DE69838116D1 - Verfahren zur Behandlung einer Substratoberfläche und Behandlungsmittel hierfür - Google Patents

Verfahren zur Behandlung einer Substratoberfläche und Behandlungsmittel hierfür

Info

Publication number
DE69838116D1
DE69838116D1 DE69838116T DE69838116T DE69838116D1 DE 69838116 D1 DE69838116 D1 DE 69838116D1 DE 69838116 T DE69838116 T DE 69838116T DE 69838116 T DE69838116 T DE 69838116T DE 69838116 D1 DE69838116 D1 DE 69838116D1
Authority
DE
Germany
Prior art keywords
treating
substrate surface
agent therefor
treating agent
therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69838116T
Other languages
English (en)
Other versions
DE69838116T2 (de
Inventor
Hitoshi Morinaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Application granted granted Critical
Publication of DE69838116D1 publication Critical patent/DE69838116D1/de
Publication of DE69838116T2 publication Critical patent/DE69838116T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/33—Amino carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/34—Organic compounds containing sulfur
    • C11D3/349—Organic compounds containing sulfur additionally containing nitrogen atoms, e.g. nitro, nitroso, amino, imino, nitrilo, nitrile groups containing compounds or their derivatives or thio urea
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/36—Organic compounds containing phosphorus
    • C11D3/364—Organic compounds containing phosphorus containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/36—Organic compounds containing phosphorus
    • C11D3/365—Organic compounds containing phosphorus containing carboxyl groups
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/34—Organic compounds containing sulfur
    • C11D3/3418—Toluene -, xylene -, cumene -, benzene - or naphthalene sulfonates or sulfates
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/34—Organic compounds containing sulfur
    • C11D3/3472—Organic compounds containing sulfur additionally containing -COOH groups or derivatives thereof
DE69838116T 1997-01-27 1998-01-26 Verfahren zur Behandlung einer Substratoberfläche und Behandlungsmittel hierfür Expired - Lifetime DE69838116T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1223297 1997-01-27
JP1223297 1997-01-27

Publications (2)

Publication Number Publication Date
DE69838116D1 true DE69838116D1 (de) 2007-09-06
DE69838116T2 DE69838116T2 (de) 2008-04-10

Family

ID=11799636

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69838116T Expired - Lifetime DE69838116T2 (de) 1997-01-27 1998-01-26 Verfahren zur Behandlung einer Substratoberfläche und Behandlungsmittel hierfür

Country Status (5)

Country Link
US (2) US6143706A (de)
EP (1) EP0858102B1 (de)
KR (1) KR100497835B1 (de)
DE (1) DE69838116T2 (de)
TW (1) TW442864B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3003684B1 (ja) * 1998-09-07 2000-01-31 日本電気株式会社 基板洗浄方法および基板洗浄液
US6627553B1 (en) * 1998-11-27 2003-09-30 Showa Denko K.K. Composition for removing side wall and method of removing side wall
JP4516176B2 (ja) * 1999-04-20 2010-08-04 関東化学株式会社 電子材料用基板洗浄液
US7456113B2 (en) * 2000-06-26 2008-11-25 Applied Materials, Inc. Cleaning method and solution for cleaning a wafer in a single wafer process
US6927176B2 (en) * 2000-06-26 2005-08-09 Applied Materials, Inc. Cleaning method and solution for cleaning a wafer in a single wafer process
KR100363092B1 (ko) * 2000-06-27 2002-12-05 삼성전자 주식회사 강유전체막의 손상층을 제거하기 위한 세정액 및 이를이용한 세정방법
TWI276682B (en) * 2001-11-16 2007-03-21 Mitsubishi Chem Corp Substrate surface cleaning liquid mediums and cleaning method
US7481949B2 (en) 2002-11-08 2009-01-27 Wako Pure Chemical Industries, Ltd Polishing composition and rinsing composition
US7442675B2 (en) * 2003-06-18 2008-10-28 Tokyo Ohka Kogyo Co., Ltd. Cleaning composition and method of cleaning semiconductor substrate
US7101832B2 (en) 2003-06-19 2006-09-05 Johnsondiversey, Inc. Cleaners containing peroxide bleaching agents for cleaning paper making equipment and method
JP4471094B2 (ja) * 2004-05-11 2010-06-02 三菱瓦斯化学株式会社 チタンまたはチタン合金のエッチング液
US7939482B2 (en) * 2005-05-25 2011-05-10 Freescale Semiconductor, Inc. Cleaning solution for a semiconductor wafer
US7645731B1 (en) * 2009-01-08 2010-01-12 Ecolab Inc. Use of aminocarboxylate functionalized catechols for cleaning applications
US20190032220A1 (en) * 2017-07-25 2019-01-31 Rohm And Haas Electronic Materials Llc Chrome-free etch solutions for chemically resistant polymer materials
DE102021214688A1 (de) 2021-12-20 2023-06-22 Henkel Ag & Co. Kgaa Metallkomplexe und Geschirrspülmittel, die sie enthalten

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1159462A (en) * 1967-06-30 1969-07-23 Chemolimpex Novel Organic Chelating Compounds
US4721532A (en) * 1985-08-05 1988-01-26 W. R. Grace & Co. Removal of iron fouling in cooling water systems
US4666528A (en) * 1985-11-27 1987-05-19 Halliburton Company Method of removing iron and copper-containing scale from a metal surface
FR2627772B1 (fr) * 1988-02-29 1990-08-17 Protex Manuf Prod Chimiq Nouveau procede de preparation de l'acide ethylene-diamine-n-n(prime)-bis(ortho-hydroxyphenylacetique) et de derives de celui-ci
DE69231971T2 (de) * 1991-01-24 2002-04-04 Wako Pure Chem Ind Ltd Lösungen zur Oberflächenbehandlung von Halbleitern
JP3075290B2 (ja) * 1991-02-28 2000-08-14 三菱瓦斯化学株式会社 半導体基板の洗浄液
US5183573A (en) * 1991-07-22 1993-02-02 W. R. Grace & Co.-Conn. Multipurpose scale preventer/remover
TW274630B (de) * 1994-01-28 1996-04-21 Wako Zunyaku Kogyo Kk
US5466389A (en) * 1994-04-20 1995-11-14 J. T. Baker Inc. PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates
US5885362A (en) 1995-07-27 1999-03-23 Mitsubishi Chemical Corporation Method for treating surface of substrate
JP3887846B2 (ja) * 1996-07-04 2007-02-28 三菱化学株式会社 高純度エチレンジアミンジオルトヒドロキシフェニル酢酸及びそれを用いた表面処理組成物

Also Published As

Publication number Publication date
EP0858102B1 (de) 2007-07-25
EP0858102A3 (de) 2000-08-30
US6228179B1 (en) 2001-05-08
TW442864B (en) 2001-06-23
US6143706A (en) 2000-11-07
DE69838116T2 (de) 2008-04-10
KR100497835B1 (ko) 2005-09-08
EP0858102A2 (de) 1998-08-12
KR19980070759A (ko) 1998-10-26

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