EP1036640A1 - Method for reclaiming slurry by a magnetic separator - Google Patents
Method for reclaiming slurry by a magnetic separator Download PDFInfo
- Publication number
- EP1036640A1 EP1036640A1 EP00105339A EP00105339A EP1036640A1 EP 1036640 A1 EP1036640 A1 EP 1036640A1 EP 00105339 A EP00105339 A EP 00105339A EP 00105339 A EP00105339 A EP 00105339A EP 1036640 A1 EP1036640 A1 EP 1036640A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- abrasion
- abrasive
- liquid
- magnetic separator
- semiconductor material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C—MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C1/00—Magnetic separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/025—Use, recovery or regeneration of abrasive mediums
Definitions
- the invention relates to a method for reprocessing a suspension used in the mechanical processing of Semiconductor material accumulates and a liquid, an abrasive contains active agent and abrasion from semiconductor material, by separating the abrasive and then Separation of the liquid and the abrasion.
- the object of the present invention is a simpler and cheaper Provide procedures.
- the task is solved by a process for reprocessing a suspension used in the mechanical processing of Semiconductor material accumulates and a liquid, an abrasive contains active agent and abrasion from semiconductor material, by separating the abrasive and then Separation of the liquid and the abrasion, which is characterized is that the liquid and the abrasion with the help of a magnetic separator.
- the invention is particularly suitable for reprocessing a suspension which is removed from semiconductor wafers when a brittle hard workpiece with the help of a wire saw or with Lapping of such semiconductor wafers occurs.
- non-metallic Abrasion for example silicon-containing abrasion metal-containing abrasion, for example from the saw wire Wire saw or a lapping plate that forms agglomerates are magnetizable.
- the invention enables complex centrifugation of To save abrasion.
- the suspension comprises a liquid, an abrasive and the abrasion that occurs during cutting or lapping, which in turn increases composed of semiconductor material and metallic abrasion.
- the one with an abrasive effect Agent separated from the rest of the suspension. Passes through in the decanter the suspension, which is also called slurry in technical jargon is initially a clarification zone, with part of the abrasive already acting agent. Then the slurry passed through a peeling disc under pressure, whereby the abrasive agent largely remains in the decanter.
- the abrasive agent can also by centrifuging Rest of the suspension to be separated because of centrifugation in this case is less expensive than centrifuging the Abrasion.
- the liquid leaving the decanter contains substantial abrasion and possibly small residues of not separate, abrasive agent.
- This solid According to the invention, liquid is fed to a magnetic separator, which magnetically holds back the solids, so that the liquid and the solids are separated.
- the regained Liquid and the abrasive separated in the decanter active agents are preferably used to prepare a new one Suspension used, for example, again for separation or lapping semiconductor wafers is used and still is free of abrasion.
- oils or aqueous solutions come as liquids in question, each of these auxiliaries such as surfactants or may contain polymers.
- abrasive are preferably hard material particles made of aluminum oxide, silicon carbide or boron carbide used.
- the abrasion separated according to the invention preferably contains silicon or silicon carbide as a semiconductor material.
Abstract
Description
Gegenstand der Erfindung ist ein Verfahren zum Wiederaufarbeiten einer Suspension, die beim mechanischen Bearbeiten von Halbleitermaterial anfällt und eine Flüssigkeit, ein abrasiv wirkendes Mittel und Abrieb aus Halbleitermaterial enthält, durch Abtrennen des abrasiv wirkenden Mittels und anschließendes Trennen der Flüssigkeit und des Abriebs.The invention relates to a method for reprocessing a suspension used in the mechanical processing of Semiconductor material accumulates and a liquid, an abrasive contains active agent and abrasion from semiconductor material, by separating the abrasive and then Separation of the liquid and the abrasion.
In der US-5,830,369 ist ein Verfahren dieser Gattung beschrieben. Demnach ist zum Trennen des Abriebs und der Flüssigkeit eine Zentrifuge einzusetzen.A method of this type is described in US Pat. No. 5,830,369. This is for separating the abrasion and the liquid use a centrifuge.
Aufgabe der vorliegenden Erfindung ist es, ein einfacheres kostengünstigeres Verfahren bereitzustellen.The object of the present invention is a simpler and cheaper Provide procedures.
Gelöst wird die Aufgabe durch ein Verfahren zum Wiederaufarbeiten einer Suspension, die beim mechanischen Bearbeiten von Halbleitermaterial anfällt und eine Flüssigkeit, ein abrasiv wirkendes Mittel und Abrieb aus Halbleitermaterial enthält, durch Abtrennen des abrasiv wirkenden Mittels und anschließendes Trennen der Flüssigkeit und des Abriebs, das dadurch gekennzeichnet ist, daß die Flüssigkeit und der Abrieb mit Hilfe eines Magnetabscheiders getrennt werden.The task is solved by a process for reprocessing a suspension used in the mechanical processing of Semiconductor material accumulates and a liquid, an abrasive contains active agent and abrasion from semiconductor material, by separating the abrasive and then Separation of the liquid and the abrasion, which is characterized is that the liquid and the abrasion with the help of a magnetic separator.
Die Erfindung eignet sich insbesondere zum Wiederaufarbeiten einer Suspension, die beim Abtrennen von Halbleiterscheiben von einem sprödhartem Werkstück mit Hilfe einer Drahtsäge oder beim Läppen solcher Halbleiterscheiben anfällt.The invention is particularly suitable for reprocessing a suspension which is removed from semiconductor wafers when a brittle hard workpiece with the help of a wire saw or with Lapping of such semiconductor wafers occurs.
Die vorgeschlagene Lösung ist überraschend, da nicht zu erwarten war, daß Abrieb aus nicht-magnetischem Material wie Halbleitermaterial einer Trennung mit Hilfe eines Magnetabscheiders zugänglich ist. Es hat sich herausgestellt, daß nichtmetallischer Abrieb, beispielsweise siliciumhaltiger Abrieb mit metallhaltigem Abrieb, der beispielsweise vom Sägedraht einer Drahtsäge oder einem Läppteller stammt, Agglomerate bildet, die magnetisierbar sind. The proposed solution is surprising because it cannot be expected was that abrasion from non-magnetic material such as semiconductor material separation using a magnetic separator is accessible. It has been found that non-metallic Abrasion, for example silicon-containing abrasion metal-containing abrasion, for example from the saw wire Wire saw or a lapping plate that forms agglomerates are magnetizable.
Die Erfindung ermöglicht es, aufwendiges Abzentrifugieren von Abrieb zu sparen.The invention enables complex centrifugation of To save abrasion.
Gemäß einer bevorzugten Ausführungsform der Erfindung wird nach dem Abtrennen oder dem Läppen von Halbleiterscheiben ein Teil oder die Gesamteit der dabei anfallenden Suspension der Maschine entnommen und einem Dekanter zugeführt. Die Suspension umfaßt eine Flüssigkeit, ein abrasiv wirkendes Mittel und den beim Abtrennen oder Läppen entstandenen Abrieb, der sich wiederum aus Halbleitermaterial und metallischem Abrieb zusammensetzt. Zunächst wird in einem Dekanter das abrasiv wirkende Mittel vom Rest der Suspension getrennt. Im Dekanter durchläuft die Suspension, die im Fachjargon auch als slurry bezeichnet wird, zunächst eine Klärzone, wobei sich ein Teil des abrasiv wirkenden Mittels bereits absetzt. Anschließend wird das slurry durch eine Schälscheibe unter Druck nach außen geführt, wobei das abrasiv wirkende Mittel weitgehend im Dekanter bleibt.According to a preferred embodiment of the invention, after part of the cutting or lapping of semiconductor wafers or the total of the resulting suspension of the machine removed and fed to a decanter. The suspension comprises a liquid, an abrasive and the abrasion that occurs during cutting or lapping, which in turn increases composed of semiconductor material and metallic abrasion. First, in a decanter, the one with an abrasive effect Agent separated from the rest of the suspension. Passes through in the decanter the suspension, which is also called slurry in technical jargon is initially a clarification zone, with part of the abrasive already acting agent. Then the slurry passed through a peeling disc under pressure, whereby the abrasive agent largely remains in the decanter.
Das abrasiv wirkende Mittel kann auch durch Zentrifugieren vom Rest der Suspension getrennt werden, weil das Zentrifugieren in diesem Fall weniger aufwendig ist als das Abzentrifugieren des Abriebs.The abrasive agent can also by centrifuging Rest of the suspension to be separated because of centrifugation in this case is less expensive than centrifuging the Abrasion.
In der den Dekanter verlassenden Flüssigkeit befindet sich im wesentlichen Abrieb und gegebenenfalls geringe Reste von nicht getrenntem, abrasiv wirkendem Mittel. Diese feststoffhaltige Flüssigkeit wird erfindungsgemäß einem Magnetabscheider zugeführt, der die Feststoffanteile magnetisch zurückhält, so daß die Flüssigkeit und die Feststoffe getrennt werden. Die wiedergewonnene Flüssigkeit und das im Dekanter abgetrennte abrasiv wirkende Mittel werden vorzugsweise zum Ansetzen einer neuen Suspension verwendet, die beispielsweise wieder zum Abtrennen oder Läppen von Halbleiterscheiben eingesetzt wird und noch frei von Abrieb ist.The liquid leaving the decanter contains substantial abrasion and possibly small residues of not separate, abrasive agent. This solid According to the invention, liquid is fed to a magnetic separator, which magnetically holds back the solids, so that the liquid and the solids are separated. The regained Liquid and the abrasive separated in the decanter active agents are preferably used to prepare a new one Suspension used, for example, again for separation or lapping semiconductor wafers is used and still is free of abrasion.
Als Flüssigkeiten kommmen insbesondere Öle oder wässerige Lösungen in Frage, wobei diese jeweils Hilfsstoffe wie Tenside oder Polymere enthalten können. Als abrasiv wirkendes Mittel werden vorzugsweise Hartstoff-Teilchen aus Aluminiumoxid, Siliciumcarbid oder Borcarbid eingesetzt.In particular, oils or aqueous solutions come as liquids in question, each of these auxiliaries such as surfactants or may contain polymers. As an abrasive are preferably hard material particles made of aluminum oxide, silicon carbide or boron carbide used.
Der erfindungsgemäß getrennte Abrieb enthält vozugsweise Silicium oder Siliciumcarbid als Halbleitermaterial.The abrasion separated according to the invention preferably contains silicon or silicon carbide as a semiconductor material.
Claims (3)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19912252A DE19912252A1 (en) | 1999-03-18 | 1999-03-18 | Procedure for reprocessing a suspension |
| DE19912252 | 1999-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP1036640A1 true EP1036640A1 (en) | 2000-09-20 |
Family
ID=7901539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP00105339A Ceased EP1036640A1 (en) | 1999-03-18 | 2000-03-16 | Method for reclaiming slurry by a magnetic separator |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6264843B1 (en) |
| EP (1) | EP1036640A1 (en) |
| JP (1) | JP2000308968A (en) |
| KR (1) | KR20010014575A (en) |
| DE (1) | DE19912252A1 (en) |
| TW (1) | TW466137B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3426149B2 (en) * | 1998-12-25 | 2003-07-14 | 富士通株式会社 | Method and apparatus for recycling polishing waste liquid in semiconductor manufacturing |
| DE19960380C2 (en) * | 1999-12-14 | 2002-05-29 | Fraunhofer Ges Forschung | Process for fractionating a cutting suspension |
| NO20014148A (en) * | 2001-08-27 | 2003-02-03 | Elkem As | Method for removing contaminants from silicon-containing residues |
| US6433205B1 (en) | 2002-01-15 | 2002-08-13 | Dow Corning Corporation | Magnetic separation for silicon-containing materials |
| SG172435A1 (en) | 2008-12-31 | 2011-07-28 | Memc Singapore Pte Ltd | Methods to recover and purify silicon particles from saw kerf |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4810368A (en) * | 1985-04-10 | 1989-03-07 | Electro Minerals (Canada) Inc. | Automatic method for separating and cleaning silicon carbide furnace materials |
| FR2704455A1 (en) * | 1993-04-28 | 1994-11-04 | Stratech International | Process for enhancing in value the sludge coming from the sawing, cutting and polishing of blocks of granite |
| US5830369A (en) * | 1996-01-26 | 1998-11-03 | Shin-Etsu Handotai Co., Ltd. | System for reusing oily slurry waste fluid |
| JPH10309647A (en) * | 1997-05-08 | 1998-11-24 | Jatco Corp | Liquid purifying method and device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100229989B1 (en) * | 1994-06-22 | 1999-11-15 | 사에기 스스므 | Machining process waste liquor regeneration method and machining process waste liquor regenerating apparatus |
| US5529695A (en) * | 1994-07-21 | 1996-06-25 | The United States Of America As Represented By The Secretary Of The Army | Apparatus and method for removing swarf and fines from cutting fluids |
| DE19535397C2 (en) * | 1995-09-23 | 2001-02-01 | Geesthacht Gkss Forschung | Method and device for separating mixtures of abrasive and abrasion particles resulting from cutting, separating or machining processes |
-
1999
- 1999-03-18 DE DE19912252A patent/DE19912252A1/en not_active Ceased
-
2000
- 2000-03-13 KR KR1020000012448A patent/KR20010014575A/en active IP Right Grant
- 2000-03-15 JP JP2000072406A patent/JP2000308968A/en active Pending
- 2000-03-16 EP EP00105339A patent/EP1036640A1/en not_active Ceased
- 2000-03-16 TW TW089104792A patent/TW466137B/en active
- 2000-03-16 US US09/526,835 patent/US6264843B1/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4810368A (en) * | 1985-04-10 | 1989-03-07 | Electro Minerals (Canada) Inc. | Automatic method for separating and cleaning silicon carbide furnace materials |
| FR2704455A1 (en) * | 1993-04-28 | 1994-11-04 | Stratech International | Process for enhancing in value the sludge coming from the sawing, cutting and polishing of blocks of granite |
| US5830369A (en) * | 1996-01-26 | 1998-11-03 | Shin-Etsu Handotai Co., Ltd. | System for reusing oily slurry waste fluid |
| JPH10309647A (en) * | 1997-05-08 | 1998-11-24 | Jatco Corp | Liquid purifying method and device |
Non-Patent Citations (2)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 1999, no. 02 26 February 1999 (1999-02-26) * |
| T.J. DROZDA, C. WICK: "Tool and manufacturing engineers handbook, Vol 1, Machining", 1983, SOCIETY OF MANUFACTURING ENGINEERS (SME), DEARBORN (US), 1983, XP002140912, 012391 * |
Also Published As
| Publication number | Publication date |
|---|---|
| US6264843B1 (en) | 2001-07-24 |
| TW466137B (en) | 2001-12-01 |
| JP2000308968A (en) | 2000-11-07 |
| DE19912252A1 (en) | 2000-09-28 |
| KR20010014575A (en) | 2001-02-26 |
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