DE69826837D1 - Inspektionsverfahren - Google Patents

Inspektionsverfahren

Info

Publication number
DE69826837D1
DE69826837D1 DE69826837T DE69826837T DE69826837D1 DE 69826837 D1 DE69826837 D1 DE 69826837D1 DE 69826837 T DE69826837 T DE 69826837T DE 69826837 T DE69826837 T DE 69826837T DE 69826837 D1 DE69826837 D1 DE 69826837D1
Authority
DE
Germany
Prior art keywords
inspection procedures
inspection
procedures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69826837T
Other languages
English (en)
Inventor
Joseph King
Edmund Ludlow
George Schurr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Acuity Imaging LLC
Original Assignee
Acuity Imaging LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/807,397 external-priority patent/US5943125A/en
Application filed by Acuity Imaging LLC filed Critical Acuity Imaging LLC
Application granted granted Critical
Publication of DE69826837D1 publication Critical patent/DE69826837D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95684Patterns showing highly reflecting parts, e.g. metallic elements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817Monitoring of soldering processes
DE69826837T 1997-02-26 1998-01-29 Inspektionsverfahren Expired - Lifetime DE69826837D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/807,397 US5943125A (en) 1997-02-26 1997-02-26 Ring illumination apparatus for illuminating reflective elements on a generally planar surface
US08/824,173 US5926557A (en) 1997-02-26 1997-03-26 Inspection method
PCT/US1998/001803 WO1998038498A1 (en) 1997-02-26 1998-01-29 Inspection method

Publications (1)

Publication Number Publication Date
DE69826837D1 true DE69826837D1 (de) 2004-11-11

Family

ID=27123007

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69826837T Expired - Lifetime DE69826837D1 (de) 1997-02-26 1998-01-29 Inspektionsverfahren

Country Status (8)

Country Link
US (1) US5926557A (de)
EP (2) EP1174708A1 (de)
JP (1) JP2002515123A (de)
KR (1) KR20000075763A (de)
AU (1) AU734389B2 (de)
CA (1) CA2282498A1 (de)
DE (1) DE69826837D1 (de)
WO (1) WO1998038498A1 (de)

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ATE322665T1 (de) * 1999-07-13 2006-04-15 Beaty Elwin M Verfahren und apparat für die dreidimensionale inspektion von elektronischen komponenten
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KR20020000583A (ko) * 2000-06-23 2002-01-05 최종배 3차원영상측정시스템
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US7344273B2 (en) 2005-03-22 2008-03-18 Binary Works, Inc. Ring light with user manipulable control
US20060291715A1 (en) * 2005-06-24 2006-12-28 Mv Research Limited Machine vision system and method
AT502810B1 (de) * 2005-11-17 2007-06-15 Arc Seibersdorf Res Gmbh Verfahren zur optischen prüfung von gegenständen
KR100763859B1 (ko) * 2006-06-16 2007-10-05 한국 고덴시 주식회사 칩 발광다이오드 패키지
SG138491A1 (en) * 2006-06-21 2008-01-28 Generic Power Pte Ltd Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components
US20080199068A1 (en) * 2007-01-10 2008-08-21 Duquette David W Inspection System
CN101711353A (zh) * 2007-06-12 2010-05-19 1317442艾伯塔有限公司 用于相机传感器灰尘检测的放大镜和照明组件
KR102100211B1 (ko) * 2015-09-10 2020-04-13 주식회사 히타치하이테크 검사 장치
US10499487B2 (en) 2015-10-05 2019-12-03 Scalia Lighting Technologies LLC Light-emitting diode (LED) lighting fixture solutions and methods
CN109187585A (zh) * 2018-10-22 2019-01-11 珠海格力智能装备有限公司 激光图标信息获取方法以及装置

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US4688935A (en) * 1983-06-24 1987-08-25 Morton Thiokol, Inc. Plasma spectroscopic analysis of organometallic compounds
JPS60249204A (ja) * 1984-05-24 1985-12-09 肇産業株式会社 照明装置
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US5023916A (en) * 1989-08-28 1991-06-11 Hewlett-Packard Company Method for inspecting the leads of electrical components on surface mount printed circuit boards
US5058178A (en) * 1989-12-21 1991-10-15 At&T Bell Laboratories Method and apparatus for inspection of specular, three-dimensional features
US5298989A (en) * 1990-03-12 1994-03-29 Fujitsu Limited Method of and apparatus for multi-image inspection of bonding wire
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JP2953736B2 (ja) * 1990-03-20 1999-09-27 松下電器産業株式会社 半田の形状検査方法
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US5137362A (en) * 1990-03-26 1992-08-11 Motorola, Inc. Automatic package inspection method
US5064291A (en) * 1990-04-03 1991-11-12 Hughes Aircraft Company Method and apparatus for inspection of solder joints utilizing shape determination from shading
US5495424A (en) * 1990-04-18 1996-02-27 Matsushita Electric Industrial Co., Ltd. Method and apparatus for inspecting solder portions
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Also Published As

Publication number Publication date
JP2002515123A (ja) 2002-05-21
WO1998038498A1 (en) 1998-09-03
EP0963548A1 (de) 1999-12-15
US5926557A (en) 1999-07-20
KR20000075763A (ko) 2000-12-26
EP0963548B1 (de) 2004-10-06
EP1174708A1 (de) 2002-01-23
CA2282498A1 (en) 1998-09-03
AU6318298A (en) 1998-09-18
EP0963548A4 (de) 2001-06-13
AU734389B2 (en) 2001-06-14

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Legal Events

Date Code Title Description
8332 No legal effect for de