DE69931057D1 - Transfer arm - Google Patents
Transfer armInfo
- Publication number
- DE69931057D1 DE69931057D1 DE69931057T DE69931057T DE69931057D1 DE 69931057 D1 DE69931057 D1 DE 69931057D1 DE 69931057 T DE69931057 T DE 69931057T DE 69931057 T DE69931057 T DE 69931057T DE 69931057 D1 DE69931057 D1 DE 69931057D1
- Authority
- DE
- Germany
- Prior art keywords
- transfer arm
- arm
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
- B25J9/1065—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
- B25J9/107—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms of the froglegs type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20305—Robotic arm
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20305—Robotic arm
- Y10T74/20329—Joint between elements
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22361398 | 1998-07-22 | ||
JP22361398 | 1998-07-22 | ||
PCT/JP1999/003921 WO2000005762A1 (fr) | 1998-07-22 | 1999-07-22 | Bras de transfert |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69931057D1 true DE69931057D1 (en) | 2006-06-01 |
DE69931057T2 DE69931057T2 (de) | 2006-11-23 |
Family
ID=16800952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69931057T Expired - Fee Related DE69931057T2 (de) | 1998-07-22 | 1999-07-22 | Transfer arm |
Country Status (5)
Country | Link |
---|---|
US (2) | US6575691B1 (de) |
EP (1) | EP1113491B1 (de) |
KR (1) | KR100532531B1 (de) |
DE (1) | DE69931057T2 (de) |
WO (1) | WO2000005762A1 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020182036A1 (en) * | 2001-06-04 | 2002-12-05 | Applied Materials, Inc. | Semiconductor wafer handling robot for linear transfer chamber |
JP4000036B2 (ja) * | 2002-09-30 | 2007-10-31 | 東京エレクトロン株式会社 | 搬送装置 |
US6892618B2 (en) * | 2003-08-06 | 2005-05-17 | Chang Chin-Chin | Circular sawing machine having a link mechanism |
DE102005052443A1 (de) * | 2005-11-03 | 2007-05-10 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Roboterarm sowie Roboter-Tragstruktur |
TW200900210A (en) * | 2006-11-09 | 2009-01-01 | Ihi Corp | Frog-leg arm robot and control method thereof |
TWI398335B (zh) * | 2006-11-27 | 2013-06-11 | Nidec Sankyo Corp | Workpiece conveying system |
KR101071606B1 (ko) * | 2007-04-05 | 2011-10-10 | 가부시키가이샤 알박 | 반송 장치 |
US8414246B2 (en) * | 2007-06-06 | 2013-04-09 | Cycogs, Llc | Modular hybrid snake arm |
US20090088912A1 (en) * | 2007-09-28 | 2009-04-02 | Anorad Corporation | Linear driven x-z robot |
CN103192372B (zh) * | 2012-01-06 | 2015-03-11 | 沈阳新松机器人自动化股份有限公司 | 连杆型机械手 |
DE102012201059A1 (de) * | 2012-01-25 | 2013-07-25 | Krones Ag | Eine Vorrichtung und ein Verfahren zum Ausleiten von Produkten, insbesondere Füllgutbehältern wie Flaschen |
FR3032698B1 (fr) * | 2015-02-13 | 2022-10-14 | Sidel Participations | "dispositif de convoyage de recipients comportant un organe de prehension mobile transversalement a la direction de deplacement" |
KR20210069029A (ko) * | 2018-06-27 | 2021-06-10 | 팹웍스 솔루션스 인코포레이티드 | 엘보 하드 스톱을 구비한 로봇식 아암 조립체 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4666366A (en) | 1983-02-14 | 1987-05-19 | Canon Kabushiki Kaisha | Articulated arm transfer device |
GB2145691B (en) * | 1983-08-29 | 1987-06-03 | Toshiba Kk | Extendible and contractable arms |
JP2588418B2 (ja) * | 1988-03-31 | 1997-03-05 | 新明和工業株式会社 | 3次元マニピュレータ |
JPH0236083A (ja) * | 1988-07-22 | 1990-02-06 | Kiyouhou Seisakusho:Kk | パンタグラフ型ロボットアーム |
US5227708A (en) | 1989-10-20 | 1993-07-13 | Applied Materials, Inc. | Two-axis magnetically coupled robot |
US5180276A (en) | 1991-04-18 | 1993-01-19 | Brooks Automation, Inc. | Articulated arm transfer device |
JPH04331090A (ja) * | 1991-04-24 | 1992-11-18 | Tokyo Electron Ltd | 搬送装置 |
JP2972008B2 (ja) * | 1991-11-07 | 1999-11-08 | 東京エレクトロン株式会社 | 搬送アーム |
JPH06132380A (ja) * | 1992-09-04 | 1994-05-13 | Fujitsu Ltd | 搬送装置 |
GB2298934B (en) * | 1993-11-22 | 1998-03-25 | Sony Corp | Multi-articulate arm type transport device |
AU1290497A (en) | 1995-12-15 | 1997-07-03 | Brooks Automation, Inc. | Wide wrist articulated arm transfer device |
JP3769802B2 (ja) * | 1996-02-09 | 2006-04-26 | 株式会社日立製作所 | 半導体装置の製造方法 |
JPH09216182A (ja) * | 1996-02-14 | 1997-08-19 | Hitachi Tokyo Electron Co Ltd | 多関節ロボットおよびその駆動方法ならびにロボットアームの位置検出装置 |
JPH09254061A (ja) * | 1996-03-15 | 1997-09-30 | Komatsu Ltd | ハンドリング用ロボット |
-
1999
- 1999-07-22 US US09/744,175 patent/US6575691B1/en not_active Expired - Fee Related
- 1999-07-22 DE DE69931057T patent/DE69931057T2/de not_active Expired - Fee Related
- 1999-07-22 EP EP99931482A patent/EP1113491B1/de not_active Expired - Lifetime
- 1999-07-22 KR KR10-2001-7000784A patent/KR100532531B1/ko not_active IP Right Cessation
- 1999-07-22 WO PCT/JP1999/003921 patent/WO2000005762A1/ja active IP Right Grant
-
2003
- 2003-04-18 US US10/418,048 patent/US6884019B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6884019B2 (en) | 2005-04-26 |
EP1113491B1 (de) | 2006-04-26 |
EP1113491A1 (de) | 2001-07-04 |
US20030190224A1 (en) | 2003-10-09 |
US6575691B1 (en) | 2003-06-10 |
WO2000005762A1 (fr) | 2000-02-03 |
KR100532531B1 (ko) | 2005-11-30 |
EP1113491A4 (de) | 2004-05-12 |
DE69931057T2 (de) | 2006-11-23 |
KR20010053569A (ko) | 2001-06-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |