DE69823556D1 - Prozesskammer und verfahren zur absetzung und/oder entfernung von material auf einem substrat - Google Patents

Prozesskammer und verfahren zur absetzung und/oder entfernung von material auf einem substrat

Info

Publication number
DE69823556D1
DE69823556D1 DE69823556T DE69823556T DE69823556D1 DE 69823556 D1 DE69823556 D1 DE 69823556D1 DE 69823556 T DE69823556 T DE 69823556T DE 69823556 T DE69823556 T DE 69823556T DE 69823556 D1 DE69823556 D1 DE 69823556D1
Authority
DE
Germany
Prior art keywords
depositing
substrate
process chamber
removing material
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69823556T
Other languages
English (en)
Other versions
DE69823556T2 (de
Inventor
H Chiu
H Holtkamp
C Ko
J Lowery
Peter Cho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mattson Thermal Products Inc
Original Assignee
Mattson Thermal Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mattson Thermal Products Inc filed Critical Mattson Thermal Products Inc
Application granted granted Critical
Publication of DE69823556D1 publication Critical patent/DE69823556D1/de
Publication of DE69823556T2 publication Critical patent/DE69823556T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
DE69823556T 1997-08-22 1998-08-03 Prozesskammer und verfahren zum abschneiden von material auf einem substrat und/oder zum entfernen von material von einem substrat Expired - Fee Related DE69823556T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/916,564 US6017437A (en) 1997-08-22 1997-08-22 Process chamber and method for depositing and/or removing material on a substrate
PCT/US1998/016174 WO1999010566A2 (en) 1997-08-22 1998-08-03 Process chamber and method for depositing and/or removing material on a substrate
US916564 2001-07-27

Publications (2)

Publication Number Publication Date
DE69823556D1 true DE69823556D1 (de) 2004-06-03
DE69823556T2 DE69823556T2 (de) 2005-04-14

Family

ID=25437473

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69823556T Expired - Fee Related DE69823556T2 (de) 1997-08-22 1998-08-03 Prozesskammer und verfahren zum abschneiden von material auf einem substrat und/oder zum entfernen von material von einem substrat

Country Status (8)

Country Link
US (3) US6017437A (de)
EP (1) EP1051544B1 (de)
JP (1) JP3274457B2 (de)
KR (1) KR100375869B1 (de)
AU (1) AU8686498A (de)
DE (1) DE69823556T2 (de)
TW (1) TW457572B (de)
WO (1) WO1999010566A2 (de)

Families Citing this family (180)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6017437A (en) * 1997-08-22 2000-01-25 Cutek Research, Inc. Process chamber and method for depositing and/or removing material on a substrate
TW405158B (en) * 1997-09-17 2000-09-11 Ebara Corp Plating apparatus for semiconductor wafer processing
US6416647B1 (en) * 1998-04-21 2002-07-09 Applied Materials, Inc. Electro-chemical deposition cell for face-up processing of single semiconductor substrates
US6099702A (en) * 1998-06-10 2000-08-08 Novellus Systems, Inc. Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability
US6716334B1 (en) 1998-06-10 2004-04-06 Novellus Systems, Inc Electroplating process chamber and method with pre-wetting and rinsing capability
US6447668B1 (en) 1998-07-09 2002-09-10 Acm Research, Inc. Methods and apparatus for end-point detection
US6395152B1 (en) 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
US7136173B2 (en) * 1998-07-09 2006-11-14 Acm Research, Inc. Method and apparatus for end-point detection
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US6187152B1 (en) * 1998-07-17 2001-02-13 Cutek Research, Inc. Multiple station processing chamber and method for depositing and/or removing material on a substrate
US6183611B1 (en) * 1998-07-17 2001-02-06 Cutek Research, Inc. Method and apparatus for the disposal of processing fluid used to deposit and/or remove material on a substrate
WO2000010200A1 (en) * 1998-08-11 2000-02-24 Ebara Corporation Wafer plating method and apparatus
TW522455B (en) * 1998-11-09 2003-03-01 Ebara Corp Plating method and apparatus therefor
US6290865B1 (en) * 1998-11-30 2001-09-18 Applied Materials, Inc. Spin-rinse-drying process for electroplated semiconductor wafers
WO2000040779A1 (en) 1998-12-31 2000-07-13 Semitool, Inc. Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece
US7429537B2 (en) * 1999-01-22 2008-09-30 Semitool, Inc. Methods and apparatus for rinsing and drying
US6557237B1 (en) * 1999-04-08 2003-05-06 Applied Materials, Inc. Removable modular cell for electro-chemical plating and method
CN1296524C (zh) * 1999-04-13 2007-01-24 塞米用具公司 对工件进行电化学处理的处理容器、反应器和方法
US7438788B2 (en) * 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7264698B2 (en) * 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US20030038035A1 (en) * 2001-05-30 2003-02-27 Wilson Gregory J. Methods and systems for controlling current in electrochemical processing of microelectronic workpieces
US7020537B2 (en) * 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6197182B1 (en) 1999-07-07 2001-03-06 Technic Inc. Apparatus and method for plating wafers, substrates and other articles
US6516815B1 (en) 1999-07-09 2003-02-11 Applied Materials, Inc. Edge bead removal/spin rinse dry (EBR/SRD) module
US6344129B1 (en) * 1999-10-13 2002-02-05 International Business Machines Corporation Method for plating copper conductors and devices formed
JP2001188254A (ja) * 1999-10-21 2001-07-10 Matsushita Electric Ind Co Ltd 基板内選択的電気化学処理装置と基板内選択的化学処理装置及びアクティブ基板の検査修正方法
WO2001041191A2 (en) * 1999-10-27 2001-06-07 Semitool, Inc. Method and apparatus for forming an oxidized structure on a microelectronic workpiece
US20020000380A1 (en) * 1999-10-28 2002-01-03 Lyndon W. Graham Method, chemistry, and apparatus for noble metal electroplating on a microelectronic workpiece
GB2355459B (en) * 1999-11-29 2001-09-26 Isis Innovation A dominant conditional lethal genetic system
US6632335B2 (en) 1999-12-24 2003-10-14 Ebara Corporation Plating apparatus
WO2001048800A1 (fr) * 1999-12-24 2001-07-05 Ebara Corporation Procede et appareil de traitement de tranche de semi-conducteur
JP4754757B2 (ja) * 2000-03-30 2011-08-24 東京エレクトロン株式会社 基板のプラズマ処理を調節するための方法、プラズマ処理システム、及び、電極組体
US20050183959A1 (en) * 2000-04-13 2005-08-25 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece
EP1204139A4 (de) * 2000-04-27 2010-04-28 Ebara Corp Rotierende halterung und anordnung zur bearbeitung von halbleitersubstraten
US7195696B2 (en) * 2000-05-11 2007-03-27 Novellus Systems, Inc. Electrode assembly for electrochemical processing of workpiece
US6478936B1 (en) * 2000-05-11 2002-11-12 Nutool Inc. Anode assembly for plating and planarizing a conductive layer
KR20010107766A (ko) * 2000-05-26 2001-12-07 마에다 시게루 기판처리장치 및 기판도금장치
US6398926B1 (en) * 2000-05-31 2002-06-04 Techpoint Pacific Singapore Pte Ltd. Electroplating apparatus and method of using the same
US6747734B1 (en) * 2000-07-08 2004-06-08 Semitool, Inc. Apparatus and method for processing a microelectronic workpiece using metrology
US6428673B1 (en) * 2000-07-08 2002-08-06 Semitool, Inc. Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology
AU2001282879A1 (en) * 2000-07-08 2002-01-21 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
US20020112964A1 (en) * 2000-07-12 2002-08-22 Applied Materials, Inc. Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths
JP3284496B2 (ja) * 2000-08-09 2002-05-20 株式会社荏原製作所 めっき装置及びめっき液除去方法
US7192335B2 (en) * 2002-08-29 2007-03-20 Micron Technology, Inc. Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
US7153195B2 (en) * 2000-08-30 2006-12-26 Micron Technology, Inc. Methods and apparatus for selectively removing conductive material from a microelectronic substrate
US7078308B2 (en) * 2002-08-29 2006-07-18 Micron Technology, Inc. Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate
US7112121B2 (en) * 2000-08-30 2006-09-26 Micron Technology, Inc. Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
US7220166B2 (en) 2000-08-30 2007-05-22 Micron Technology, Inc. Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
US7134934B2 (en) * 2000-08-30 2006-11-14 Micron Technology, Inc. Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
US7129160B2 (en) * 2002-08-29 2006-10-31 Micron Technology, Inc. Method for simultaneously removing multiple conductive materials from microelectronic substrates
US6464855B1 (en) 2000-10-04 2002-10-15 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece
JP4644926B2 (ja) * 2000-10-13 2011-03-09 ソニー株式会社 半導体製造装置および半導体装置の製造方法
DE10052762A1 (de) * 2000-10-25 2002-05-16 Infineon Technologies Ag Verfahren und Vorrichtung zum Reinigen einer Halbleiterscheibe
US6363624B1 (en) 2000-11-21 2002-04-02 Applied Materials, Inc. Apparatus for cleaning a semiconductor process chamber
US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US6896776B2 (en) * 2000-12-18 2005-05-24 Applied Materials Inc. Method and apparatus for electro-chemical processing
US6579439B1 (en) 2001-01-12 2003-06-17 Southern Industrial Chemicals, Inc. Electrolytic aluminum polishing processes
US6402592B1 (en) 2001-01-17 2002-06-11 Steag Cutek Systems, Inc. Electrochemical methods for polishing copper films on semiconductor substrates
JP2002212786A (ja) * 2001-01-17 2002-07-31 Ebara Corp 基板処理装置
US6736952B2 (en) * 2001-02-12 2004-05-18 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece
US20050061676A1 (en) * 2001-03-12 2005-03-24 Wilson Gregory J. System for electrochemically processing a workpiece
US20060169597A1 (en) * 2001-03-14 2006-08-03 Applied Materials, Inc. Method and composition for polishing a substrate
US7582564B2 (en) * 2001-03-14 2009-09-01 Applied Materials, Inc. Process and composition for conductive material removal by electrochemical mechanical polishing
US6811680B2 (en) * 2001-03-14 2004-11-02 Applied Materials Inc. Planarization of substrates using electrochemical mechanical polishing
US7128825B2 (en) * 2001-03-14 2006-10-31 Applied Materials, Inc. Method and composition for polishing a substrate
US6899804B2 (en) * 2001-12-21 2005-05-31 Applied Materials, Inc. Electrolyte composition and treatment for electrolytic chemical mechanical polishing
US7323416B2 (en) * 2001-03-14 2008-01-29 Applied Materials, Inc. Method and composition for polishing a substrate
US7232514B2 (en) * 2001-03-14 2007-06-19 Applied Materials, Inc. Method and composition for polishing a substrate
US7160432B2 (en) * 2001-03-14 2007-01-09 Applied Materials, Inc. Method and composition for polishing a substrate
US7189647B2 (en) 2001-04-05 2007-03-13 Novellus Systems, Inc. Sequential station tool for wet processing of semiconductor wafers
US6572755B2 (en) * 2001-04-11 2003-06-03 Speedfam-Ipec Corporation Method and apparatus for electrochemically depositing a material onto a workpiece surface
US6852618B2 (en) * 2001-04-19 2005-02-08 Micron Technology, Inc. Combined barrier layer and seed layer
EP1256639A1 (de) * 2001-05-08 2002-11-13 Universite Catholique De Louvain Mehrfachbad Elektroplattierung
JP2002332597A (ja) * 2001-05-11 2002-11-22 Tokyo Electron Ltd 液処理装置及び液処理方法
US6722942B1 (en) 2001-05-21 2004-04-20 Advanced Micro Devices, Inc. Chemical mechanical polishing with electrochemical control
DE10296935T5 (de) * 2001-06-14 2004-04-22 Mattson Technology Inc., Fremont Barrierenverstärkungsprozess für Kupferdurchkontaktierungen(oder Zwischenverbindungen)
US7082345B2 (en) * 2001-06-19 2006-07-25 Applied Materials, Inc. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US20020192966A1 (en) * 2001-06-19 2002-12-19 Shanmugasundram Arulkumar P. In situ sensor based control of semiconductor processing procedure
US7101799B2 (en) * 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US6910947B2 (en) * 2001-06-19 2005-06-28 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US7047099B2 (en) * 2001-06-19 2006-05-16 Applied Materials Inc. Integrating tool, module, and fab level control
US6558750B2 (en) 2001-07-16 2003-05-06 Technic Inc. Method of processing and plating planar articles
US6524463B2 (en) 2001-07-16 2003-02-25 Technic, Inc. Method of processing wafers and other planar articles within a processing cell
US6723224B2 (en) * 2001-08-01 2004-04-20 Applied Materials Inc. Electro-chemical polishing apparatus
US6984198B2 (en) * 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
US6638840B1 (en) 2001-08-20 2003-10-28 Megic Corporation Electrode for electroplating planar structures
KR101055564B1 (ko) * 2001-08-23 2011-08-08 에이씨엠 리서치, 인코포레이티드 전해 연마 공정에서 금속 리세스를 감소시키기 위한 더미구조들
EP1481114A4 (de) * 2001-08-31 2005-06-22 Semitool Inc Vorrichtung und verfahren zur elektrochemischen verarbeitung von mikroelektronischen werkstücken
US20070295611A1 (en) * 2001-12-21 2007-12-27 Liu Feng Q Method and composition for polishing a substrate
US6824612B2 (en) * 2001-12-26 2004-11-30 Applied Materials, Inc. Electroless plating system
US6770565B2 (en) 2002-01-08 2004-08-03 Applied Materials Inc. System for planarizing metal conductive layers
US6843852B2 (en) * 2002-01-16 2005-01-18 Intel Corporation Apparatus and method for electroless spray deposition
US6742279B2 (en) 2002-01-16 2004-06-01 Applied Materials Inc. Apparatus and method for rinsing substrates
US7138014B2 (en) * 2002-01-28 2006-11-21 Applied Materials, Inc. Electroless deposition apparatus
US6913651B2 (en) * 2002-03-22 2005-07-05 Blue29, Llc Apparatus and method for electroless deposition of materials on semiconductor substrates
US6689258B1 (en) * 2002-04-30 2004-02-10 Advanced Micro Devices, Inc. Electrochemically generated reactants for chemical mechanical planarization
US20030209326A1 (en) * 2002-05-07 2003-11-13 Mattson Technology, Inc. Process and system for heating semiconductor substrates in a processing chamber containing a susceptor
US6790336B2 (en) * 2002-06-19 2004-09-14 Intel Corporation Method of fabricating damascene structures in mechanically weak interlayer dielectrics
US20040063224A1 (en) * 2002-09-18 2004-04-01 Applied Materials, Inc. Feedback control of a chemical mechanical polishing process for multi-layered films
US20050040049A1 (en) * 2002-09-20 2005-02-24 Rimma Volodarsky Anode assembly for plating and planarizing a conductive layer
DE10247051A1 (de) * 2002-10-09 2004-04-22 Polymer Latex Gmbh & Co Kg Latex und Verfahren zu seiner Herstellung
US7025862B2 (en) * 2002-10-22 2006-04-11 Applied Materials Plating uniformity control by contact ring shaping
US6796887B2 (en) 2002-11-13 2004-09-28 Speedfam-Ipec Corporation Wear ring assembly
TWI601199B (zh) * 2002-11-15 2017-10-01 荏原製作所股份有限公司 基板處理裝置及基板處理方法
AU2003290932A1 (en) 2002-11-15 2004-06-15 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
US20040104119A1 (en) * 2002-12-02 2004-06-03 Applied Materials, Inc. Small volume electroplating cell
US20040108212A1 (en) * 2002-12-06 2004-06-10 Lyndon Graham Apparatus and methods for transferring heat during chemical processing of microelectronic workpieces
US7596886B1 (en) * 2002-12-18 2009-10-06 Lam Research Corporation Method and system to separate and recycle divergent chemistries
US6892472B2 (en) * 2003-03-18 2005-05-17 Novellus Systems, Inc. Method and apparatus for cleaning and drying a workpiece
US7390429B2 (en) * 2003-06-06 2008-06-24 Applied Materials, Inc. Method and composition for electrochemical mechanical polishing processing
US6860944B2 (en) * 2003-06-16 2005-03-01 Blue29 Llc Microelectronic fabrication system components and method for processing a wafer using such components
US7883739B2 (en) 2003-06-16 2011-02-08 Lam Research Corporation Method for strengthening adhesion between dielectric layers formed adjacent to metal layers
WO2005005693A1 (en) 2003-07-01 2005-01-20 Superpower, Inc. Process control methods of electropolishing for metal substrate preparation in producing ybco coated conductors
US7100954B2 (en) * 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
US7112122B2 (en) * 2003-09-17 2006-09-26 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
US20050092620A1 (en) * 2003-10-01 2005-05-05 Applied Materials, Inc. Methods and apparatus for polishing a substrate
US7727366B2 (en) 2003-10-22 2010-06-01 Nexx Systems, Inc. Balancing pressure to improve a fluid seal
CN1920105B (zh) 2003-10-22 2010-12-08 内克斯系统公司 用于对工件进行流体处理的方法和设备
WO2005055283A2 (en) * 2003-11-26 2005-06-16 Acm Research, Inc. Monitoring an electropolishing process in integrated circuit fabrication
US7128821B2 (en) * 2004-01-20 2006-10-31 Taiwan Semiconductor Manufacturing Co., Ltd. Electropolishing method for removing particles from wafer surface
US7390744B2 (en) 2004-01-29 2008-06-24 Applied Materials, Inc. Method and composition for polishing a substrate
US20060021974A1 (en) * 2004-01-29 2006-02-02 Applied Materials, Inc. Method and composition for polishing a substrate
US7153777B2 (en) * 2004-02-20 2006-12-26 Micron Technology, Inc. Methods and apparatuses for electrochemical-mechanical polishing
US7226860B2 (en) * 2004-04-28 2007-06-05 Taiwan Semiconductor Manfacturing Co. Ltd. Method and apparatus for fabricating metal layer
US20050283993A1 (en) * 2004-06-18 2005-12-29 Qunwei Wu Method and apparatus for fluid processing and drying a workpiece
WO2006020565A2 (en) * 2004-08-09 2006-02-23 Blue29, Llc Barrier layer configurations and methods for processing microelectronic topographies having barrier layers
DE102004039443B4 (de) * 2004-08-13 2023-05-25 Beijing E-Town Semiconductor Technology, Co., Ltd. Verfahren zum thermischen Behandeln von scheibenförmigen Substraten
US7566391B2 (en) 2004-09-01 2009-07-28 Micron Technology, Inc. Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media
JP4556576B2 (ja) * 2004-09-13 2010-10-06 トヨタ自動車株式会社 セパレータの製造方法および電着塗装装置
US20060091551A1 (en) * 2004-10-29 2006-05-04 Taiwan Semiconductor Manufacturing Co., Ltd. Differentially metal doped copper damascenes
US7396412B2 (en) * 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
US7819079B2 (en) * 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7798764B2 (en) * 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7699021B2 (en) * 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US20060182535A1 (en) * 2004-12-22 2006-08-17 Mike Rice Cartesian robot design
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US20060241813A1 (en) * 2005-04-22 2006-10-26 Applied Materials, Inc. Optimized cluster tool transfer process and collision avoidance design
JP2006299367A (ja) * 2005-04-22 2006-11-02 Yamamoto Mekki Shikenki:Kk 電気めっき試験器
US20060249395A1 (en) * 2005-05-05 2006-11-09 Applied Material, Inc. Process and composition for electrochemical mechanical polishing
US20060249394A1 (en) * 2005-05-05 2006-11-09 Applied Materials, Inc. Process and composition for electrochemical mechanical polishing
US20070181441A1 (en) * 2005-10-14 2007-08-09 Applied Materials, Inc. Method and apparatus for electropolishing
US20070151866A1 (en) * 2006-01-05 2007-07-05 Applied Materials, Inc. Substrate polishing with surface pretreatment
FR2898138B1 (fr) * 2006-03-03 2008-05-16 Commissariat Energie Atomique Procede de structuration electrochimique d'un materiau conducteur ou semi-conducteur, et dispositif de mise en oeuvre.
US20070254485A1 (en) * 2006-04-28 2007-11-01 Daxin Mao Abrasive composition for electrochemical mechanical polishing
US20070281106A1 (en) * 2006-05-30 2007-12-06 Applied Materials, Inc. Process chamber for dielectric gapfill
US20080083623A1 (en) * 2006-10-04 2008-04-10 Golden Josh H Method and apparatus for treatment of plating solutions
US7601264B2 (en) * 2006-10-04 2009-10-13 Applied Materials, Inc. Method for treatment of plating solutions
US7964040B2 (en) * 2007-11-08 2011-06-21 Applied Materials, Inc. Multi-port pumping system for substrate processing chambers
US20090120584A1 (en) * 2007-11-08 2009-05-14 Applied Materials, Inc. Counter-balanced substrate support
US20090120368A1 (en) * 2007-11-08 2009-05-14 Applied Materials, Inc. Rotating temperature controlled substrate pedestal for film uniformity
US20090277587A1 (en) * 2008-05-09 2009-11-12 Applied Materials, Inc. Flowable dielectric equipment and processes
US8425687B2 (en) * 2009-02-10 2013-04-23 Tel Nexx, Inc. Wetting a workpiece surface in a fluid-processing system
US8500983B2 (en) 2009-05-27 2013-08-06 Novellus Systems, Inc. Pulse sequence for plating on thin seed layers
US9677188B2 (en) 2009-06-17 2017-06-13 Novellus Systems, Inc. Electrofill vacuum plating cell
US9455139B2 (en) 2009-06-17 2016-09-27 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US8962085B2 (en) * 2009-06-17 2015-02-24 Novellus Systems, Inc. Wetting pretreatment for enhanced damascene metal filling
US9138784B1 (en) 2009-12-18 2015-09-22 Novellus Systems, Inc. Deionized water conditioning system and methods
US9385035B2 (en) 2010-05-24 2016-07-05 Novellus Systems, Inc. Current ramping and current pulsing entry of substrates for electroplating
GB201021326D0 (en) * 2010-12-16 2011-01-26 Picofluidics Ltd Electro chemical deposition apparatus
US20120180954A1 (en) 2011-01-18 2012-07-19 Applied Materials, Inc. Semiconductor processing system and methods using capacitively coupled plasma
FR2982877B1 (fr) * 2011-11-18 2014-10-03 Alchimer Machine adaptee pour metalliser une cavite d'un substrat semi-conducteur ou conducteur telle qu'une structure du type via traversant
US9476139B2 (en) * 2012-03-30 2016-10-25 Novellus Systems, Inc. Cleaning electroplating substrate holders using reverse current deplating
US8889566B2 (en) 2012-09-11 2014-11-18 Applied Materials, Inc. Low cost flowable dielectric films
US9018108B2 (en) 2013-01-25 2015-04-28 Applied Materials, Inc. Low shrinkage dielectric films
US9613833B2 (en) 2013-02-20 2017-04-04 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
GB2512056B (en) 2013-03-18 2018-04-18 Spts Technologies Ltd Electrochemical deposition chamber
US10385471B2 (en) 2013-03-18 2019-08-20 Spts Technologies Limited Electrochemical deposition chamber
US9435049B2 (en) 2013-11-20 2016-09-06 Lam Research Corporation Alkaline pretreatment for electroplating
US9412581B2 (en) 2014-07-16 2016-08-09 Applied Materials, Inc. Low-K dielectric gapfill by flowable deposition
US9481942B2 (en) 2015-02-03 2016-11-01 Lam Research Corporation Geometry and process optimization for ultra-high RPM plating
US9617648B2 (en) 2015-03-04 2017-04-11 Lam Research Corporation Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias
US11495932B2 (en) 2017-06-09 2022-11-08 Applied Materials, Inc. Slip ring for use in rotatable substrate support
JP7401458B2 (ja) 2018-05-22 2023-12-19 イーティーエックス コーポレーション 二次元材料を移すための方法及び装置
US20240044030A1 (en) * 2020-12-21 2024-02-08 Anycasting Co., Ltd. Three-dimensional printing device using selective electrochemical deposition
WO2022138999A1 (ko) * 2020-12-21 2022-06-30 주식회사 애니캐스팅 선택적 전기화학 전착을 이용한 3d 프린팅 장치 및 이의 제어 방법

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2751344A (en) * 1949-06-21 1956-06-19 Charles A Kienberger Electropolisher
US2871174A (en) * 1957-04-25 1959-01-27 Bell Telephone Labor Inc Method for electropolishing semiconducting material
US4096042A (en) * 1969-04-04 1978-06-20 The United States Of America As Represented By The United States Department Of Energy Electroplating method and apparatus
DE2051710B2 (de) * 1970-10-21 1975-09-04 Robert Bosch Gmbh, 7000 Stuttgart Maschine für die elektrochemische Metallbearbeitung mit mehreren Bearbeitungsstellen
IT1129345B (it) * 1980-10-29 1986-06-04 Fiat Ricerche Disp*sitivo per il trattamento elettrolitico della superficie di pezzi maccanici particolarmente di cilindri di motori a combustione interna
SE8101046L (sv) * 1981-02-16 1982-08-17 Europafilm Anordning vid anleggningar, serskilt for matrisering av grammofonskivor och dylikt
US5024746A (en) * 1987-04-13 1991-06-18 Texas Instruments Incorporated Fixture and a method for plating contact bumps for integrated circuits
US5000827A (en) * 1990-01-02 1991-03-19 Motorola, Inc. Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect
US5368711A (en) * 1990-08-01 1994-11-29 Poris; Jaime Selective metal electrodeposition process and apparatus
US5256274A (en) * 1990-08-01 1993-10-26 Jaime Poris Selective metal electrodeposition process
JP2734269B2 (ja) * 1991-12-26 1998-03-30 日本電気株式会社 半導体製造装置
JP3200468B2 (ja) * 1992-05-21 2001-08-20 日本エレクトロプレイテイング・エンジニヤース株式会社 ウエーハ用めっき装置
WO1994006953A1 (en) * 1992-09-15 1994-03-31 Atr Wire & Cable Co., Inc. Method and apparatus for electrolytically plating copper
JP3308333B2 (ja) * 1993-03-30 2002-07-29 三菱電機株式会社 電解メッキ装置，及び電解メッキ処理方法
JP3377849B2 (ja) * 1994-02-02 2003-02-17 日本エレクトロプレイテイング・エンジニヤース株式会社 ウエーハ用メッキ装置
US6042712A (en) * 1995-05-26 2000-03-28 Formfactor, Inc. Apparatus for controlling plating over a face of a substrate
US5597460A (en) * 1995-11-13 1997-01-28 Reynolds Tech Fabricators, Inc. Plating cell having laminar flow sparger
US5830805A (en) * 1996-11-18 1998-11-03 Cornell Research Foundation Electroless deposition equipment or apparatus and method of performing electroless deposition
DE29701092U1 (de) * 1997-01-23 1997-03-20 Technotrans Gmbh Galvanische Abscheidungsvorrichtung
JP3490238B2 (ja) * 1997-02-17 2004-01-26 三菱電機株式会社 メッキ処理装置およびメッキ処理方法
US5865984A (en) * 1997-06-30 1999-02-02 International Business Machines Corporation Electrochemical etching apparatus and method for spirally etching a workpiece
US6017437A (en) * 1997-08-22 2000-01-25 Cutek Research, Inc. Process chamber and method for depositing and/or removing material on a substrate

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US6179982B1 (en) 2001-01-30
KR100375869B1 (ko) 2003-03-15
JP2001514332A (ja) 2001-09-11
EP1051544A2 (de) 2000-11-15
WO1999010566A3 (en) 1999-05-06
US6077412A (en) 2000-06-20
JP3274457B2 (ja) 2002-04-15
DE69823556T2 (de) 2005-04-14
WO1999010566A2 (en) 1999-03-04
KR20010052062A (ko) 2001-06-25
AU8686498A (en) 1999-03-16
US6017437A (en) 2000-01-25
TW457572B (en) 2001-10-01

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