DE69921903D1 - Elektrisch leitfähige Silikonzusammensetzungen - Google Patents
Elektrisch leitfähige SilikonzusammensetzungenInfo
- Publication number
- DE69921903D1 DE69921903D1 DE69921903T DE69921903T DE69921903D1 DE 69921903 D1 DE69921903 D1 DE 69921903D1 DE 69921903 T DE69921903 T DE 69921903T DE 69921903 T DE69921903 T DE 69921903T DE 69921903 D1 DE69921903 D1 DE 69921903D1
- Authority
- DE
- Germany
- Prior art keywords
- electrically conductive
- conductive silicone
- silicone compositions
- compositions
- electrically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/60—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/112,392 US6017587A (en) | 1998-07-09 | 1998-07-09 | Electrically conductive silicone compositions |
US112392 | 1998-07-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69921903D1 true DE69921903D1 (de) | 2004-12-23 |
DE69921903T2 DE69921903T2 (de) | 2005-11-03 |
Family
ID=22343647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1999621903 Expired - Fee Related DE69921903T2 (de) | 1998-07-09 | 1999-07-06 | Elektrisch leitfähige Silikonzusammensetzungen |
Country Status (4)
Country | Link |
---|---|
US (1) | US6017587A (de) |
EP (1) | EP0971367B1 (de) |
JP (1) | JP2000038510A (de) |
DE (1) | DE69921903T2 (de) |
Families Citing this family (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69407137T2 (de) * | 1993-10-06 | 1998-04-09 | Dow Corning Toray Silicone | Mit Silber gefüllte, elektrisch leitfähige Organosiloxan-Zusammensetzungen |
US6277941B1 (en) * | 1997-09-12 | 2001-08-21 | Shin-Etsu Chemical Co., Ltd. | Organopolysiloxane composition |
CN101033376A (zh) * | 1999-08-25 | 2007-09-12 | 日立化成工业株式会社 | 粘合剂,配线端子的连接方法和配线结构体 |
JP3603945B2 (ja) * | 1999-10-06 | 2004-12-22 | 信越化学工業株式会社 | 導電性シリコーンゴム組成物 |
US6433057B1 (en) * | 2000-03-28 | 2002-08-13 | Dow Corning Corporation | Silicone composition and electrically conductive silicone adhesive formed therefrom |
US6534581B1 (en) * | 2000-07-20 | 2003-03-18 | Dow Corning Corporation | Silicone composition and electrically conductive silicone adhesive formed therefrom |
US6361716B1 (en) * | 2000-07-20 | 2002-03-26 | Dow Corning Corporation | Silicone composition and electrically conductive silicone adhesive formed therefrom |
US6433055B1 (en) * | 2000-09-13 | 2002-08-13 | Dow Corning Corporation | Electrically conductive hot-melt silicone adhesive composition |
CN1273994C (zh) * | 2001-04-06 | 2006-09-06 | 世界财产股份有限公司 | 导电性有机硅及其制造方法 |
US7520897B2 (en) * | 2001-04-11 | 2009-04-21 | Helix Medical, Llc | Medical devices having antimicrobial properties |
US8317861B2 (en) * | 2001-04-11 | 2012-11-27 | Helix Medical, Llc | Antimicrobial indwelling voice prosthesis |
US7393547B2 (en) * | 2001-04-11 | 2008-07-01 | Helix Medical, Llc | Antimicrobial elastomer composition and method for making |
DE60122475T2 (de) * | 2001-04-12 | 2007-04-19 | Dow Corning Corp., Midland | Silikonzusammensetzung und daraus erhältlicher elektrisch leitender Silikonklebstoff |
JP4872166B2 (ja) * | 2001-06-28 | 2012-02-08 | 日立化成工業株式会社 | 導電ペーストを用いた電気回路とその製造方法及び導電ペーストの製造方法 |
JP3999994B2 (ja) * | 2002-04-03 | 2007-10-31 | 東レ・ダウコーニング株式会社 | 導電性シリコーンゴム組成物 |
US6945783B2 (en) * | 2002-05-21 | 2005-09-20 | The University Of Iowa Research Foundation | Interactive breast examination training model |
US6942824B1 (en) | 2002-05-22 | 2005-09-13 | Western Digital (Fremont), Inc. | UV curable and electrically conductive adhesive for bonding magnetic disk drive components |
JP3846575B2 (ja) * | 2002-06-27 | 2006-11-15 | 信越化学工業株式会社 | 導電性シリコーンゴム組成物 |
TWI287562B (en) * | 2002-07-25 | 2007-10-01 | Shinetsu Chemical Co | Silicone coating composition and release sheet |
JP4568472B2 (ja) * | 2002-11-29 | 2010-10-27 | 東レ・ダウコーニング株式会社 | 銀粉末の製造方法および硬化性シリコーン組成物 |
WO2005012435A1 (en) * | 2003-07-31 | 2005-02-10 | World Properties, Inc. | Electrically conductive, flame retardant fillers, method of manufacture, and use thereof |
US20050062024A1 (en) * | 2003-08-06 | 2005-03-24 | Bessette Michael D. | Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof |
CN1942526B (zh) * | 2004-04-01 | 2010-05-12 | 三键株式会社 | 可固化组合物和密封方法 |
US20090162596A1 (en) * | 2005-08-02 | 2009-06-25 | World Properties, Inc. | Silicone compositions, methods of manufacture, and articles formed therefrom |
US20090162651A1 (en) * | 2005-08-02 | 2009-06-25 | World Properties, Inc. | Silicone compositions, methods of manufacture, and articles formed therefrom |
US7625625B2 (en) * | 2005-08-02 | 2009-12-01 | World Properties, Inc. | Silicone compositions, methods of manufacture, and articles formed therefrom |
US20100183814A1 (en) * | 2005-08-02 | 2010-07-22 | Victor Rios | Silicone compositions, methods of manufacture, and articles formed therefrom |
JP4839041B2 (ja) * | 2005-08-29 | 2011-12-14 | 東レ・ダウコーニング株式会社 | 絶縁性液状ダイボンディング剤および半導体装置 |
US7309734B2 (en) * | 2005-09-30 | 2007-12-18 | Industrial Control Development, Inc. | Silicone-coated architectural glass |
US7531242B2 (en) * | 2005-09-30 | 2009-05-12 | Industrial Control Development, Inc. | Silicone-coated architectural glass |
US7838116B2 (en) * | 2005-09-30 | 2010-11-23 | Industrial Control Development, Inc. | Silicone-coated architectural and decorative glass |
CN101356214B (zh) * | 2006-01-17 | 2011-05-18 | 陶氏康宁公司 | 热稳定的透明有机硅树脂组合物及其制备方法和用途 |
JP4946130B2 (ja) * | 2006-03-28 | 2012-06-06 | 住友ベークライト株式会社 | 導電性ペースト及び導電性ペーストを使用して作製した半導体装置 |
JP2007265801A (ja) * | 2006-03-28 | 2007-10-11 | Sumitomo Bakelite Co Ltd | 導電性粉末及び導電性粉末の作製方法 |
WO2008013521A1 (en) * | 2006-07-25 | 2008-01-31 | Hewlett-Packard Development Company, L.P. | Laser printer systems, intermediate transfer members, primer layers for intermediate transfer members, and primer layer compositions |
US20080053153A1 (en) * | 2006-09-01 | 2008-03-06 | Shin-Etsu Chemical Co., Ltd. | Method of producing inorganic molded item, and inorganic molded item obtained using the method |
US8243358B2 (en) * | 2006-11-24 | 2012-08-14 | The Hong Kong University Of Science & Technology | Constructing planar and three-dimensional microstructures with PDMS-based conducting composite |
US8431647B2 (en) * | 2006-12-27 | 2013-04-30 | Bluestar Silicones France Sas | Adhesive silicone compositions and adhesive bonding/seaming therewith |
JP4739301B2 (ja) * | 2007-09-12 | 2011-08-03 | 信越化学工業株式会社 | 金属光沢を示す金属−セラミック複合材料の製造方法 |
CN102066488A (zh) * | 2008-04-21 | 2011-05-18 | 霍尼韦尔国际公司 | 热互连和界面材料、它们的制造方法和用途 |
US20120133072A1 (en) * | 2009-08-12 | 2012-05-31 | Parker-Hannifin Corporation | Fully-cured thermally or electrically conductive form-in-place gap filler |
JP5539689B2 (ja) * | 2009-09-14 | 2014-07-02 | 東レ・ダウコーニング株式会社 | エマルジョン、その製造方法、および架橋性シリコーン組成物 |
JP5402910B2 (ja) * | 2010-11-22 | 2014-01-29 | 日立化成株式会社 | 導電ペースト及びその製造方法 |
JP5751214B2 (ja) * | 2012-03-13 | 2015-07-22 | 信越化学工業株式会社 | 硬化性シリコーン樹脂組成物、その硬化物及び光半導体デバイス |
CN104662098A (zh) * | 2012-08-02 | 2015-05-27 | 汉高股份有限公司 | 用于led封装剂的包含聚碳硅烷和含氢聚硅氧烷的可固化组合物 |
WO2014059577A1 (en) * | 2012-10-15 | 2014-04-24 | Dow Global Technologies Llc | Conductive composition |
DE102012220700A1 (de) * | 2012-11-13 | 2014-05-15 | Wacker Chemie Ag | Füllstoffhaltige Siliconzusammensetzungen |
JP6355646B2 (ja) * | 2012-12-20 | 2018-07-11 | ダウ シリコーンズ コーポレーション | 硬化性シリコーン組成物、導電性シリコーン接着剤、これらの製造及び使用方法、並びにこれらを含有する電気装置 |
CN105008484B (zh) * | 2013-03-14 | 2017-12-22 | 道康宁公司 | 可固化有机硅组合物、导电有机硅粘合剂、制备及使用它们的方法以及包含它们的电气装置 |
WO2014159792A1 (en) * | 2013-03-14 | 2014-10-02 | Dow Corning Corporation | Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same |
US9428680B2 (en) | 2013-03-14 | 2016-08-30 | Dow Corning Corporation | Conductive silicone materials and uses |
JP2014201627A (ja) * | 2013-04-02 | 2014-10-27 | 三菱化学株式会社 | 熱硬化性シリコーン樹脂組成物、シリコーン樹脂成形体の製造方法、およびシリコーン樹脂成形体 |
US20180182506A1 (en) * | 2015-06-17 | 2018-06-28 | Basf Se | Conductive paste comprising lubricating oils and semiconductor device |
EP3150672B1 (de) * | 2015-10-02 | 2018-05-09 | Shin-Etsu Chemical Co., Ltd. | Wärmeleitende und silikonzusammensetzung und halbleiterbauelement |
JP6729143B2 (ja) * | 2015-10-29 | 2020-07-22 | 三菱マテリアル株式会社 | 樹脂組成物、接合体及び半導体装置 |
WO2017073393A1 (ja) * | 2015-10-29 | 2017-05-04 | 三菱マテリアル株式会社 | 樹脂組成物、接合体及び半導体装置 |
US10453974B2 (en) | 2016-02-23 | 2019-10-22 | Basf Se | Conductive paste comprising a silicone oil |
GB201603107D0 (en) | 2016-02-23 | 2016-04-06 | Dow Corning | Low temperature cure silicone elastomer |
JP6610491B2 (ja) * | 2016-10-03 | 2019-11-27 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
US10590042B2 (en) * | 2017-06-29 | 2020-03-17 | Hrl Laboratories, Llc | Photopolymer resins with solid and liquid phases for polymer-derived ceramics |
WO2019023840A1 (en) * | 2017-07-31 | 2019-02-07 | Dow Global Technologies Llc | GLACIOPHOBIC COATINGS |
US11320323B2 (en) | 2017-09-06 | 2022-05-03 | Regents Of The University Of Minnesota | Additively manufactured flexible electronic sensors and conductive compositions used therein |
US11326059B2 (en) | 2017-09-07 | 2022-05-10 | Dow Global Technologies Llc | Thermally conductive ice-phobic coatings |
US11834554B2 (en) * | 2018-05-15 | 2023-12-05 | Threebond Co., Ltd. | Conductive silicone composition and cured product thereof |
KR20210149082A (ko) * | 2019-03-29 | 2021-12-08 | 다우 도레이 캄파니 리미티드 | 경화성 실리콘 조성물, 그의 경화물 및 그의 제조 방법 |
FR3103820B1 (fr) * | 2019-11-29 | 2022-08-05 | Michelin & Cie | Membrane expansible pour moule de cuisson revêtue d’une composition de caoutchouc silicone |
CN112980196A (zh) * | 2019-12-18 | 2021-06-18 | 富士高分子工业株式会社 | 导热性组合物、导热性片材及其制造方法 |
KR20230125240A (ko) * | 2020-12-23 | 2023-08-29 | 다우 글로벌 테크놀로지스 엘엘씨 | 실리콘 조성물 |
CN114058326B (zh) * | 2021-11-22 | 2023-05-23 | 烟台德邦科技股份有限公司 | 一种粘接及可靠性优异的有机聚硅氧烷组合物及其制备方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL131800C (de) * | 1965-05-17 | |||
US3609104A (en) * | 1968-02-15 | 1971-09-28 | Ercon Inc | Electrically conductive gasket and material thereof |
US4087585A (en) * | 1977-05-23 | 1978-05-02 | Dow Corning Corporation | Self-adhering silicone compositions and preparations thereof |
JPS61108661A (ja) * | 1984-11-02 | 1986-05-27 | Shin Etsu Polymer Co Ltd | 導電性シリコ−ンゴム組成物 |
US4659851A (en) * | 1986-03-26 | 1987-04-21 | Dow Corning Corporation | Novel organosilicon compounds |
JPS62257939A (ja) * | 1986-05-02 | 1987-11-10 | Shin Etsu Chem Co Ltd | シリコ−ンエラストマ−球状微粉末の製造方法 |
US4766176A (en) * | 1987-07-20 | 1988-08-23 | Dow Corning Corporation | Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts |
JP2618663B2 (ja) * | 1987-11-30 | 1997-06-11 | 東レ・ダウコーニング・シリコーン株式会社 | 磁性シリコーンゴム粉状物の製造方法 |
JPH02102263A (ja) * | 1988-10-11 | 1990-04-13 | Shin Etsu Chem Co Ltd | 導電性シリコーンゴム組成物 |
CA2000787A1 (en) * | 1988-11-04 | 1990-05-04 | Richard L. Cole | Electrically conductive silicone compositions |
JPH0791464B2 (ja) * | 1989-10-31 | 1995-10-04 | 信越化学工業株式会社 | 導電性シリコーンゴム組成物およびその硬化物 |
JP2608484B2 (ja) * | 1990-05-24 | 1997-05-07 | 東レ・ダウコーニング・シリコーン株式会社 | ヒドロシリル化反応用触媒含有熱可塑性樹脂微粒子の製造方法 |
US5371139A (en) * | 1991-06-21 | 1994-12-06 | Dow Corning Toray Silicone Co., Ltd. | Silicone rubber microsuspension and method for its preparation |
US5227093A (en) * | 1991-11-29 | 1993-07-13 | Dow Corning Corporation | Curable organosiloxane compositions yielding electrically conductive materials |
JPH05271548A (ja) * | 1992-03-27 | 1993-10-19 | Shin Etsu Chem Co Ltd | オルガノポリシロキサン組成物及びその硬化物の形成方法 |
JPH05314812A (ja) * | 1992-05-06 | 1993-11-26 | Sumitomo Metal Mining Co Ltd | 導電性樹脂ペースト |
JPH06157996A (ja) * | 1992-11-19 | 1994-06-07 | Shin Etsu Chem Co Ltd | 接着方法 |
DE4414653A1 (de) * | 1993-05-13 | 1994-11-17 | Gen Electric | Schneller klebende Silicon-Klebstoffzusammensetzungen |
DE69407137T2 (de) * | 1993-10-06 | 1998-04-09 | Dow Corning Toray Silicone | Mit Silber gefüllte, elektrisch leitfähige Organosiloxan-Zusammensetzungen |
JP2819444B2 (ja) * | 1993-11-08 | 1998-10-30 | 東レ・ダウコーニング・シリコーン株式会社 | 導電性シリコーンゴム組成物 |
US5424384A (en) * | 1994-05-10 | 1995-06-13 | Dow Corning Corporation | Curable organosiloxane compositions containing low temperature reactive adhesion additives |
DE19528225A1 (de) * | 1995-08-01 | 1997-02-06 | Wacker Chemie Gmbh | Beschichtete Airbags, Beschichtungsmaterial und Beschichtungsverfahren |
JP3950493B2 (ja) * | 1996-04-26 | 2007-08-01 | 東レ・ダウコーニング株式会社 | 導電性シリコーンゴム組成物、半導体装置の製造方法およびその半導体装置 |
JP3436464B2 (ja) * | 1996-10-31 | 2003-08-11 | 東レ・ダウコーニング・シリコーン株式会社 | 付加反応硬化型導電性シリコーン組成物および導電性シリコーン硬化物の製造方法 |
-
1998
- 1998-07-09 US US09/112,392 patent/US6017587A/en not_active Expired - Fee Related
-
1999
- 1999-07-06 DE DE1999621903 patent/DE69921903T2/de not_active Expired - Fee Related
- 1999-07-06 JP JP19212599A patent/JP2000038510A/ja not_active Withdrawn
- 1999-07-06 EP EP99113542A patent/EP0971367B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6017587A (en) | 2000-01-25 |
EP0971367A1 (de) | 2000-01-12 |
JP2000038510A (ja) | 2000-02-08 |
DE69921903T2 (de) | 2005-11-03 |
EP0971367B1 (de) | 2004-11-17 |
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DE29806869U1 (de) | Elektrisches Anschlußelement | |
DE59807185D1 (de) | Elektrisches Kontaktelement | |
DE19980577T1 (de) | Elektroschalter | |
DE59803794D1 (de) | Elektrische steckverbindung | |
NO991216D0 (no) | Elektrisk kopling | |
DE60041033D1 (de) | Elektrisch leitendes element | |
DE59903376D1 (de) | Elektrisches Verbindungselement | |
DE29804419U1 (de) | Elektrisches Steckverbindungsteil | |
FR2777392B1 (fr) | Connecteur electrique | |
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