DE69935277D1 - Flüssigkristall-Polymerfilm, Laminat und Verfahren zur Herstellung dieser und bauteilbestückter Multilayerleiterplatte - Google Patents

Flüssigkristall-Polymerfilm, Laminat und Verfahren zur Herstellung dieser und bauteilbestückter Multilayerleiterplatte

Info

Publication number
DE69935277D1
DE69935277D1 DE69935277T DE69935277T DE69935277D1 DE 69935277 D1 DE69935277 D1 DE 69935277D1 DE 69935277 T DE69935277 T DE 69935277T DE 69935277 T DE69935277 T DE 69935277T DE 69935277 D1 DE69935277 D1 DE 69935277D1
Authority
DE
Germany
Prior art keywords
componentized
laminate
making
liquid crystal
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69935277T
Other languages
English (en)
Other versions
DE69935277T2 (de
Inventor
Minoru Onodera
Yoshinobu Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kuraray Co Ltd
Original Assignee
Kuraray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuraray Co Ltd filed Critical Kuraray Co Ltd
Publication of DE69935277D1 publication Critical patent/DE69935277D1/de
Application granted granted Critical
Publication of DE69935277T2 publication Critical patent/DE69935277T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/02—Thermal after-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]
DE1999635277 1998-04-06 1999-03-31 Flüssigkristall-Polymerfilm, Laminat und Verfahren zur Herstellung dieser und bauteilbestückter Multilayerleiterplatte Expired - Lifetime DE69935277T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP9329998 1998-04-06
JP9329998 1998-04-06
JP4814199 1999-02-25
JP4814199A JP2000044797A (ja) 1998-04-06 1999-02-25 液晶ポリマ―フィルムと積層体及びそれらの製造方法並びに多層実装回路基板

Publications (2)

Publication Number Publication Date
DE69935277D1 true DE69935277D1 (de) 2007-04-12
DE69935277T2 DE69935277T2 (de) 2007-10-31

Family

ID=26388366

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1999635277 Expired - Lifetime DE69935277T2 (de) 1998-04-06 1999-03-31 Flüssigkristall-Polymerfilm, Laminat und Verfahren zur Herstellung dieser und bauteilbestückter Multilayerleiterplatte

Country Status (8)

Country Link
US (1) US6274242B1 (de)
EP (1) EP0951206B1 (de)
JP (1) JP2000044797A (de)
KR (1) KR100349952B1 (de)
CN (1) CN1206317C (de)
DE (1) DE69935277T2 (de)
HK (1) HK1023256A1 (de)
TW (1) TW436510B (de)

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CN112969585A (zh) * 2018-11-08 2021-06-15 株式会社可乐丽 热塑性液晶聚合物膜和使用该膜的电路基板
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CN111808616A (zh) * 2019-04-12 2020-10-23 佳胜科技股份有限公司 改质液晶高分子的制作方法、液晶高分子组合物及改变液晶高分子的熔点的方法
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Also Published As

Publication number Publication date
EP0951206A3 (de) 1999-11-17
HK1023256A1 (en) 2000-09-01
CN1206317C (zh) 2005-06-15
KR100349952B1 (ko) 2002-08-22
EP0951206A2 (de) 1999-10-20
EP0951206B1 (de) 2007-02-28
CN1232860A (zh) 1999-10-27
KR19990082889A (ko) 1999-11-25
JP2000044797A (ja) 2000-02-15
TW436510B (en) 2001-05-28
US6274242B1 (en) 2001-08-14
DE69935277T2 (de) 2007-10-31

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