DE69926241D1 - Leiterplatten-verbindungsvorrichtung und herstellungsverfahren - Google Patents

Leiterplatten-verbindungsvorrichtung und herstellungsverfahren

Info

Publication number
DE69926241D1
DE69926241D1 DE69926241T DE69926241T DE69926241D1 DE 69926241 D1 DE69926241 D1 DE 69926241D1 DE 69926241 T DE69926241 T DE 69926241T DE 69926241 T DE69926241 T DE 69926241T DE 69926241 D1 DE69926241 D1 DE 69926241D1
Authority
DE
Germany
Prior art keywords
manufacturing
connecting device
pcb connecting
pcb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69926241T
Other languages
English (en)
Other versions
DE69926241T2 (de
Inventor
N Eldridge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FormFactor Inc filed Critical FormFactor Inc
Application granted granted Critical
Publication of DE69926241D1 publication Critical patent/DE69926241D1/de
Publication of DE69926241T2 publication Critical patent/DE69926241T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0441Details
    • G01R1/0466Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • H01L24/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001Internal layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001Internal layers
    • H01L2224/05005Structure
    • H01L2224/05008Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body, e.g.
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001Internal layers
    • H01L2224/0502Disposition
    • H01L2224/05024Disposition the internal layer being disposed on a redistribution layer on the semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001Internal layers
    • H01L2224/0502Disposition
    • H01L2224/05026Disposition the internal layer being disposed in a recess of the surface
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001Internal layers
    • H01L2224/05075Plural internal layers
    • H01L2224/0508Plural internal layers being stacked
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001Internal layers
    • H01L2224/05099Material
    • H01L2224/051Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0556Disposition
    • H01L2224/05568Disposition the whole external layer protruding from the surface
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0556Disposition
    • H01L2224/05569Disposition the external layer being disposed on a redistribution layer on the semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/05599Material
    • H01L2224/056Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001Core members of the bump connector
    • H01L2224/13099Material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/03Manufacturing methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01019Potassium [K]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01023Vanadium [V]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01027Cobalt [Co]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01051Antimony [Sb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01074Tungsten [W]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/82Coupling devices connected with low or zero insertion force
    • H01R12/85Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
    • H01R12/853Fluid activated
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10568Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00Electrical connectors
    • Y10S439/948Contact or connector with insertion depth limiter
DE69926241T 1998-07-13 1999-01-04 Leiterplatten-verbindungsvorrichtung und herstellungsverfahren Expired - Lifetime DE69926241T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/114,586 US6705876B2 (en) 1998-07-13 1998-07-13 Electrical interconnect assemblies and methods
US114586 1998-07-13
PCT/US1999/000322 WO2000003569A1 (en) 1998-07-13 1999-01-04 Interconnect assembly for printed circuit boards and method of fabrication

Publications (2)

Publication Number Publication Date
DE69926241D1 true DE69926241D1 (de) 2005-08-25
DE69926241T2 DE69926241T2 (de) 2006-04-20

Family

ID=22356165

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69926241T Expired - Lifetime DE69926241T2 (de) 1998-07-13 1999-01-04 Leiterplatten-verbindungsvorrichtung und herstellungsverfahren

Country Status (9)

Country Link
US (4) US6705876B2 (de)
EP (2) EP1097617B1 (de)
JP (2) JP3949377B2 (de)
KR (1) KR100423683B1 (de)
CN (1) CN1203739C (de)
AU (1) AU2107299A (de)
DE (1) DE69926241T2 (de)
TW (1) TW404033B (de)
WO (1) WO2000003569A1 (de)

Families Citing this family (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6705876B2 (en) * 1998-07-13 2004-03-16 Formfactor, Inc. Electrical interconnect assemblies and methods
US7435108B1 (en) * 1999-07-30 2008-10-14 Formfactor, Inc. Variable width resilient conductive contact structures
US6468098B1 (en) * 1999-08-17 2002-10-22 Formfactor, Inc. Electrical contactor especially wafer level contactor using fluid pressure
US6827584B2 (en) * 1999-12-28 2004-12-07 Formfactor, Inc. Interconnect for microelectronic structures with enhanced spring characteristics
US7458816B1 (en) 2000-04-12 2008-12-02 Formfactor, Inc. Shaped spring
US6640432B1 (en) * 2000-04-12 2003-11-04 Formfactor, Inc. Method of fabricating shaped springs
JP4509437B2 (ja) * 2000-09-11 2010-07-21 Hoya株式会社 多層配線基板の製造方法
US7396236B2 (en) 2001-03-16 2008-07-08 Formfactor, Inc. Wafer level interposer
US6627980B2 (en) 2001-04-12 2003-09-30 Formfactor, Inc. Stacked semiconductor device assembly with microelectronic spring contacts
DE10143790B4 (de) * 2001-09-06 2007-08-02 Infineon Technologies Ag Elektronisches Bauteil mit wenigstens einem Halbleiterchip
US6759311B2 (en) 2001-10-31 2004-07-06 Formfactor, Inc. Fan out of interconnect elements attached to semiconductor wafer
US7385821B1 (en) 2001-12-06 2008-06-10 Apple Inc. Cooling method for ICS
US7265565B2 (en) 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
US7363705B2 (en) * 2003-02-04 2008-04-29 Microfabrica, Inc. Method of making a contact
US7273812B2 (en) * 2002-05-07 2007-09-25 Microfabrica Inc. Microprobe tips and methods for making
US7412767B2 (en) * 2003-02-04 2008-08-19 Microfabrica, Inc. Microprobe tips and methods for making
US20050184748A1 (en) * 2003-02-04 2005-08-25 Microfabrica Inc. Pin-type probes for contacting electronic circuits and methods for making such probes
US20050104609A1 (en) * 2003-02-04 2005-05-19 Microfabrica Inc. Microprobe tips and methods for making
US20060238209A1 (en) * 2002-05-07 2006-10-26 Microfabrica Inc. Vertical microprobes for contacting electronic components and method for making such probes
US20060053625A1 (en) * 2002-05-07 2006-03-16 Microfabrica Inc. Microprobe tips and methods for making
US20060006888A1 (en) * 2003-02-04 2006-01-12 Microfabrica Inc. Electrochemically fabricated microprobes
US7640651B2 (en) * 2003-12-31 2010-01-05 Microfabrica Inc. Fabrication process for co-fabricating multilayer probe array and a space transformer
US7531077B2 (en) 2003-02-04 2009-05-12 Microfabrica Inc. Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
US20060051948A1 (en) * 2003-02-04 2006-03-09 Microfabrica Inc. Microprobe tips and methods for making
US6905914B1 (en) 2002-11-08 2005-06-14 Amkor Technology, Inc. Wafer level package and fabrication method
US7723210B2 (en) * 2002-11-08 2010-05-25 Amkor Technology, Inc. Direct-write wafer level chip scale package
US7084650B2 (en) * 2002-12-16 2006-08-01 Formfactor, Inc. Apparatus and method for limiting over travel in a probe card assembly
US8088158B2 (en) * 2002-12-20 2012-01-03 Boston Scientific Scimed, Inc. Radiopaque ePTFE medical devices
US8613846B2 (en) * 2003-02-04 2013-12-24 Microfabrica Inc. Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US9244101B2 (en) * 2003-02-04 2016-01-26 University Of Southern California Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
US7567089B2 (en) * 2003-02-04 2009-07-28 Microfabrica Inc. Two-part microprobes for contacting electronic components and methods for making such probes
US20080106280A1 (en) * 2003-02-04 2008-05-08 Microfabrica Inc. Vertical Microprobes for Contacting Electronic Components and Method for Making Such Probes
US20080211524A1 (en) * 2003-02-04 2008-09-04 Microfabrica Inc. Electrochemically Fabricated Microprobes
TW579104U (en) * 2003-04-09 2004-03-01 Hon Hai Prec Ind Co Ltd Electrical connector
US9671429B2 (en) 2003-05-07 2017-06-06 University Of Southern California Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
TWM249244U (en) * 2003-07-18 2004-11-01 Hon Hai Prec Ind Co Ltd Electrical connector
US7345350B2 (en) 2003-09-23 2008-03-18 Micron Technology, Inc. Process and integration scheme for fabricating conductive components, through-vias and semiconductor components including conductive through-wafer vias
US20080108221A1 (en) * 2003-12-31 2008-05-08 Microfabrica Inc. Microprobe Tips and Methods for Making
US10641792B2 (en) 2003-12-31 2020-05-05 University Of Southern California Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
JP4592292B2 (ja) * 2004-01-16 2010-12-01 株式会社日本マイクロニクス 電気的接続装置
US7282932B2 (en) * 2004-03-02 2007-10-16 Micron Technology, Inc. Compliant contact pin assembly, card system and methods thereof
US7128580B2 (en) * 2004-04-09 2006-10-31 Hon Hai Precision Ind. Co., Ltd. Socket connector with supporting housing protrusions
TWM267656U (en) * 2004-08-20 2005-06-11 Hon Hai Prec Ind Co Ltd Land grid array electrical connector
US7053644B1 (en) * 2004-12-15 2006-05-30 Aehr Test Systems System for testing and burning in of integrated circuits
US7442049B2 (en) * 2005-02-09 2008-10-28 International Business Machines Corporation Electrical connecting device and method of forming same
US7898276B2 (en) * 2005-03-01 2011-03-01 Sv Probe Pte Ltd. Probe card with stacked substrate
JP2006261566A (ja) * 2005-03-18 2006-09-28 Alps Electric Co Ltd 電子部品用ホルダ及び電子部品用保持シート、これらを用いた電子モジュール、電子モジュールの積層体、電子モジュールの製造方法並びに検査方法
JP2006261565A (ja) * 2005-03-18 2006-09-28 Alps Electric Co Ltd 電子機能部品実装体及びその製造方法
JP4036872B2 (ja) * 2005-05-18 2008-01-23 アルプス電気株式会社 半導体装置の製造方法
JP2007053071A (ja) 2005-07-20 2007-03-01 Alps Electric Co Ltd 接続素子および前記接続素子を使用した回路接続装置
US7572681B1 (en) 2005-12-08 2009-08-11 Amkor Technology, Inc. Embedded electronic component package
US7382143B2 (en) * 2006-05-18 2008-06-03 Centipede Systems, Inc. Wafer probe interconnect system
US7902660B1 (en) 2006-05-24 2011-03-08 Amkor Technology, Inc. Substrate for semiconductor device and manufacturing method thereof
US7442045B1 (en) * 2007-08-17 2008-10-28 Centipede Systems, Inc. Miniature electrical ball and tube socket with self-capturing multiple-contact-point coupling
JP2009192309A (ja) * 2008-02-13 2009-08-27 Shinko Electric Ind Co Ltd 半導体検査装置
US7936177B2 (en) * 2008-03-07 2011-05-03 Formfactor, Inc. Providing an electrically conductive wall structure adjacent a contact structure of an electronic device
US20100188825A1 (en) * 2009-01-28 2010-07-29 Honeywell International Inc. Apparatus for isolating multiple circuit boards from vibration
US8796561B1 (en) 2009-10-05 2014-08-05 Amkor Technology, Inc. Fan out build up substrate stackable package and method
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US8324511B1 (en) 2010-04-06 2012-12-04 Amkor Technology, Inc. Through via nub reveal method and structure
US8294276B1 (en) 2010-05-27 2012-10-23 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8440554B1 (en) 2010-08-02 2013-05-14 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US8487445B1 (en) 2010-10-05 2013-07-16 Amkor Technology, Inc. Semiconductor device having through electrodes protruding from dielectric layer
US8791501B1 (en) 2010-12-03 2014-07-29 Amkor Technology, Inc. Integrated passive device structure and method
US8390130B1 (en) 2011-01-06 2013-03-05 Amkor Technology, Inc. Through via recessed reveal structure and method
DE102011109808B4 (de) 2011-08-08 2022-09-22 Volkswagen Aktiengesellschaft Verfahren zur Herstellung einer Bauteilverbindung durch Elementreibschweißen
US8552548B1 (en) 2011-11-29 2013-10-08 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
JP2013080938A (ja) * 2012-11-26 2013-05-02 Japan Electronic Materials Corp 半導体検査装置
JP6500258B2 (ja) * 2015-06-12 2019-04-17 北川工業株式会社 接触部材
US9899757B2 (en) * 2015-09-03 2018-02-20 Apple Inc. Surface connector with silicone spring member
US9876307B2 (en) 2015-09-03 2018-01-23 Apple Inc. Surface connector with silicone spring member
US9801269B1 (en) * 2016-05-10 2017-10-24 Northrop Grumman Systems Corporation Resilient miniature integrated electrical connector
WO2017212814A1 (ja) * 2016-06-09 2017-12-14 日本電産リード株式会社 検査治具、及び検査装置
DE102017002150A1 (de) * 2017-03-06 2018-09-06 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Elektrisches Kontaktelement
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making

Family Cites Families (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US923327A (en) * 1908-10-17 1909-06-01 Frank A Champlin Electrical-connection rosette.
US4205588A (en) * 1958-06-10 1980-06-03 The United States Of America As Represented By The Secretary Of The Navy Method and material for fuze render safe procedure
US3193793A (en) * 1963-03-14 1965-07-06 Kenneth W Plunkett Electronic connector
US3290636A (en) * 1963-09-30 1966-12-06 Northern Electric Co Thin-film circuit connector
US3573617A (en) * 1967-10-27 1971-04-06 Aai Corp Method and apparatus for testing packaged integrated circuits
US3936930A (en) * 1972-07-10 1976-02-10 Rca Corporation Method of making electrical connections for liquid crystal cells
US3842189A (en) * 1973-01-08 1974-10-15 Rca Corp Contact array and method of making the same
US3794953A (en) * 1973-01-22 1974-02-26 Security Instr Inc Electrical terminal for conductive foil
US4029375A (en) * 1976-06-14 1977-06-14 Electronic Engineering Company Of California Miniature electrical connector
US4209745A (en) * 1978-06-12 1980-06-24 Everett/Charles, Inc. Interchangeable test head for loaded test member
US4239312A (en) * 1978-11-29 1980-12-16 Hughes Aircraft Company Parallel interconnect for planar arrays
US4202588A (en) * 1978-11-29 1980-05-13 Technical Wire Products Electrical connector and support means therefor
US4352061A (en) * 1979-05-24 1982-09-28 Fairchild Camera & Instrument Corp. Universal test fixture employing interchangeable wired personalizers
JPS56116282A (en) * 1980-02-19 1981-09-11 Sharp Kk Electronic part with plural terminals
US4403272A (en) * 1980-06-02 1983-09-06 Oak Industries Inc. Membrane switch interconnect tail and printed circuit board connection
US4428633A (en) * 1982-03-01 1984-01-31 Amp Incorporated Dual-in-line socket assembly
JPS5987842A (ja) * 1982-11-10 1984-05-21 Toshiba Corp Ic/lsiソケツト
US4553192A (en) * 1983-08-25 1985-11-12 International Business Machines Corporation High density planar interconnected integrated circuit package
US4615573A (en) * 1983-10-28 1986-10-07 Honeywell Inc. Spring finger interconnect for IC chip carrier
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US6043563A (en) 1997-05-06 2000-03-28 Formfactor, Inc. Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals
US6330164B1 (en) * 1985-10-18 2001-12-11 Formfactor, Inc. Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5829128A (en) * 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US4770641A (en) * 1986-03-31 1988-09-13 Amp Incorporated Conductive gel interconnection apparatus
US4988306A (en) * 1989-05-16 1991-01-29 Labinal Components And Systems, Inc. Low-loss electrical interconnects
US5264268B1 (en) * 1986-07-15 1998-12-22 Mcneil Ppc Inc Sanitary napkin with composite cover
US4813129A (en) * 1987-06-19 1989-03-21 Hewlett-Packard Company Interconnect structure for PC boards and integrated circuits
JPS6447090A (en) * 1987-08-18 1989-02-21 Seiko Epson Corp Circuit board
JPS6447090U (de) 1987-09-17 1989-03-23
JPH01313969A (ja) * 1988-06-13 1989-12-19 Hitachi Ltd 半導体装置
US4871316A (en) * 1988-10-17 1989-10-03 Microelectronics And Computer Technology Corporation Printed wire connector
US5366380A (en) * 1989-06-13 1994-11-22 General Datacomm, Inc. Spring biased tapered contact elements for electrical connectors and integrated circuit packages
US5030109A (en) * 1990-08-24 1991-07-09 Amp Incorporated Area array connector for substrates
US5136238A (en) * 1990-11-26 1992-08-04 Electro-Fix, Inc. Test fixture with diaphragm board with one or more internal grounded layers
US5172050A (en) 1991-02-15 1992-12-15 Motorola, Inc. Micromachined semiconductor probe card
FR2680284B1 (fr) 1991-08-09 1993-12-03 Thomson Csf Dispositif de connexion a tres faible pas et procede de fabrication.
JPH0564784A (ja) 1991-09-04 1993-03-19 Easy Net:Kk 電極式水処理装置
DE4135887A1 (de) * 1991-10-31 1993-05-06 Wolfram Dr. 4040 Neuss De Seiler Vorrichtung zum abtauen von kaeltetrocknern unter 0(grad) c
US5199889A (en) * 1991-11-12 1993-04-06 Jem Tech Leadless grid array socket
US5309324A (en) * 1991-11-26 1994-05-03 Herandez Jorge M Device for interconnecting integrated circuit packages to circuit boards
US5252916A (en) * 1992-01-27 1993-10-12 Everett Charles Technologies, Inc. Pneumatic test fixture with springless test probes
US5338208A (en) * 1992-02-04 1994-08-16 International Business Machines Corporation High density electronic connector and method of assembly
JPH0669663A (ja) 1992-08-18 1994-03-11 Sony Corp コンデンサ内蔵多層基板
EP0615131A1 (de) 1993-03-10 1994-09-14 Co-Operative Facility For Aging Tester Development Sonde für Halbleiterscheiben mit integrierten Schaltelementen
US5373231A (en) 1993-06-10 1994-12-13 G. G. B. Industries, Inc. Integrated circuit probing apparatus including a capacitor bypass structure
JP3293334B2 (ja) * 1993-08-25 2002-06-17 セイコーエプソン株式会社 半導体装置及びその製造方法
JP2963828B2 (ja) 1993-09-24 1999-10-18 東京エレクトロン株式会社 プローブ装置
US5573172A (en) * 1993-11-08 1996-11-12 Sawtek, Inc. Surface mount stress relief hidden lead package device and method
JP3400051B2 (ja) * 1993-11-10 2003-04-28 ザ ウィタカー コーポレーション 異方性導電膜、その製造方法及びそれを使用するコネクタ
US5974662A (en) 1993-11-16 1999-11-02 Formfactor, Inc. Method of planarizing tips of probe elements of a probe card assembly
US5772451A (en) 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US6482013B2 (en) 1993-11-16 2002-11-19 Formfactor, Inc. Microelectronic spring contact element and electronic component having a plurality of spring contact elements
US5475317A (en) * 1993-12-23 1995-12-12 Epi Technologies, Inc. Singulated bare die tester and method of performing forced temperature electrical tests and burn-in
US5495667A (en) * 1994-11-07 1996-03-05 Micron Technology, Inc. Method for forming contact pins for semiconductor dice and interconnects
KR100394205B1 (ko) 1994-11-15 2003-08-06 폼팩터, 인크. 시험된 반도체 장치 및 시험된 반도체 장치의 제조방법
KR100335167B1 (ko) 1994-11-15 2002-05-04 이고르 와이. 칸드로스 반도체 장치를 시험하는 방법
US5633535A (en) * 1995-01-27 1997-05-27 Chao; Clinton C. Spacing control in electronic device assemblies
JP2876106B2 (ja) * 1995-01-31 1999-03-31 タバイエスペック株式会社 バーンイン用複合体及び複合体使用バーンイン装置
US5773986A (en) * 1995-04-03 1998-06-30 Motorola, Inc Semiconductor wafer contact system and method for contacting a semiconductor wafer
EP0886894B1 (de) 1995-05-26 2005-09-28 Formfactor, Inc. Kontakträger zum bestücken von substraten mit federkontakten
KR100299465B1 (ko) 1995-05-26 2001-10-27 이고르 와이. 칸드로스 칩상호접속캐리어와,스프링접촉자를반도체장치에장착하는방법
JP2799973B2 (ja) 1995-07-06 1998-09-21 日本電子材料株式会社 垂直作動式プローブカード
US5869961A (en) * 1995-07-31 1999-02-09 Spinner; Howard D. Smart IC-test receptacle having holes adapted for mounting capacitors arranged adjacent to pin positions
JPH0945740A (ja) 1995-08-01 1997-02-14 Nippon Steel Corp 半導体基板の評価方法及びそれに用いるチェック用ボード
JP2002509604A (ja) 1996-05-17 2002-03-26 フォームファクター,インコーポレイテッド マイクロエレクトロニクス相互接続要素のための接触チップ構造及びその製造方法
WO1998001906A1 (en) 1996-07-05 1998-01-15 Formfactor, Inc. Floating lateral support for ends of elongate interconnection elements
JPH10125857A (ja) 1996-10-18 1998-05-15 Fuji Electric Co Ltd コンデンサ内蔵基板およびその基板を用いた電子装置
US5952840A (en) * 1996-12-31 1999-09-14 Micron Technology, Inc. Apparatus for testing semiconductor wafers
US6072323A (en) * 1997-03-03 2000-06-06 Micron Technology, Inc. Temporary package, and method system for testing semiconductor dice having backside electrodes
US6224396B1 (en) * 1997-07-23 2001-05-01 International Business Machines Corporation Compliant, surface-mountable interposer
US6114240A (en) * 1997-12-18 2000-09-05 Micron Technology, Inc. Method for fabricating semiconductor components using focused laser beam
US6664628B2 (en) * 1998-07-13 2003-12-16 Formfactor, Inc. Electronic component overlapping dice of unsingulated semiconductor wafer
US6705876B2 (en) 1998-07-13 2004-03-16 Formfactor, Inc. Electrical interconnect assemblies and methods
US6694941B2 (en) * 2001-08-24 2004-02-24 Kioritz Corporation Starter
US7084650B2 (en) * 2002-12-16 2006-08-01 Formfactor, Inc. Apparatus and method for limiting over travel in a probe card assembly

Also Published As

Publication number Publication date
EP1097617B1 (de) 2005-07-20
AU2107299A (en) 2000-02-01
US20010012704A1 (en) 2001-08-09
JP4389209B2 (ja) 2009-12-24
US20070123082A1 (en) 2007-05-31
US20040127074A1 (en) 2004-07-01
KR100423683B1 (ko) 2004-03-22
JP2002520864A (ja) 2002-07-09
WO2000003569A1 (en) 2000-01-20
US7618281B2 (en) 2009-11-17
JP3949377B2 (ja) 2007-07-25
EP1583406A3 (de) 2009-09-23
CN1317224A (zh) 2001-10-10
US20060024988A1 (en) 2006-02-02
EP1097617A1 (de) 2001-05-09
US6705876B2 (en) 2004-03-16
TW404033B (en) 2000-09-01
US7169646B2 (en) 2007-01-30
CN1203739C (zh) 2005-05-25
DE69926241T2 (de) 2006-04-20
EP1583406A2 (de) 2005-10-05
JP2004251910A (ja) 2004-09-09
US6948941B2 (en) 2005-09-27
KR20010074710A (ko) 2001-08-09

Similar Documents

Publication Publication Date Title
DE69926241D1 (de) Leiterplatten-verbindungsvorrichtung und herstellungsverfahren
DE69840246D1 (de) Elektronisches Bauteil und Herstellungsverfahren
DE69718693D1 (de) Elektronisches Bauteil und Herstellungsverfahren
DE69737588D1 (de) Halbleiteranordnung und Herstellungsverfahren dafür
DE69929456D1 (de) Nahfeldabtastkopf und herstellungsverfahren
DE69831541D1 (de) Endoskop und sein herstellungsverfahren
KR960015789A (ko) 전자부품과 그 제조방법
DE69527330T2 (de) Halbleiteranordnung und Herstellungsverfahren
DE69721411D1 (de) Halbleiteranordnung und Herstellungsverfahren dafür
DE60203685D1 (de) Verbinder und Zusammenbauverfahren
DE69931221D1 (de) SOI-Substrat und Herstellungsverfahren dafür
DE69834561D1 (de) Halbleiteranordnung und herstellungsverfahren dafür
EE200000047A (et) Elektriline seadis ja selle valmistamise meetod
DE69838411D1 (de) Flache bildanzeigetafel und herstellungsverfahren
DE69708879T2 (de) Z-achsenzwischenverbindungsverfahren und schaltung
DE69735240D1 (de) Elektronisches bauteil und bestückungsverfahren und -vorrichtung
DE50003179D1 (de) Elektrisches verbindungsverfahren und verbindungsstelle
DE69931725D1 (de) Magnetophoretische Anzeigevorrichtung und Herstellungsverfahren dafür
DE60020737D1 (de) Sic-einkristall und herstellungsverfahren dafür
DE69941200D1 (de) Elektrolumineszente Vorrichtung und Herstellungsverfahren
DE69941874D1 (de) Optielektronisches bauelement und herstellungsverfahren
DE60039547D1 (de) Bestückungsverfahren und Bestückungsvorrichtung
DE60043337D1 (de) Leiterplatte und herstellungsverfahren der leiterplatte
DE69940042D1 (de) Wasserdichter Verbinder und Zusammenbauverfahren
DE69832364D1 (de) Therapiegerät und entsprechendes Herstellungsverfahren

Legal Events

Date Code Title Description
8364 No opposition during term of opposition