EP0690772A1 - Compositions and methods for polishing and planarizing surfaces - Google Patents
Compositions and methods for polishing and planarizing surfacesInfo
- Publication number
- EP0690772A1 EP0690772A1 EP93902930A EP93902930A EP0690772A1 EP 0690772 A1 EP0690772 A1 EP 0690772A1 EP 93902930 A EP93902930 A EP 93902930A EP 93902930 A EP93902930 A EP 93902930A EP 0690772 A1 EP0690772 A1 EP 0690772A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- particle size
- percent
- work piece
- aqueous slurry
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/346—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties utilised during polishing, or grinding operation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/874,654 US5264010A (en) | 1992-04-27 | 1992-04-27 | Compositions and methods for polishing and planarizing surfaces |
PCT/US1993/000046 WO1993022103A1 (en) | 1992-04-27 | 1993-01-05 | Compositions and methods for polishing and planarizing surfaces |
US874654 | 2004-06-23 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0690772A4 EP0690772A4 (en) | 1995-06-01 |
EP0690772A1 true EP0690772A1 (en) | 1996-01-10 |
EP0690772B1 EP0690772B1 (en) | 1998-05-13 |
Family
ID=25364263
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP93902930A Expired - Lifetime EP0690772B1 (en) | 1992-04-27 | 1993-01-05 | Compositions and methods for polishing and planarizing surfaces |
Country Status (12)
Country | Link |
---|---|
US (1) | US5264010A (en) |
EP (1) | EP0690772B1 (en) |
JP (1) | JP2592401B2 (en) |
KR (1) | KR950701264A (en) |
CN (2) | CN1052502C (en) |
AT (1) | ATE166018T1 (en) |
AU (1) | AU3432693A (en) |
DE (1) | DE69318577T2 (en) |
MY (1) | MY108954A (en) |
SG (1) | SG43334A1 (en) |
TW (1) | TW226403B (en) |
WO (1) | WO1993022103A1 (en) |
Families Citing this family (121)
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MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
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US5556323A (en) * | 1994-06-30 | 1996-09-17 | Siecor Corporation | Method of polishing optical connectors |
JP3278532B2 (en) * | 1994-07-08 | 2002-04-30 | 株式会社東芝 | Method for manufacturing semiconductor device |
US5607341A (en) | 1994-08-08 | 1997-03-04 | Leach; Michael A. | Method and structure for polishing a wafer during manufacture of integrated circuits |
TW274625B (en) * | 1994-09-30 | 1996-04-21 | Hitachi Seisakusyo Kk | |
US5527423A (en) * | 1994-10-06 | 1996-06-18 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers |
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JPH08250455A (en) * | 1995-02-15 | 1996-09-27 | Texas Instr Inc <Ti> | Method and device for removing contamination from semiconductor wafer surface which is ground with chemical machinery |
US5658553A (en) * | 1995-05-02 | 1997-08-19 | The Procter & Gamble Company | Dentifrice compositions |
KR960041316A (en) * | 1995-05-22 | 1996-12-19 | 고사이 아키오 | Polishing slurry, method for producing the same, and use thereof |
US6046110A (en) * | 1995-06-08 | 2000-04-04 | Kabushiki Kaisha Toshiba | Copper-based metal polishing solution and method for manufacturing a semiconductor device |
JP3134719B2 (en) * | 1995-06-23 | 2001-02-13 | 信越半導体株式会社 | Polishing agent for polishing semiconductor wafer and polishing method |
US5958794A (en) * | 1995-09-22 | 1999-09-28 | Minnesota Mining And Manufacturing Company | Method of modifying an exposed surface of a semiconductor wafer |
US5672095A (en) * | 1995-09-29 | 1997-09-30 | Intel Corporation | Elimination of pad conditioning in a chemical mechanical polishing process |
JP3359479B2 (en) * | 1995-11-07 | 2002-12-24 | 三井金属鉱業株式会社 | Abrasive, manufacturing method and polishing method |
DE69611653T2 (en) * | 1995-11-10 | 2001-05-03 | Tokuyama Corp | Polishing suspensions and processes for their manufacture |
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US5897675A (en) * | 1996-04-26 | 1999-04-27 | Degussa Aktiengesellschaft | Cerium oxide-metal/metalloid oxide mixture |
KR19980019046A (en) * | 1996-08-29 | 1998-06-05 | 고사이 아키오 | Abrasive composition and use of the same |
KR19980024187A (en) * | 1996-09-03 | 1998-07-06 | 고사이 아키오 | Polishing compositions and uses thereof for polishing metal films on semiconductor substrates |
US6132637A (en) | 1996-09-27 | 2000-10-17 | Rodel Holdings, Inc. | Composition and method for polishing a composite of silica and silicon nitride |
US5738800A (en) * | 1996-09-27 | 1998-04-14 | Rodel, Inc. | Composition and method for polishing a composite of silica and silicon nitride |
CA2263241C (en) * | 1996-09-30 | 2004-11-16 | Masato Yoshida | Cerium oxide abrasive and method of abrading substrates |
FR2754937B1 (en) * | 1996-10-23 | 1999-01-15 | Hoechst France | NOVEL MECHANICAL AND CHEMICAL POLISHING OF INSULATING MATERIAL LAYERS BASED ON SILICON OR SILICON DERIVATIVES |
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US5759917A (en) * | 1996-12-30 | 1998-06-02 | Cabot Corporation | Composition for oxide CMP |
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DE59806748D1 (en) * | 1997-07-25 | 2003-01-30 | Infineon Technologies Ag | POLISHING AGENT FOR SEMICONDUCTOR SUBSTRATES |
JPH11181403A (en) | 1997-12-18 | 1999-07-06 | Hitachi Chem Co Ltd | Cerium oxide abrasive and grinding of substrate |
US6083839A (en) * | 1997-12-31 | 2000-07-04 | Intel Corporation | Unique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process control |
US6143662A (en) * | 1998-02-18 | 2000-11-07 | Rodel Holdings, Inc. | Chemical mechanical polishing composition and method of polishing a substrate |
US6015499A (en) * | 1998-04-17 | 2000-01-18 | Parker-Hannifin Corporation | Membrane-like filter element for chemical mechanical polishing slurries |
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US6533832B2 (en) | 1998-06-26 | 2003-03-18 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry and method for using same |
TW455626B (en) * | 1998-07-23 | 2001-09-21 | Eternal Chemical Co Ltd | Chemical mechanical abrasive composition for use in semiconductor processing |
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JP2000080350A (en) | 1998-09-07 | 2000-03-21 | Speedfam-Ipec Co Ltd | Abrasive composition and polishing method using same |
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DE69942615D1 (en) | 1998-10-23 | 2010-09-02 | Fujifilm Electronic Materials | A CHEMICAL-MECHANICAL POLISHING AIRBREAKING, CONTAINING A ACCELERATOR SOLUTION |
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US6106368A (en) * | 1998-11-18 | 2000-08-22 | Siecor Operations, Llc | Polishing method for preferentially etching a ferrule and ferrule assembly |
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1992
- 1992-04-27 US US07/874,654 patent/US5264010A/en not_active Expired - Fee Related
-
1993
- 1993-01-05 JP JP5519224A patent/JP2592401B2/en not_active Expired - Fee Related
- 1993-01-05 AT AT93902930T patent/ATE166018T1/en not_active IP Right Cessation
- 1993-01-05 KR KR1019940703896A patent/KR950701264A/en not_active Application Discontinuation
- 1993-01-05 DE DE69318577T patent/DE69318577T2/en not_active Expired - Fee Related
- 1993-01-05 SG SG1996008434A patent/SG43334A1/en unknown
- 1993-01-05 EP EP93902930A patent/EP0690772B1/en not_active Expired - Lifetime
- 1993-01-05 AU AU34326/93A patent/AU3432693A/en not_active Abandoned
- 1993-01-05 WO PCT/US1993/000046 patent/WO1993022103A1/en active IP Right Grant
- 1993-01-11 TW TW082100126A patent/TW226403B/zh active
- 1993-01-12 MY MYPI93000044A patent/MY108954A/en unknown
- 1993-03-05 CN CN93102414A patent/CN1052502C/en not_active Expired - Fee Related
-
1999
- 1999-02-12 CN CN99101890A patent/CN1243857A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US3715842A (en) * | 1970-07-02 | 1973-02-13 | Tizon Chem Corp | Silica polishing compositions having a reduced tendency to scratch silicon and germanium surfaces |
DD216477A1 (en) * | 1983-07-04 | 1984-12-12 | Fernsehkolbenwerk Friedrichsha | POLISHING MIXTURE FOR GLASS OBJECTS |
DD241083A1 (en) * | 1985-09-17 | 1986-11-26 | Univ Schiller Jena | POLISHING MIXTURES WITH CEROXIDE FOR POLISHING MATERIALS |
JPS62172099A (en) * | 1986-01-24 | 1987-07-29 | ダイセル化学工業株式会社 | Liquid cleanser composition excellent in dispersion stability |
JPS63114866A (en) * | 1986-10-31 | 1988-05-19 | Hoya Corp | Method of processing glass |
Non-Patent Citations (5)
Title |
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DATABASE WPI Section Ch, Week 8516, Derwent Publications Ltd., London, GB; Class LGF, AN 85-093287 C16! & DD-A-216 477 (FERNSEHENGERATEWERKE VEB) 12 December 1984 * |
DATABASE WPI Section Ch, Week 8713, Derwent Publications Ltd., London, GB; Class LEF, AN 87-087105 C13! & DD-A-241 083 (FR-SCHILLER - UNIV. JENA) 26 November 1986 * |
DATABASE WPI Section Ch, Week 8736, Derwent Publications Ltd., London, GB; Class ADE, AN 87-252489 C36! & JP-A-62 172 099 (DAICEL CHEM. IND. LTD.) 29 July 1987 * |
PATENT ABSTRACTS OF JAPAN vol. 12, no. 360 (M-746) 27 September 1988 & JP-A-63 114 866 (HAYA CORP.) 19 May 1988 * |
See also references of WO9322103A1 * |
Also Published As
Publication number | Publication date |
---|---|
DE69318577D1 (en) | 1998-06-18 |
DE69318577T2 (en) | 1998-11-12 |
ATE166018T1 (en) | 1998-05-15 |
AU3432693A (en) | 1993-11-29 |
CN1052502C (en) | 2000-05-17 |
CN1243857A (en) | 2000-02-09 |
EP0690772A4 (en) | 1995-06-01 |
SG43334A1 (en) | 1997-10-17 |
CN1077974A (en) | 1993-11-03 |
JPH07502778A (en) | 1995-03-23 |
EP0690772B1 (en) | 1998-05-13 |
JP2592401B2 (en) | 1997-03-19 |
KR950701264A (en) | 1995-03-23 |
US5264010A (en) | 1993-11-23 |
WO1993022103A1 (en) | 1993-11-11 |
TW226403B (en) | 1994-07-11 |
MY108954A (en) | 1996-11-30 |
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