EP0112701A2 - Valve element for use in an ink-jet printer head - Google Patents
Valve element for use in an ink-jet printer head Download PDFInfo
- Publication number
- EP0112701A2 EP0112701A2 EP19830307693 EP83307693A EP0112701A2 EP 0112701 A2 EP0112701 A2 EP 0112701A2 EP 19830307693 EP19830307693 EP 19830307693 EP 83307693 A EP83307693 A EP 83307693A EP 0112701 A2 EP0112701 A2 EP 0112701A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- valve
- valve seat
- pattern
- forming
- ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K99/0001—Microvalves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17596—Ink pumps, ink valves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
- F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
- F15C5/00—Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K15/00—Check valves
- F16K15/14—Check valves with flexible valve members
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K99/0001—Microvalves
- F16K99/0003—Constructional types of microvalves; Details of the cutting-off member
- F16K99/0005—Lift valves
- F16K99/0007—Lift valves of cantilever type
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K99/0001—Microvalves
- F16K99/0034—Operating means specially adapted for microvalves
- F16K99/0055—Operating means specially adapted for microvalves actuated by fluids
- F16K99/0057—Operating means specially adapted for microvalves actuated by fluids the fluid being the circulating fluid itself, e.g. check valves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K2099/0073—Fabrication methods specifically adapted for microvalves
- F16K2099/0074—Fabrication methods specifically adapted for microvalves using photolithography, e.g. etching
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K2099/0082—Microvalves adapted for a particular use
- F16K2099/0092—Inkjet printers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K99/0001—Microvalves
- F16K99/0034—Operating means specially adapted for microvalves
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/7722—Line condition change responsive valves
- Y10T137/7837—Direct response valves [i.e., check valve type]
- Y10T137/7869—Biased open
Definitions
- This invention relates to a micro mechanical valve, and more particularly to a valve element which is suitable for an ink-jet printer head for jetting ink droplets by the pump action caused by the interaction between electromechanical conversion means and a valve and for supplying the ink.
- valve elements for ink-jet printer heads have been proposed in the U.S. Patent Application Serial No. 274,210 filed on June 16, 1981.
- the conventional valve element is constituted by superposing a disc-like valve seat having a cylindrical ink passage at the center with a valve element for supporting a disc-like valve at the center by arms around the valve and a ring-like fixing portion.
- the diameter of the valve is greater than that of the ink passage and this difference is preferably as small as possible in order to facilitate the ink flow in the forward direction. This means that extremely high accuracy is necessary in superposing the valve seat and the valve component. Accordingly, the assembly of the valve element is difficult, the yield of the approved valve element is low and variance of the characteristics is great.
- a valve element for use in an ink-jet head comprising: a valve seat having a fine hole for a passage of a fluid, said valve seat being formed by a photoelectroforming technique; a valve for covering said hole; a support portion for supporting said valve and for displacing said valve in response to the pressure of said fluid; and a fixing portion for fitting said support portion to said valve seat, said valve, support portion and fixing portion being formed on said valve seat by the photoelectroforming technique in order to integrate said valve seat, valve, support portion and fixing portion.
- the first embodiment comprises a valve seat 202 having at its center a fluid passage 201 having a circular cross-section, a valve 203 disposed so as to shield fluid passage 201, and a valve member 206 consisting of arms 204 supporting the valve 203 and a fixing portion 205.
- the valve member 206 is fixed to the valve seat 202 by the fixing portion 205.
- the valve 203 and the arms 204 are separated from the valve seat 202.
- the planar shape of the valve member 206 may be arbitrary.
- Fig. 1(a) shows a typical example in which the valve 203 is formed concentrically at the center of the ring-like fixing portion 205 and four arms 204 for supporting the valve 203 are disposed in the crisscross form.
- the diameter of the valve 203 is greater than that of the fluid passage 201.
- the valve seat 202 and the valve member 206 are formed by means of photoelctroforming technique as the combination of a patterning technique using a photoresist and plating technique, and corrosion-resist metals such as nickel, gold, chronium and the like are suitable as the metallic material.
- valve member 206 Since the valve member 206 is formed on the valve seat 202 using the same material by the photoelctroforming technique, the valve seat and the valve member become a unitrary structure. Even if the valve seat 202 and the valve member 206 are formed by different materials, the valve seat and the valve member will not separate from each other if a combination providing high bonding power at the fixing portion is used.
- an example of the size of the valve element suitable for an ink-jet printer head is as follows:
- the valve element according to the first embodiment is produced in accordance with the following production process: As shown in Fig. 2(a), a substrate 301 is formed by forming a conductive layer 303 on one surface of a glass sheet 302 by vacuum deposition.
- the conductive layer must be one that can be selectively etched against a material forming the valve element. Since the valve element is made of nickel in the first embodiment, the conductive layer consists of an aluminum layer and of a nickel layer from the side of the glass sheet 302.
- the nickel layer is a protective layer for the aluminum layer when plating is effected in a subsequent step. Hence, no problem occurs even if the aluminum layer alone is used.
- the thickness of the aluminum layer there is no particular limitaton to the thickness of the aluminum layer and it ranges from several hundreds to several throusands of angstroms. However, a greater thickness is preferred because the aluminum layer is molten in the last step.
- the thickness of the nickel is from dozens to hundreds of angstroms and is preferably as thin as possible within the range in which it can protect the aluminum layer.
- a photoresist layer 304 is formed on the substrate 301 described above.
- the pattern of the valve seat is exposed to light and a pattern having the conductive layer 303 exposed in the shape of the valve seat is formed by development.
- the thickness of the photoresist layer is equal to that of the valve seat to be formed. In this embodiment, 20 to 60,Vm-thick resist is used.
- the portion of the substrate devoid of the resist is plated by electroplating as shown in Fig. 2(b), thereby forming the valve seat 305.
- nickel is plated using a nickel sulfaminate bath.
- the thickness of the plating needs be equal to that of the resist layer 304 and the difference of the thickness is preferably within ⁇ 5 ⁇ m.
- a spacer 306 is formed at the center as shown in Fig. 2(c). This is to be removed in the final step and is formed so as to separate the valve 203 and the arms 204 from the valve seat.
- a conductive layer 307 for effecting next electroplating is formed over the entire surface as shown in Fig. 2(d). It is preferably made of the same metal as the valve seat and this embodiment uses vacuum deposited nickel. Alternatvely, the nickel film can be formed by non-electrolytic nickel plating, for example.
- the pattern of the valve member consisting of the valve 309, the arms 310 and the fixing portion 311, is formed on the conductive layer 307 by the photoresist 308.
- the pattern 309 of the valve in this case is formed in such a manner as to cover the resist pattern 304a of the hole of the valve seat. Since this can be made by mask registration at the time of exposure of the photoresist, the registration accuracy can be remarkably improved in comparison with the conventional method in which the vlave seat and the vlave member are produced individually and are then superposed.
- the spacer 306 does not exist below the fixing portion 311.
- the vlave member 312 is nickel-plated by electroplating as shown in Fig. 2(f).
- the thickness of plating in this case may be irrelevant to the thickness of the resist layer 308 and can be determined in accordance with the fluid resistance value in the forward direction of the value. It may be about 10 ⁇ m, for example.
- the conductive layer 303, the resist layers 304 and 308, and the spacer 306 are dissolved, providing the vlave element as shown in Fig. 2(g). Since the conductive layer 303 is formed by aluminum, it can be selectively dissolved with respect to nickel that forms the valve element, by use of sodium hyroxide. A solution that does not dissolve nickel but does the resist is used for the resist layers. In this step, if dissolution does not proceed because the surface of the spacer 306 is covered with the nickel conductive layer 307, the conductive layer 307 is etched and removed by an acid, whereby the spacer 306 appears on the surface and can be dissolved.
- FIG. 3(a) to 3(c) The embodiment shown in Figs. 3(a) to 3(c) is different from the first production method in forming the spacer. In other words, the steps till the formation of the valve seat in Fig. 2(b) are followed in the same way.
- an aluminum layer 401 is formed by vacuum deposition or the like on the upper surface of the nickel plating layer 305 and the resist layer 304 as shown in Fig. 3(a).
- the pattern of the portion in which the spacer is formed is formed on its surface by the photoresist 402 as shown in Fig. 3(b).
- the aluminum layer of the portion devoid of the resist pattern 402 is etched and removed, whereby the spacer 403 consisting of aluminum is formed as shown in Fig. 3(c). Since this spacer is electrically conductive, the step of forming the pattern of the valve member consisting of the valve, the arms and the fixing portion, that is shown in Fig. 2(e), by the photoresist can be followed as the next step. In accordance with this method, since the spacer consists of the aluminum vacuum deposition film, it can be easily removed in the final step. Moreover, since it is thin, hardly any gap occurs between the valve and the arms versus the valve seat after the spacer is removed.
- a protective layer of nickel or the like may be disposed on the upper surface of the aluminum layer in the same way as the substrate if the aluminum layer is corroded by a plating solution when electroplating of the pattern of the valve member is later electroplated.
- this invention makes it possible to form all of the valve seat and the valve member (valve, arms and fixing portion) forming the valve element by photoelectroforming, and to improve the dimensional accuracy of the valve element. Since locating between the fine hole of the valve seat and the valve can be made by mask registration, the position accuracy can also be improved.
- valve elements can form simultaneously a large number of the valve elements of the same type on one substrate and since the accuracy of dimension and position is high, the valve elements having uniform characteristics can be mass-produced.
Abstract
Description
- This invention relates to a micro mechanical valve, and more particularly to a valve element which is suitable for an ink-jet printer head for jetting ink droplets by the pump action caused by the interaction between electromechanical conversion means and a valve and for supplying the ink.
- Conventional valve elements for ink-jet printer heads have been proposed in the U.S. Patent Application Serial No. 274,210 filed on June 16, 1981. The conventional valve element is constituted by superposing a disc-like valve seat having a cylindrical ink passage at the center with a valve element for supporting a disc-like valve at the center by arms around the valve and a ring-like fixing portion. When a pressure acts upon the valve from the side of the ink passage, the vlave is pushed up and the ink flows out through the gap between the valve and the valve seat. When the pressure acts in the reverse direction, however, the valve is pushed to the valve seat, cutting the flow of the ink.
- The diameter of the valve is greater than that of the ink passage and this difference is preferably as small as possible in order to facilitate the ink flow in the forward direction. This means that extremely high accuracy is necessary in superposing the valve seat and the valve component. Accordingly, the assembly of the valve element is difficult, the yield of the approved valve element is low and variance of the characteristics is great.
- Moreover, the assembly method described above is not suitable for mass and economical production of a large number of valve elements.
- It is, therefore, an object of this invention to provide a valve element for use in an ink-jet printer head which is suitable for mass and economical production.
- According to this invention, there is provided a valve element for use in an ink-jet head comprising: a valve seat having a fine hole for a passage of a fluid, said valve seat being formed by a photoelectroforming technique; a valve for covering said hole; a support portion for supporting said valve and for displacing said valve in response to the pressure of said fluid; and a fixing portion for fitting said support portion to said valve seat, said valve, support portion and fixing portion being formed on said valve seat by the photoelectroforming technique in order to integrate said valve seat, valve, support portion and fixing portion.
- Other features and advantages of this invention will be apparent from the following description of preferred embodiments of this invention taken in conjunction with the accompanying drawings, wherein:
- Figs. 1(a) and 1(b) are a cross-sectional view and a plan view of a first embodiment of this invention, respectively;
- Figs. 2(a) to 2(g) are cross-sectional views for illustrating method of producing the valve element according to the first embodiment of this invention; and
- Figs. 3(a) to 3(c) are cross-sectional views for illustrating another method of producing the valve element.
- Referring to Figs. 1(a) and 1(b), the first embodiment comprises a
valve seat 202 having at its center afluid passage 201 having a circular cross-section, avalve 203 disposed so as to shieldfluid passage 201, and avalve member 206 consisting ofarms 204 supporting thevalve 203 and afixing portion 205. Thevalve member 206 is fixed to thevalve seat 202 by thefixing portion 205. On the other hand, thevalve 203 and thearms 204 are separated from thevalve seat 202. - The planar shape of the
valve member 206 may be arbitrary. Fig. 1(a) shows a typical example in which thevalve 203 is formed concentrically at the center of the ring-like fixing portion 205 and fourarms 204 for supporting thevalve 203 are disposed in the crisscross form. The diameter of thevalve 203 is greater than that of thefluid passage 201. Thevalve seat 202 and thevalve member 206 are formed by means of photoelctroforming technique as the combination of a patterning technique using a photoresist and plating technique, and corrosion-resist metals such as nickel, gold, chronium and the like are suitable as the metallic material. Since thevalve member 206 is formed on thevalve seat 202 using the same material by the photoelctroforming technique, the valve seat and the valve member become a unitrary structure. Even if thevalve seat 202 and thevalve member 206 are formed by different materials, the valve seat and the valve member will not separate from each other if a combination providing high bonding power at the fixing portion is used. - In the first embodiment, an example of the size of the valve element suitable for an ink-jet printer head is as follows:
- diameter of fluid passage 201: 180 µm diameter of valve 203: 200 µm (provided that the valve member is made of nickel)
- width of support arm 204: 50µm
- length of support arm 204: 400µm
- thickness of valve member 206: approx. 10jUm.
- Referring to Figs. 2(a) to 2(g), the valve element according to the first embodiment is produced in accordance with the following production process: As shown in Fig. 2(a), a
substrate 301 is formed by forming aconductive layer 303 on one surface of aglass sheet 302 by vacuum deposition. The conductive layer must be one that can be selectively etched against a material forming the valve element. Since the valve element is made of nickel in the first embodiment, the conductive layer consists of an aluminum layer and of a nickel layer from the side of theglass sheet 302. The nickel layer is a protective layer for the aluminum layer when plating is effected in a subsequent step. Hence, no problem occurs even if the aluminum layer alone is used. There is no particular limitaton to the thickness of the aluminum layer and it ranges from several hundreds to several throusands of angstroms. However, a greater thickness is preferred because the aluminum layer is molten in the last step. The thickness of the nickel is from dozens to hundreds of angstroms and is preferably as thin as possible within the range in which it can protect the aluminum layer. - A
photoresist layer 304 is formed on thesubstrate 301 described above. The pattern of the valve seat is exposed to light and a pattern having theconductive layer 303 exposed in the shape of the valve seat is formed by development. The thickness of the photoresist layer is equal to that of the valve seat to be formed. In this embodiment, 20 to 60,Vm-thick resist is used. After the subatrate is thus patterned by photoresist, the portion of the substrate devoid of the resist is plated by electroplating as shown in Fig. 2(b), thereby forming thevalve seat 305. Here, nickel is plated using a nickel sulfaminate bath. The thickness of the plating needs be equal to that of theresist layer 304 and the difference of the thickness is preferably within ±5µm. - Next, a
spacer 306 is formed at the center as shown in Fig. 2(c). This is to be removed in the final step and is formed so as to separate thevalve 203 and thearms 204 from the valve seat. - Then, a
conductive layer 307 for effecting next electroplating is formed over the entire surface as shown in Fig. 2(d). It is preferably made of the same metal as the valve seat and this embodiment uses vacuum deposited nickel. Alternatvely, the nickel film can be formed by non-electrolytic nickel plating, for example. The pattern of the valve member consisting of thevalve 309, thearms 310 and thefixing portion 311,is formed on theconductive layer 307 by thephotoresist 308. Thepattern 309 of the valve in this case is formed in such a manner as to cover theresist pattern 304a of the hole of the valve seat. Since this can be made by mask registration at the time of exposure of the photoresist, the registration accuracy can be remarkably improved in comparison with the conventional method in which the vlave seat and the vlave member are produced individually and are then superposed. - Among the pattern of the valve member, the
spacer 306 does not exist below thefixing portion 311. Next, thevlave member 312 is nickel-plated by electroplating as shown in Fig. 2(f). The thickness of plating in this case may be irrelevant to the thickness of theresist layer 308 and can be determined in accordance with the fluid resistance value in the forward direction of the value. It may be about 10µm, for example. - Finally, the
conductive layer 303, theresist layers spacer 306 are dissolved, providing the vlave element as shown in Fig. 2(g). Since theconductive layer 303 is formed by aluminum, it can be selectively dissolved with respect to nickel that forms the valve element, by use of sodium hyroxide. A solution that does not dissolve nickel but does the resist is used for the resist layers. In this step, if dissolution does not proceed because the surface of thespacer 306 is covered with the nickelconductive layer 307, theconductive layer 307 is etched and removed by an acid, whereby thespacer 306 appears on the surface and can be dissolved. - Next, the second embodiment of the production method of this invention will be explained with reference to Figs. 3(a) to 3(c). The embodiment shown in Figs. 3(a) to 3(c) is different from the first production method in forming the spacer. In other words, the steps till the formation of the valve seat in Fig. 2(b) are followed in the same way. Next, to form the spacer, an
aluminum layer 401 is formed by vacuum deposition or the like on the upper surface of thenickel plating layer 305 and theresist layer 304 as shown in Fig. 3(a). Next, the pattern of the portion in which the spacer is formed is formed on its surface by thephotoresist 402 as shown in Fig. 3(b). - Further, the aluminum layer of the portion devoid of the resist
pattern 402 is etched and removed, whereby thespacer 403 consisting of aluminum is formed as shown in Fig. 3(c). Since this spacer is electrically conductive, the step of forming the pattern of the valve member consisting of the valve, the arms and the fixing portion, that is shown in Fig. 2(e), by the photoresist can be followed as the next step. In accordance with this method, since the spacer consists of the aluminum vacuum deposition film, it can be easily removed in the final step. Moreover, since it is thin, hardly any gap occurs between the valve and the arms versus the valve seat after the spacer is removed. - Though the embodiment illustrates the case of the aluminum . layer alone, a protective layer of nickel or the like may be disposed on the upper surface of the aluminum layer in the same way as the substrate if the aluminum layer is corroded by a plating solution when electroplating of the pattern of the valve member is later electroplated.
- As described above, this invention makes it possible to form all of the valve seat and the valve member (valve, arms and fixing portion) forming the valve element by photoelectroforming, and to improve the dimensional accuracy of the valve element. Since locating between the fine hole of the valve seat and the valve can be made by mask registration, the position accuracy can also be improved.
- Though the foregoing description deals with only one valve element, this invention can form simultaneously a large number of the valve elements of the same type on one substrate and since the accuracy of dimension and position is high, the valve elements having uniform characteristics can be mass-produced.
Claims (2)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57220593A JPS59110967A (en) | 1982-12-16 | 1982-12-16 | Valve element and its manufacture method |
JP220593/82 | 1982-12-16 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0112701A2 true EP0112701A2 (en) | 1984-07-04 |
EP0112701A3 EP0112701A3 (en) | 1985-08-28 |
EP0112701B1 EP0112701B1 (en) | 1988-06-01 |
Family
ID=16753404
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19830307693 Expired EP0112701B1 (en) | 1982-12-16 | 1983-12-16 | Valve element for use in an ink-jet printer head |
Country Status (4)
Country | Link |
---|---|
US (1) | US4770740A (en) |
EP (1) | EP0112701B1 (en) |
JP (1) | JPS59110967A (en) |
DE (1) | DE3376816D1 (en) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0160463A2 (en) * | 1984-04-18 | 1985-11-06 | Nec Corporation | Valve element for use in an ink-jet printer head |
US4734706A (en) * | 1986-03-10 | 1988-03-29 | Tektronix, Inc. | Film-protected print head for an ink jet printer or the like |
EP0284282A2 (en) * | 1987-03-24 | 1988-09-28 | Tokyo Electric Co., Ltd. | Thermal ink jet printer |
WO1991002169A1 (en) * | 1989-08-11 | 1991-02-21 | Robert Bosch Gmbh | Method of making a microvalve |
EP0435237A1 (en) * | 1989-12-27 | 1991-07-03 | Honeywell Inc. | Electrostatic miniature valve and method for its fabrication |
EP0512521A1 (en) * | 1991-05-08 | 1992-11-11 | Hewlett-Packard Company | Thermally actuated microminiature valve |
US5176358A (en) * | 1991-08-08 | 1993-01-05 | Honeywell Inc. | Microstructure gas valve control |
WO1994028318A1 (en) * | 1993-05-27 | 1994-12-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Microvalve |
WO1995009989A1 (en) * | 1993-10-04 | 1995-04-13 | Research International, Inc. | Micromachined flow switches |
US5441597A (en) * | 1992-12-01 | 1995-08-15 | Honeywell Inc. | Microstructure gas valve control forming method |
FR2761002A1 (en) * | 1997-03-19 | 1998-09-25 | Seiko Epson Corp | VALVE UNIT, CARTRIDGE, INK TRANSMISSION NEEDLE, AND METHOD FOR MANUFACTURING THE VALVE UNIT |
US6550901B2 (en) | 1994-10-26 | 2003-04-22 | Seiko Epson Corporation | Ink cartridge for ink jet printer |
US6871944B2 (en) | 1996-02-21 | 2005-03-29 | Seiko Epson Corporation | Ink cartridge |
US6905199B2 (en) | 2000-10-20 | 2005-06-14 | Seiko Epson Corporation | Ink cartridge for ink jet recording device |
US7011397B2 (en) | 2002-09-12 | 2006-03-14 | Seiko Epson Corporation | Ink cartridge and method of regulating fluid flow |
US7090341B1 (en) | 1998-07-15 | 2006-08-15 | Seiko Epson Corporation | Ink-jet recording device and ink supply unit suitable for it |
US7367652B2 (en) | 2000-10-20 | 2008-05-06 | Seiko Epson Corporation | Ink-jet recording device and ink cartridge |
US7748835B2 (en) | 2000-10-20 | 2010-07-06 | Seiko Epson Corporation | Ink-jet recording device and ink cartridge |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0144861Y2 (en) * | 1984-10-25 | 1989-12-25 | ||
SE8801299L (en) * | 1988-04-08 | 1989-10-09 | Bertil Hoeoek | MICROMECHANICAL ONE-WAY VALVE |
US5244537A (en) * | 1989-12-27 | 1993-09-14 | Honeywell, Inc. | Fabrication of an electronic microvalve apparatus |
US5603809A (en) * | 1993-07-09 | 1997-02-18 | Roark, Sr.; Roger R. | Spinning band |
US5413668A (en) * | 1993-10-25 | 1995-05-09 | Ford Motor Company | Method for making mechanical and micro-electromechanical devices |
US6218155B1 (en) * | 1994-06-21 | 2001-04-17 | Zeneca Limited | Plants and processes for obtaining them |
US5646664A (en) * | 1995-01-18 | 1997-07-08 | Hewlett-Packard Company | Ink container valving |
FR2736654B1 (en) * | 1995-07-13 | 1997-08-22 | Commissariat Energie Atomique | METHOD FOR MANUFACTURING RIGID FLOATING MICROSTRUCTURE ELEMENTS AND DEVICE EQUIPPED WITH SUCH ELEMENTS |
US6120131A (en) * | 1995-08-28 | 2000-09-19 | Lexmark International, Inc. | Method of forming an inkjet printhead nozzle structure |
US6183064B1 (en) | 1995-08-28 | 2001-02-06 | Lexmark International, Inc. | Method for singulating and attaching nozzle plates to printheads |
US6093631A (en) * | 1998-01-15 | 2000-07-25 | International Business Machines Corporation | Dummy patterns for aluminum chemical polishing (CMP) |
AUPQ130899A0 (en) * | 1999-06-30 | 1999-07-22 | Silverbrook Research Pty Ltd | A method and apparatus (IJ47V12) |
AUPQ131099A0 (en) * | 1999-06-30 | 1999-07-22 | Silverbrook Research Pty Ltd | A method and apparatus (IJ47V8) |
AUPQ130399A0 (en) * | 1999-06-30 | 1999-07-22 | Silverbrook Research Pty Ltd | A method and apparatus (IJ47V9) |
US6644789B1 (en) | 2000-07-06 | 2003-11-11 | Lexmark International, Inc. | Nozzle assembly for an ink jet printer |
US6508532B1 (en) * | 2000-10-25 | 2003-01-21 | Eastman Kodak Company | Active compensation for changes in the direction of drop ejection in an inkjet printhead having orifice restricting member |
US6684504B2 (en) * | 2001-04-09 | 2004-02-03 | Lexmark International, Inc. | Method of manufacturing an imageable support matrix for printhead nozzle plates |
JP2008106889A (en) * | 2006-10-27 | 2008-05-08 | Kikuchiseisakusho Co Ltd | Microvalve and micropump using the same |
JP6417740B2 (en) * | 2014-06-18 | 2018-11-07 | セイコーエプソン株式会社 | Liquid ejecting head and manufacturing method of liquid ejecting head |
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EP0052914A1 (en) * | 1980-11-21 | 1982-06-02 | Nec Corporation | Printer head for an ink-on-demand type ink-jet printer |
GB2092960A (en) * | 1981-01-09 | 1982-08-25 | Canon Kk | Ink jet head |
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- 1983-12-16 EP EP19830307693 patent/EP0112701B1/en not_active Expired
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1987
- 1987-08-05 US US07/081,876 patent/US4770740A/en not_active Expired - Fee Related
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EP0052914A1 (en) * | 1980-11-21 | 1982-06-02 | Nec Corporation | Printer head for an ink-on-demand type ink-jet printer |
GB2092960A (en) * | 1981-01-09 | 1982-08-25 | Canon Kk | Ink jet head |
Cited By (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0160463A3 (en) * | 1984-04-18 | 1987-09-16 | Nec Corporation | Valve element for use in an ink-jet printer head |
EP0160463A2 (en) * | 1984-04-18 | 1985-11-06 | Nec Corporation | Valve element for use in an ink-jet printer head |
US4734706A (en) * | 1986-03-10 | 1988-03-29 | Tektronix, Inc. | Film-protected print head for an ink jet printer or the like |
EP0284282A2 (en) * | 1987-03-24 | 1988-09-28 | Tokyo Electric Co., Ltd. | Thermal ink jet printer |
EP0284282A3 (en) * | 1987-03-24 | 1990-11-22 | Tokyo Electric Co., Ltd. | Thermal ink jet printer |
WO1991002169A1 (en) * | 1989-08-11 | 1991-02-21 | Robert Bosch Gmbh | Method of making a microvalve |
EP0435237A1 (en) * | 1989-12-27 | 1991-07-03 | Honeywell Inc. | Electrostatic miniature valve and method for its fabrication |
EP0512521A1 (en) * | 1991-05-08 | 1992-11-11 | Hewlett-Packard Company | Thermally actuated microminiature valve |
US5176358A (en) * | 1991-08-08 | 1993-01-05 | Honeywell Inc. | Microstructure gas valve control |
US5323999A (en) * | 1991-08-08 | 1994-06-28 | Honeywell Inc. | Microstructure gas valve control |
US5441597A (en) * | 1992-12-01 | 1995-08-15 | Honeywell Inc. | Microstructure gas valve control forming method |
WO1994028318A1 (en) * | 1993-05-27 | 1994-12-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Microvalve |
US5839467A (en) * | 1993-10-04 | 1998-11-24 | Research International, Inc. | Micromachined fluid handling devices |
WO1995009989A1 (en) * | 1993-10-04 | 1995-04-13 | Research International, Inc. | Micromachined flow switches |
US5617632A (en) * | 1993-10-04 | 1997-04-08 | Research International, Inc. | Methods for forming a contoured regulator seat |
US5660728A (en) * | 1993-10-04 | 1997-08-26 | Research International, Inc. | Micromachined fluid handling apparatus with filter |
US5697153A (en) * | 1993-10-04 | 1997-12-16 | Research International, Inc. | Method for manufacturing a fluid flow regulator |
US5702618A (en) * | 1993-10-04 | 1997-12-30 | Research International, Inc. | Methods for manufacturing a flow switch |
US5705070A (en) * | 1993-10-04 | 1998-01-06 | Research International, Inc. | Micromachined filters |
US5585011A (en) * | 1993-10-04 | 1996-12-17 | Research International, Inc. | Methods for manufacturing a filter |
US6948804B2 (en) | 1994-10-26 | 2005-09-27 | Seiko Epson Corporation | Ink cartridge for ink jet printer |
US7029103B2 (en) | 1994-10-26 | 2006-04-18 | Seiko Epson Corporation | Ink cartridge for ink jet printer |
US6550901B2 (en) | 1994-10-26 | 2003-04-22 | Seiko Epson Corporation | Ink cartridge for ink jet printer |
US6916089B2 (en) | 1994-10-26 | 2005-07-12 | Seiko Epson Corporation | Ink cartridge for ink jet printer |
US6871944B2 (en) | 1996-02-21 | 2005-03-29 | Seiko Epson Corporation | Ink cartridge |
US6648459B2 (en) | 1997-03-19 | 2003-11-18 | Seiko Epson Corporation | Valve unit in ink supply channel of ink-jet recording apparatus, ink cartridge using the valve unit, ink supply needle and method of producing the valve unit |
US6302531B1 (en) | 1997-03-19 | 2001-10-16 | Seiko Epson Corporation | Valve unit in ink supply channel of ink-jet recording apparatus, ink cartridge using the valve unit, ink supply needle and method of producing the valve unit |
FR2761002A1 (en) * | 1997-03-19 | 1998-09-25 | Seiko Epson Corp | VALVE UNIT, CARTRIDGE, INK TRANSMISSION NEEDLE, AND METHOD FOR MANUFACTURING THE VALVE UNIT |
US6986568B2 (en) | 1997-03-19 | 2006-01-17 | Seiko Epson Corporation | Valve unit in ink supply channel of ink-jet recording apparatus, ink cartridge using the valve unit, ink supply needle and method of producing the valve unit |
US7090341B1 (en) | 1998-07-15 | 2006-08-15 | Seiko Epson Corporation | Ink-jet recording device and ink supply unit suitable for it |
US7559634B2 (en) | 1998-07-15 | 2009-07-14 | Seiko Epson Corporation | Ink-jet recording device and ink supply unit suitable for it |
US8136931B2 (en) | 1998-07-15 | 2012-03-20 | Seiko Epson Corporation | Ink-jet recording device and ink supply unit suitable for it |
US8007088B2 (en) | 1998-07-15 | 2011-08-30 | Seiko Epson Corporation | Ink-jet recording device and ink supply unit suitable for it |
US7350907B2 (en) | 1998-07-15 | 2008-04-01 | Seiko Epson Corporation | Ink-jet recording device and ink supply unit suitable for it |
US7422317B2 (en) | 1998-07-15 | 2008-09-09 | Seiko Epson Corporation | Ink-jet recording device and ink supply unit suitable for it |
US7367652B2 (en) | 2000-10-20 | 2008-05-06 | Seiko Epson Corporation | Ink-jet recording device and ink cartridge |
US7748835B2 (en) | 2000-10-20 | 2010-07-06 | Seiko Epson Corporation | Ink-jet recording device and ink cartridge |
US7784930B2 (en) | 2000-10-20 | 2010-08-31 | Seiko Epson Corporation | Ink cartridge for ink jet recording device |
US7815298B2 (en) | 2000-10-20 | 2010-10-19 | Seiko Epson Corporation | Ink cartridge for ink jet recording device |
US7293866B2 (en) | 2000-10-20 | 2007-11-13 | Seiko Epson Corporation | Ink cartridge for ink jet recording device |
US6905199B2 (en) | 2000-10-20 | 2005-06-14 | Seiko Epson Corporation | Ink cartridge for ink jet recording device |
US7011397B2 (en) | 2002-09-12 | 2006-03-14 | Seiko Epson Corporation | Ink cartridge and method of regulating fluid flow |
US7794067B2 (en) | 2002-09-12 | 2010-09-14 | Seiko Epson Corporation | Ink cartridge and method of regulating fluid flow |
Also Published As
Publication number | Publication date |
---|---|
JPS59110967A (en) | 1984-06-27 |
US4770740A (en) | 1988-09-13 |
DE3376816D1 (en) | 1988-07-07 |
JPH0450471B2 (en) | 1992-08-14 |
EP0112701B1 (en) | 1988-06-01 |
EP0112701A3 (en) | 1985-08-28 |
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