DE69823679D1 - Miniaturisiertes halbleiter-kondensatormikrophon - Google Patents

Miniaturisiertes halbleiter-kondensatormikrophon

Info

Publication number
DE69823679D1
DE69823679D1 DE69823679T DE69823679T DE69823679D1 DE 69823679 D1 DE69823679 D1 DE 69823679D1 DE 69823679 T DE69823679 T DE 69823679T DE 69823679 T DE69823679 T DE 69823679T DE 69823679 D1 DE69823679 D1 DE 69823679D1
Authority
DE
Germany
Prior art keywords
frame
movable plate
distal portion
condenser microphone
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69823679T
Other languages
English (en)
Other versions
DE69823679T2 (de
Inventor
V Loeppert
E Schafer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Knowles Electronics LLC
Original Assignee
Knowles Electronics LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Knowles Electronics LLC filed Critical Knowles Electronics LLC
Publication of DE69823679D1 publication Critical patent/DE69823679D1/de
Application granted granted Critical
Publication of DE69823679T2 publication Critical patent/DE69823679T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
DE69823679T 1997-02-25 1998-02-19 Miniaturisiertes halbleiter-kondensatormikrophon Expired - Lifetime DE69823679T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/805,983 US5870482A (en) 1997-02-25 1997-02-25 Miniature silicon condenser microphone
US805983 1997-02-25
PCT/US1998/003144 WO1998037388A1 (en) 1997-02-25 1998-02-19 Miniature silicon condenser microphone

Publications (2)

Publication Number Publication Date
DE69823679D1 true DE69823679D1 (de) 2004-06-09
DE69823679T2 DE69823679T2 (de) 2005-04-28

Family

ID=25193025

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69823679T Expired - Lifetime DE69823679T2 (de) 1997-02-25 1998-02-19 Miniaturisiertes halbleiter-kondensatormikrophon

Country Status (8)

Country Link
US (1) US5870482A (de)
EP (1) EP1012547B1 (de)
JP (1) JP3556676B2 (de)
AT (1) ATE266190T1 (de)
AU (1) AU6658798A (de)
DE (1) DE69823679T2 (de)
DK (1) DK1012547T3 (de)
WO (1) WO1998037388A1 (de)

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DE69823679T2 (de) 2005-04-28
EP1012547B1 (de) 2004-05-06
WO1998037388A1 (en) 1998-08-27
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EP1012547A1 (de) 2000-06-28
ATE266190T1 (de) 2004-05-15

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