EP0512456A1 - Process for fitting and removal of a target plate in a vacuum processing chamber, fitting therefor, target plate and vacuum chamber - Google Patents
Process for fitting and removal of a target plate in a vacuum processing chamber, fitting therefor, target plate and vacuum chamber Download PDFInfo
- Publication number
- EP0512456A1 EP0512456A1 EP92107498A EP92107498A EP0512456A1 EP 0512456 A1 EP0512456 A1 EP 0512456A1 EP 92107498 A EP92107498 A EP 92107498A EP 92107498 A EP92107498 A EP 92107498A EP 0512456 A1 EP0512456 A1 EP 0512456A1
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- European Patent Office
- Prior art keywords
- plate
- target
- target plate
- bayonet
- chamber
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J31/00—Apparatus for making beverages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3497—Temperature of target
Definitions
- the present invention relates to a method for assembling or disassembling a target plate to be cooled in a vacuum process room, an arrangement for assembling or disassembling such a target plate in a vacuum process chamber, and a target plate and a vacuum chamber.
- target plates are used in various vacuum processes and are consumed in the course of the processes.
- the target is atomized over a large area by DC or AC glow discharge by ion bombardment and the dusted target particles, reacted directly or with a reactive gas, are placed on workpieces in order to coat them.
- the target is often operated with a magnetron arrangement during high-rate sputtering, which increases the ion density in the target area.
- the target is locally vaporized by an arc or by electron beam bombardment.
- the sputtering or evaporation process places a high thermal load on the target, be it through ion or electron bombardment or the incident arc.
- All target plates should be easy to replace without dismantling larger vacuum chamber parts, whereby it is often necessary to ensure that non-non-process materials of fastening elements are exposed against the process space, since such would inadmissibly contaminate sensitive coating processes if they were atomized or evaporated.
- target plates are used for the dissipation of heat, e.g. mounted on a cooling plate arrangement.
- EP-A-0 393 344 discloses a conduit system for the cooling medium from the contact surface on the target plate through a thin, membrane-like or to separate film-like, heat-conducting wall, which on the one hand eliminates the vacuum-technical sealing problems compared to direct cooling, and on the other hand, by the pressure of the cooling medium on the membrane-like intermediate wall and on the back of the target plate, a very good heat transfer from the target plate to the cooling medium can be guaranteed.
- the pressure forces of the medium are absorbed by the target plate.
- the mechanical strength of the target plate is too low, be it due to its dimensioning and / or the properties of the target material, it is customary to form the target plate from a plate made of target material and a target back plate, for example to bond it together.
- the back plate then absorbs a large part of the mechanical stress on the target plate.
- the target plate is attached either from the process room side, ie from the front, or from the cooling plate, from the rear.
- a target plate attachment from the front (CH-A-664 303) has the advantage that the plate can be easily dismantled and assembled without the cooling plate having to be dismantled.
- the disadvantage here is that a material of the fastening elements, such as screws, which differs from the target material is exposed against the process space, which has to be taken into account in that the target plate cannot be atomized over the entire surface. This in turn has an impact on the layer thickness distribution of the layers produced by atomization or on the utilization of the often expensive target material.
- Co-atomization from the front i.e. Fastening elements provided from the process space can never be completely ruled out, which is why such fastenings can be avoided with delicate coating processes that meet the highest requirements.
- a target plate attachment with screw connection from behind (CH-A-669 242) has the advantage that the target can be atomized on the entire front side, but the disadvantage that when changing the target, the cooling plate, from which the fastening elements are provided, is removed got to.
- the carrier cylinder has radially projecting tabs on a collar, with the aid of which it is clamped in recesses on the vacuum chamber side.
- the cylinder with the target plate attached to it defines a cylinder interior much higher than the target plate thickness, which serves to hold a relatively large volume of coolant.
- the carrier cylinder has to be replaced with the actual target plate, which is generally not made of the same material as the target plate for manufacturing and / or cost reasons, but with which non-process material of the carrier cylinder is also atomized.
- the present invention sets itself the task of proposing a method or a mounting arrangement of the type mentioned above, by means of which only the advantages of the above-mentioned types of fastening are combined, that is to say the front side of the target plate, which is exposed on the process space side, is free of fastening elements, the target plate without additional, expensive holding means - And support parts can be exchanged from the process space, which allows a quick replacement of just the consumable part, namely the target plate.
- the provision of the bayonet lock makes it possible, in particular, depending on the expansion, thickness and material of the target plate which is highly loaded, as mentioned, to support it in its central region and / or in its peripheral region against the pressure of the cooling medium according to the wording of claim 3.
- the closure can preferably be designed such that only tolerable mechanical stresses arise in the target when it is thermally conditioned expands.
- a rotary bayonet lock is provided for the plate, so the radial expansion of the plate is not clamped positively, but only in the direction of its normal.
- the choice of the carrier material and the fastening means provided for it is not critical in a vapor deposition process in which, unlike a target plate, this carrier is not evaporated.
- the side mounting guides similar to drawer guides, are not actually bayonet locks, in which locking takes place only by relative movement of the parts to be locked in two separate directions, be it linear, corresponding to x-, y Directions, or as with a rotating bayonet, by axially shifting and rotating about this axis.
- the thermal load on a vacuum-vaporized carrier is significantly lower than that of one atomized or vaporized targets, because only in the latter case does the energy applied lead to atomization or evaporation. Clamping such a carrier is thus much less problematic than that of a target plate according to the present invention.
- a dash-dotted vacuum chamber 12 comprises a cooling plate 14 with channels 16 for a cooling medium, liquid or gaseous, usually for water.
- the channels 16 in the cooling plate 14 are sealed off from the process space P with membranes 18, preferably metal foils, which conduct heat well.
- the target plate 10 and the cooling plate 14 each have bayonet fitting parts in the center and on the periphery, so the target plate 10 radially protruding or protruding parts 20p and 20z and the cooling plate 14 corresponding bayonet fitting parts 22p and 22z.
- the parts 22p form part of the chamber wall of the vacuum chamber 12.
- the bayonet lock parts 20, 22 on the cooling plate and target plate side according to FIG. 1 form two coaxially arranged bayonet locks, corresponding to the indices p and z, which, as shown by the arrow b, by pivoting the
- the target plate is closed or opened essentially parallel to the target surface 24 facing the process space P. Attention is drawn to the radial play between the target plate 10 and the chamber-side support arrangement, which permits thermal radial expansion of the plate 10 essentially free of stress.
- FIGS. 5 to 7 An embodiment of the bayonet-type locking parts is shown in a top view in FIGS. 5 to 7, the primary embodiment of the peripheral closure being shown there, and, dashed in FIGS. 5 and 6, the additional configuration of the central lock, corresponding to the indices, e.g.
- the cooling medium in the channels 16 is not yet pressurized. In this state, there is axial and radial play between the target plate and the cooling plate, so that the target plate 10 can be easily pushed into the bayonet after being placed on the cooling plate. In spite of the radial play L in the peripheral region, the target is centered on the cooling plate 14 at 26 by the central bayonet pin, relative to the cooling plate 14.
- the cooling medium in the channels 16 of the arrangement according to FIG. 1 is pressurized, as a result of which the membrane 18, as mentioned preferably formed by metal foils, lies against the target plate 10 and lifts it axially within the intended axial play.
- the bayonet catch is clamped and at the same time good heat transfer from target plate 10 via metal foil 18 to the medium in channels 16 is ensured.
- the radial play L of the target plate 10 remains with respect to the cooling plate 14 on the vacuum chamber 12, so that the target plate 10 can expand radially thermally freely. In the case of axial expansion, it works against the pressure of the medium in the channels 16 thermal stresses in the target are reduced and consequently deformations of the target surface 24.
- target plates 10 can be better utilized, in some cases, as shown in FIGS. 1 and 2, targets can be used without stiffening plates and thus become cheaper and larger target plates can be realized.
- central and peripheral bayonet locks instead of central and peripheral bayonet locks, only central or peripheral ones can be used, which can be decided according to the dimensions, in particular the ratio of target expansion to target thickness, and the target material - brittle or rather ductile - and the target operating temperature.
- FIG. 3 shows a target plate 10 analogous to FIG. 1, with the medium in the channels 16 relaxed, the bayonet lock arrangement comprising only a central bayonet lock.
- the actual target plate 10 with the surface 24 to be atomized can be mounted on a stiffening plate 30, for example, depending on the target material, dimension and the target operating temperature be bonded, in which case, in the sense of the present invention, plate 10 and stiffening plate 30 together form the target plate.
- the parts forming the bayonet lock part or the bayonet lock parts on the target plate 10 can be formed by separate components, bayonet lock frames 32, which are used again for a next target after use of the target 10 and for this purpose, for example , as shown at 34, are screwed to the target plate.
Abstract
Description
Die vorliegende Erfindung betrifft ein Verfahren zur Montage bzw. Demontage einer Zu kühlenden Targetplatte in einem Vakuumprozessraum, eine Anordnung für die Montage bzw. Demontage einer derartigen Targetplatte in einer Vakuumprozesskammer sowie eine Targetplatte und eine Vakuumkammer.The present invention relates to a method for assembling or disassembling a target plate to be cooled in a vacuum process room, an arrangement for assembling or disassembling such a target plate in a vacuum process chamber, and a target plate and a vacuum chamber.
Bekanntlich werden bei verschiedenen Vakuumprozessen Targetplatten eingesetzt, welche im Laufe der Prozesse verbraucht werden.As is known, target plates are used in various vacuum processes and are consumed in the course of the processes.
Bei der einen Art reaktiver oder nicht reaktiver Beschichtungsprozesse wird das Target durch eine DC- oder AC-Glimmentladung durch Ionenbeschuss grossflächig zerstäubt und die abgestäubten Targetpartikel, direkt oder mit einem Reaktivgas reagiert, auf Werkstücke abgelegt, um diese zu beschichten. Dabei wird das Target oft - beim sog. Hochratezerstäuben - mit einer Magnetronanordnung betrieben, wodurch die Ionendichte im Targetbereich erhöht wird.In one type of reactive or non-reactive coating process, the target is atomized over a large area by DC or AC glow discharge by ion bombardment and the dusted target particles, reacted directly or with a reactive gas, are placed on workpieces in order to coat them. The target is often operated with a magnetron arrangement during high-rate sputtering, which increases the ion density in the target area.
Bei einer anderen Art der genannten Beschichtungsprozesse wird das Target durch Lichtbogen lokal verdampft oder durch Elektronenstrahlbeschuss.In another type of coating process, the target is locally vaporized by an arc or by electron beam bombardment.
In jedem Fall wird das Target durch den Zerstäubungs- bzw. Verdampfungsprozess thermisch stark belastet, sei dies durch den Ionen-, den Elektronenbeschuss oder den auftreffenden Lichtbogen.In any case, the sputtering or evaporation process places a high thermal load on the target, be it through ion or electron bombardment or the incident arc.
Alle Targetplatten sollten einfach und ohne Demontage grösserer Vakuumkammerteile ersetzbar sein, wobei oft sicherzustellen ist, dass nicht prozessfremde Materialien von Befestigungsorganen gegen den Prozessraum freiliegen, da solche bei ihrer Mitzerstäubung oder -verdampfung heikle Beschichtungsprozesse unzulässig kontaminieren würden.All target plates should be easy to replace without dismantling larger vacuum chamber parts, whereby it is often necessary to ensure that non-non-process materials of fastening elements are exposed against the process space, since such would inadmissibly contaminate sensitive coating processes if they were atomized or evaporated.
Für die Abfuhr der Wärme werden Targetplatten bekanntlich z.B. auf einer Kühlplattenanordnung montiert.As is known, target plates are used for the dissipation of heat, e.g. mounted on a cooling plate arrangement.
Die grösste Wärmeabfuhr liesse sich dadurch erreichen, dass die Targetplattenrückseite direkt mit einem Kühlmedium, flüssig oder gasförmig, in Kontakt gebracht wird. Diese Kühlart ist aus vakuumtechnischen Gründen meist nicht erwünscht.The greatest heat dissipation could be achieved by contacting the back of the target plate directly with a cooling medium, liquid or gaseous. This type of cooling is usually not desirable for reasons of vacuum technology.
Deshalb ist es beispielsweise aus der EP-A-0 334 347 oder dem Artikel "Cathode cooling apparatus for a planar magnetron sputtering system", M.R. Lake and G.L. Harding, aus J.Vac.Sci.Technol. A 2(3), July-Sept. 1984, American Vacuum Society, S. 1391 f., oder aus der SU-Patentschrift Nr. 823 459, der EP-A-0 393 344, bekannt, ein Leitungssystem für das Kühlmedium von der Auflagefläche an der Targetplatte durch eine dünne, membranartige bzw. folienartige, wärmeleitende Wandung zu trennen, womit einerseits die vakuumtechnischen Dichtungsprobleme, gegenüber einer direkten Kühlung, entfallen, anderseits, durch den Druck des Kühlmediums auf die membranartige Zwischenwand und auf die Targetplattenrückseite, ein sehr guter Wärmedurchgang von Targetplatte auf Kühlmedium gewährleistet werden kann. Dabei werden die Druckkräfte des Mediums von der Targetplatte aufgenommen. Ist die mechanische Belastbarkeit der Targetplatte, sei dies aufgrund ihrer Dimensionierung und/oder der Eigenschaften des Targetmaterials, zu gering, so ist es üblich, die Targetplatte aus einer Platte aus Targetmaterial und einer Targetrückplatte auszubilden, sie z.B. zusammenzubonden. Die Rückplatte nimmt dann einen Grossteil der mechanischen Beanspruchungen der Targetplatte auf.It is therefore, for example, from EP-A-0 334 347 or the article "Cathode cooling apparatus for a planar magnetron sputtering system", MR Lake and GL Harding, from J.Vac.Sci.Technol. A 2 (3), July-Sept. 1984, American Vacuum Society, p. 1391 f., Or from SU Patent No. 823 459, EP-A-0 393 344, discloses a conduit system for the cooling medium from the contact surface on the target plate through a thin, membrane-like or to separate film-like, heat-conducting wall, which on the one hand eliminates the vacuum-technical sealing problems compared to direct cooling, and on the other hand, by the pressure of the cooling medium on the membrane-like intermediate wall and on the back of the target plate, a very good heat transfer from the target plate to the cooling medium can be guaranteed. The pressure forces of the medium are absorbed by the target plate. If the mechanical strength of the target plate is too low, be it due to its dimensioning and / or the properties of the target material, it is customary to form the target plate from a plate made of target material and a target back plate, for example to bond it together. The back plate then absorbs a large part of the mechanical stress on the target plate.
Bei kleinen Targetplatten reicht im allgemeinen eine Befestigung an deren Rand, beispielsweise mittels eines Klemmrahmens; grössere Targetplatten werden üblicherweise zusätzlich in ihrem Mittenbereich befestigt.In the case of small target plates, an attachment to their edge is generally sufficient, for example by means of a clamping frame; Larger target plates are usually attached in their central area.
Die Targetplattenbefestigung erfolgt entweder von der Prozessraumseite her, d.h. von vorne, oder von der Kühlplatte her, von hinten. Eine Targetplattenbefestigung von vorne (CH-A-664 303) hat den Vorteil, dass eine leichte Demontage und Montage der Platte möglich ist, ohne dass die Kühlplatte demontiert werden muss. Nachteilig dabei ist, dass ein vom Targetmaterial abweichendes Material der Befestigungsorgane, wie von Schrauben, gegen den Prozessraum freiliegt, dem dadurch Rechnung zu tragen ist, dass die Targetplatte nicht ganzflächig zerstäubt werden kann. Dies hat wiederum Auswirkungen auf die Schichtdickenverteilung der durch Zerstäubung hergestellten Schichten bzw. auf die Ausnutzung des oft teuren Targetmaterials.The target plate is attached either from the process room side, ie from the front, or from the cooling plate, from the rear. A target plate attachment from the front (CH-A-664 303) has the advantage that the plate can be easily dismantled and assembled without the cooling plate having to be dismantled. The disadvantage here is that a material of the fastening elements, such as screws, which differs from the target material is exposed against the process space, which has to be taken into account in that the target plate cannot be atomized over the entire surface. This in turn has an impact on the layer thickness distribution of the layers produced by atomization or on the utilization of the often expensive target material.
Eine Mitzerstäubung solcher von vorne, d.h. vom Prozessraum her vorgesehener Befestigungsorgane kann nie vollständig ausgeschlossen werden, weshalb solche Befestigungen bei heiklen, höchsten Anforderungen genügenden Beschichtungsprozessen vermieden werden.Co-atomization from the front, i.e. Fastening elements provided from the process space can never be completely ruled out, which is why such fastenings can be avoided with delicate coating processes that meet the highest requirements.
Eine Targetplattenbefestigung mit Verschraubung von hinten (CH-A-669 242) hat zwar den Vorteil, dass das Target an der gesamten Vorderseite zerstäubt werden kann, jedoch den Nachteil, dass beim Targetwechsel die Kühlplatte, von welcher her die Befestigungsorgane vorgesehen werden, demontiert werden muss.A target plate attachment with screw connection from behind (CH-A-669 242) has the advantage that the target can be atomized on the entire front side, but the disadvantage that when changing the target, the cooling plate, from which the fastening elements are provided, is removed got to.
Aus der US-A-5 009 765 ist es bekannt, eine Targetplatte auf einen Trägerzylinder zu schweissen oder zu bonden.From US-A-5 009 765 it is known to weld or bond a target plate to a carrier cylinder.
Der Trägerzylinder weist radial auskragende Laschen an einem Kragen auf, mit deren Hilfe er in Einnehmungen vakuumkammerseitig festgespannt wird. Der Zylinder mit daran befestigter Targetplatte definiert einen Zylinderinnenraum wesentlich höher als die Targetplattendicke, der dazu dient, ein relativ grosses Kühlflüssigkeitsvolumen aufzunehmen.The carrier cylinder has radially projecting tabs on a collar, with the aid of which it is clamped in recesses on the vacuum chamber side. The cylinder with the target plate attached to it defines a cylinder interior much higher than the target plate thickness, which serves to hold a relatively large volume of coolant.
An dieser Anordnung ist es nachteilig, dass mit der eigentlichen Targetplatte ein relativ komplizierter Teil, der Trägerzylinder, auszuwechseln ist, der im allgemeinen aus Fertigungs- und/oder Kostengründen nicht aus dem gleichen Material wie die Targetplatte gefertigt ist, womit aber dann prozessfremdes Material des Trägerzylinders mitzerstäubt wird.With this arrangement, it is disadvantageous that a relatively complicated part, the carrier cylinder, has to be replaced with the actual target plate, which is generally not made of the same material as the target plate for manufacturing and / or cost reasons, but with which non-process material of the carrier cylinder is also atomized.
Die eigentliche Befestigung der Targetplatte, die Schweissnaht, ist hohen thermischen und mechanischen (Kühlmedium/Vakuum) Beanspruchungen ausgesetzt, was unter Berücksichtigung einzusetzender Materialpaarungen Targetplatte/Trägerzylinder zu beurteilen ist.The actual attachment of the target plate, the weld seam, is exposed to high thermal and mechanical (cooling medium / vacuum) stresses, which must be assessed taking into account the material pairings of the target plate / carrier cylinder.
Beim Vorgehen gemäss der EP-0 393 344 wird zwar nur die Targetplatte gewechselt, aber es sind, als Widerlager für den über eine Membran auf die Targetplattenrückseite wirkenden Kühlmediumsdruck, gegen den Prozessraum freiliegende Halterahmen vorgesehen, die im allgemeinen, z.B. aus Festigkeitsgründen, nicht aus Targetmaterial gefertigt sind.In the procedure according to EP-0 393 344 only the target plate is changed, but there are provided as an abutment for the cooling medium pressure acting on the back of the target plate against the process space, which generally, e.g. for reasons of strength, are not made of target material.
Die vorliegende Erfindung setzt sich zur Aufgabe, ein Verfahren bzw. eine Montageanordnung eingangs genannter Art vorzuschlagen, mittels welchen nur die Vorteile der oben erwähnten Befestigungsarten kombiniert werden, mithin die prozessraumseitig freiliegende Vorderseite der Targetplatte frei von Befestigungsorganen ist, die Targetplatte ohne zusätzliche, aufwendige Halte- und Stützteile vom Prozessraum her gewechselt werden kann, womit ein schnelles Auswechseln im wesentlichen nur gerade des Verbrauchsteils, nämlich der Targetplatte, ermöglicht wird.The present invention sets itself the task of proposing a method or a mounting arrangement of the type mentioned above, by means of which only the advantages of the above-mentioned types of fastening are combined, that is to say the front side of the target plate, which is exposed on the process space side, is free of fastening elements, the target plate without additional, expensive holding means - And support parts can be exchanged from the process space, which allows a quick replacement of just the consumable part, namely the target plate.
Dies wird bei Vorgehen nach dem kennzeichnenden Teil von Anspruch 1 erreicht, bei einer Montageanordnung, die sich nach dem kennzeichnenden Teil von Anspruch 6 auszeichnet.This is achieved in the procedure according to the characterizing part of claim 1, in a mounting arrangement which is distinguished by the characterizing part of claim 6.
Durch Vorsehen des Bajonettverschlusses mit Teilen an der Platte und Teilen an der Vakuumkammer wird erreicht, dass
- die Platte selbst gewechselt werden kann, und zwar von der Prozesseite her,
- ausser Partien der Kammerwand, die ohnehin gegen den Prozessraum freiliegt, keine zusätzlichen Befestigungsorgane bzw. Spannorgane vorzusehen sind,
- die Doppelfunktion des Kühlmediums zum Kühlen der Targetplatte und zum Spannen bzw. Lösen des Verschlusses beibehalten wird und
- die Targetplatte in klar definierter Position montiert wird, definiert durch die Bajonettverschlussanschläge.
- the plate itself can be changed, from the process side,
- apart from parts of the chamber wall, which are already exposed against the process space, no additional fastening elements or tensioning elements are to be provided,
- the dual function of the cooling medium for cooling the target plate and for tensioning or releasing the closure is maintained and
- the target plate is mounted in a clearly defined position, defined by the bayonet lock stops.
Durch Vorgehen nach Anspruch 2 wird eine besonders einfache Handhabung möglich.A particularly simple handling is possible by proceeding according to claim 2.
Das Vorsehen des Bajonettverschlusses ermöglicht es insbesondere, je nach Ausdehnung, Dicke und Material der, wie erwähnt, hoch belasteten Targetplatte, sie in ihrem Zentralbereich und/oder in ihrem Peripheriebereich gegen den Druck des Kühlmediums widerzulagern nach dem Wortlaut von Anspruch 3.The provision of the bayonet lock makes it possible, in particular, depending on the expansion, thickness and material of the target plate which is highly loaded, as mentioned, to support it in its central region and / or in its peripheral region against the pressure of the cooling medium according to the wording of claim 3.
Dabei kann der Verschluss bevorzugterweise so ausgebildet sein, dass nur tolerable mechanische Spannungen im Target entstehen, wenn es sich thermisch bedingt ausdehnt.The closure can preferably be designed such that only tolerable mechanical stresses arise in the target when it is thermally conditioned expands.
Wird z.B. in bevorzugter Art und Weise ein Drehbajonettverschluss für die Platte vorgesehen, so wird die Platte in ihrer Radialausdehnung nicht formschlüssig eingespannt, sondern nur in Richtung ihrer Normalen.E.g. In a preferred manner, a rotary bayonet lock is provided for the plate, so the radial expansion of the plate is not clamped positively, but only in the direction of its normal.
Aus Patent Abstracts of Japan, vol. 12, no. 56 (C-477) (2903), 19. Februar 1988, und JP, A, 62 199 769 (Hitachi), 3. September 1987, ist es bekannt, im Rahmen eines Bedampfungsprozesses Werkstücke mit einem Träger in einer Vorkammer aufzunehmen, Träger und Werkstück durch ein Schleusenventil in den Bedampfungsraum einzubringen, dort den Träger linear in eine seitliche Halterungsführung einzuschieben und diese durch Wirkung eines Kühlstempels zu spannen.From Patent Abstracts of Japan, vol. 12, no. 56 (C-477) (2903), February 19, 1988, and JP, A, 62 199 769 (Hitachi), September 3, 1987, it is known in the course of an evaporation process workpieces with a carrier in one Take up the prechamber, insert the carrier and workpiece through a lock valve into the steaming chamber, slide the carrier linearly into a lateral holder guide and clamp it using a cooling stamp.
Die Wahl des Trägermaterials und des Materials dafür vorgesehener Befestigungsorgane ist bei einem Bedampfungsprozess - bei dem, anders als eine Targetplatte, nicht dieser Träger verdampft wird - unkritisch. Obwohl als "bayonet" bezeichnet, handelt es sich bei den seitlichen Halterungsführungen, ähnlich Schubladenführungen, nicht um einen eigentlichen Bajonettverschluss, bei dem eine Verschliessung erst durch Relativbewegung der zu verschliessenden Teile in zwei separaten Richtungen erfolgt, sei dies linear, entsprechend x-, y-Richtungen, oder wie bei einem Drehbajonett durch axiales Verschieben und Verdrehen um diese Achse.The choice of the carrier material and the fastening means provided for it is not critical in a vapor deposition process in which, unlike a target plate, this carrier is not evaporated. Although referred to as "bayonet", the side mounting guides, similar to drawer guides, are not actually bayonet locks, in which locking takes place only by relative movement of the parts to be locked in two separate directions, be it linear, corresponding to x-, y Directions, or as with a rotating bayonet, by axially shifting and rotating about this axis.
Im weiteren ist die thermische Belastung eines vakuumbedampften Trägers wesentlich geringer als die eines zerstäubten oder verdampften Targets, weil nur bei letzterem die aufgebrachte Energie zur Zerstäubung oder Verdampfung führen muss. Damit ist das Festspannen eines solchen Trägers wesentlich unproblematischer als dasjenige einer Targetplatte gemäss vorliegender Erfindung.Furthermore, the thermal load on a vacuum-vaporized carrier is significantly lower than that of one atomized or vaporized targets, because only in the latter case does the energy applied lead to atomization or evaporation. Clamping such a carrier is thus much less problematic than that of a target plate according to the present invention.
Weitere Vorteile werden aus der anschliessenden beispielsweisen Beschreibung der Erfindung ersichtlich.Further advantages will become apparent from the subsequent exemplary description of the invention.
Sie wird anschliessend beispielsweise anhand von Figuren erläutert.It is then explained using figures, for example.
Es zeigen:
- Fig. 1
- eine schematische Querschnittsdarstellung einer erfindungsgemässen Montageanordnung für eine Targetplatte, in entspanntem Zustand,
- Fig. 2
- die Anordnung gemäss Fig. 1 in gespannten Zustand,
- Fig. 3
- eine Darstellung analog zu Fig. 1, nur mit Zentrumsverschluss,
- Fig. 4
- eine Darstellung analog zu Fig. 1, nur mit Peripherieverschluss,
- Fig. 5
- die Aufsicht auf den vakuumkammerseitigen Teil eines erfindungsgemässen Bajonettverschlusses,
- Fig. 6
- einen verbrauchsplattenseitigen Bajonettverschlussteil in Aufsicht,
- Fig. 7
- eine montierte Targetplatte mit Bajonettverschluss gemäss den Fig. 5 und 6, als Peripherieverschluss ausgebildet.
- Fig. 1
- 2 shows a schematic cross-sectional representation of an inventive mounting arrangement for a target plate, in a relaxed state,
- Fig. 2
- 1 in the tensioned state,
- Fig. 3
- a representation analogous to FIG. 1, only with center lock,
- Fig. 4
- a representation analogous to FIG. 1, only with peripheral closure,
- Fig. 5
- the supervision of the vacuum chamber-side part of a bayonet lock according to the invention,
- Fig. 6
- a bayonet fitting part on the consumable side under supervision,
- Fig. 7
- a mounted target plate with bayonet lock according to FIGS. 5 and 6, designed as a peripheral lock.
In Fig. 1 ist, schematisch, eine erfindungsgemäss montierte Targetplatte 10 dargestellt. Eine strichpunktiert angedeutete Vakuumkammer 12 umfasst eine Kühlplatte 14 mit Kanälen 16 für ein Kühlmedium, flüssig oder gasförmig, üblicherweise für Wasser. Die Kanäle 16 in der Kühlplatte 14 sind gegen den Prozessraum P hin mit gut wärmedurchleitenden Membranen 18, vorzugsweise Metallfolien, dichtend verschlossen.1 shows, schematically, a
Die Targetplatte 10 sowie die Kühlplatte 14 weisen je im Zentrum und an der Peripherie Bajonettverschlussteile auf, so die Targetplatte 10 radial aus- bzw. einspringende Partien 20p und 20z und die Kühlplatte 14 entsprechende Bajonettverschlusspartien 22p bzw. 22z. Dabei bilden die Teile 22p Teil der Kammerwand der Vakuumkammer 12. Die kühlplatten- und targetplattenseitigen Bajonettverschlussteile 20, 22 gemäss Fig. 1 bilden zwei koaxial angeordnete Bajonettverschlüsse, entsprechend den Indices p und z, welche, wie mit dem Pfeil b dargestellt, durch Verschwenken der Targetplatte im wesentlichen parallel zu der dem Prozessraum P zugewandten Targetoberfläche 24 geschlossen bzw. geöffnet werden. Es wird auf das radiale Spiel zwischen Targetplatte 10 und kammerseitiger Trägeranordnung hingewiesen, das eine thermische Radialausdehnung der Platte 10 im wesentlichen spannungsfrei zulässt.The
Eine Ausbildung der Bajonettverschlussteile ist in den Fig. 5 bis 7 in Aufsicht dargestellt, wobei dort primär die Ausbildung des Peripherieverschlusses dargestellt ist, und, in den Fig. 5 und 6 gestrichelt, die zusätzliche Ausbildung des Zentralverschlusses, entsprechend den Indices z.An embodiment of the bayonet-type locking parts is shown in a top view in FIGS. 5 to 7, the primary embodiment of the peripheral closure being shown there, and, dashed in FIGS. 5 and 6, the additional configuration of the central lock, corresponding to the indices, e.g.
Bei der Darstellung von Fig. 1 ist das Kühlmedium in den Kanälen 16 noch nicht unter Druck gesetzt. In diesem Zustand besteht zwischen Targetplatte und Kühlplatte axiales und radiales Spiel, so dass die Targetplatte 10 nach dem Aufsetzen auf die Kühlplatte leicht durch Drehen in das Bajonett geschoben werden kann. Dabei wird das Target trotz des radialen Spiels L im Peripheriebereich durch den zentralen Bajonettzapfen an der Kühlplatte 14, bei 26 eingetragen, gegenüber der Kühlplatte 14 zentriert.1, the cooling medium in the
In Fig. 2 ist das Kühlmedium in den Kanälen 16 der Anordnung gemäss Fig. 1 unter Druck gesetzt, wodurch sich die Membrane 18, wie erwähnt vorzugsweise durch Metallfolien gebildet, gegen die Targetplatte 10 legt und diese axial im Rahmen des vorgesehenen axialen Spiels hochhebt. Dadurch wird der Bajonettverschluss verspannt und gleichzeitig ein guter Wärmeübergang von Targetplatte 10 über die Metallfolie 18 auf das Medium in den Kanälen 16 sichergestellt. Trotz des axialen Verspannens des Bajonettverschlusses bleibt das radiale Spiel L der Targetplatte 10 bezüglich der Kühlplatte 14 an der Vakuumkammer 12 bestehen, so dass sich die Targetplatte 10 thermisch frei radial ausdehnen kann. Bei axialer Ausdehnung arbeitet sie gegen den Druck des Mediums in den Kanälen 16. Dadurch werden thermisch bedingte Spannungen im Target reduziert und mithin Verformungen der Targetoberfläche 24.2, the cooling medium in the
Damit wird grundsätzlich erreicht, dass Targetplatten 10 besser ausgenützt werden können, teilweise, wie in den Fig. 1 und 2 dargestellt, Targets ohne versteifende Platten einsetzbar sind und damit billiger werden und grössere Targetplatten realisiert werden können.This basically ensures that
Wie noch gezeigt werden wird, können anstelle von zentralen und peripheren Bajonettverschlüssen auch nur zentrale oder nur periphere eingesetzt werden, was sich nach den Dimensionen, insbesondere dem Verhältnis Targetausdehnung zu Targetdicke, und dem Targetmaterial - spröd oder eher duktil - und der Targetbetriebstemperatur entscheiden lässt.As will be shown, instead of central and peripheral bayonet locks, only central or peripheral ones can be used, which can be decided according to the dimensions, in particular the ratio of target expansion to target thickness, and the target material - brittle or rather ductile - and the target operating temperature.
In Fig. 3 ist eine Targetplatte 10 analog zu Fig. 1 dargestellt, bei entspanntem Medium in den Kanälen 16, wobei die Bajonettverschlussanordnung lediglich einen Zentralbajonettverschluss umfasst.FIG. 3 shows a
In Fig. 4 ist, analog, die entspannte Verschlussanordnung dargestellt mit nur peripherem Bajonettverschluss.4 shows, analogously, the relaxed locking arrangement with only a peripheral bayonet lock.
Wie als Beispiel an der Anordnung gemäss Fig. 4 dargestellt, kann die eigentliche Targetplatte 10 mit der zu zerstäubenden Oberfläche 24 je nach Targetmaterial, Dimension und der Targetbetriebstemperatur auf eine Versteifungsplatte 30 montiert sein, beispielsweise gebondet sein, wobei dann, im Sinne der vorliegenden Erfindung, Platte 10 und Versteifungsplatte 30 gemeinsam die Targetplatte bilden.As shown as an example in the arrangement according to FIG. 4, the
Im weiteren können, wie gestrichelt in Fig. 3 eingetragen, die den Bajonettverschlussteil oder die Bajonettverschlussteile an der Targetplatte 10 bildenden Partien durch separate Bauteile, Bajonettverschlussrahmen 32, gebildet sein, welche nach Verbrauch des Targets 10 wieder eingesetzt werden für ein nächstes Target und hierzu beispielsweise, wie bei 34 dargestellt, mit der Targetplatte verschraubt sind.3, the parts forming the bayonet lock part or the bayonet lock parts on the
Es hat sich gezeigt, dass die vorgeschlagene Technik sich insbesondere beim Einsatz von Aluminium- oder Aluminiumlegierungstargets ausgezeichnet eignet.It has been shown that the proposed technique is particularly suitable when using aluminum or aluminum alloy targets.
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CH1386/91 | 1991-05-08 | ||
CH138691 | 1991-05-08 |
Publications (2)
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EP0512456A1 true EP0512456A1 (en) | 1992-11-11 |
EP0512456B1 EP0512456B1 (en) | 1997-06-18 |
Family
ID=4209217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP92107498A Expired - Lifetime EP0512456B1 (en) | 1991-05-08 | 1992-05-04 | Process for fitting and removal of a target plate in a vacuum processing chamber, fitting therefor, target plate and vacuum chamber |
Country Status (5)
Country | Link |
---|---|
US (1) | US5269894A (en) |
EP (1) | EP0512456B1 (en) |
JP (1) | JP3417578B2 (en) |
KR (2) | KR100263136B1 (en) |
DE (1) | DE59208623D1 (en) |
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EP0499770A2 (en) * | 1991-02-21 | 1992-08-26 | Hauzer Holding B.V. | Indirectly cooled target with quick-change system |
US5286361A (en) * | 1992-10-19 | 1994-02-15 | Regents Of The University Of California | Magnetically attached sputter targets |
DE4301516A1 (en) * | 1993-01-21 | 1994-07-28 | Leybold Ag | Target cooling with tub |
DE4410466C1 (en) * | 1994-03-25 | 1995-09-14 | Balzers Hochvakuum | Target holder, target and use thereof, |
WO1996024947A2 (en) * | 1995-02-08 | 1996-08-15 | Nobler Technologies, Inc. | Magnetron sputtering cathode apparatus |
EP0770701A1 (en) * | 1995-09-27 | 1997-05-02 | LEYBOLD MATERIALS GmbH | Target for the sputtering cathode of a vacuum coating apparatus and process for its manufacture |
US5653726A (en) * | 1994-11-03 | 1997-08-05 | Archimedes Surgical, Inc. | Retrograde dissector and method for facilitating a TRAM flap |
EP0951049A1 (en) * | 1998-04-16 | 1999-10-20 | Balzers Aktiengesellschaft | Retaining ring, target and its manufacturing procedure |
US6015421A (en) * | 1997-05-15 | 2000-01-18 | General Surgical Innovations, Inc. | Apparatus and method for developing an anatomic space for laparoscopic procedures |
US6312442B1 (en) | 1992-06-02 | 2001-11-06 | General Surgical Innovations, Inc. | Method for developing an anatomic space for laparoscopic hernia repair |
US6632234B2 (en) | 1992-06-02 | 2003-10-14 | General Surgical Innovations, Inc. | Apparatus and method for developing an anatomic space for laparoscopic procedures with laparoscopic visualization |
DE4405747B4 (en) * | 1993-05-04 | 2006-04-27 | Unaxis Balzers Ag | Magnetic field assisted sputtering assembly and vacuum processing equipment equipped therewith |
WO2013149692A1 (en) * | 2012-04-04 | 2013-10-10 | Oerlikon Trading Ag, Trübbach | Target adapted to an indirect cooling device |
WO2014166621A1 (en) * | 2013-04-08 | 2014-10-16 | Oerlikon Trading Ag, Trübbach | Centering of a plate in a holder both at room temperatures and at higher temperatures |
WO2015000577A1 (en) * | 2013-07-03 | 2015-01-08 | Oerlikon Trading Ag, Trübbach | Target, adapted to an indirect cooling device, having a cooling plate |
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CH687427A5 (en) * | 1993-10-13 | 1996-11-29 | Balzers Hochvakuum | Sputtering with target assembly and mounting. |
US5680013A (en) * | 1994-03-15 | 1997-10-21 | Applied Materials, Inc. | Ceramic protection for heated metal surfaces of plasma processing chamber exposed to chemically aggressive gaseous environment therein and method of protecting such heated metal surfaces |
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US6068742A (en) * | 1996-07-22 | 2000-05-30 | Balzers Aktiengesellschaft | Target arrangement with a circular plate, magnetron for mounting the target arrangement, and process for coating a series of circular disc-shaped workpieces by means of said magnetron source |
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JP3818084B2 (en) * | 2000-12-22 | 2006-09-06 | 日立電線株式会社 | Cooling plate and manufacturing method thereof, and sputtering target and manufacturing method thereof |
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- 1992-05-04 EP EP92107498A patent/EP0512456B1/en not_active Expired - Lifetime
- 1992-05-08 KR KR1019920007833A patent/KR100263136B1/en not_active IP Right Cessation
- 1992-05-08 JP JP15997692A patent/JP3417578B2/en not_active Expired - Fee Related
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EP0393344A1 (en) * | 1989-04-20 | 1990-10-24 | Balzers Aktiengesellschaft | Targets supporting device for sputtering sources and procedure for maintaining a target in a support |
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Cited By (33)
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EP0499770A3 (en) * | 1991-02-21 | 1994-12-28 | Hauzer Holding | Indirectly cooled target with quick-change system |
EP0499770A2 (en) * | 1991-02-21 | 1992-08-26 | Hauzer Holding B.V. | Indirectly cooled target with quick-change system |
US6755845B2 (en) | 1992-06-02 | 2004-06-29 | General Surgical Innovations, Inc. | Apparatus and method for developing an anatomic space for laparoscopic hernia repair and patch for use therewith |
US6312442B1 (en) | 1992-06-02 | 2001-11-06 | General Surgical Innovations, Inc. | Method for developing an anatomic space for laparoscopic hernia repair |
US6514272B1 (en) | 1992-06-02 | 2003-02-04 | General Surgical Innovations, Inc. | Apparatus and method for developing an anatomic space for laparoscopic hernia repair and patch for use therewith |
US7001405B2 (en) | 1992-06-02 | 2006-02-21 | General Surgical Innovations, Inc. | Apparatus and method for developing an anatomic space for laparoscopic procedures with laparoscopic visualization |
US6565590B2 (en) | 1992-06-02 | 2003-05-20 | General Surgical Innovations, Inc. | Apparatus and methods for developing an anatomic space |
US6632234B2 (en) | 1992-06-02 | 2003-10-14 | General Surgical Innovations, Inc. | Apparatus and method for developing an anatomic space for laparoscopic procedures with laparoscopic visualization |
US5286361A (en) * | 1992-10-19 | 1994-02-15 | Regents Of The University Of California | Magnetically attached sputter targets |
US5421978A (en) * | 1993-01-21 | 1995-06-06 | Leybold Aktiengesellschaft | Target cooling system with trough |
DE4301516C2 (en) * | 1993-01-21 | 2003-02-13 | Applied Films Gmbh & Co Kg | Target cooling with a tub |
DE4301516A1 (en) * | 1993-01-21 | 1994-07-28 | Leybold Ag | Target cooling with tub |
DE4405747B4 (en) * | 1993-05-04 | 2006-04-27 | Unaxis Balzers Ag | Magnetic field assisted sputtering assembly and vacuum processing equipment equipped therewith |
DE4410466C1 (en) * | 1994-03-25 | 1995-09-14 | Balzers Hochvakuum | Target holder, target and use thereof, |
US5653726A (en) * | 1994-11-03 | 1997-08-05 | Archimedes Surgical, Inc. | Retrograde dissector and method for facilitating a TRAM flap |
WO1996024947A3 (en) * | 1995-02-08 | 1996-10-31 | Nobler Technologies Inc | Magnetron sputtering cathode apparatus |
WO1996024947A2 (en) * | 1995-02-08 | 1996-08-15 | Nobler Technologies, Inc. | Magnetron sputtering cathode apparatus |
EP0770701A1 (en) * | 1995-09-27 | 1997-05-02 | LEYBOLD MATERIALS GmbH | Target for the sputtering cathode of a vacuum coating apparatus and process for its manufacture |
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WO1999054910A1 (en) * | 1998-04-16 | 1999-10-28 | Unaxis Balzers Aktiengesellschaft | Retaining ring and target and method for producing same |
EP0951049A1 (en) * | 1998-04-16 | 1999-10-20 | Balzers Aktiengesellschaft | Retaining ring, target and its manufacturing procedure |
WO2013149692A1 (en) * | 2012-04-04 | 2013-10-10 | Oerlikon Trading Ag, Trübbach | Target adapted to an indirect cooling device |
US9934951B2 (en) | 2012-04-04 | 2018-04-03 | Oerlikon Surface Solutions Ag, Pfäffikon | Target adapted to an indirect cooling device |
WO2014166620A1 (en) * | 2013-04-08 | 2014-10-16 | Oerlikon Trading Ag, Trübbach | Sputtering target having increased power compatibility |
US9536714B2 (en) | 2013-04-08 | 2017-01-03 | Oerlikon Surface Solutions Ag, Pfäffikon | Sputtering target having increased power compatibility |
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WO2014166621A1 (en) * | 2013-04-08 | 2014-10-16 | Oerlikon Trading Ag, Trübbach | Centering of a plate in a holder both at room temperatures and at higher temperatures |
WO2015000577A1 (en) * | 2013-07-03 | 2015-01-08 | Oerlikon Trading Ag, Trübbach | Target, adapted to an indirect cooling device, having a cooling plate |
DE102013011074A1 (en) * | 2013-07-03 | 2015-01-08 | Oerlikon Trading Ag | Target adapted to an indirect cooling device with cooling plate |
US10636635B2 (en) | 2013-07-03 | 2020-04-28 | Oerlikon Surface Solutions Ag, Pfäffikon | Target, adapted to an indirect cooling device, having a cooling plate |
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US11158491B2 (en) | 2017-06-01 | 2021-10-26 | Oerlikon Surface Solutions Ag, Pfäffikon | Target assembly for safe and economic evaporation of brittle materials |
Also Published As
Publication number | Publication date |
---|---|
DE59208623D1 (en) | 1997-07-24 |
EP0512456B1 (en) | 1997-06-18 |
KR100403567B1 (en) | 2003-11-01 |
KR920021732A (en) | 1992-12-18 |
JP3417578B2 (en) | 2003-06-16 |
JPH05171429A (en) | 1993-07-09 |
KR100263136B1 (en) | 2000-08-01 |
US5269894A (en) | 1993-12-14 |
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