DE69908591D1 - Vorrichtung zum Laden von Halbleiterscheiben - Google Patents
Vorrichtung zum Laden von HalbleiterscheibenInfo
- Publication number
- DE69908591D1 DE69908591D1 DE69908591T DE69908591T DE69908591D1 DE 69908591 D1 DE69908591 D1 DE 69908591D1 DE 69908591 T DE69908591 T DE 69908591T DE 69908591 T DE69908591 T DE 69908591T DE 69908591 D1 DE69908591 D1 DE 69908591D1
- Authority
- DE
- Germany
- Prior art keywords
- wafer
- present
- load station
- descend
- nozzles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/006—Arrangements for observing, indicating or measuring on machine tools for indicating the presence of a work or tool in its holder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US7512998P | 1998-02-14 | 1998-02-14 | |
US75129P | 1998-02-14 | ||
PCT/US1999/002699 WO1999041022A1 (en) | 1998-02-14 | 1999-02-09 | Accurate positioning of a wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69908591D1 true DE69908591D1 (de) | 2003-07-10 |
DE69908591T2 DE69908591T2 (de) | 2004-04-29 |
Family
ID=22123745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69908591T Expired - Fee Related DE69908591T2 (de) | 1998-02-14 | 1999-02-09 | Vorrichtung zum Laden von Halbleiterscheiben |
Country Status (7)
Country | Link |
---|---|
US (7) | US6102057A (de) |
EP (1) | EP1084001B1 (de) |
JP (1) | JP2002503044A (de) |
KR (1) | KR100545680B1 (de) |
AT (1) | ATE242064T1 (de) |
DE (1) | DE69908591T2 (de) |
WO (1) | WO1999041022A1 (de) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE242064T1 (de) * | 1998-02-14 | 2003-06-15 | Lam Res Corp | Vorrichtung zum laden von halbleiterscheiben |
TW484184B (en) * | 1998-11-06 | 2002-04-21 | Canon Kk | Sample separating apparatus and method, and substrate manufacturing method |
JP2000150836A (ja) * | 1998-11-06 | 2000-05-30 | Canon Inc | 試料の処理システム |
US6672358B2 (en) | 1998-11-06 | 2004-01-06 | Canon Kabushiki Kaisha | Sample processing system |
US6464571B2 (en) * | 1998-12-01 | 2002-10-15 | Nutool, Inc. | Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein |
US7425250B2 (en) * | 1998-12-01 | 2008-09-16 | Novellus Systems, Inc. | Electrochemical mechanical processing apparatus |
US6716086B1 (en) * | 1999-06-14 | 2004-04-06 | Applied Materials Inc. | Edge contact loadcup |
JP3245833B2 (ja) * | 1999-07-08 | 2002-01-15 | 日本エー・エス・エム株式会社 | 半導体基板アライナー装置および方法 |
US6425280B1 (en) * | 1999-07-30 | 2002-07-30 | International Business Machines Corporation | Wafer alignment jig for wafer-handling systems |
US6386947B2 (en) * | 2000-02-29 | 2002-05-14 | Applied Materials, Inc. | Method and apparatus for detecting wafer slipouts |
US6413145B1 (en) | 2000-04-05 | 2002-07-02 | Applied Materials, Inc. | System for polishing and cleaning substrates |
KR100387524B1 (ko) * | 2001-01-26 | 2003-06-18 | 삼성전자주식회사 | 반도체 웨이퍼 위치 상태 감지 시스템과 이를 이용하는 반도체장치 제조 설비 및 그에 따른 웨이퍼 위치 상태 감지방법 |
US6398631B1 (en) * | 2001-02-02 | 2002-06-04 | Memc Electronic Materials, Inc. | Method and apparatus to place wafers into and out of machine |
US6561204B2 (en) * | 2001-09-05 | 2003-05-13 | Silicon Integrated Systems Corp. | Apparatus and method for cleaning wafers with contact holes or via holes |
US6752442B2 (en) | 2001-11-09 | 2004-06-22 | Speedfam-Ipec Corporation | Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector |
US6743722B2 (en) | 2002-01-29 | 2004-06-01 | Strasbaugh | Method of spin etching wafers with an alkali solution |
US7018268B2 (en) * | 2002-04-09 | 2006-03-28 | Strasbaugh | Protection of work piece during surface processing |
JP3978780B2 (ja) | 2002-08-09 | 2007-09-19 | 信越半導体株式会社 | ウエーハの研磨方法及び装置 |
US7101253B2 (en) * | 2002-08-27 | 2006-09-05 | Applied Materials Inc. | Load cup for chemical mechanical polishing |
US6788991B2 (en) | 2002-10-09 | 2004-09-07 | Asm International N.V. | Devices and methods for detecting orientation and shape of an object |
US6729947B1 (en) * | 2002-11-04 | 2004-05-04 | Texas Instruments Incorporated | Semiconductor wafer handler |
US6950774B2 (en) * | 2003-01-16 | 2005-09-27 | Asm America, Inc. | Out-of-pocket detection system using wafer rotation as an indicator |
JP2005123485A (ja) * | 2003-10-17 | 2005-05-12 | Ebara Corp | 研磨装置 |
US7044832B2 (en) | 2003-11-17 | 2006-05-16 | Applied Materials | Load cup for chemical mechanical polishing |
US7648622B2 (en) * | 2004-02-27 | 2010-01-19 | Novellus Systems, Inc. | System and method for electrochemical mechanical polishing |
US20060066333A1 (en) * | 2004-09-30 | 2006-03-30 | Jian-Huei Feng | System and method for aligning wafers |
US8500916B2 (en) * | 2004-11-05 | 2013-08-06 | HGST Netherlands B.V. | Method for aligning wafers within wafer processing equipment |
DE102004057215B4 (de) * | 2004-11-26 | 2008-12-18 | Erich Reitinger | Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer Sondenkarte unter Verwendung eines temperierten Fluidstrahls |
US20070169700A1 (en) * | 2006-01-26 | 2007-07-26 | Gert-Jan Sniders | Sensing system and method for determining the alignment of a substrate holder in a batch reactor |
JP2007234882A (ja) * | 2006-03-01 | 2007-09-13 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板取り扱い方法 |
KR100739100B1 (ko) * | 2006-03-08 | 2007-07-12 | 주식회사 디엠에스 | 기판이송장치 |
JP5033354B2 (ja) * | 2006-05-29 | 2012-09-26 | 不二越機械工業株式会社 | ワークセンタリング装置 |
US8057602B2 (en) * | 2007-05-09 | 2011-11-15 | Applied Materials, Inc. | Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber |
US8057601B2 (en) * | 2007-05-09 | 2011-11-15 | Applied Materials, Inc. | Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber |
JP2009111024A (ja) * | 2007-10-26 | 2009-05-21 | Applied Materials Inc | 化学機械研磨装置の基板支持部材、および化学機械研磨装置 |
KR101489963B1 (ko) * | 2007-12-13 | 2015-02-04 | 한국에이에스엠지니텍 주식회사 | 박막 증착 장치 및 이를 이용한 증착 방법 |
US8273178B2 (en) | 2008-02-28 | 2012-09-25 | Asm Genitech Korea Ltd. | Thin film deposition apparatus and method of maintaining the same |
US8454408B2 (en) * | 2008-11-26 | 2013-06-04 | Applied Materials, Inc. | Load cup substrate sensing |
CN103293862B (zh) * | 2012-02-22 | 2015-04-15 | 上海微电子装备有限公司 | 硅片边缘保护装置 |
JP6027454B2 (ja) * | 2013-02-05 | 2016-11-16 | 株式会社荏原製作所 | 研磨装置 |
JP6145334B2 (ja) * | 2013-06-28 | 2017-06-07 | 株式会社荏原製作所 | 基板処理装置 |
US10269557B2 (en) * | 2015-10-20 | 2019-04-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus of processing semiconductor substrate |
US10373858B2 (en) | 2016-04-06 | 2019-08-06 | Lam Research Corporation | Chuck for edge bevel removal and method for centering a wafer prior to edge bevel removal |
CN206692727U (zh) * | 2017-04-28 | 2017-12-01 | 京东方科技集团股份有限公司 | 一种基板承载组件及磁控溅射装置 |
US10792736B1 (en) * | 2018-05-26 | 2020-10-06 | Kitagawa-Northtech, Inc. | Lightweight intelligent top-tooling apparatus |
CN110103119A (zh) * | 2018-09-20 | 2019-08-09 | 杭州众硅电子科技有限公司 | 一种抛光装卸部件模块 |
JP7052771B2 (ja) * | 2019-04-15 | 2022-04-12 | 株式会社Sumco | 片面研磨装置へのウェーハ装填装置 |
CN110860502B (zh) * | 2019-12-25 | 2021-07-16 | 徐州双裕电子技术有限公司 | 一种自动清灰传感器 |
Family Cites Families (26)
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US3677276A (en) * | 1970-10-02 | 1972-07-18 | Bowles Fluidics Corp | Interruptible jet sensor |
JPS5435653Y2 (de) * | 1971-11-08 | 1979-10-29 | ||
US4256535A (en) * | 1979-12-05 | 1981-03-17 | Western Electric Company, Inc. | Method of polishing a semiconductor wafer |
US4521995A (en) * | 1980-05-23 | 1985-06-11 | Disco Co., Ltd. | Wafer attracting and fixing device |
US4508161A (en) * | 1982-05-25 | 1985-04-02 | Varian Associates, Inc. | Method for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer |
US4566726A (en) * | 1984-06-13 | 1986-01-28 | At&T Technologies, Inc. | Method and apparatus for handling semiconductor wafers |
JPH07105345B2 (ja) * | 1985-08-08 | 1995-11-13 | 日電アネルバ株式会社 | 基体処理装置 |
AT389959B (de) * | 1987-11-09 | 1990-02-26 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben |
JPH0736417B2 (ja) * | 1989-10-24 | 1995-04-19 | 株式会社メツクス | ウエハーの位置決め装置 |
US5169408A (en) * | 1990-01-26 | 1992-12-08 | Fsi International, Inc. | Apparatus for wafer processing with in situ rinse |
JPH0770504B2 (ja) * | 1990-12-26 | 1995-07-31 | 信越半導体株式会社 | ウエーハのハンドリング方法及び装置 |
US5267418A (en) * | 1992-05-27 | 1993-12-07 | International Business Machines Corporation | Confined water fixture for holding wafers undergoing chemical-mechanical polishing |
JP2862754B2 (ja) * | 1993-04-19 | 1999-03-03 | 東京エレクトロン株式会社 | 処理装置及び回転部材 |
US5443416A (en) * | 1993-09-09 | 1995-08-22 | Cybeq Systems Incorporated | Rotary union for coupling fluids in a wafer polishing apparatus |
US5582534A (en) * | 1993-12-27 | 1996-12-10 | Applied Materials, Inc. | Orbital chemical mechanical polishing apparatus and method |
US5449316A (en) * | 1994-01-05 | 1995-09-12 | Strasbaugh; Alan | Wafer carrier for film planarization |
US5423716A (en) * | 1994-01-05 | 1995-06-13 | Strasbaugh; Alan | Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied |
JP3388628B2 (ja) * | 1994-03-24 | 2003-03-24 | 東京応化工業株式会社 | 回転式薬液処理装置 |
US5979475A (en) * | 1994-04-28 | 1999-11-09 | Hitachi, Ltd. | Specimen holding method and fluid treatment method of specimen surface and systems therefor |
US5738574A (en) * | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
JP3580936B2 (ja) * | 1996-02-26 | 2004-10-27 | 株式会社荏原製作所 | ポリッシング装置のプッシャー及びポリッシング装置 |
US5800248A (en) * | 1996-04-26 | 1998-09-01 | Ontrak Systems Inc. | Control of chemical-mechanical polishing rate across a substrate surface |
JP3831043B2 (ja) * | 1997-01-24 | 2006-10-11 | 東京エレクトロン株式会社 | 回転処理装置 |
US5885135A (en) * | 1997-04-23 | 1999-03-23 | International Business Machines Corporation | CMP wafer carrier for preferential polishing of a wafer |
US6062959A (en) * | 1997-11-05 | 2000-05-16 | Aplex Group | Polishing system including a hydrostatic fluid bearing support |
ATE242064T1 (de) * | 1998-02-14 | 2003-06-15 | Lam Res Corp | Vorrichtung zum laden von halbleiterscheiben |
-
1999
- 1999-02-09 AT AT99906813T patent/ATE242064T1/de not_active IP Right Cessation
- 1999-02-09 EP EP99906813A patent/EP1084001B1/de not_active Expired - Lifetime
- 1999-02-09 US US09/247,109 patent/US6102057A/en not_active Expired - Fee Related
- 1999-02-09 US US09/247,108 patent/US6267642B1/en not_active Expired - Fee Related
- 1999-02-09 DE DE69908591T patent/DE69908591T2/de not_active Expired - Fee Related
- 1999-02-09 US US09/247,107 patent/US6283827B1/en not_active Expired - Fee Related
- 1999-02-09 JP JP2000531259A patent/JP2002503044A/ja active Pending
- 1999-02-09 WO PCT/US1999/002699 patent/WO1999041022A1/en active IP Right Grant
- 1999-02-09 KR KR1020007008698A patent/KR100545680B1/ko not_active IP Right Cessation
- 1999-02-09 US US09/247,106 patent/US6131589A/en not_active Expired - Fee Related
-
2000
- 2000-06-30 US US09/608,618 patent/US6505635B1/en not_active Expired - Fee Related
- 2000-08-02 US US09/630,507 patent/US6405740B1/en not_active Expired - Fee Related
-
2001
- 2001-02-09 US US09/780,067 patent/US6796881B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6505635B1 (en) | 2003-01-14 |
US6283827B1 (en) | 2001-09-04 |
US6405740B1 (en) | 2002-06-18 |
WO1999041022A1 (en) | 1999-08-19 |
KR100545680B1 (ko) | 2006-01-24 |
JP2002503044A (ja) | 2002-01-29 |
EP1084001A1 (de) | 2001-03-21 |
US6131589A (en) | 2000-10-17 |
US6796881B1 (en) | 2004-09-28 |
US6102057A (en) | 2000-08-15 |
EP1084001A4 (de) | 2001-04-18 |
ATE242064T1 (de) | 2003-06-15 |
KR20010040804A (ko) | 2001-05-15 |
EP1084001B1 (de) | 2003-06-04 |
US6267642B1 (en) | 2001-07-31 |
DE69908591T2 (de) | 2004-04-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |