DE69835659D1 - Mehrschichtiges keramisches Substrat mit einem passiven Bauelement, sowie Herstellungsverfahren - Google Patents
Mehrschichtiges keramisches Substrat mit einem passiven Bauelement, sowie HerstellungsverfahrenInfo
- Publication number
- DE69835659D1 DE69835659D1 DE69835659T DE69835659T DE69835659D1 DE 69835659 D1 DE69835659 D1 DE 69835659D1 DE 69835659 T DE69835659 T DE 69835659T DE 69835659 T DE69835659 T DE 69835659T DE 69835659 D1 DE69835659 D1 DE 69835659D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- ceramic substrate
- multilayer ceramic
- passive component
- passive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/642—Capacitive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58498 | 1998-01-06 | ||
JP00058498A JP3322199B2 (ja) | 1998-01-06 | 1998-01-06 | 多層セラミック基板およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69835659D1 true DE69835659D1 (de) | 2006-10-05 |
DE69835659T2 DE69835659T2 (de) | 2007-09-20 |
Family
ID=11477776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69835659T Expired - Lifetime DE69835659T2 (de) | 1998-01-06 | 1998-12-30 | Mehrschichtiges keramisches Substrat mit einem passiven Bauelement, sowie Herstellungsverfahren |
Country Status (5)
Country | Link |
---|---|
US (1) | US6153290A (de) |
EP (1) | EP0929207B1 (de) |
JP (1) | JP3322199B2 (de) |
KR (1) | KR100352780B1 (de) |
DE (1) | DE69835659T2 (de) |
Families Citing this family (80)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999056510A1 (fr) * | 1998-04-24 | 1999-11-04 | Matsushita Electric Industrial Co., Ltd. | Procede servant a fabriquer un substrat en ceramique possedant des couches multiples |
US6228196B1 (en) * | 1998-06-05 | 2001-05-08 | Murata Manufacturing Co., Ltd. | Method of producing a multi-layer ceramic substrate |
US6377464B1 (en) * | 1999-01-29 | 2002-04-23 | Conexant Systems, Inc. | Multiple chip module with integrated RF capabilities |
WO2000063970A1 (fr) * | 1999-04-16 | 2000-10-26 | Matsushita Electric Industrial Co., Ltd. | Composant modulaire et son procede de production |
KR20070101408A (ko) * | 1999-09-02 | 2007-10-16 | 이비덴 가부시키가이샤 | 프린트배선판 및 프린트배선판의 제조방법 |
KR100890475B1 (ko) * | 1999-09-02 | 2009-03-26 | 이비덴 가부시키가이샤 | 프린트배선판 및 그 제조방법 |
JP3646587B2 (ja) * | 1999-10-27 | 2005-05-11 | 株式会社村田製作所 | 多層セラミック基板およびその製造方法 |
US6535398B1 (en) * | 2000-03-07 | 2003-03-18 | Fujitsu Limited | Multichip module substrates with buried discrete capacitors and components and methods for making |
US6841740B2 (en) * | 2000-06-14 | 2005-01-11 | Ngk Spark Plug Co., Ltd. | Printed-wiring substrate and method for fabricating the same |
EP1231825A4 (de) * | 2000-06-29 | 2005-09-28 | Mitsubishi Electric Corp | Mehrschichtiges substratmodul und tragbares, drahtloses terminal |
US6407929B1 (en) * | 2000-06-29 | 2002-06-18 | Intel Corporation | Electronic package having embedded capacitors and method of fabrication therefor |
CN1196392C (zh) * | 2000-07-31 | 2005-04-06 | 日本特殊陶业株式会社 | 布线基板及其制造方法 |
US6600385B2 (en) * | 2000-08-21 | 2003-07-29 | Tdk Corporation | Front end module for mobile communications apparatus |
TW471067B (en) * | 2000-08-31 | 2002-01-01 | Advanced Semiconductor Eng | Integrated circuit package board which integrates de-coupled capacitor |
JP2002084065A (ja) * | 2000-09-07 | 2002-03-22 | Murata Mfg Co Ltd | 多層セラミック基板およびその製造方法ならびに電子装置 |
US6388207B1 (en) | 2000-12-29 | 2002-05-14 | Intel Corporation | Electronic assembly with trench structures and methods of manufacture |
US20020158305A1 (en) * | 2001-01-05 | 2002-10-31 | Sidharth Dalmia | Organic substrate having integrated passive components |
JP2002246503A (ja) * | 2001-02-16 | 2002-08-30 | Philips Japan Ltd | 電子部品及びその製造方法 |
JP2002252297A (ja) * | 2001-02-23 | 2002-09-06 | Hitachi Ltd | 多層回路基板を用いた電子回路装置 |
JP3716783B2 (ja) * | 2001-11-22 | 2005-11-16 | 株式会社村田製作所 | セラミック多層基板の製造方法及び半導体装置 |
US6711029B2 (en) * | 2002-05-21 | 2004-03-23 | Cts Corporation | Low temperature co-fired ceramic with improved shrinkage control |
US7260890B2 (en) * | 2002-06-26 | 2007-08-28 | Georgia Tech Research Corporation | Methods for fabricating three-dimensional all organic interconnect structures |
US6987307B2 (en) | 2002-06-26 | 2006-01-17 | Georgia Tech Research Corporation | Stand-alone organic-based passive devices |
US6900708B2 (en) * | 2002-06-26 | 2005-05-31 | Georgia Tech Research Corporation | Integrated passive devices fabricated utilizing multi-layer, organic laminates |
TW546800B (en) * | 2002-06-27 | 2003-08-11 | Via Tech Inc | Integrated moduled board embedded with IC chip and passive device and its manufacturing method |
US6876535B2 (en) * | 2002-10-10 | 2005-04-05 | Matsushita Electric Industrial Co., Ltd. | Ceramic capacitor, method for producing the same, and dielectric multilayer device |
US20040108134A1 (en) * | 2002-10-11 | 2004-06-10 | Borland William J. | Printed wiring boards having low inductance embedded capacitors and methods of making same |
US6806793B2 (en) * | 2002-12-13 | 2004-10-19 | International Business Machines Corporation | MLC frequency selective circuit structures |
US7489914B2 (en) * | 2003-03-28 | 2009-02-10 | Georgia Tech Research Corporation | Multi-band RF transceiver with passive reuse in organic substrates |
US7626828B1 (en) * | 2003-07-30 | 2009-12-01 | Teradata Us, Inc. | Providing a resistive element between reference plane layers in a circuit board |
US8345433B2 (en) * | 2004-07-08 | 2013-01-01 | Avx Corporation | Heterogeneous organic laminate stack ups for high frequency applications |
JP4310468B2 (ja) * | 2004-10-29 | 2009-08-12 | 株式会社村田製作所 | セラミック多層基板及びその製造方法 |
US7423608B2 (en) * | 2005-12-20 | 2008-09-09 | Motorola, Inc. | High impedance electromagnetic surface and method |
US7342308B2 (en) | 2005-12-20 | 2008-03-11 | Atmel Corporation | Component stacking for integrated circuit electronic package |
US7821122B2 (en) * | 2005-12-22 | 2010-10-26 | Atmel Corporation | Method and system for increasing circuitry interconnection and component capacity in a multi-component package |
US7843302B2 (en) * | 2006-05-08 | 2010-11-30 | Ibiden Co., Ltd. | Inductor and electric power supply using it |
US7439840B2 (en) | 2006-06-27 | 2008-10-21 | Jacket Micro Devices, Inc. | Methods and apparatuses for high-performing multi-layer inductors |
US7808434B2 (en) * | 2006-08-09 | 2010-10-05 | Avx Corporation | Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices |
US7989895B2 (en) | 2006-11-15 | 2011-08-02 | Avx Corporation | Integration using package stacking with multi-layer organic substrates |
KR100826410B1 (ko) * | 2006-12-29 | 2008-04-29 | 삼성전기주식회사 | 캐패시터 및 이를 이용한 캐패시터 내장형 다층 기판 구조 |
KR100896601B1 (ko) * | 2007-11-05 | 2009-05-08 | 삼성전기주식회사 | 무수축 세라믹 기판의 제조방법 및 이를 이용한 무수축세라믹 기판 |
US20090115022A1 (en) * | 2007-11-06 | 2009-05-07 | Nec Electronics Coroporation | Semiconductor device |
US8064214B2 (en) * | 2008-01-04 | 2011-11-22 | Dialogic Corporation | Press fit passive component |
KR101004840B1 (ko) * | 2008-09-05 | 2010-12-28 | 삼성전기주식회사 | 캐비티를 갖는 다층 세라믹 기판의 제조방법 |
US8198548B2 (en) * | 2009-07-23 | 2012-06-12 | Lexmark International, Inc. | Z-directed capacitor components for printed circuit boards |
US8198547B2 (en) * | 2009-07-23 | 2012-06-12 | Lexmark International, Inc. | Z-directed pass-through components for printed circuit boards |
US8278568B2 (en) * | 2009-07-23 | 2012-10-02 | Lexmark International, Inc. | Z-directed variable value components for printed circuit boards |
US8237061B2 (en) * | 2009-07-23 | 2012-08-07 | Lexmark International, Inc. | Z-directed filter components for printed circuit boards |
US20110017502A1 (en) * | 2009-07-23 | 2011-01-27 | Keith Bryan Hardin | Z-Directed Components for Printed Circuit Boards |
US8735734B2 (en) * | 2009-07-23 | 2014-05-27 | Lexmark International, Inc. | Z-directed delay line components for printed circuit boards |
US20110017504A1 (en) * | 2009-07-23 | 2011-01-27 | Keith Bryan Hardin | Z-Directed Ferrite Bead Components for Printed Circuit Boards |
US8273996B2 (en) * | 2009-07-23 | 2012-09-25 | Lexmark International, Inc. | Z-directed connector components for printed circuit boards |
US20110017581A1 (en) * | 2009-07-23 | 2011-01-27 | Keith Bryan Hardin | Z-Directed Switch Components for Printed Circuit Boards |
JP5305042B2 (ja) | 2010-07-22 | 2013-10-02 | Tdk株式会社 | 積層型電子部品の製造方法 |
US9107306B2 (en) * | 2010-10-14 | 2015-08-11 | Panasonic Intellectual Property Management Co., Ltd. | Hybrid substrate, method for manufacturing the same, and semiconductor integrated circuit package |
US8752280B2 (en) | 2011-09-30 | 2014-06-17 | Lexmark International, Inc. | Extrusion process for manufacturing a Z-directed component for a printed circuit board |
US8790520B2 (en) | 2011-08-31 | 2014-07-29 | Lexmark International, Inc. | Die press process for manufacturing a Z-directed component for a printed circuit board |
US9009954B2 (en) | 2011-08-31 | 2015-04-21 | Lexmark International, Inc. | Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material |
US9078374B2 (en) | 2011-08-31 | 2015-07-07 | Lexmark International, Inc. | Screening process for manufacturing a Z-directed component for a printed circuit board |
US8658245B2 (en) | 2011-08-31 | 2014-02-25 | Lexmark International, Inc. | Spin coat process for manufacturing a Z-directed component for a printed circuit board |
US8943684B2 (en) * | 2011-08-31 | 2015-02-03 | Lexmark International, Inc. | Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board |
US8822838B2 (en) | 2012-03-29 | 2014-09-02 | Lexmark International, Inc. | Z-directed printed circuit board components having conductive channels for reducing radiated emissions |
US8912452B2 (en) | 2012-03-29 | 2014-12-16 | Lexmark International, Inc. | Z-directed printed circuit board components having different dielectric regions |
US8830692B2 (en) | 2012-03-29 | 2014-09-09 | Lexmark International, Inc. | Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component |
US8822840B2 (en) | 2012-03-29 | 2014-09-02 | Lexmark International, Inc. | Z-directed printed circuit board components having conductive channels for controlling transmission line impedance |
US9613917B2 (en) | 2012-03-30 | 2017-04-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package-on-package (PoP) device with integrated passive device in a via |
US9165887B2 (en) | 2012-09-10 | 2015-10-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device with discrete blocks |
US9391041B2 (en) | 2012-10-19 | 2016-07-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fan-out wafer level package structure |
JP2014192225A (ja) * | 2013-03-26 | 2014-10-06 | Ngk Spark Plug Co Ltd | 配線基板 |
US10014843B2 (en) * | 2013-08-08 | 2018-07-03 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Multilayer electronic structures with embedded filters |
US9373527B2 (en) | 2013-10-30 | 2016-06-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chip on package structure and method |
JP2015135870A (ja) * | 2014-01-16 | 2015-07-27 | 富士通株式会社 | インダクタ装置及びインダクタ装置の製造方法 |
US20160055976A1 (en) * | 2014-08-25 | 2016-02-25 | Qualcomm Incorporated | Package substrates including embedded capacitors |
US10062838B2 (en) * | 2015-03-31 | 2018-08-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Co-fired passive integrated circuit devices |
JP2016207940A (ja) * | 2015-04-27 | 2016-12-08 | イビデン株式会社 | 電子部品内蔵配線板及びその製造方法 |
WO2016189609A1 (ja) * | 2015-05-25 | 2016-12-01 | オリンパス株式会社 | 立体配線板および立体配線板の製造方法 |
US9748227B2 (en) * | 2015-07-15 | 2017-08-29 | Apple Inc. | Dual-sided silicon integrated passive devices |
US9839131B2 (en) * | 2015-10-21 | 2017-12-05 | International Business Machines Corporation | Embedding a discrete electrical device in a printed circuit board |
WO2018063279A1 (en) * | 2016-09-30 | 2018-04-05 | Intel Corporation | Vertical embedded component in a printed circuit board blind hole |
CN112738994B (zh) * | 2020-11-24 | 2022-12-09 | 鹤山市世拓电子科技有限公司 | 一种内嵌功率器件的印刷电路板 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4109296A (en) * | 1977-08-01 | 1978-08-22 | Ncr Corporation | Machine insertable circuit board electronic component |
JPS60166289A (ja) * | 1984-02-03 | 1985-08-29 | 松下電器産業株式会社 | アルミナ回路基板 |
JPH0632378B2 (ja) * | 1985-06-14 | 1994-04-27 | 株式会社村田製作所 | 電子部品内蔵多層セラミック基板 |
JPH01179741A (ja) * | 1988-01-12 | 1989-07-17 | Asahi Glass Co Ltd | ガラスセラミックス組成物 |
US4811164A (en) * | 1988-03-28 | 1989-03-07 | American Telephone And Telegraph Company, At&T Bell Laboratories | Monolithic capacitor-varistor |
US4899118A (en) * | 1988-12-27 | 1990-02-06 | Hughes Aircraft Company | Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits |
DE4030055A1 (de) * | 1990-09-22 | 1992-03-26 | Bosch Gmbh Robert | Verfahren zum herstellen einer schaltung |
JP2753892B2 (ja) * | 1990-09-29 | 1998-05-20 | 京セラ株式会社 | コンデンサー内蔵複合回路基板 |
US5055966A (en) * | 1990-12-17 | 1991-10-08 | Hughes Aircraft Company | Via capacitors within multi-layer, 3 dimensional structures/substrates |
JPH04280496A (ja) * | 1991-03-07 | 1992-10-06 | Narumi China Corp | コンデンサ内蔵セラミック多層回路基板及びその製造方法 |
EP0547807A3 (en) * | 1991-12-16 | 1993-09-22 | General Electric Company | Packaged electronic system |
US5384434A (en) * | 1992-03-02 | 1995-01-24 | Murata Manufacturing Co., Ltd. | Multilayer ceramic circuit board |
EP0563873B1 (de) * | 1992-04-03 | 1998-06-03 | Matsushita Electric Industrial Co., Ltd. | Keramisches Mehrschicht-Substrat für hohe Frequenzen |
US5661882A (en) * | 1995-06-30 | 1997-09-02 | Ferro Corporation | Method of integrating electronic components into electronic circuit structures made using LTCC tape |
JPH0992983A (ja) * | 1995-07-17 | 1997-04-04 | Sumitomo Kinzoku Electro Device:Kk | セラミック多層基板の製造方法 |
JPH0992978A (ja) * | 1995-09-21 | 1997-04-04 | Sumitomo Metal Mining Co Ltd | コンデンサ内蔵ガラスセラミック基板 |
US5708570A (en) * | 1995-10-11 | 1998-01-13 | Hughes Aircraft Company | Shrinkage-matched circuit package utilizing low temperature co-fired ceramic structures |
US5708559A (en) * | 1995-10-27 | 1998-01-13 | International Business Machines Corporation | Precision analog metal-metal capacitor |
US5757611A (en) * | 1996-04-12 | 1998-05-26 | Norhtrop Grumman Corporation | Electronic package having buried passive components |
US6021050A (en) * | 1998-12-02 | 2000-02-01 | Bourns, Inc. | Printed circuit boards with integrated passive components and method for making same |
-
1998
- 1998-01-06 JP JP00058498A patent/JP3322199B2/ja not_active Expired - Fee Related
- 1998-12-28 US US09/221,466 patent/US6153290A/en not_active Expired - Fee Related
- 1998-12-30 DE DE69835659T patent/DE69835659T2/de not_active Expired - Lifetime
- 1998-12-30 EP EP98124881A patent/EP0929207B1/de not_active Expired - Lifetime
-
1999
- 1999-01-06 KR KR1019990000097A patent/KR100352780B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6153290A (en) | 2000-11-28 |
JPH11195873A (ja) | 1999-07-21 |
KR19990067739A (ko) | 1999-08-25 |
DE69835659T2 (de) | 2007-09-20 |
EP0929207A2 (de) | 1999-07-14 |
JP3322199B2 (ja) | 2002-09-09 |
KR100352780B1 (ko) | 2002-09-16 |
EP0929207B1 (de) | 2006-08-23 |
EP0929207A3 (de) | 2000-03-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69835659D1 (de) | Mehrschichtiges keramisches Substrat mit einem passiven Bauelement, sowie Herstellungsverfahren | |
DE69938767D1 (de) | Halbleiterbauelement und dessen herstellungsverfahren, bauelementsubstrat, und elektronisches bauelement | |
DE60320717D1 (de) | Schichtbildungsverfahren und Substrat mit einer dadurch erhaltenen Schicht | |
DE69729158D1 (de) | Auf einem Substrat hergestellte Quantendrähte und deren Herstellungsverfahren, sowie ein Bauteil mit Quantendrähten auf einem Substrat | |
DE69833222D1 (de) | Mehrlagige deckschicht und herstellungsverfahren | |
SG91948A1 (en) | Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method | |
AU6229199A (en) | Multilayer electronic part, its manufacturing method, two-dimensionally arrayed element packaging structure, and its manufacturing method | |
DE69906945D1 (de) | Mehrschichtige wärmefixierwalzen aus mit einer fluorpolymerbeschichtung versehener nachgiebiger unterlage und herstellungsverfahren | |
EP0609861A3 (de) | Keramisches Substrat und Verfahren zu dessen Herstellung. | |
GB2380198B (en) | Photosensitive conductive paste,method for forming conductive pattern using the same,and method for manufacturing ceramic multilayer element | |
EP0676796A3 (de) | Halbleitersubstrat und Verfahren zur Herstellung. | |
DE60208795D1 (de) | Mehrschicht polymerartikel mit vernetzten polymerlagen und herstellungsverfahren | |
DE60118817D1 (de) | Integrierte Schaltung mit einem dielektrischen Schichtverbund und Verfahren | |
DE69835934D1 (de) | Mehrlagiges keramisches Elektronikbauteil und dessen Herstellungsverfahren | |
DE69514435T2 (de) | Metallisiertes Keramiksubstrat mit glatter Plattierungsschicht und Herstellungsverfahren | |
HK1021772A1 (en) | Multilayer electronic component and manufacturing method thereof | |
EP1229389A4 (de) | Lichtempfindliche zusammensetzung, sowie ein entsprechendes lichtempfindliches element; verfahren zur erzeugung eines resistmusters; ein resistmuster, sowie ein substrat auf das das muster auflaminiert ist. | |
DE69837134D1 (de) | Herstellung eines mehrschichtigen keramischen Substrats mit einem passiven Bauelement | |
AU2003275583A1 (en) | Substrate having multilayer film and method for manufacturing the same | |
GB2395604B (en) | Ceramic multilayer substrate and method for manufacturing the same | |
GB2395605B (en) | Ceramic multilayer substrate and method for manufacturing the same | |
HK1029218A1 (en) | Multi layer ceramic electronic parts and manufacturing method thereof. | |
AU2003248359A1 (en) | Ceramic multilayer substrate manufacturing method and unfired composite multilayer body | |
DE69840062D1 (de) | Keramisches Substrat mit einer metallischen Schaltung | |
DE69602121T2 (de) | Mehrschichtsystem bestehend aus einer Diamantschicht, einer Zwischenschicht, und einem metallischen Substrat |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |