EP0813943A3 - Cutting center - Google Patents

Cutting center Download PDF

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Publication number
EP0813943A3
EP0813943A3 EP97109938A EP97109938A EP0813943A3 EP 0813943 A3 EP0813943 A3 EP 0813943A3 EP 97109938 A EP97109938 A EP 97109938A EP 97109938 A EP97109938 A EP 97109938A EP 0813943 A3 EP0813943 A3 EP 0813943A3
Authority
EP
European Patent Office
Prior art keywords
unit
operations
slicing
cutting center
subgroups
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP97109938A
Other languages
German (de)
French (fr)
Other versions
EP0813943A2 (en
EP0813943B1 (en
Inventor
Charles Hauser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Switzerland SARL
Original Assignee
Hauser Charles
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hauser Charles filed Critical Hauser Charles
Publication of EP0813943A2 publication Critical patent/EP0813943A2/en
Publication of EP0813943A3 publication Critical patent/EP0813943A3/en
Application granted granted Critical
Publication of EP0813943B1 publication Critical patent/EP0813943B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor

Abstract

Le centre de tranchage comprend réunis dans une même unité des premiers moyens (23) pour réaliser les opérations (24) nécessaires à la production de tranches conditionnées en cassettes ou emballées selon besoin à partir de pièces à trancher. Ces opérations (24) sont gérées et liées entre elles par des seconds moyens (25) de façon à former des sous-groupes (26) consistant en une unité de positionnement, une unité de tranchage, une unité de conditionnement et une unité de traitement final. Ces sous-groupes (26) sont eux-mêmes reliés par des troisièmes moyens (27) comportant des dispositifs de stockage et des organes de manipulation et de transport, pour former ainsi une chaíne de transfert dans laquelle tous les éléments sont compatibles et interconnectés.

Figure 00000001
The slicing center comprises, brought together in the same unit, first means (23) for carrying out the operations (24) necessary for the production of slices packaged in cassettes or packed as required from pieces to be sliced. These operations (24) are managed and linked together by second means (25) so as to form sub-groups (26) consisting of a positioning unit, a slicing unit, a packaging unit and a processing unit. final. These subgroups (26) are themselves connected by third means (27) comprising storage devices and handling and transport members, thereby forming a transfer chain in which all the elements are compatible and interconnected.
Figure 00000001
EP97109938A 1996-06-19 1997-06-18 Cutting center Expired - Lifetime EP0813943B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH153296 1996-06-19
CH1532/96 1996-06-19
CH01532/96A CH691798A5 (en) 1996-06-19 1996-06-19 Cutting center for producing slices from slicing pieces.

Publications (3)

Publication Number Publication Date
EP0813943A2 EP0813943A2 (en) 1997-12-29
EP0813943A3 true EP0813943A3 (en) 1998-04-08
EP0813943B1 EP0813943B1 (en) 2002-11-27

Family

ID=4212643

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97109938A Expired - Lifetime EP0813943B1 (en) 1996-06-19 1997-06-18 Cutting center

Country Status (5)

Country Link
US (1) US6524162B1 (en)
EP (1) EP0813943B1 (en)
JP (1) JPH1076430A (en)
CH (1) CH691798A5 (en)
DE (1) DE69717349T2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003072329A1 (en) * 2002-02-28 2003-09-04 Memc Electronic Materials, S.P.A. Automated control of wafer slicing process
US9046892B2 (en) * 2009-06-05 2015-06-02 The Boeing Company Supervision and control of heterogeneous autonomous operations
DE102011119015A1 (en) 2011-11-14 2013-05-16 Jens Hansen Foldable keyboard for e.g. computer, has longitudinal stabilizers that are provided at the center of the keyboard main structure, for stabilization of rails
US10052848B2 (en) 2012-03-06 2018-08-21 Apple Inc. Sapphire laminates
JP6021261B2 (en) * 2013-01-09 2016-11-09 コマツＮｔｃ株式会社 Multi-axis machining wire saw system
US9154678B2 (en) 2013-12-11 2015-10-06 Apple Inc. Cover glass arrangement for an electronic device
US10406634B2 (en) 2015-07-01 2019-09-10 Apple Inc. Enhancing strength in laser cutting of ceramic components

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3736968A (en) * 1970-11-25 1973-06-05 Sun Studs Method and apparatus for processing logs
US4719694A (en) * 1985-11-13 1988-01-19 Siemens Aktiengesellschaft Installation for automatic assembly and testing of electronic card modules
JPH04282702A (en) * 1991-03-12 1992-10-07 Omron Corp Hirarchical type plant management system
US5164905A (en) * 1987-08-12 1992-11-17 Hitachi, Ltd. Production system with order of processing determination
US5246524A (en) * 1988-06-06 1993-09-21 Nitto Denko Corporation Semiconductor wafer processing system
US5255197A (en) * 1990-07-06 1993-10-19 Honda Giken Kogyo Kabushiki Kaisha Line production management system
JPH076939A (en) * 1992-12-02 1995-01-10 Hitachi Ltd Production control system
JPH08110805A (en) * 1994-10-07 1996-04-30 Kokusai Electric Co Ltd Control system for multiple process device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0688193B2 (en) * 1986-07-18 1994-11-09 三洋電機株式会社 Production control equipment
US5536128A (en) * 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
DE4001885A1 (en) * 1990-01-23 1991-07-25 Kuka Schweissanlagen & Roboter MULTI-AXIS INDUSTRIAL ROBOT
US5399531A (en) * 1990-12-17 1995-03-21 United Micrpelectronics Corporation Single semiconductor wafer transfer method and plural processing station manufacturing system
JPH05121521A (en) * 1991-10-29 1993-05-18 Komatsu Electron Metals Co Ltd Apparatus and method for manufacture of semiconductor wafer
JP2516717B2 (en) * 1991-11-29 1996-07-24 信越半導体株式会社 Wire saw and its cutting method
JPH0821807B2 (en) * 1993-04-07 1996-03-04 日本電気株式会社 Microwave circuit module manufacturing equipment
JP3085136B2 (en) * 1995-03-25 2000-09-04 信越半導体株式会社 Work slicing method and apparatus
US5653622A (en) * 1995-07-25 1997-08-05 Vlsi Technology, Inc. Chemical mechanical polishing system and method for optimization and control of film removal uniformity

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3736968A (en) * 1970-11-25 1973-06-05 Sun Studs Method and apparatus for processing logs
US4719694A (en) * 1985-11-13 1988-01-19 Siemens Aktiengesellschaft Installation for automatic assembly and testing of electronic card modules
US5164905A (en) * 1987-08-12 1992-11-17 Hitachi, Ltd. Production system with order of processing determination
US5246524A (en) * 1988-06-06 1993-09-21 Nitto Denko Corporation Semiconductor wafer processing system
US5255197A (en) * 1990-07-06 1993-10-19 Honda Giken Kogyo Kabushiki Kaisha Line production management system
JPH04282702A (en) * 1991-03-12 1992-10-07 Omron Corp Hirarchical type plant management system
JPH076939A (en) * 1992-12-02 1995-01-10 Hitachi Ltd Production control system
JPH08110805A (en) * 1994-10-07 1996-04-30 Kokusai Electric Co Ltd Control system for multiple process device

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 017, no. 082 (P - 1489) 18 February 1993 (1993-02-18) *
PATENT ABSTRACTS OF JAPAN vol. 095, no. 004 31 May 1995 (1995-05-31) *
PATENT ABSTRACTS OF JAPAN vol. 096, no. 008 30 August 1996 (1996-08-30) *

Also Published As

Publication number Publication date
JPH1076430A (en) 1998-03-24
CH691798A5 (en) 2001-10-31
DE69717349T2 (en) 2003-10-09
DE69717349D1 (en) 2003-01-09
US6524162B1 (en) 2003-02-25
EP0813943A2 (en) 1997-12-29
EP0813943B1 (en) 2002-11-27

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