DE69823283D1 - Reinigungszusammensetzung - Google Patents

Reinigungszusammensetzung

Info

Publication number
DE69823283D1
DE69823283D1 DE69823283T DE69823283T DE69823283D1 DE 69823283 D1 DE69823283 D1 DE 69823283D1 DE 69823283 T DE69823283 T DE 69823283T DE 69823283 T DE69823283 T DE 69823283T DE 69823283 D1 DE69823283 D1 DE 69823283D1
Authority
DE
Germany
Prior art keywords
cleaning composition
cleaning
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69823283T
Other languages
English (en)
Other versions
DE69823283T2 (de
Inventor
Norio Ishikawa
Kiyoto Mori
Hidemitsu Aoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanto Chemical Co Inc
Renesas Electronics Corp
Original Assignee
Kanto Chemical Co Inc
NEC Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Chemical Co Inc, NEC Electronics Corp filed Critical Kanto Chemical Co Inc
Publication of DE69823283D1 publication Critical patent/DE69823283D1/de
Application granted granted Critical
Publication of DE69823283T2 publication Critical patent/DE69823283T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3245—Aminoacids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • C11D2111/22—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Emergency Medicine (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
DE69823283T 1997-08-12 1998-08-11 Reinigungszusammensetzung Expired - Lifetime DE69823283T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22894397 1997-08-12
JP22894397 1997-08-12

Publications (2)

Publication Number Publication Date
DE69823283D1 true DE69823283D1 (de) 2004-05-27
DE69823283T2 DE69823283T2 (de) 2005-04-28

Family

ID=16884291

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69823283T Expired - Lifetime DE69823283T2 (de) 1997-08-12 1998-08-11 Reinigungszusammensetzung

Country Status (6)

Country Link
US (1) US6080709A (de)
EP (1) EP0897975B1 (de)
KR (1) KR100533194B1 (de)
CN (1) CN1203163C (de)
DE (1) DE69823283T2 (de)
TW (1) TW387936B (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6896826B2 (en) * 1997-01-09 2005-05-24 Advanced Technology Materials, Inc. Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
US6755989B2 (en) * 1997-01-09 2004-06-29 Advanced Technology Materials, Inc. Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
US6231677B1 (en) * 1998-02-27 2001-05-15 Kanto Kagaku Kabushiki Kaisha Photoresist stripping liquid composition
US6332988B1 (en) 1999-06-02 2001-12-25 International Business Machines Corporation Rework process
US6419554B2 (en) * 1999-06-24 2002-07-16 Micron Technology, Inc. Fixed abrasive chemical-mechanical planarization of titanium nitride
US6436302B1 (en) * 1999-08-23 2002-08-20 Applied Materials, Inc. Post CU CMP polishing for reduced defects
JP3307375B2 (ja) * 1999-10-04 2002-07-24 日本電気株式会社 半導体装置の製造方法
US6592433B2 (en) * 1999-12-31 2003-07-15 Intel Corporation Method for defect reduction
CN1872976A (zh) * 2000-03-21 2006-12-06 和光纯药工业株式会社 半导体基板洗涤剂和洗涤方法
US6627546B2 (en) 2001-06-29 2003-09-30 Ashland Inc. Process for removing contaminant from a surface and composition useful therefor
JP3787085B2 (ja) 2001-12-04 2006-06-21 関東化学株式会社 フォトレジスト残渣除去液組成物
TWI339680B (en) * 2002-02-19 2011-04-01 Kanto Kagaku Washing liquid composition for semiconductor substrate
WO2003091376A1 (en) * 2002-04-24 2003-11-06 Ekc Technology, Inc. Oxalic acid as a cleaning product for aluminium, copper and dielectric surfaces
JP4221191B2 (ja) * 2002-05-16 2009-02-12 関東化学株式会社 Ｃｍｐ後洗浄液組成物
KR100974034B1 (ko) * 2002-11-08 2010-08-04 와코 쥰야꾸 고교 가부시키가이샤 세정액 및 이것을 이용한 세정방법
JP4375991B2 (ja) * 2003-04-09 2009-12-02 関東化学株式会社 半導体基板洗浄液組成物
US20060293199A1 (en) 2003-06-04 2006-12-28 Kao Corporation Removing agent composition and removing/cleaning method using same
JP4628209B2 (ja) * 2004-11-18 2011-02-09 花王株式会社 剥離剤組成物
KR20090073376A (ko) * 2007-12-31 2009-07-03 삼성전자주식회사 위상 반전 마스크 세정용 조성물, 위상 반전 마스크의 세정방법 및 위상 반전 마스크의 제조 방법
SG175830A1 (en) * 2009-04-08 2011-12-29 Sunsonix Process and apparatus for removal of contaminating material from substrates
US8357287B2 (en) * 2009-11-23 2013-01-22 MetCon LLC Electrolyte solution and electropolishing methods
SG183510A1 (en) * 2010-03-05 2012-09-27 Lam Res Corp Cleaning solution for sidewall polymer of damascene processes
WO2011158634A1 (ja) 2010-06-18 2011-12-22 三菱瓦斯化学株式会社 銅層及びモリブデン層を含む多層構造膜用エッチング液
US8580103B2 (en) 2010-11-22 2013-11-12 Metcon, Llc Electrolyte solution and electrochemical surface modification methods
JP6066552B2 (ja) 2011-12-06 2017-01-25 関東化學株式会社 電子デバイス用洗浄液組成物
CN104412376B (zh) * 2012-07-17 2017-02-08 三井化学株式会社 半导体装置及其制造方法及冲洗液

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4209418A (en) * 1978-07-18 1980-06-24 Union Carbide Corporation Gelatin benzimidazole blends as inhibitors for carboxylic acids
US4226640A (en) * 1978-10-26 1980-10-07 Kraftwerk Union Aktiengesellschaft Method for the chemical decontamination of nuclear reactor components
CA1136398A (en) * 1979-12-10 1982-11-30 William A. Seddon Decontaminating reagents for radioactive systems
US4357254A (en) * 1981-01-12 1982-11-02 Chemical Sciences, Inc. Cleaning composition
US4452643A (en) * 1983-01-12 1984-06-05 Halliburton Company Method of removing copper and copper oxide from a ferrous metal surface
US4822854A (en) * 1987-09-23 1989-04-18 The Drackett Company Cleaning compositions containing a colorant stabilized against fading
US5154197A (en) * 1990-05-18 1992-10-13 Westinghouse Electric Corp. Chemical cleaning method for steam generators utilizing pressure pulsing
US5108514A (en) * 1991-02-08 1992-04-28 Kisner Kim T In-situ method for cleaning swimming pools without draining the water
US5489735A (en) * 1994-01-24 1996-02-06 D'muhala; Thomas F. Decontamination composition for removing norms and method utilizing the same
DE19525521B4 (de) * 1994-07-15 2007-04-26 Lam Research Corp.(N.D.Ges.D.Staates Delaware), Fremont Verfahren zum Reinigen von Substraten
TW416987B (en) * 1996-06-05 2001-01-01 Wako Pure Chem Ind Ltd A composition for cleaning the semiconductor substrate surface
US5759437A (en) * 1996-10-31 1998-06-02 International Business Machines Corporation Etching of Ti-W for C4 rework

Also Published As

Publication number Publication date
TW387936B (en) 2000-04-21
KR100533194B1 (ko) 2006-09-20
CN1203163C (zh) 2005-05-25
EP0897975B1 (de) 2004-04-21
EP0897975A1 (de) 1999-02-24
CN1210886A (zh) 1999-03-17
DE69823283T2 (de) 2005-04-28
US6080709A (en) 2000-06-27
KR19990023555A (ko) 1999-03-25

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