DE69942913D1 - Verfahren und gerät zum entwickeln von fotoresistmustern - Google Patents
Verfahren und gerät zum entwickeln von fotoresistmusternInfo
- Publication number
- DE69942913D1 DE69942913D1 DE69942913T DE69942913T DE69942913D1 DE 69942913 D1 DE69942913 D1 DE 69942913D1 DE 69942913 T DE69942913 T DE 69942913T DE 69942913 T DE69942913 T DE 69942913T DE 69942913 D1 DE69942913 D1 DE 69942913D1
- Authority
- DE
- Germany
- Prior art keywords
- manifold
- fluid
- developer
- rinse
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/02—Spray pistols; Apparatus for discharge
- B05B7/08—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point
- B05B7/0884—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point the outlet orifices for jets constituted by a liquid or a mixture containing a liquid being aligned
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10073898P | 1998-09-17 | 1998-09-17 | |
US09/221,060 US6248171B1 (en) | 1998-09-17 | 1998-12-28 | Yield and line width performance for liquid polymers and other materials |
PCT/US1999/020115 WO2000016163A2 (en) | 1998-09-17 | 1999-09-01 | Method and apparatus for developing photoresist patterns |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69942913D1 true DE69942913D1 (de) | 2010-12-16 |
Family
ID=26797493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69942913T Expired - Lifetime DE69942913D1 (de) | 1998-09-17 | 1999-09-01 | Verfahren und gerät zum entwickeln von fotoresistmustern |
Country Status (9)
Country | Link |
---|---|
US (6) | US6248171B1 (de) |
EP (1) | EP1114355B8 (de) |
JP (1) | JP3708437B2 (de) |
KR (1) | KR100560180B1 (de) |
AT (1) | ATE487164T1 (de) |
AU (1) | AU5802399A (de) |
DE (1) | DE69942913D1 (de) |
TW (1) | TWI249657B (de) |
WO (1) | WO2000016163A2 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6248171B1 (en) * | 1998-09-17 | 2001-06-19 | Silicon Valley Group, Inc. | Yield and line width performance for liquid polymers and other materials |
US6689215B2 (en) | 1998-09-17 | 2004-02-10 | Asml Holdings, N.V. | Method and apparatus for mitigating cross-contamination between liquid dispensing jets in close proximity to a surface |
US6746826B1 (en) | 2000-07-25 | 2004-06-08 | Asml Holding N.V. | Method for an improved developing process in wafer photolithography |
AU2002334796A1 (en) * | 2001-10-03 | 2003-04-14 | Silicon Valley Group, Inc. | Method and apparatus for mitigating cross-contamination between liquid dispensing jets in close proximity to a surface |
US7389783B2 (en) * | 2002-09-30 | 2008-06-24 | Lam Research Corporation | Proximity meniscus manifold |
US6770424B2 (en) | 2002-12-16 | 2004-08-03 | Asml Holding N.V. | Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms |
KR100562302B1 (ko) * | 2003-12-27 | 2006-03-22 | 동부아남반도체 주식회사 | 멀티 화학액 처리 단계를 이용한 랜덤 폴리머 제거 방법 |
EP1950584B1 (de) | 2007-01-26 | 2009-04-22 | Sick Ag | Optoelektronischer Sensor und Empfangsverfahren mit Störlichtkorrektur |
TWI409597B (zh) * | 2010-08-06 | 2013-09-21 | Inotera Memories Inc | 用於減少顯影劑用量之顯影劑噴灑裝置 |
US9120190B2 (en) | 2011-11-30 | 2015-09-01 | Palo Alto Research Center Incorporated | Co-extruded microchannel heat pipes |
US10371468B2 (en) | 2011-11-30 | 2019-08-06 | Palo Alto Research Center Incorporated | Co-extruded microchannel heat pipes |
US8875653B2 (en) * | 2012-02-10 | 2014-11-04 | Palo Alto Research Center Incorporated | Micro-extrusion printhead with offset orifices for generating gridlines on non-square substrates |
JP6300477B2 (ja) | 2012-09-20 | 2018-03-28 | 花王株式会社 | 皮膚又は毛髪用洗浄剤組成物 |
JP6235843B2 (ja) | 2012-09-20 | 2017-11-22 | 花王株式会社 | 皮膚又は毛髪用洗浄剤組成物 |
US9573144B2 (en) * | 2014-05-30 | 2017-02-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Coating apparatus and method of forming coating film |
KR101593019B1 (ko) | 2015-11-05 | 2016-02-11 | 고진우 | 불빛이 나오는 인테리어 장식판 |
US10203606B1 (en) * | 2017-11-22 | 2019-02-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for dispensing developer onto semiconductor substrate |
CN112965347B (zh) * | 2020-11-12 | 2023-11-03 | 重庆康佳光电科技有限公司 | 晶圆显影装置、方法和晶圆 |
US11747729B2 (en) * | 2021-03-19 | 2023-09-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor developer tool and methods of operation |
CN113772246A (zh) * | 2021-09-10 | 2021-12-10 | 贵州聚材科技有限公司 | 可以同时多点涂布储光与反光涂层的装置及其使用方法 |
Family Cites Families (75)
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US2295522A (en) * | 1940-09-12 | 1942-09-08 | Linde Air Prod Co | Blowpipe head |
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US2501724A (en) * | 1946-02-15 | 1950-03-28 | Air Reduction | Apparatus for thermochemically cutting metal |
US3204682A (en) * | 1963-08-26 | 1965-09-07 | American Gas Furnace Co | Oxy-gas blowpipe |
US3516607A (en) * | 1968-08-02 | 1970-06-23 | Westvaco Corp | Steam application system |
US4326553A (en) | 1980-08-28 | 1982-04-27 | Rca Corporation | Megasonic jet cleaner apparatus |
JPS57198457A (en) | 1981-06-01 | 1982-12-06 | Nec Corp | Developing method for photoresist |
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JPS58111318A (ja) | 1981-12-25 | 1983-07-02 | Hitachi Ltd | 現像方法 |
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US4457259A (en) | 1983-03-14 | 1984-07-03 | Rca Corporation | Apparatus for spraying a liquid on a spinning surface |
DE3346979A1 (de) * | 1983-12-24 | 1985-07-04 | Merck Patent Gmbh, 6100 Darmstadt | Entwickler fuer positivfotoresists |
US4721252A (en) * | 1985-02-22 | 1988-01-26 | Slautterback Corporation | Hot-melt sputtering apparatus |
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JP3227642B2 (ja) | 1995-10-13 | 2001-11-12 | 東京エレクトロン株式会社 | 塗布装置 |
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JPH10303106A (ja) | 1997-04-30 | 1998-11-13 | Toshiba Corp | 現像処理装置およびその処理方法 |
JP3265238B2 (ja) | 1997-08-01 | 2002-03-11 | 東京エレクトロン株式会社 | 液膜形成装置及びその方法 |
US6062240A (en) | 1998-03-06 | 2000-05-16 | Tokyo Electron Limited | Treatment device |
KR20010013818A (ko) | 1998-04-15 | 2001-02-26 | 게스레이 마크 | 포토레지스트 현상액 및 현상 방법 |
JPH11307433A (ja) | 1998-04-23 | 1999-11-05 | Dainippon Screen Mfg Co Ltd | 現像装置および現像方法 |
JP3665715B2 (ja) | 1998-09-09 | 2005-06-29 | 東京エレクトロン株式会社 | 現像方法及び現像装置 |
US6689215B2 (en) * | 1998-09-17 | 2004-02-10 | Asml Holdings, N.V. | Method and apparatus for mitigating cross-contamination between liquid dispensing jets in close proximity to a surface |
US6248171B1 (en) * | 1998-09-17 | 2001-06-19 | Silicon Valley Group, Inc. | Yield and line width performance for liquid polymers and other materials |
US6159662A (en) | 1999-05-17 | 2000-12-12 | Taiwan Semiconductor Manufacturing Company | Photoresist development method with reduced cycle time and improved performance |
US6384894B2 (en) * | 2000-01-21 | 2002-05-07 | Tokyo Electron Limited | Developing method and developing unit |
US6746826B1 (en) * | 2000-07-25 | 2004-06-08 | Asml Holding N.V. | Method for an improved developing process in wafer photolithography |
-
1998
- 1998-12-28 US US09/221,060 patent/US6248171B1/en not_active Expired - Lifetime
-
1999
- 1999-09-01 AU AU58023/99A patent/AU5802399A/en not_active Abandoned
- 1999-09-01 KR KR1020017001889A patent/KR100560180B1/ko not_active IP Right Cessation
- 1999-09-01 AT AT99945422T patent/ATE487164T1/de not_active IP Right Cessation
- 1999-09-01 DE DE69942913T patent/DE69942913D1/de not_active Expired - Lifetime
- 1999-09-01 JP JP2000570638A patent/JP3708437B2/ja not_active Expired - Fee Related
- 1999-09-01 WO PCT/US1999/020115 patent/WO2000016163A2/en active IP Right Grant
- 1999-09-01 EP EP99945422A patent/EP1114355B8/de not_active Expired - Lifetime
- 1999-09-14 TW TW088115847A patent/TWI249657B/zh not_active IP Right Cessation
-
2001
- 2001-03-05 US US09/800,060 patent/US6669779B2/en not_active Expired - Lifetime
-
2003
- 2003-09-16 US US10/664,095 patent/US7255975B2/en not_active Expired - Lifetime
-
2004
- 2004-12-07 US US11/006,876 patent/US7208262B2/en not_active Expired - Lifetime
-
2006
- 2006-11-08 US US11/595,452 patent/US7625692B2/en not_active Expired - Fee Related
- 2006-11-22 US US11/604,130 patent/US20070089671A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
KR20010089163A (ko) | 2001-09-29 |
ATE487164T1 (de) | 2010-11-15 |
US7255975B2 (en) | 2007-08-14 |
JP3708437B2 (ja) | 2005-10-19 |
WO2000016163A2 (en) | 2000-03-23 |
EP1114355A2 (de) | 2001-07-11 |
US7208262B2 (en) | 2007-04-24 |
AU5802399A (en) | 2000-04-03 |
WO2000016163A3 (en) | 2000-09-08 |
US20070089671A1 (en) | 2007-04-26 |
TWI249657B (en) | 2006-02-21 |
US20040062876A1 (en) | 2004-04-01 |
US7625692B2 (en) | 2009-12-01 |
EP1114355B8 (de) | 2011-01-19 |
US6248171B1 (en) | 2001-06-19 |
JP2002525653A (ja) | 2002-08-13 |
EP1114355B1 (de) | 2010-11-03 |
US20050095368A1 (en) | 2005-05-05 |
US20020187442A1 (en) | 2002-12-12 |
US6669779B2 (en) | 2003-12-30 |
KR100560180B1 (ko) | 2006-03-13 |
US20070059651A1 (en) | 2007-03-15 |
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