of a transformer.
On a déjà proposé de réaliser des micro-composants incluant des bobinages inductifs réalisés par des techniques de micro-usinage. De tels micro-composants, montés en surface, sont réalisés par le bobinage d'un fil de cuivre autour d'un noyau de ferrite ou de matériau ferromagnétique, puis un assemblage avec des plots de contact en extérieur de barrettes.It has already been proposed to produce micro-components including windings inductive made by micro-machining techniques. Such micro-components, surface mounted, are made by winding a copper wire around a core of ferrite or ferromagnetic material, then an assembly with outdoor contact pads.
Des micro-transformateurs ont également été réalisés par les mêmes techniques avec des problèmes supplémentaires inhérents à la mise en boítier plastique. De tels composants sont très difficiles à miniaturiser, ce qui se traduit par la limitation de la possibilité de réduire leur consommation électrique, et un encombrement qui reste élevé, ce qui limite leurs utilisations dans les appareils portables.Micro-transformers have also been produced by the same techniques with additional problems inherent in the packaging plastic. Such components are very difficult to miniaturize, which results in limiting the possibility of reducing their electrical consumption, and footprint which remains high, which limits their use in devices portable.
Par ailleurs, on a également proposé, comme illustré dans le document US 5 279 988, de fabriquer des micro-inductances ou micro-transformateurs grâce à des technologies de type micro-électronique.Furthermore, it has also been proposed, as illustrated in the document US 5,279,988, to manufacture micro-inductors or micro-transformers using microelectronic technologies.
Néanmoins, ces techniques mettent en oeuvre des procédés possédant un grand nombre d'étapes, ce qui les rend complexes, et voire coûteuses. En outre, l'enchaínement de cette multitude d'étapes ne permet pas d'obtenir un couplage optimal entre les spires du bobinage et le noyau magnétique. However, these techniques implement methods having a large number of steps, which makes them complex, and even expensive. In addition, the sequence of this multitude of steps does not allow to obtain a coupling optimal between the turns of the winding and the magnetic core.
Par ailleurs, les solutions mettant en oeuvre des procédés de micro-mécanique s'avèrent inefficaces, car les tolérances nécessaires dans ces technologies limitent fortement la précision de tels micro-composants.In addition, solutions implementing micro-mechanical processes prove to be ineffective because the tolerances required in these technologies limit strongly the precision of such micro-components.
L'invention se propose donc de résoudre les problèmes d'encombrement de micro-inductance ou de micro-transformateur, tout en conservant de très bonnes caractéristiques électriques, soit en valeur d'inductance et en facteur de qualité, soit en couplage magnétique.The invention therefore proposes to solve the congestion problems of micro-inductance or micro-transformer, while retaining very good electrical characteristics, either in inductance value and quality factor, or in magnetic coupling.
Un autre problème que se propose de résoudre l'invention est celui de la complexité des procédés de fabrication de tels micro-composants.Another problem which the invention proposes to solve is that of the complexity of the manufacturing processes for such micro-components.
L'invention concerne donc notamment un procédé de fabrication d'un micro-composant électrique, tel que micro-inductance ou micro-transformateur, incluant au moins un bobinage, et comprenant une couche de substrat.The invention therefore relates in particular to a method of manufacturing a micro-component electric, such as micro-inductance or micro-transformer, including at least one coil, and comprising a substrate layer.
Ce procédé se caractérise en ce qu'il comprend les étapes suivantes consistant :
- à graver sur le substrat une pluralité de canaux disposés de façon ordonnée selon une bande, et orientés sensiblement perpendiculairement à ladite bande ;
- à déposer par électrolyse, du cuivre dans lesdits canaux de façon à former une pluralité de segments ;
- à planariser la face supérieure du substrat et de la pluralité de segments ;
- à déposer au-dessus dudit substrat et desdits segments, au moins une couche destinée à former un noyau ;
- à graver le noyau pour ne le conserver qu'au-dessus de ladite bande ;
- à déposer par une seule étape d'électrolyse au-dessus du noyau, une pluralité d'arches, chaque arche reliant une extrémité d'un segment avec une extrémité d'un segment adjacent, en passant au-dessus dudit noyau.
- etching on the substrate a plurality of channels arranged in an orderly fashion along a strip, and oriented substantially perpendicular to said strip;
- depositing copper by electrolysis in said channels so as to form a plurality of segments;
- planarizing the upper face of the substrate and the plurality of segments;
- depositing above said substrate and said segments, at least one layer intended to form a core;
- etching the core so as to keep it only above said strip;
- to deposit by a single electrolysis step above the core, a plurality of arches, each arch connecting one end of a segment with one end of an adjacent segment, passing over said core.
Ainsi, le substrat sert de support mécanique, rigidiant la base du composant. En outre, lorsque le substrat utilisé présente de bonnes propriétés diélectriques, la capacité parasite entre les différents segments formant la base du micro-composant est relativement faible. Thus, the substrate serves as a mechanical support, stiffening the base of the component. In addition, when the substrate used has good dielectric properties, the parasitic capacitance between the different segments forming the base of the micro-component is relatively small.
Ainsi, conformément à l'invention, ces micro-composants comportent des spires à trois dimensions, de forme sensiblement hélicoïdale se rapprochant le plus de la forme idéale, à savoir pour les inductances, de la section circulaire, qui par tour réalisé présente le moindre périmètre.Thus, in accordance with the invention, these micro-components include three-dimensional turns, substantially helical in shape closest to of the ideal shape, namely for the inductors, of the circular section, which by completed tour has the slightest perimeter.
Pour la réalisation de micro-transformateurs, la partie haute des spires est réalisée à la manière d'un pont qui enjambe le noyau qui servira de circuit magnétique.For the realization of micro-transformers, the upper part of the turns is carried out in the manner of a bridge which spans the core which will serve as a circuit magnetic.
Pour réaliser des inductances, on procède en outre à une élimination dudit noyau après l'étape de dépôt des arches, le noyau sacrificiel étant alors réalisé en résine ou en un matériau polymère organique soluble.In order to produce inductors, furthermore said elimination is carried out. core after the step of depositing the arches, the sacrificial core then being made in resin or a soluble organic polymeric material.
De la sorte, on obtient une micro inductance de forme solénoïde ne présentant aucune matière interposée entre les spires, à l'exception de la partie du substrat dans laquelle est ancré le bas des spires. On obtient de la sorte une micro-inductance de forte valeur de self-inductance, et dont la capacité parasite entre spires est extrêmement faible.In this way, a micro inductance of solenoid shape is obtained which does not have no material interposed between the turns, except for the part of the substrate in which is anchored the bottom of the turns. We thus obtain a micro-inductance of high self-inductance value, and whose parasitic capacity between turns is extremely small.
De telles inductances fonctionnent donc dans des plages de fréquence larges avec un coefficient de qualité important.Such inductors therefore operate in wide frequency ranges with a significant quality coefficient.
L'utilisation de cuivre, préférentiellement en épaisseur de quelques dizaines de micromètres permet en outre de réduire fortement la résistance du bobinage, et d'augmenter fortement le facteur de qualité, dès les basses fréquences.The use of copper, preferably in the thickness of a few tens micrometers also makes it possible to greatly reduce the resistance of the winding, and greatly increase the quality factor, from low frequencies.
Dans une variante de réalisation, le noyau est réalisé en un matériau ferromagnétique. De la sorte, on assure un couplage magnétique entre les différentes spires du bobinage. Ainsi, si l'on réalise une micro inductance, l'utilisation d'un noyau magnétique augmente encore la valeur de la self-inductance.In an alternative embodiment, the core is made of a material ferromagnetic. In this way, magnetic coupling is ensured between the different turns of the winding. So, if we realize a micro inductance, the use of a magnetic core further increases the value of self-inductance.
Par ailleurs, si le noyau magnétique présente une géométrie en boucle, on peut ainsi réaliser des micro-transformateurs en réalisant un second bobinage analogue au premier, en sélectionnant le rapport du nombre de spires entre ces deux bobinages selon l'application voulue. Furthermore, if the magnetic core has a loop geometry, we can thus realize micro-transformers by making a second winding analogous to the first, by selecting the ratio of the number of turns between these two windings depending on the desired application.
En pratique, pour réaliser les composants incluant un noyau magnétique, après l'étape de planarisation, on procède au dépôt d'une couche isolante, avant dépôt de la couche destinée à former le noyau magnétique. Après gravure du noyau, on procède au dépôt d'une couche isolante par dessus le noyau. De la sorte, les segments formant le bas des spires et les arches formant la partie haute des spires ne sont pas en contact avec le matériau magnétique.In practice, to make the components including a magnetic core, after the planarization step, an insulating layer is deposited, before deposition of the layer intended to form the magnetic core. After engraving of core, we proceed to the deposition of an insulating layer over the core. In this way, the segments forming the bottom of the turns and the arches forming the top part of the turns are not in contact with the magnetic material.
Néanmoins, la faible épaisseur de ces couches isolantes permet d'obtenir un couplage optimal, car les segments et les arches de chaque spire sont au plus près du noyau magnétique.However, the small thickness of these insulating layers makes it possible to obtain a optimal coupling, because the segments and arches of each turn are as close as possible of the magnetic core.
En outre, lorsque le composant est destiné à être utilisé en atmosphère humide, voire chimiquement agressive, on effectue un dépôt d'une couche de passivation au-dessus des arches. De la sorte, on s'affranchit des risques de corrosion du cuivre, qui dégraderait les caractéristiques électriques, et notamment la résistance électrique d'un tel composant.In addition, when the component is intended to be used in an atmosphere wet, even chemically aggressive, a layer of passivation above the arches. In this way, we are freed from the risks of corrosion of copper, which would degrade the electrical characteristics, and in particular the electrical resistance of such a component.
Comme déjà dit, l'invention concerne non seulement le procédé de fabrication, mais également des micro-composants électriques du type micro-inductance ou micro-transformateur incluant au moins un bobinage inductif, et comprenant une couche de substrat.As already said, the invention relates not only to the method of manufacturing, but also electrical micro-components of the micro-inductance type or micro-transformer including at least one inductive winding, and comprising a substrate layer.
Ces micro-composants se caractérisent en ce que ledit bobinage est formé d'une pluralité de spires adjacentes en série disposées selon une bande, chacune des spires étant constituée :
- d'un segment de cuivre formé à l'intérieur de canaux gravés dans le substrat ;
- d'une arche reliant une extrémité dudit segment à une extrémité du segment de la spire adjacente, en passant au-dessus de ladite bande ;
- a copper segment formed inside channels etched in the substrate;
- an arch connecting one end of said segment to one end of the segment of the adjacent turn, passing over said strip;
De la sorte, le bobinage d'un tel micro composant présente une forme solénoïde d'une forte rigidité, puisque fermement ancrée dans une couche de substrat, et d'autre part présentant des propriétés électriques optimales, de par la forme en pont ou en arche monolithique de la partie haute des spires. In this way, the winding of such a micro component has a shape solenoid of high rigidity, since firmly anchored in a layer of substrate, and on the other hand having optimal electrical properties, by the monolithic bridge or arch shape of the upper part of the turns.
Ainsi, selon différentes variantes, le micro composant peut inclure un noyau en matériau ferromagnétique, traversant les spires et disposé entre les segments et les arches.Thus, according to different variants, the micro component can include a core made of ferromagnetic material, crossing the turns and disposed between the segments and the arches.
Dans le cas où le noyau forme une boucle fermée, le micro-composant peut comporter un second bobinage enroulé sur ledit noyau, de manière à former le micro transformateur.In the case where the nucleus forms a closed loop, the micro-component can have a second winding wound on said core, so as to form the micro transformer.
Dans le cas d'une inductance, le noyau magnétique présente une forme de barreau.In the case of an inductor, the magnetic core has a shape of bar.
Selon une caractéristique de l'invention, l'espace compris entre les arches des spires adjacentes est empli d'air, ce qui limite très fortement la valeur de la capacité parasite existante entre spires et permet l'utilisation d'une telle micro inductance à de hautes fréquences.According to a characteristic of the invention, the space between the arches of the adjacent coils is filled with air, which greatly limits the value of the capacity parasite existing between turns and allows the use of such a micro inductance to high frequencies.
Dans une forme préférée, au moins les arches sont recouvertes d'une couche de passivation réalisée en un matériau choisi dans le groupe contenant l'or et les alliages à base d'or.In a preferred form, at least the arches are covered with a layer passivation made of a material chosen from the group containing gold and gold-based alloys.
La manière de réaliser l'invention, ainsi que les avantages qui en découlent ressortiront bien de la description des modes de réalisation qui suivent, à l'appui des figures annexées, dans lesquelles :The manner of carrying out the invention, as well as the advantages which flow therefrom will emerge clearly from the description of the embodiments which follow, in support appended figures, in which:
Les figures 1 à 3, 5 et 6 sont des vues en coupe longitudinales médianes d'une inductance réalisée conformément à l'invention, au fur et à mesure de l'enchaínement des étapes de son procédé de fabrication.Figures 1 to 3, 5 and 6 are median longitudinal sectional views of a inductance carried out in accordance with the invention, as and when the sequence of steps in its manufacturing process.
La figure 4 est une vue de dessus de la même inductance après l'étape de gravure du noyau.Figure 4 is a top view of the same inductor after the step of core engraving.
La figure 7 est une vue de dessus d'une inductance conforme à l'invention.Figure 7 is a top view of an inductor according to the invention.
La figure 8 est une vue en coupe selon le plan repéré VIII-VIII sur la figure 7.FIG. 8 is a sectional view along the plane marked VIII-VIII in FIG. 7.
La figure 9 est une vue en coupe selon le plan repéré IX-IX de la figure 7.FIG. 9 is a sectional view along the plane marked IX-IX in FIG. 7.
La figure 10 est une vue en coupe longitudinale médiane d'un transformateur ou d'une inductance illustrée au moment du dépôt de la couche magnétique.FIG. 10 is a view in median longitudinal section of a transformer or an inductor illustrated at the time of the deposition of the magnetic layer.
La figure 11 est une vue de dessus d'un enroulement d'une inductance ou d'un transformateur équipé d'un noyau magnétique. Figure 11 is a top view of a winding of an inductor or a transformer fitted with a magnetic core.
La figure 12 est une vue en coupe selon le plan repéré XII-XII sur la figure 11.Figure 12 is a sectional view along the plane marked XII-XII in the figure 11.
La figure 13 est une vue en coupe selon le plan repéré XIII-XIII sur la figure 11.Figure 13 is a sectional view along the plane marked XIII-XIII in the figure 11.
La figure 14 est une vue de dessus schématique d'un transformateur réalisé conformément à l'invention.Figure 14 is a schematic top view of a transformer made according to the invention.
Comme déjà dit, l'invention concerne un procédé de réalisation d'un micro composant électrique tel que micro-inductance ou micro-transformateur pouvant notamment inclure un noyau magnétique.As already said, the invention relates to a method of producing a microphone electrical component such as micro-inductance or micro-transformer which can in particular include a magnetic core.
De nombreuses étapes du procédé sont communes à la réalisation de micro-inductances et de micro-transformateurs, de sorte que dans la suite de la description, les étapes communes ne seront décrites qu'une fois.Many steps of the process are common to the realization of micro-inductors and micro-transformers, so that in the following of the description, the common steps will only be described once.
Le procédé de réalisation d'une inductance est illustré aux figures 1 à 6.The process for producing an inductor is illustrated in Figures 1 to 6.
Comme illustré à la figure 1, une des premières étapes du procédé consiste à réaliser, dans une couche de substrat (1) préférentiellement en quartz, une pluralité de canaux (2).As illustrated in Figure 1, one of the first steps in the process is to producing, in a substrate layer (1) preferably made of quartz, a plurality of channels (2).
A titre d'exemple, non limitatif, ces différents canaux (2) présentent une profondeur comprise entre 1 et 30 microns, une largeur comprise entre 1 et 30 microns, et une longueur de l'ordre de 5 à plusieurs dizaines de microns. Dans une forme particulière non limitative, chacun de ces canaux (2) est éloigné les uns des autres d'une distance de l'ordre de d'une demi largeur de canal.By way of non-limiting example, these different channels (2) have a depth between 1 and 30 microns, width between 1 and 30 microns, and a length of the order of 5 to several tens of microns. In particular nonlimiting form, each of these channels (2) is distant from each other others by a distance of the order of half a channel width.
Ces différents canaux (2) sont disposés de façon ordonnée selon une bande (3) telle qu'elle est matérialisée en traits pointillés à la figure 7, et qui correspond à la direction générale de l'axe (4) du bobinage du micro-inductance ou du micro-transformateur.These different channels (2) are arranged in an orderly fashion along a strip (3) as shown in dotted lines in Figure 7, and which corresponds to the general direction of the axis (4) of the winding of the micro-inductance or the micro-transformer.
Dans la forme illustrée, ces canaux (2) sont perpendiculaires à la direction de la bande (3), mais d'autres géométries peuvent être adoptées dans lesquelles par exemple chaque canal présente une orientation fixe par rapport à l'axe de la bande. In the illustrated form, these channels (2) are perpendicular to the direction of the strip (3), but other geometries can be adopted in which by example each channel has a fixed orientation relative to the axis of the strip.
Par la suite, comme illustré à la figure 2, on procède à un dépôt de métal, avantageusement de cuivre, à l'intérieur des canaux (2), par électrolyse.Thereafter, as illustrated in FIG. 2, a metal deposition is carried out, advantageously copper, inside the channels (2), by electrolysis.
L'utilisation de cuivre, combinée avec la profondeur des canaux permet d'obtenir des segments (7) présentant une résistance électrique relativement faible, ce qui s'avère avantageux en termes de consommation électrique ainsi que pour le facteur de qualité d'une inductance.The use of copper, combined with the depth of the channels allows to obtain segments (7) having a relatively low electrical resistance, which is advantageous in terms of electricity consumption as well as for the quality factor of an inductor.
Après l'étape de dépôt par électrolyse, on procède, comme montré à la figure 3, à la planarisation assurant un état de surface aussi plan que possible à la face supérieure du substrat.After the electrolysis deposition step, proceed as shown in the figure 3, planarization ensuring a surface condition as flat as possible to the face top of the substrate.
Par cette opération, les segments de cuivre (7) présents à l'intérieur des canaux (2) sont également planarisés, et leur face supérieure (8) se trouve au même niveau que la face supérieure (10) du substrat (1).By this operation, the copper segments (7) present inside the channels (2) are also planarized, and their upper face (8) is at the same level than the upper face (10) of the substrate (1).
En d'autres termes, les segments de cuivre (7) affleurent mais ne dépassent pas de la face supérieure (10) du substrat (1).In other words, the copper segments (7) are flush but do not protrude not from the upper face (10) of the substrate (1).
Par la suite, le procédé diffère selon que l'on réalise une inductance dans l'air ou un micro transformateur ou une inductance présentant un noyau magnétique.Subsequently, the process differs depending on whether an inductance is carried out in the air or a micro transformer or an inductor having a magnetic core.
Ainsi, dans le cas où l'on réalise une inductance dans l'air, on dépose au-dessus du substrat (1) et des segments de cuivre (7), une couche de résine polymère (12) destinée à être éliminée en fin de procédé. Cette résine polymère (12) est une résine du type photosensible couramment utilisée dans ce genre d'application micro-électronique. De la sorte, il est aisé d'en définir la géométrie en forme de barres, puis par fluage d'aboutir à une forme de type demi circulaire sans recourir à d'autre procédé, comme illustré à la figure 4.Thus, in the case where an inductance is produced in the air, it is deposited above substrate (1) and copper segments (7), a layer of polymer resin (12) intended to be eliminated at the end of the process. This polymer resin (12) is a resin of the photosensitive type commonly used in this kind of application microelectronics. In this way, it is easy to define its geometry in the form of bars, then by creep to achieve a semicircular type without resorting to other process, as shown in Figure 4.
Ensuite, on dépose une sous-couche de croissance métallique (13) sur toute la surface (10) du substrat (1) et du ou des noyaux ainsi formés. Une résine photosensible (14) est ensuite déposée sur cette sous-couche de croissance métallique (13). Then, a metal growth underlay (13) is deposited over the entire surface (10) of the substrate (1) and of the nucleus (s) thus formed. A resin photosensitive (14) is then deposited on this growth sublayer metallic (13).
Par la suite, la résine photosensible (14) est insolée en utilisant un masque permettant d'ouvrir des motifs (16) reliant deux segments (7) ancrés dans le substrat.Thereafter, the photosensitive resin (14) is exposed using a mask allowing to open patterns (16) connecting two segments (7) anchored in the substrate.
Par la suite, comme illustré à la figure 5, le motif (16) ainsi ouvert est rempli de métal déposé par électrolyse, de manière à former un pont (17) entre deux extrémités de segments (7) adjacents. Ces ponts (17) sont obtenus en une seule étape d'électrolyse. Les flancs des motifs (16), réalisés dans la résine, permettent d'obtenir des arches (17) dont les parois sont relativement planes.Subsequently, as illustrated in FIG. 5, the pattern (16) thus opened is filled of metal deposited by electrolysis, so as to form a bridge (17) between two ends of adjacent segments (7). These bridges (17) are obtained in a single electrolysis step. The sides of the patterns (16), made in resin, allow to obtain arches (17) whose walls are relatively flat.
Par la suite, on réalise une étape de gravure qui permet d'éliminer la résine (14) et la sous-couche métallique (13) ayant servi à la croissance pour obtenir une pluralité d'arches formant la partie haute des spires, reposant sur le noyau.Thereafter, an etching step is carried out which makes it possible to remove the resin (14) and the metal underlay (13) used for growth to obtain a plurality of arches forming the upper part of the turns, resting on the core.
Pour obtenir, comme illustré à la figure 6, une inductance dans l'air, on procède à l'élimination par dissolution ou gravure par plasma du noyau de résine (15) sur lequel se sont formées les arches métalliques (17).To obtain, as illustrated in figure 6, an inductance in the air, one proceed to the elimination by dissolution or plasma etching of the resin core (15) on which the metal arches (17) are formed.
On obtient ainsi, comme illustré à la figure 7, une inductance comprenant des segments rectilignes (7) formant la partie basse de chaque spire et des arches (18) monolithiques reliant des segments adjacents (7).There is thus obtained, as illustrated in FIG. 7, an inductor comprising rectilinear segments (7) forming the lower part of each turn and arches (18) monolithic connecting adjacent segments (7).
Comme on le voit à la figure 8, de telles spires ont ainsi une forme sensiblement elliptique, se rapprochant de la forme circulaire idéale, qui présente par tour réalisé le moindre périmètre.As seen in Figure 8, such turns have a shape substantially elliptical, approaching the ideal circular shape, which has per turn made the smallest perimeter.
Par la suite, on procède au dépôt d'une couche de passivation typiquement réalisée en or ou en alliage à base d'or pour protéger le cuivre de l'oxydation. Cette couche présente une épaisseur de l'ordre de quelques centaines d'angströms.Thereafter, a passivation layer is typically deposited made of gold or a gold-based alloy to protect copper from oxidation. This layer has a thickness of the order of a few hundred angstroms.
De la sorte, l'inductance ainsi obtenue présente des spires qui sont, dans leur majeure partie, séparées des spires suivantes par une couche d'air, ce qui limite très fortement la capacité parasite entre spires. Les seules parties des spires n'étant pas séparées par de l'air sont les segments rectilignes (7), qui sont séparés par une zone de substrat en quartz, dont les propriétés diélectriques sont également favorables en termes de capacité parasite. In this way, the inductance thus obtained has turns which are, in their for the most part, separated from the following turns by a layer of air, which limits very strongly the parasitic capacity between turns. The only parts of the turns not being separated by air are the straight segments (7), which are separated by an area quartz substrate, whose dielectric properties are also favorable in parasitic capacity terms.
Comme déjà dit, l'invention permet également de réaliser des inductances incorporant un noyau magnétique, ou des micro-transformateurs.As already said, the invention also makes it possible to produce inductors incorporating a magnetic core, or micro-transformers.
Ainsi, pour réaliser de tels micro-composants, le procédé conforme à l'invention enchaíne les étapes de gravure du substrat, de dépôt de cuivre pour former les segments, et de planarisation telles qu'illustrées aux figures 1 à 3.Thus, to produce such micro-components, the process according to the invention follows the steps of etching the substrate, depositing copper for form the segments, and planarization as illustrated in Figures 1 to 3.
Par la suite, on procède, comme illustré à la figure 10, au dépôt d'une couche isolante (21) réalisée à plat sur toute la surface de la plaque, c'est-à-dire au-dessus du substrat (1) et des segments (7).Thereafter, as shown in FIG. 10, a layer is deposited insulator (21) made flat over the entire surface of the plate, that is to say above substrate (1) and segments (7).
L'épaisseur de cette couche isolante (21) est minimisée, typiquement de l'ordre de quelques dixièmes de microns, de manière à limiter la distance séparant le noyau magnétique et les spires de cuivre pour améliorer le couplage magnétique.The thickness of this insulating layer (21) is minimized, typically by the order of a few tenths of a micron, so as to limit the distance separating the magnetic core and the copper coils to improve the magnetic coupling.
Par la suite, au-dessus de la couche d'isolant (21), on dépose une couche de matériau magnétique (22), déposée soit par électrolyse, soit par dépôt en pulvérisation cathodique réactives.Thereafter, above the insulating layer (21), a layer of magnetic material (22), deposited either by electrolysis or by deposition in reactive sputtering.
Typiquement, les matériaux utilisés pour réaliser cette couche magnétique sont des alliages de fer et nickel généralement appelés permalloy, ou d'autres composés laminés.Typically, the materials used to make this magnetic layer are alloys of iron and nickel generally called permalloy, or others laminated compounds.
Par la suite, on procède à une gravure de la couche de matériau magnétique (22) pour ne conserver ce dernier que dans la zone correspondant à l'emplacement du noyau magnétique proprement dit. Le matériau magnétique est par exemple gravé par un procédé de photolithogravure connu par ailleurs.Thereafter, the magnetic material layer is etched (22) to keep it only in the area corresponding to the location of the magnetic core itself. The magnetic material is for example engraved by a photolithography process known elsewhere.
Par la suite, lorsque le matériau magnétique présente la configuration du noyau, on procède à un dépôt, au-dessus de ce dernier, d'un film mince de matériau isolant (24), d'une épaisseur typique de l'ordre de quelques dixièmes de micron.Subsequently, when the magnetic material has the configuration of the core, a thin film of material is deposited above it insulator (24), with a typical thickness of the order of a few tenths of a micron.
Le film isolant supérieur (24) s'étend sur le noyau magnétique (22) et sur le premier film isolant (21) déposé sur le substrat (2). The upper insulating film (24) extends over the magnetic core (22) and over the first insulating film (21) deposited on the substrate (2).
Ces deux films (21, 24) sont gravés à l'aplomb des extrémités du segment (7) ancré dans le substrat (2), de manière à former une ouverture de contact permettant la connexion électrique entre le segment (7) et les futures arches qui seront formées au-dessus du noyau.These two films (21, 24) are engraved directly above the ends of the segment (7) anchored in the substrate (2), so as to form a contact opening allowing the electrical connection between the segment (7) and the future arches that will be formed above the nucleus.
Par la suite, comme déjà décrit pour la réalisation d'inductances dans l'air, on procède au dépôt d'une sous-couche de croissance métallique par dessus le noyau magnétique, puis à la formation en une étape des arches de cuivre destinées à former les spires. La géométrie des extrémités des arches permet de maximiser la surface de contact avec le segment inférieur (7).Thereafter, as already described for the realization of inductances in the air, we deposits a metallic growth undercoat over the core magnetic, then the one-step formation of copper arches intended for form the turns. The geometry of the ends of the arches maximizes the contact surface with the lower segment (7).
On procède ultérieurement au dépôt de la couche de passivation à base d'or ou d'alliage d'or.The gold-based passivation layer is subsequently deposited or gold alloy.
On obtient ainsi le produit illustré partiellement à la figure 12, dans lequel les spires (28) comprennent des segments rectilignes (7) ancrés dans le substrat et des arches (29) reliant les extrémités de deux segments (7) adjacents disposés de part et d'autre du noyau (22).This gives the product partially illustrated in Figure 12, in which the turns (28) comprise rectilinear segments (7) anchored in the substrate and arches (29) connecting the ends of two adjacent segments (7) arranged on one side and on the other of the core (22).
Comme on le voit aux figures 12 et 13, la faible épaisseur des films isolants (21, 24) permet un couplage magnétique optimal.As seen in Figures 12 and 13, the thinness of the insulating films (21, 24) allows optimal magnetic coupling.
De la sorte, on peut réaliser des inductances présentant un noyau magnétique destiné à augmenter le coefficient de self-inductance.In this way, it is possible to produce inductors having a magnetic core intended to increase the self-inductance coefficient.
Ainsi, par cette technique, on a pu obtenir des inductances dans une gamme allant du nanoHenry à quelques dizaines de microHenry. De telles inductances, dans la version sans noyau magnétique, peuvent présenter un facteur de qualité de plusieurs dizaines à des fréquences de quelques gigaHertz.Thus, by this technique, we were able to obtain inductances in a range ranging from nanoHenry to a few dozen microHenry. Such inductances, in the version without magnetic core, may have a quality factor of several tens at frequencies of a few gigaHertz.
Comme déjà dit, le procédé conforme à l'invention permet d'obtenir, par la combinaison de deux enroulements (30, 31) et d'un noyau (32) en boucle fermée, un micro transformateur tel qu'illustré à la figure 14. De tels transformateurs sont utilisés pour l'isolation galvanique entre entrée et sortie de circuits, ou bien encore pour des applications de transformation du signal. As already said, the process according to the invention makes it possible, by combination of two windings (30, 31) and a closed loop core (32), a micro transformer as illustrated in figure 14. Such transformers are used for galvanic isolation between input and output of circuits, or even for signal transformation applications.
Les micro-composants réalisés conformément au procédé de l'invention peuvent être utilisés dans de nombreuses applications, et notamment celles liées à la téléphonie mobile, au traitement du signal et à la miniaturisation.Micro-components produced according to the process of the invention can be used in many applications, including those related to mobile telephony, signal processing and miniaturization.
De tels composants peuvent notamment être montés par la technique connue sous l'appellation de "flip-chip " directement sur des circuits intégrés.Such components can in particular be mounted by the known technique under the name of "flip-chip" directly on integrated circuits.
Claims (11)
caractérisé en ce qu'il comprend les étapes suivantes consistant :
characterized in that it comprises the following stages consisting:
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EP (1) | EP1054417A1 (en) |
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US7404249B2 (en) | 2001-10-10 | 2008-07-29 | Stmicroelectronics S.A. | Method of manufacturing an inductance |
FR2842018A3 (en) * | 2002-07-02 | 2004-01-09 | Memscap | Micro-component includes inductive element of inductance or transformer type, incorporating magnetic core formed by pile of successive strongly magnetic and electrical insulating layers |
Also Published As
Publication number | Publication date |
---|---|
FR2793943A1 (en) | 2000-11-24 |
JP2000353617A (en) | 2000-12-19 |
CA2308871A1 (en) | 2000-11-18 |
US6429764B1 (en) | 2002-08-06 |
FR2793943B1 (en) | 2001-07-13 |
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