DE9014091U1 - - Google Patents

Info

Publication number
DE9014091U1
DE9014091U1 DE9014091U DE9014091U DE9014091U1 DE 9014091 U1 DE9014091 U1 DE 9014091U1 DE 9014091 U DE9014091 U DE 9014091U DE 9014091 U DE9014091 U DE 9014091U DE 9014091 U1 DE9014091 U1 DE 9014091U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9014091U
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE9014091U priority Critical patent/DE9014091U1/de
Priority to DE4131504A priority patent/DE4131504C2/de
Priority to US07/767,795 priority patent/US5170325A/en
Priority to JP1991081582U priority patent/JP2565474Y2/ja
Priority to FR9112475A priority patent/FR2668022B1/fr
Publication of DE9014091U1 publication Critical patent/DE9014091U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/44—Clasp, clip, support-clamp, or required component thereof
    • Y10T24/44017—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured
DE9014091U 1990-10-10 1990-10-10 Expired - Lifetime DE9014091U1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE9014091U DE9014091U1 (de) 1990-10-10 1990-10-10
DE4131504A DE4131504C2 (de) 1990-10-10 1991-09-21 Federelement für eine Baugruppe eines elektronischen Steuergeräts
US07/767,795 US5170325A (en) 1990-10-10 1991-09-27 Spring element for a group of components of an electronic control device
JP1991081582U JP2565474Y2 (ja) 1990-10-10 1991-10-08 電子制御装置の構成部材群のためのばね部材
FR9112475A FR2668022B1 (fr) 1990-10-10 1991-10-10 Element de ressort pour un sous-ensemble d'appareil de commande electronique.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9014091U DE9014091U1 (de) 1990-10-10 1990-10-10

Publications (1)

Publication Number Publication Date
DE9014091U1 true DE9014091U1 (de) 1992-02-13

Family

ID=6858249

Family Applications (2)

Application Number Title Priority Date Filing Date
DE9014091U Expired - Lifetime DE9014091U1 (de) 1990-10-10 1990-10-10
DE4131504A Expired - Fee Related DE4131504C2 (de) 1990-10-10 1991-09-21 Federelement für eine Baugruppe eines elektronischen Steuergeräts

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE4131504A Expired - Fee Related DE4131504C2 (de) 1990-10-10 1991-09-21 Federelement für eine Baugruppe eines elektronischen Steuergeräts

Country Status (2)

Country Link
US (1) US5170325A (de)
DE (2) DE9014091U1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19648090A1 (de) * 1996-11-20 1998-05-28 Becker Gmbh Verfahren und Vorrichtung zur Befestigung von elektrischen Bauteilen
DE102010042211A1 (de) * 2010-10-08 2012-04-12 Eta Plus Electronic Gmbh Kühlvorrichtung für Halbleiterbauelemente
EP3057128A1 (de) * 2015-02-11 2016-08-17 Abb Ag Elektronisches installationsgerät der gebäude-installationstechnik

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9007236U1 (de) * 1990-06-29 1991-10-31 Robert Bosch Gmbh, 7000 Stuttgart, De
US5304735A (en) * 1992-02-14 1994-04-19 Aavid Engineering, Inc. Heat sink for an electronic pin grid array
DE4218224A1 (de) * 1992-06-03 1993-12-09 Asea Brown Boveri Vorrichtung zum Befestigen mindestens eines Bauelementes an einem Träger
JPH0629459A (ja) * 1992-07-08 1994-02-04 Mitsubishi Electric Corp 半導体装置およびその製造方法
US5327324A (en) * 1993-11-05 1994-07-05 Ford Motor Company Spring clip for a heat sink apparatus
US5422790A (en) * 1994-02-18 1995-06-06 Chen; Pao-Chin Computer chip mounting hardware for heat dissipation
KR0126781Y1 (ko) * 1994-08-23 1999-05-01 이형도 반도체소자 방열장치
US5731955A (en) * 1996-02-05 1998-03-24 Ford Motor Company Spring clip for electronics assembly
US5847928A (en) * 1996-07-09 1998-12-08 Thermalloy, Inc. Strap spring for attaching heat sinks to circuit boards
US6465728B1 (en) * 1998-03-06 2002-10-15 Rockwell Automation Technologies, Inc. Spring clip for electronic device and heat sink assembly
US6310776B1 (en) * 1999-03-01 2001-10-30 Vincent Byrne Transverse mountable heat sink for use in an electronic device
US6201699B1 (en) * 1999-03-01 2001-03-13 Lucent Technologies Inc. Transverse mountable heat sink for use in an electronic device
TW534367U (en) * 2000-04-05 2003-05-21 Foxconn Prec Components Co Ltd Heat dissipation device assembly
US7021365B2 (en) * 2002-08-15 2006-04-04 Valere Power, Inc. Component to heat sink spring clip method and apparatus
US7477524B2 (en) * 2005-03-02 2009-01-13 Woodward Governor Company Retainer and method for holding a circuit card against a clamping surface of a chassis or heatsink
US7630204B2 (en) * 2005-03-28 2009-12-08 Sandisk Il Ltd. Detachable device holder
US20070165380A1 (en) * 2006-01-16 2007-07-19 Cheng-Tien Lai Memory module assembly including a clip for mounting a heat sink thereon
US7750252B2 (en) * 2006-03-29 2010-07-06 American Power Conversion Corporation Apparatus and method for limiting noise and smoke emissions due to failure of electronic devices or assemblies
CN201171048Y (zh) * 2008-03-26 2008-12-24 吴力航 一种芯片散热器用双弹簧型夹持结构
US8893770B2 (en) 2011-07-29 2014-11-25 Schneider Electric It Corporation Heat sink assembly for electronic components
US20160057891A1 (en) * 2013-05-03 2016-02-25 Schneider Electric USA, Inc. Heat sink and method of assemblying
CN106541495A (zh) * 2016-12-14 2017-03-29 刘志林 地铁盾构隧道预埋件固定弹簧及固定方法
CN106535543A (zh) * 2017-01-05 2017-03-22 科蒂斯技术（苏州）有限公司 控制器晶体管的固定装置
DE102019107280A1 (de) * 2019-03-21 2020-09-24 apt Extrusions GmbH & Co. KG Kühleinrichtung zur Kühlung eines zu kühlenden Drittgegenstands

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3519889A (en) * 1967-11-06 1970-07-07 Motorola Inc Assembly with transistor heat dissipation
DE3331207A1 (de) * 1983-08-30 1985-03-07 Robert Bosch Gmbh, 7000 Stuttgart Baugruppe fuer elektronische steuergeraete
FR2567324B1 (fr) * 1984-07-06 1986-11-28 Telemecanique Electrique Dispositif de montage, pour composant hybride a couche epaisse notamment pour module electronique
DE8526283U1 (de) * 1985-09-13 1985-10-31 Puls Elektronische Stromversorgungen Gmbh, 8000 Muenchen Kühlkörper für elektronische Bauelemente
DE8707370U1 (de) * 1987-05-22 1987-07-23 Ta Triumph-Adler Ag, 8500 Nuernberg, De
US4899255A (en) * 1988-07-25 1990-02-06 Motorola Inc. Heat sink clip and assembly and method of manufacture
US4964198A (en) * 1988-09-21 1990-10-23 Avvid Engineering, Inc. V-shaped clip for attaching a semiconductor device to a heat sink
US4872089A (en) * 1988-12-19 1989-10-03 Motorola Inc. Heat sink assembly for densely packed transistors
US4972294A (en) * 1989-04-03 1990-11-20 Motorola, Inc. Heat sink clip assembly
US5040096A (en) * 1990-06-07 1991-08-13 Aavid Engineering, Inc. High force clip

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19648090A1 (de) * 1996-11-20 1998-05-28 Becker Gmbh Verfahren und Vorrichtung zur Befestigung von elektrischen Bauteilen
DE19648090C2 (de) * 1996-11-20 2000-09-21 Becker Gmbh Verfahren und Anordnung zur Befestigung von elektrischen Bauteilen
DE102010042211A1 (de) * 2010-10-08 2012-04-12 Eta Plus Electronic Gmbh Kühlvorrichtung für Halbleiterbauelemente
EP3057128A1 (de) * 2015-02-11 2016-08-17 Abb Ag Elektronisches installationsgerät der gebäude-installationstechnik

Also Published As

Publication number Publication date
DE4131504A1 (de) 1992-04-16
US5170325A (en) 1992-12-08
DE4131504C2 (de) 1999-12-09

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