DE798762T1 - Automatisiertes Halbleiter-Behandlungsverfahren - Google Patents
Automatisiertes Halbleiter-BehandlungsverfahrenInfo
- Publication number
- DE798762T1 DE798762T1 DE0798762T DE96308916T DE798762T1 DE 798762 T1 DE798762 T1 DE 798762T1 DE 0798762 T DE0798762 T DE 0798762T DE 96308916 T DE96308916 T DE 96308916T DE 798762 T1 DE798762 T1 DE 798762T1
- Authority
- DE
- Germany
- Prior art keywords
- treatment process
- semiconductor treatment
- automated semiconductor
- automated
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
- Y10S414/138—Wafers positioned vertically within cassette
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/622,349 US5784797A (en) | 1994-04-28 | 1996-03-26 | Carrierless centrifugal semiconductor processing system |
| US08/680,463 US5664337A (en) | 1996-03-26 | 1996-07-15 | Automated semiconductor processing systems |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE798762T1 true DE798762T1 (de) | 1998-03-12 |
Family
ID=27089186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE0798762T Pending DE798762T1 (de) | 1996-03-26 | 1996-12-09 | Automatisiertes Halbleiter-Behandlungsverfahren |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5664337A (de) |
| EP (1) | EP0798762A3 (de) |
| DE (1) | DE798762T1 (de) |
Families Citing this family (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6599075B2 (en) * | 1994-04-28 | 2003-07-29 | Semitool, Inc. | Semiconductor wafer processing apparatus |
| EP0757844A1 (de) * | 1994-04-28 | 1997-02-12 | Semitool, Inc. | Verarbeitungssysteme für halbleiter |
| US6447232B1 (en) | 1994-04-28 | 2002-09-10 | Semitool, Inc. | Semiconductor wafer processing apparatus having improved wafer input/output handling system |
| US6799932B2 (en) | 1994-04-28 | 2004-10-05 | Semitool, Inc. | Semiconductor wafer processing apparatus |
| US6942738B1 (en) | 1996-07-15 | 2005-09-13 | Semitool, Inc. | Automated semiconductor processing system |
| US6723174B2 (en) | 1996-03-26 | 2004-04-20 | Semitool, Inc. | Automated semiconductor processing system |
| US6279724B1 (en) | 1997-12-19 | 2001-08-28 | Semitoll Inc. | Automated semiconductor processing system |
| US6203582B1 (en) | 1996-07-15 | 2001-03-20 | Semitool, Inc. | Modular semiconductor workpiece processing tool |
| US6672820B1 (en) | 1996-07-15 | 2004-01-06 | Semitool, Inc. | Semiconductor processing apparatus having linear conveyer system |
| US6645355B2 (en) | 1996-07-15 | 2003-11-11 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
| US6091498A (en) * | 1996-07-15 | 2000-07-18 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
| TW353772B (en) * | 1996-09-09 | 1999-03-01 | Tokyo Electron Ltd | Workpiece relaying apparatus |
| US6736148B2 (en) * | 1997-05-05 | 2004-05-18 | Semitool, Inc. | Automated semiconductor processing system |
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| US6115645A (en) * | 1997-08-18 | 2000-09-05 | Credence Systems Corporation | Semiconductor tester with remote debugging for handler |
| AU6016498A (en) * | 1997-09-30 | 1999-04-23 | Semitool, Inc. | Semiconductor processing apparatus having linear conveyor system |
| KR100616198B1 (ko) | 1998-04-21 | 2006-08-25 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판상에 전기도금하는 전기화학적 증착 시스템 및 방법 |
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| US6672358B2 (en) | 1998-11-06 | 2004-01-06 | Canon Kabushiki Kaisha | Sample processing system |
| AU1242600A (en) * | 1998-11-06 | 2000-05-29 | Salter Labs | Nebulizer mouthpiece and accessories |
| TW484184B (en) | 1998-11-06 | 2002-04-21 | Canon Kk | Sample separating apparatus and method, and substrate manufacturing method |
| JP2000150836A (ja) * | 1998-11-06 | 2000-05-30 | Canon Inc | 試料の処理システム |
| US6969682B2 (en) * | 1999-01-22 | 2005-11-29 | Semitool, Inc. | Single workpiece processing system |
| US7217325B2 (en) * | 1999-01-22 | 2007-05-15 | Semitool, Inc. | System for processing a workpiece |
| US7192494B2 (en) | 1999-03-05 | 2007-03-20 | Applied Materials, Inc. | Method and apparatus for annealing copper films |
| US6370791B1 (en) * | 2000-03-10 | 2002-04-16 | Semitool, Inc. | Processing machine with lockdown rotor |
| US20040079633A1 (en) * | 2000-07-05 | 2004-04-29 | Applied Materials, Inc. | Apparatus for electro chemical deposition of copper metallization with the capability of in-situ thermal annealing |
| AU2001268656A1 (en) * | 2000-07-07 | 2002-01-21 | Semitool, Inc. | Automated processing system |
| US6427359B1 (en) * | 2001-07-16 | 2002-08-06 | Semitool, Inc. | Systems and methods for processing workpieces |
| US6691720B2 (en) | 2001-07-16 | 2004-02-17 | Semitool, Inc. | Multi-process system with pivoting process chamber |
| US20040025901A1 (en) * | 2001-07-16 | 2004-02-12 | Semitool, Inc. | Stationary wafer spin/spray processor |
| US6668844B2 (en) | 2001-07-16 | 2003-12-30 | Semitool, Inc. | Systems and methods for processing workpieces |
| WO2003008114A1 (en) * | 2001-07-16 | 2003-01-30 | Semitool, Inc. | Systems and methods for processing workpieces |
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| WO2003061830A1 (en) * | 2002-01-25 | 2003-07-31 | Thermo Crs Ltd. | Modular robotic system for sample processing |
| US7114903B2 (en) * | 2002-07-16 | 2006-10-03 | Semitool, Inc. | Apparatuses and method for transferring and/or pre-processing microelectronic workpieces |
| JP3865703B2 (ja) * | 2002-10-25 | 2007-01-10 | ファナック株式会社 | 物品搬送システム及び搬送方法 |
| US7289734B2 (en) * | 2002-12-24 | 2007-10-30 | Tropic Networks Inc. | Method and system for multi-level power management in an optical network |
| US7611318B2 (en) | 2003-01-27 | 2009-11-03 | Applied Materials, Inc. | Overhead transfer flange and support for suspending a substrate carrier |
| US7473339B2 (en) * | 2003-04-18 | 2009-01-06 | Applied Materials, Inc. | Slim cell platform plumbing |
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| US7597319B2 (en) * | 2005-05-20 | 2009-10-06 | Hewlett-Packard Development Company, L.P. | Sheet handling using a ramp and grippers on an endless belt |
| US7958650B2 (en) * | 2006-01-23 | 2011-06-14 | Turatti S.R.L. | Apparatus for drying foodstuffs |
| US20070080613A1 (en) * | 2006-09-20 | 2007-04-12 | Sterlite Optical Technologies Ltd | Storage and transportation device for storing and transporting optical fiber preform and precursors thereof |
| US20080155852A1 (en) * | 2006-12-29 | 2008-07-03 | Olgado Donald J K | Multiple substrate vapor drying systems and methods |
| KR101181560B1 (ko) * | 2008-09-12 | 2012-09-10 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 그것에 사용되는 기판반송장치 |
| JP2014038929A (ja) * | 2012-08-15 | 2014-02-27 | Disco Abrasive Syst Ltd | インラインシステム |
| JP6275155B2 (ja) | 2012-11-28 | 2018-02-07 | エーシーエム リサーチ （シャンハイ） インコーポレーテッド | 半導体ウェハ洗浄方法及び半導体ウェハ洗浄装置 |
| US10406562B2 (en) * | 2017-07-21 | 2019-09-10 | Applied Materials, Inc. | Automation for rotary sorters |
| CN112518804B (zh) * | 2021-01-14 | 2022-10-11 | 重庆云海机械制造有限公司 | 一种机械手臂高效自动清洁装置 |
| CN112794067B (zh) * | 2021-01-22 | 2022-04-19 | 深圳市晶科鑫实业有限公司 | 一种具有停振检测功能的车载晶体烧录装置 |
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| US5489341A (en) * | 1993-08-23 | 1996-02-06 | Semitool, Inc. | Semiconductor processing with non-jetting fluid stream discharge array |
| EP0757844A1 (de) | 1994-04-28 | 1997-02-12 | Semitool, Inc. | Verarbeitungssysteme für halbleiter |
| WO1995030239A2 (en) | 1994-04-28 | 1995-11-09 | Semitool, Incorporated | Semiconductor processing system with wafer container docking and loading station |
| US5544421A (en) | 1994-04-28 | 1996-08-13 | Semitool, Inc. | Semiconductor wafer processing system |
-
1996
- 1996-07-15 US US08/680,463 patent/US5664337A/en not_active Expired - Lifetime
- 1996-12-09 EP EP96308916A patent/EP0798762A3/de not_active Withdrawn
- 1996-12-09 DE DE0798762T patent/DE798762T1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US5664337A (en) | 1997-09-09 |
| EP0798762A3 (de) | 1998-01-07 |
| EP0798762A2 (de) | 1997-10-01 |
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