DE69927228D1 - Verfahren und Vorrichtung zum Aufbringen eines Szintillationsmaterials auf eine Strahlungs-Bildaufnahmevorrichtung - Google Patents

Verfahren und Vorrichtung zum Aufbringen eines Szintillationsmaterials auf eine Strahlungs-Bildaufnahmevorrichtung

Info

Publication number
DE69927228D1
DE69927228D1 DE69927228T DE69927228T DE69927228D1 DE 69927228 D1 DE69927228 D1 DE 69927228D1 DE 69927228 T DE69927228 T DE 69927228T DE 69927228 T DE69927228 T DE 69927228T DE 69927228 D1 DE69927228 D1 DE 69927228D1
Authority
DE
Germany
Prior art keywords
applying
imaging device
radiation imaging
scintillation material
scintillation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69927228T
Other languages
English (en)
Other versions
DE69927228T2 (de
Inventor
Reinhold Franz Wirth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Application granted granted Critical
Publication of DE69927228D1 publication Critical patent/DE69927228D1/de
Publication of DE69927228T2 publication Critical patent/DE69927228T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0232Optical elements or arrangements associated with the device
    • H01L31/02322Optical elements or arrangements associated with the device comprising luminescent members, e.g. fluorescent sheets upon the device
DE69927228T 1998-11-19 1999-11-19 Verfahren und Vorrichtung zum Aufbringen eines Szintillationsmaterials auf eine Strahlungs-Bildaufnahmevorrichtung Expired - Fee Related DE69927228T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/195,656 US6146489A (en) 1998-11-19 1998-11-19 Method and apparatus for depositing scintillator material on radiation imager
US195656 1998-11-19

Publications (2)

Publication Number Publication Date
DE69927228D1 true DE69927228D1 (de) 2005-10-20
DE69927228T2 DE69927228T2 (de) 2006-06-29

Family

ID=22722225

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69927228T Expired - Fee Related DE69927228T2 (de) 1998-11-19 1999-11-19 Verfahren und Vorrichtung zum Aufbringen eines Szintillationsmaterials auf eine Strahlungs-Bildaufnahmevorrichtung

Country Status (5)

Country Link
US (1) US6146489A (de)
EP (1) EP1003226B1 (de)
JP (1) JP2000180556A (de)
CA (1) CA2288468C (de)
DE (1) DE69927228T2 (de)

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US6589382B2 (en) * 2001-11-26 2003-07-08 Eastman Kodak Company Aligning mask segments to provide a stitched mask for producing OLED devices
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US6642524B2 (en) * 2002-01-09 2003-11-04 Ge Medical Systems Global Technology Company, Llc Scintillator sealing for solid state X-ray detector
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CN1953802B (zh) 2004-01-26 2011-10-19 哈佛大学 流体递送系统和方法
US8030057B2 (en) * 2004-01-26 2011-10-04 President And Fellows Of Harvard College Fluid delivery system and method
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US7608837B2 (en) 2006-11-24 2009-10-27 Tower Semiconductor Ltd. High resolution integrated X-ray CMOS image sensor
US8202492B2 (en) 2007-05-04 2012-06-19 Opko Diagnostics, Llc Fluidic connectors and microfluidic systems
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US8105499B2 (en) * 2008-07-14 2012-01-31 International Business Macines Corporation Transmission electron microscopy sample etching fixture
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KR102104688B1 (ko) * 2012-04-19 2020-05-29 인테벡, 인코포레이티드 태양 전지 제조를 위한 이중 마스크 장치
US10679883B2 (en) * 2012-04-19 2020-06-09 Intevac, Inc. Wafer plate and mask arrangement for substrate fabrication
US10062600B2 (en) 2012-04-26 2018-08-28 Intevac, Inc. System and method for bi-facial processing of substrates
PT2852469T (pt) 2012-04-26 2019-07-31 Intevac Inc Arquitetura de sistema para processamento sob vácuo
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US9490153B2 (en) 2013-07-26 2016-11-08 Varian Semiconductor Equipment Associates, Inc. Mechanical alignment of substrates to a mask
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US20170172181A9 (en) * 2014-09-19 2017-06-22 Ginny G McCormick Stencil holder apparatus and method
CN107206376B (zh) 2014-12-12 2021-07-09 欧普科诊断有限责任公司 包括通过模塑形成之流控系统的包含孵育通道的流控系统
US10036814B2 (en) * 2015-07-23 2018-07-31 General Electric Company X-ray detector with directly applied scintillator
USD804682S1 (en) 2015-08-10 2017-12-05 Opko Diagnostics, Llc Multi-layered sample cassette
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US3678892A (en) * 1970-05-19 1972-07-25 Western Electric Co Pallet and mask for substrates
US5463225A (en) * 1992-06-01 1995-10-31 General Electric Company Solid state radiation imager with high integrity barrier layer and method of fabricating
JPH09297181A (ja) * 1996-05-07 1997-11-18 Canon Inc 放射線撮像装置
FR2758630B1 (fr) * 1997-01-21 1999-04-09 Thomson Tubes Electroniques Procede de scellement etanche d'un detecteur de rayonnement a l'etat solide et detecteur obtenu par ce procede

Also Published As

Publication number Publication date
DE69927228T2 (de) 2006-06-29
CA2288468A1 (en) 2000-05-19
EP1003226A2 (de) 2000-05-24
CA2288468C (en) 2006-10-17
JP2000180556A (ja) 2000-06-30
EP1003226B1 (de) 2005-09-14
US6146489A (en) 2000-11-14
EP1003226A3 (de) 2000-06-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee