DE932709C - Process for the deposition of smooth and shiny copper coatings - Google Patents
Process for the deposition of smooth and shiny copper coatingsInfo
- Publication number
- DE932709C DE932709C DEK15340A DEK0015340A DE932709C DE 932709 C DE932709 C DE 932709C DE K15340 A DEK15340 A DE K15340A DE K0015340 A DEK0015340 A DE K0015340A DE 932709 C DE932709 C DE 932709C
- Authority
- DE
- Germany
- Prior art keywords
- smooth
- deposition
- copper coatings
- shiny copper
- coatings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Description
Verfahren zur Abscheidung von glatten und glänzenden Kupferüberzügen Die Abscheidung von glatten und glänzenden Kupferüberzügen aus sauren Kupferelektrolyten mit Hilfe von Kolloiden, Gelatine, Gummi, Melasse oder Phenol und seinen Derivaten oder oxyheterocyclischen Verbindungen wie Piperonal in Verbindung mit Moiybdänsalzen ist bekannt.Process for the deposition of smooth and shiny copper coatings The deposition of smooth and shiny copper coatings from acidic copper electrolytes with the help of colloids, gelatin, gum, molasses or phenol and its derivatives or oxyheterocyclic compounds such as piperonal in conjunction with Moiybdänsalzen is known.
Es wurde nun gefunden, daß bei Zugabe von dreifach ungesättigten Alkoholen zu einem sauren Kupferelektrolyten in Verbindung mit Thiophenol oder dessen Derivaten sehr glatte überzöge zu, erzielen waren und daß die Konzentration des Glanzbildners im Elektrolyten, in diesem Falle i, q.-Butindiol oder Propargylnlkohol oder einer Mischung beider im Gegensatz zu den bekannten Glanzbildnern, in bedeutend weiteren Grenzen gehalten werden konnte. Durch die Zugabe von Thiophenol und dessen Derivaten konnte in Verbindung mit dreifach ungesättigten Alkoholen eine wesentliche Glanzsteigerung der Kupferüberzüge erreicht werden. Außerdem war eine Erhöhung der Stromdichte im kalten sowie im temperierten Bade bei Anwesenheit von dreifach ungesättigten Alkoholen zu verzeichnen. Beispiel 25o g/1 Kupfersulfat, crist.It has now been found that when triunsaturated alcohols are added to an acidic copper electrolyte in connection with thiophenol or its derivatives very smooth coatings were to be achieved and that the concentration of the brightener in the electrolyte, in this case i, q.-butynediol or propargyl alcohol or one Mixture of both in contrast to the known brighteners, in significantly more Limits could be kept. By adding thiophenol and its derivatives was able to achieve a significant increase in gloss in connection with triunsaturated alcohols the copper coatings can be achieved. In addition, there was an increase in the current density in the cold as well as in tempered baths in the presence of tri-unsaturated alcohols recorded. Example 250 g / 1 copper sulphate, crist.
25 g/1 Schwefelsäure (66° Be) o,o5 g/1 Propargylalkohol o,oi g/1 Thiophenol.25 g / 1 sulfuric acid (66 ° Be) 0.05 g / 1 propargyl alcohol 0.1 g / 1 thiophenol.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEK15340A DE932709C (en) | 1952-08-31 | 1952-08-31 | Process for the deposition of smooth and shiny copper coatings |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEK15340A DE932709C (en) | 1952-08-31 | 1952-08-31 | Process for the deposition of smooth and shiny copper coatings |
Publications (1)
Publication Number | Publication Date |
---|---|
DE932709C true DE932709C (en) | 1955-09-08 |
Family
ID=7214566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DEK15340A Expired DE932709C (en) | 1952-08-31 | 1952-08-31 | Process for the deposition of smooth and shiny copper coatings |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE932709C (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1055314B (en) * | 1956-01-19 | 1959-04-16 | Harshaw Chem Corp | Cyanide bath and process for the galvanic deposition of shiny copper coatings |
DE1214069B (en) * | 1957-04-16 | 1966-04-07 | Dehydag Gmbh | Galvanic copper baths |
EP0952242A1 (en) * | 1998-04-21 | 1999-10-27 | Applied Materials, Inc. | Electro deposition chemistry |
US6478937B2 (en) | 2001-01-19 | 2002-11-12 | Applied Material, Inc. | Substrate holder system with substrate extension apparatus and associated method |
US6551484B2 (en) | 1999-04-08 | 2003-04-22 | Applied Materials, Inc. | Reverse voltage bias for electro-chemical plating system and method |
US6571657B1 (en) | 1999-04-08 | 2003-06-03 | Applied Materials Inc. | Multiple blade robot adjustment apparatus and associated method |
US6576110B2 (en) | 2000-07-07 | 2003-06-10 | Applied Materials, Inc. | Coated anode apparatus and associated method |
US6610189B2 (en) | 2001-01-03 | 2003-08-26 | Applied Materials, Inc. | Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature |
US6808612B2 (en) | 2000-05-23 | 2004-10-26 | Applied Materials, Inc. | Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE688155C (en) * | 1938-12-08 | 1940-02-14 | Degussa | Baths for the electrolytic deposition of brass |
US2526999A (en) * | 1947-06-07 | 1950-10-24 | Hanson Van Winkle Munning Co | Cadmium plating bath |
DE848890C (en) * | 1950-09-27 | 1952-09-08 | W Kampschulte & Cie Dr | Process for the electrolytic production of high-gloss nickel coatings |
DE874100C (en) * | 1952-01-01 | 1953-04-20 | Guenter Mueschenig | Process for the electrolytic production of high-gloss copper layers from cyan-alkaline baths |
-
1952
- 1952-08-31 DE DEK15340A patent/DE932709C/en not_active Expired
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE688155C (en) * | 1938-12-08 | 1940-02-14 | Degussa | Baths for the electrolytic deposition of brass |
US2526999A (en) * | 1947-06-07 | 1950-10-24 | Hanson Van Winkle Munning Co | Cadmium plating bath |
DE848890C (en) * | 1950-09-27 | 1952-09-08 | W Kampschulte & Cie Dr | Process for the electrolytic production of high-gloss nickel coatings |
DE874100C (en) * | 1952-01-01 | 1953-04-20 | Guenter Mueschenig | Process for the electrolytic production of high-gloss copper layers from cyan-alkaline baths |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1055314B (en) * | 1956-01-19 | 1959-04-16 | Harshaw Chem Corp | Cyanide bath and process for the galvanic deposition of shiny copper coatings |
DE1214069B (en) * | 1957-04-16 | 1966-04-07 | Dehydag Gmbh | Galvanic copper baths |
EP0952242A1 (en) * | 1998-04-21 | 1999-10-27 | Applied Materials, Inc. | Electro deposition chemistry |
US6113771A (en) * | 1998-04-21 | 2000-09-05 | Applied Materials, Inc. | Electro deposition chemistry |
US6350366B1 (en) | 1998-04-21 | 2002-02-26 | Applied Materials, Inc. | Electro deposition chemistry |
US6610191B2 (en) | 1998-04-21 | 2003-08-26 | Applied Materials, Inc. | Electro deposition chemistry |
US6551484B2 (en) | 1999-04-08 | 2003-04-22 | Applied Materials, Inc. | Reverse voltage bias for electro-chemical plating system and method |
US6571657B1 (en) | 1999-04-08 | 2003-06-03 | Applied Materials Inc. | Multiple blade robot adjustment apparatus and associated method |
US6808612B2 (en) | 2000-05-23 | 2004-10-26 | Applied Materials, Inc. | Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio |
US6576110B2 (en) | 2000-07-07 | 2003-06-10 | Applied Materials, Inc. | Coated anode apparatus and associated method |
US6610189B2 (en) | 2001-01-03 | 2003-08-26 | Applied Materials, Inc. | Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature |
US6478937B2 (en) | 2001-01-19 | 2002-11-12 | Applied Material, Inc. | Substrate holder system with substrate extension apparatus and associated method |
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