DE9405963U1 - Vorrichtung zur elektrischen Berührungskontaktierung von IC-Einrichtungen - Google Patents

Vorrichtung zur elektrischen Berührungskontaktierung von IC-Einrichtungen

Info

Publication number
DE9405963U1
DE9405963U1 DE9405963U DE9405963U DE9405963U1 DE 9405963 U1 DE9405963 U1 DE 9405963U1 DE 9405963 U DE9405963 U DE 9405963U DE 9405963 U DE9405963 U DE 9405963U DE 9405963 U1 DE9405963 U1 DE 9405963U1
Authority
DE
Germany
Prior art keywords
devices
electrical contacting
contacting
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9405963U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of DE9405963U1 publication Critical patent/DE9405963U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
DE9405963U 1993-04-09 1994-04-11 Vorrichtung zur elektrischen Berührungskontaktierung von IC-Einrichtungen Expired - Lifetime DE9405963U1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/045,589 US5322446A (en) 1993-04-09 1993-04-09 Top load socket and carrier

Publications (1)

Publication Number Publication Date
DE9405963U1 true DE9405963U1 (de) 1994-08-04

Family

ID=21938795

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9405963U Expired - Lifetime DE9405963U1 (de) 1993-04-09 1994-04-11 Vorrichtung zur elektrischen Berührungskontaktierung von IC-Einrichtungen

Country Status (4)

Country Link
US (1) US5322446A (de)
JP (1) JP3280796B2 (de)
DE (1) DE9405963U1 (de)
GB (1) GB2276988B (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5495179A (en) * 1991-06-04 1996-02-27 Micron Technology, Inc. Carrier having interchangeable substrate used for testing of semiconductor dies
US5519332A (en) * 1991-06-04 1996-05-21 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
KR950013605B1 (ko) * 1993-11-20 1995-11-13 삼성전자주식회사 번인 테스트용 칩 홀딩장치 및 그 제조방법
US5614377A (en) 1994-02-28 1997-03-25 Myco Pharmaceuticals, Incorporated Methods for identifying inhibitors of fungal pathogenicity
JP3667786B2 (ja) * 1994-03-17 2005-07-06 インテル・コーポレーション Ｉｃソケットおよびそのプリント基板との導通接続状態の検査方法
US5451165A (en) * 1994-07-27 1995-09-19 Minnesota Mining And Manufacturing Company Temporary package for bare die test and burn-in
US5498970A (en) * 1995-02-06 1996-03-12 Minnesota Mining And Manufacturing Top load socket for ball grid array devices
JPH0997661A (ja) * 1995-10-02 1997-04-08 Sumitomo Metal Ind Ltd 電子部品用ソケット
KR100202326B1 (ko) * 1995-11-08 1999-06-15 오우라 히로시 Ic 소켓
US6403226B1 (en) 1996-05-17 2002-06-11 3M Innovative Properties Company Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance
US5855347A (en) * 1996-07-18 1999-01-05 Hollingsworth; Don A. Fastener for holding items to a perforated wall
US6014031A (en) * 1996-12-10 2000-01-11 International Business Machines Corporation Apparatus for pressing an electronic card against contacts of a test socket
US6072323A (en) * 1997-03-03 2000-06-06 Micron Technology, Inc. Temporary package, and method system for testing semiconductor dice having backside electrodes
US6025730A (en) 1997-03-17 2000-02-15 Micron Technology, Inc. Direct connect interconnect for testing semiconductor dice and wafers
US6025728A (en) * 1997-04-25 2000-02-15 Micron Technology, Inc. Semiconductor package with wire bond protective member
US6040702A (en) * 1997-07-03 2000-03-21 Micron Technology, Inc. Carrier and system for testing bumped semiconductor components
US6072326A (en) * 1997-08-22 2000-06-06 Micron Technology, Inc. System for testing semiconductor components
RU2133522C1 (ru) 1997-11-03 1999-07-20 Закрытое акционерное общество "Техно-ТМ" Способ изготовления и контроля электронных компонентов
US6285202B1 (en) 1999-02-19 2001-09-04 Micron Technology, Inc. Test carrier with force applying mechanism guide and terminal contact protector
US6396291B1 (en) 1999-04-23 2002-05-28 Micron Technology, Inc. Method for testing semiconductor components
US6114757A (en) * 1999-09-27 2000-09-05 Thomas & Betts International, Inc. Leadless IC socket
JP2001183415A (ja) * 1999-12-28 2001-07-06 Molex Inc ベアチップ用ｉｃソケット
US6353329B1 (en) 2000-03-14 2002-03-05 3M Innovative Properties Company Integrated circuit test socket lid assembly
TW570333U (en) * 2003-03-07 2004-01-01 Hon Hai Prec Ind Co Ltd Electrical connector assembly
US7112983B2 (en) * 2004-11-10 2006-09-26 International Business Machines Corporation Apparatus and method for single die backside probing of semiconductor devices
US7108535B1 (en) * 2005-07-12 2006-09-19 Spansion, Llc Integrated circuit test socket
US20070111566A1 (en) * 2005-11-17 2007-05-17 Tyco Electronic Corporation Elastomeric connector assembly
CN2886983Y (zh) * 2006-02-18 2007-04-04 鸿富锦精密工业（深圳）有限公司 芯片保护装置
US7547216B1 (en) * 2008-01-18 2009-06-16 Hon Hai Precision Ind. Co., Ltd. Electrical connector assembly with alignment posts
TWM366780U (en) * 2009-04-03 2009-10-11 Hon Hai Prec Ind Co Ltd Electrical connector
CN107766092A (zh) * 2016-08-18 2018-03-06 江苏迈隆电子科技有限公司 一种烧录冶具

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4340266A (en) * 1978-05-22 1982-07-20 Minnesota Mining And Manufacturing Company Connector system
US4351580A (en) * 1980-05-15 1982-09-28 Augat Inc. Carrier socket for leadless integrated circuit devices
US4395084A (en) * 1981-07-06 1983-07-26 Teledyne Industries, Inc. Electrical socket for leadless integrated circuit packages
US4554505A (en) * 1983-06-10 1985-11-19 Rockwell International Corporation Test socket for a leadless chip carrier
GB2164213B (en) * 1984-09-06 1988-07-13 Nec Corp Structure for connecting leadless chip carrier
GB2169154B (en) * 1984-12-31 1989-01-18 Gen Electric Pressure-fit electrical socket for direct interconnection to a semiconductor chip
US4669796A (en) * 1985-11-22 1987-06-02 Wells Electronics, Inc. RAM connector
US4744009A (en) * 1986-10-31 1988-05-10 Amp Incorporated Protective carrier and securing means therefor
US4783719A (en) * 1987-01-20 1988-11-08 Hughes Aircraft Company Test connector for electrical devices
US4859189A (en) * 1987-09-25 1989-08-22 Minnesota Mining And Manufacturing Company Multipurpose socket
JPH01119043A (ja) * 1987-10-31 1989-05-11 Yamaichi Electric Mfg Co Ltd Ｉｃソケット
US4949159A (en) * 1988-08-03 1990-08-14 Byers Photo Equipment Company Carrier for film-mounted integrated circuit
US4969828A (en) * 1989-05-17 1990-11-13 Amp Incorporated Electrical socket for TAB IC's
JPH07114136B2 (ja) * 1989-05-22 1995-12-06 第一精工株式会社 検査用ｉｃソケット
US5010038A (en) * 1989-06-29 1991-04-23 Digital Equipment Corp. Method of cooling and powering an integrated circuit chip using a compliant interposing pad
US5167326A (en) * 1990-03-19 1992-12-01 R. H. Murphy Co., Inc. Carriers for integrated circuits and the like
US5007842A (en) * 1990-10-11 1991-04-16 Amp Incorporated Flexible area array connector
US5161984A (en) * 1991-10-16 1992-11-10 Amp Incorporated Electrical socket
US5158467A (en) * 1991-11-01 1992-10-27 Amp Incorporated High speed bare chip test socket
JPH06276274A (ja) * 1993-03-17 1994-09-30 Toshiba Corp 電話装置
JPH06276273A (ja) * 1993-03-19 1994-09-30 Nippon Telegr & Teleph Corp <Ntt> 着信払い通話の接続確認方法

Also Published As

Publication number Publication date
GB9405522D0 (en) 1994-05-04
GB2276988B (en) 1996-10-02
GB2276988A (en) 1994-10-12
JPH06308194A (ja) 1994-11-04
US5322446A (en) 1994-06-21
JP3280796B2 (ja) 2002-05-13

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