DE69934022D1 - Apparat und methode, substrate zu kühlen - Google Patents

Apparat und methode, substrate zu kühlen

Info

Publication number
DE69934022D1
DE69934022D1 DE69934022T DE69934022T DE69934022D1 DE 69934022 D1 DE69934022 D1 DE 69934022D1 DE 69934022 T DE69934022 T DE 69934022T DE 69934022 T DE69934022 T DE 69934022T DE 69934022 D1 DE69934022 D1 DE 69934022D1
Authority
DE
Germany
Prior art keywords
cool substrate
cool
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69934022T
Other languages
English (en)
Other versions
DE69934022T2 (de
Inventor
Ivo Raaijmakers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM America Inc
Original Assignee
ASM America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM America Inc filed Critical ASM America Inc
Application granted granted Critical
Publication of DE69934022D1 publication Critical patent/DE69934022D1/de
Publication of DE69934022T2 publication Critical patent/DE69934022T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/56—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/10—Heating of the reaction chamber or the substrate
DE69934022T 1998-09-10 1999-08-26 Apparat und methode, substrate zu kühlen Expired - Fee Related DE69934022T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US150986 1998-09-10
US09/150,986 US6108937A (en) 1998-09-10 1998-09-10 Method of cooling wafers
PCT/US1999/019687 WO2000016380A1 (en) 1998-09-10 1999-08-26 Method and apparatus for cooling substrates

Publications (2)

Publication Number Publication Date
DE69934022D1 true DE69934022D1 (de) 2006-12-28
DE69934022T2 DE69934022T2 (de) 2007-06-28

Family

ID=22536844

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69934022T Expired - Fee Related DE69934022T2 (de) 1998-09-10 1999-08-26 Apparat und methode, substrate zu kühlen

Country Status (8)

Country Link
US (3) US6108937A (de)
EP (1) EP1116261B1 (de)
JP (1) JP3632126B2 (de)
KR (1) KR100613171B1 (de)
AU (1) AU6131599A (de)
DE (1) DE69934022T2 (de)
TW (1) TW449772B (de)
WO (1) WO2000016380A1 (de)

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EP1116261B1 (de) 2006-11-15
KR100613171B1 (ko) 2006-08-17
JP2002525848A (ja) 2002-08-13
JP3632126B2 (ja) 2005-03-23
KR20010086378A (ko) 2001-09-10
US20050229855A1 (en) 2005-10-20
TW449772B (en) 2001-08-11
DE69934022T2 (de) 2007-06-28
AU6131599A (en) 2000-04-03
WO2000016380A1 (en) 2000-03-23
US6108937A (en) 2000-08-29
US6209220B1 (en) 2001-04-03
EP1116261A1 (de) 2001-07-18

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