DE69908591D1 - Vorrichtung zum Laden von Halbleiterscheiben - Google Patents

Vorrichtung zum Laden von Halbleiterscheiben

Info

Publication number
DE69908591D1
DE69908591D1 DE69908591T DE69908591T DE69908591D1 DE 69908591 D1 DE69908591 D1 DE 69908591D1 DE 69908591 T DE69908591 T DE 69908591T DE 69908591 T DE69908591 T DE 69908591T DE 69908591 D1 DE69908591 D1 DE 69908591D1
Authority
DE
Germany
Prior art keywords
wafer
present
load station
descend
nozzles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69908591T
Other languages
English (en)
Other versions
DE69908591T2 (de
Inventor
R Vogtmann
L Lentz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Application granted granted Critical
Publication of DE69908591D1 publication Critical patent/DE69908591D1/de
Publication of DE69908591T2 publication Critical patent/DE69908591T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/006—Arrangements for observing, indicating or measuring on machine tools for indicating the presence of a work or tool in its holder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
DE69908591T 1998-02-14 1999-02-09 Vorrichtung zum Laden von Halbleiterscheiben Expired - Fee Related DE69908591T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7512998P 1998-02-14 1998-02-14
US75129P 1998-02-14
PCT/US1999/002699 WO1999041022A1 (en) 1998-02-14 1999-02-09 Accurate positioning of a wafer

Publications (2)

Publication Number Publication Date
DE69908591D1 true DE69908591D1 (de) 2003-07-10
DE69908591T2 DE69908591T2 (de) 2004-04-29

Family

ID=22123745

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69908591T Expired - Fee Related DE69908591T2 (de) 1998-02-14 1999-02-09 Vorrichtung zum Laden von Halbleiterscheiben

Country Status (7)

Country Link
US (7) US6283827B1 (de)
EP (1) EP1084001B1 (de)
JP (1) JP2002503044A (de)
KR (1) KR100545680B1 (de)
AT (1) ATE242064T1 (de)
DE (1) DE69908591T2 (de)
WO (1) WO1999041022A1 (de)

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ATE242064T1 (de) * 1998-02-14 2003-06-15 Lam Res Corp Vorrichtung zum laden von halbleiterscheiben
US6672358B2 (en) * 1998-11-06 2004-01-06 Canon Kabushiki Kaisha Sample processing system
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US7101253B2 (en) * 2002-08-27 2006-09-05 Applied Materials Inc. Load cup for chemical mechanical polishing
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US6950774B2 (en) * 2003-01-16 2005-09-27 Asm America, Inc. Out-of-pocket detection system using wafer rotation as an indicator
JP2005123485A (ja) * 2003-10-17 2005-05-12 Ebara Corp 研磨装置
US7044832B2 (en) * 2003-11-17 2006-05-16 Applied Materials Load cup for chemical mechanical polishing
US7648622B2 (en) * 2004-02-27 2010-01-19 Novellus Systems, Inc. System and method for electrochemical mechanical polishing
US20060066333A1 (en) * 2004-09-30 2006-03-30 Jian-Huei Feng System and method for aligning wafers
US8500916B2 (en) * 2004-11-05 2013-08-06 HGST Netherlands B.V. Method for aligning wafers within wafer processing equipment
DE102004057215B4 (de) * 2004-11-26 2008-12-18 Erich Reitinger Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer Sondenkarte unter Verwendung eines temperierten Fluidstrahls
US20070169700A1 (en) * 2006-01-26 2007-07-26 Gert-Jan Sniders Sensing system and method for determining the alignment of a substrate holder in a batch reactor
JP2007234882A (ja) * 2006-03-01 2007-09-13 Dainippon Screen Mfg Co Ltd 基板処理装置および基板取り扱い方法
KR100739100B1 (ko) * 2006-03-08 2007-07-12 주식회사 디엠에스 기판이송장치
JP5033354B2 (ja) * 2006-05-29 2012-09-26 不二越機械工業株式会社 ワークセンタリング装置
US8057602B2 (en) * 2007-05-09 2011-11-15 Applied Materials, Inc. Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber
US8057601B2 (en) 2007-05-09 2011-11-15 Applied Materials, Inc. Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber
JP2009111024A (ja) * 2007-10-26 2009-05-21 Applied Materials Inc 化学機械研磨装置の基板支持部材、および化学機械研磨装置
KR101489963B1 (ko) * 2007-12-13 2015-02-04 한국에이에스엠지니텍 주식회사 박막 증착 장치 및 이를 이용한 증착 방법
US8273178B2 (en) * 2008-02-28 2012-09-25 Asm Genitech Korea Ltd. Thin film deposition apparatus and method of maintaining the same
US8454408B2 (en) * 2008-11-26 2013-06-04 Applied Materials, Inc. Load cup substrate sensing
CN103293862B (zh) * 2012-02-22 2015-04-15 上海微电子装备有限公司 硅片边缘保护装置
JP6027454B2 (ja) * 2013-02-05 2016-11-16 株式会社荏原製作所 研磨装置
JP6145334B2 (ja) * 2013-06-28 2017-06-07 株式会社荏原製作所 基板処理装置
US10269557B2 (en) * 2015-10-20 2019-04-23 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus of processing semiconductor substrate
US10373858B2 (en) 2016-04-06 2019-08-06 Lam Research Corporation Chuck for edge bevel removal and method for centering a wafer prior to edge bevel removal
CN206692727U (zh) * 2017-04-28 2017-12-01 京东方科技集团股份有限公司 一种基板承载组件及磁控溅射装置
US10792736B1 (en) * 2018-05-26 2020-10-06 Kitagawa-Northtech, Inc. Lightweight intelligent top-tooling apparatus
CN110103119A (zh) * 2018-09-20 2019-08-09 杭州众硅电子科技有限公司 一种抛光装卸部件模块
JP7052771B2 (ja) * 2019-04-15 2022-04-12 株式会社Sumco 片面研磨装置へのウェーハ装填装置
CN110860502B (zh) * 2019-12-25 2021-07-16 徐州双裕电子技术有限公司 一种自动清灰传感器

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Also Published As

Publication number Publication date
KR20010040804A (ko) 2001-05-15
US6102057A (en) 2000-08-15
DE69908591T2 (de) 2004-04-29
WO1999041022A1 (en) 1999-08-19
ATE242064T1 (de) 2003-06-15
EP1084001B1 (de) 2003-06-04
US6131589A (en) 2000-10-17
EP1084001A1 (de) 2001-03-21
EP1084001A4 (de) 2001-04-18
US6267642B1 (en) 2001-07-31
US6283827B1 (en) 2001-09-04
KR100545680B1 (ko) 2006-01-24
US6796881B1 (en) 2004-09-28
JP2002503044A (ja) 2002-01-29
US6405740B1 (en) 2002-06-18
US6505635B1 (en) 2003-01-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee