DE932709C - Process for the deposition of smooth and shiny copper coatings - Google Patents

Process for the deposition of smooth and shiny copper coatings

Info

Publication number
DE932709C
DE932709C DEK15340A DEK0015340A DE932709C DE 932709 C DE932709 C DE 932709C DE K15340 A DEK15340 A DE K15340A DE K0015340 A DEK0015340 A DE K0015340A DE 932709 C DE932709 C DE 932709C
Authority
DE
Germany
Prior art keywords
smooth
deposition
copper coatings
shiny copper
coatings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DEK15340A
Other languages
German (de)
Inventor
Karl Kuell
Adolf Schwedhelm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kampschulte & Cie Dr W
Original Assignee
Kampschulte & Cie Dr W
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kampschulte & Cie Dr W filed Critical Kampschulte & Cie Dr W
Priority to DEK15340A priority Critical patent/DE932709C/en
Application granted granted Critical
Publication of DE932709C publication Critical patent/DE932709C/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Description

Verfahren zur Abscheidung von glatten und glänzenden Kupferüberzügen Die Abscheidung von glatten und glänzenden Kupferüberzügen aus sauren Kupferelektrolyten mit Hilfe von Kolloiden, Gelatine, Gummi, Melasse oder Phenol und seinen Derivaten oder oxyheterocyclischen Verbindungen wie Piperonal in Verbindung mit Moiybdänsalzen ist bekannt.Process for the deposition of smooth and shiny copper coatings The deposition of smooth and shiny copper coatings from acidic copper electrolytes with the help of colloids, gelatin, gum, molasses or phenol and its derivatives or oxyheterocyclic compounds such as piperonal in conjunction with Moiybdänsalzen is known.

Es wurde nun gefunden, daß bei Zugabe von dreifach ungesättigten Alkoholen zu einem sauren Kupferelektrolyten in Verbindung mit Thiophenol oder dessen Derivaten sehr glatte überzöge zu, erzielen waren und daß die Konzentration des Glanzbildners im Elektrolyten, in diesem Falle i, q.-Butindiol oder Propargylnlkohol oder einer Mischung beider im Gegensatz zu den bekannten Glanzbildnern, in bedeutend weiteren Grenzen gehalten werden konnte. Durch die Zugabe von Thiophenol und dessen Derivaten konnte in Verbindung mit dreifach ungesättigten Alkoholen eine wesentliche Glanzsteigerung der Kupferüberzüge erreicht werden. Außerdem war eine Erhöhung der Stromdichte im kalten sowie im temperierten Bade bei Anwesenheit von dreifach ungesättigten Alkoholen zu verzeichnen. Beispiel 25o g/1 Kupfersulfat, crist.It has now been found that when triunsaturated alcohols are added to an acidic copper electrolyte in connection with thiophenol or its derivatives very smooth coatings were to be achieved and that the concentration of the brightener in the electrolyte, in this case i, q.-butynediol or propargyl alcohol or one Mixture of both in contrast to the known brighteners, in significantly more Limits could be kept. By adding thiophenol and its derivatives was able to achieve a significant increase in gloss in connection with triunsaturated alcohols the copper coatings can be achieved. In addition, there was an increase in the current density in the cold as well as in tempered baths in the presence of tri-unsaturated alcohols recorded. Example 250 g / 1 copper sulphate, crist.

25 g/1 Schwefelsäure (66° Be) o,o5 g/1 Propargylalkohol o,oi g/1 Thiophenol.25 g / 1 sulfuric acid (66 ° Be) 0.05 g / 1 propargyl alcohol 0.1 g / 1 thiophenol.

Claims (1)

PATENTANSPRUCH: Verfahren zur Abscheidung von glatten und glänzenden Kupferüberzügen aus sauren, wäL3-rigen Kupfersalzlösungen, gekennzeichnet durch einen Zusatz von dreifach ungesättigten Alkoholen in Verbindung mixt Thiophenol oder dessen Derivaten. Angezogene Druckschriften: Deutsche. Patentschrift .Nr. 688 r55; deutsche Patentanmeldungen Nr. K6716 VIa/ 48a (Patent 848890) und M 1:2434 VI a / 48 a (Patent 874 100) ; USA.-Patentschrift Nr. 2 526 999.PATENT CLAIM: Process for the deposition of smooth and shiny copper coatings from acidic, aqueous copper salt solutions, characterized by the addition of tri-unsaturated alcohols combined with thiophenol or its derivatives. Printed publications: German. Patent specification no. 688 r55; German patent applications No. K6716 VIa / 48a (patent 848890) and M 1: 2434 VI a / 48 a (patent 874 100); USA. Pat. No. 2,526,999.
DEK15340A 1952-08-31 1952-08-31 Process for the deposition of smooth and shiny copper coatings Expired DE932709C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DEK15340A DE932709C (en) 1952-08-31 1952-08-31 Process for the deposition of smooth and shiny copper coatings

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEK15340A DE932709C (en) 1952-08-31 1952-08-31 Process for the deposition of smooth and shiny copper coatings

Publications (1)

Publication Number Publication Date
DE932709C true DE932709C (en) 1955-09-08

Family

ID=7214566

Family Applications (1)

Application Number Title Priority Date Filing Date
DEK15340A Expired DE932709C (en) 1952-08-31 1952-08-31 Process for the deposition of smooth and shiny copper coatings

Country Status (1)

Country Link
DE (1) DE932709C (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1055314B (en) * 1956-01-19 1959-04-16 Harshaw Chem Corp Cyanide bath and process for the galvanic deposition of shiny copper coatings
DE1214069B (en) * 1957-04-16 1966-04-07 Dehydag Gmbh Galvanic copper baths
EP0952242A1 (en) * 1998-04-21 1999-10-27 Applied Materials, Inc. Electro deposition chemistry
US6478937B2 (en) 2001-01-19 2002-11-12 Applied Material, Inc. Substrate holder system with substrate extension apparatus and associated method
US6551484B2 (en) 1999-04-08 2003-04-22 Applied Materials, Inc. Reverse voltage bias for electro-chemical plating system and method
US6571657B1 (en) 1999-04-08 2003-06-03 Applied Materials Inc. Multiple blade robot adjustment apparatus and associated method
US6576110B2 (en) 2000-07-07 2003-06-10 Applied Materials, Inc. Coated anode apparatus and associated method
US6610189B2 (en) 2001-01-03 2003-08-26 Applied Materials, Inc. Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature
US6808612B2 (en) 2000-05-23 2004-10-26 Applied Materials, Inc. Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE688155C (en) * 1938-12-08 1940-02-14 Degussa Baths for the electrolytic deposition of brass
US2526999A (en) * 1947-06-07 1950-10-24 Hanson Van Winkle Munning Co Cadmium plating bath
DE848890C (en) * 1950-09-27 1952-09-08 W Kampschulte & Cie Dr Process for the electrolytic production of high-gloss nickel coatings
DE874100C (en) * 1952-01-01 1953-04-20 Guenter Mueschenig Process for the electrolytic production of high-gloss copper layers from cyan-alkaline baths

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE688155C (en) * 1938-12-08 1940-02-14 Degussa Baths for the electrolytic deposition of brass
US2526999A (en) * 1947-06-07 1950-10-24 Hanson Van Winkle Munning Co Cadmium plating bath
DE848890C (en) * 1950-09-27 1952-09-08 W Kampschulte & Cie Dr Process for the electrolytic production of high-gloss nickel coatings
DE874100C (en) * 1952-01-01 1953-04-20 Guenter Mueschenig Process for the electrolytic production of high-gloss copper layers from cyan-alkaline baths

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1055314B (en) * 1956-01-19 1959-04-16 Harshaw Chem Corp Cyanide bath and process for the galvanic deposition of shiny copper coatings
DE1214069B (en) * 1957-04-16 1966-04-07 Dehydag Gmbh Galvanic copper baths
EP0952242A1 (en) * 1998-04-21 1999-10-27 Applied Materials, Inc. Electro deposition chemistry
US6113771A (en) * 1998-04-21 2000-09-05 Applied Materials, Inc. Electro deposition chemistry
US6350366B1 (en) 1998-04-21 2002-02-26 Applied Materials, Inc. Electro deposition chemistry
US6610191B2 (en) 1998-04-21 2003-08-26 Applied Materials, Inc. Electro deposition chemistry
US6551484B2 (en) 1999-04-08 2003-04-22 Applied Materials, Inc. Reverse voltage bias for electro-chemical plating system and method
US6571657B1 (en) 1999-04-08 2003-06-03 Applied Materials Inc. Multiple blade robot adjustment apparatus and associated method
US6808612B2 (en) 2000-05-23 2004-10-26 Applied Materials, Inc. Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
US6576110B2 (en) 2000-07-07 2003-06-10 Applied Materials, Inc. Coated anode apparatus and associated method
US6610189B2 (en) 2001-01-03 2003-08-26 Applied Materials, Inc. Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature
US6478937B2 (en) 2001-01-19 2002-11-12 Applied Material, Inc. Substrate holder system with substrate extension apparatus and associated method

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