DE69813805T2 - Verfahren und vorrichtung zum örtlichen glühen einer auf einem substrat geformten mikrostruktur und dadurch hergestellte vorrichtung - Google Patents
Verfahren und vorrichtung zum örtlichen glühen einer auf einem substrat geformten mikrostruktur und dadurch hergestellte vorrichtungInfo
- Publication number
- DE69813805T2 DE69813805T2 DE69813805T DE69813805T DE69813805T2 DE 69813805 T2 DE69813805 T2 DE 69813805T2 DE 69813805 T DE69813805 T DE 69813805T DE 69813805 T DE69813805 T DE 69813805T DE 69813805 T2 DE69813805 T2 DE 69813805T2
- Authority
- DE
- Germany
- Prior art keywords
- microstructure
- micromechanical
- glowing
- local
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 title 1
- 238000000137 annealing Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000009966 trimming Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02393—Post-fabrication trimming of parameters, e.g. resonance frequency, Q factor
- H03H9/02401—Post-fabrication trimming of parameters, e.g. resonance frequency, Q factor by annealing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/874,785 US5976994A (en) | 1997-06-13 | 1997-06-13 | Method and system for locally annealing a microstructure formed on a substrate and device formed thereby |
| PCT/US1998/011028 WO1998057423A1 (en) | 1997-06-13 | 1998-05-29 | Method and system for locally annealing a microstructure formed on a substrate and device formed thereby |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69813805D1 DE69813805D1 (de) | 2003-05-28 |
| DE69813805T2 true DE69813805T2 (de) | 2003-11-06 |
Family
ID=25364575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69813805T Expired - Lifetime DE69813805T2 (de) | 1997-06-13 | 1998-05-29 | Verfahren und vorrichtung zum örtlichen glühen einer auf einem substrat geformten mikrostruktur und dadurch hergestellte vorrichtung |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US5976994A (de) |
| EP (1) | EP0988695B1 (de) |
| JP (2) | JP2002505046A (de) |
| KR (1) | KR100370602B1 (de) |
| CN (1) | CN1271474A (de) |
| AT (1) | ATE238630T1 (de) |
| AU (1) | AU7605098A (de) |
| DE (1) | DE69813805T2 (de) |
| NO (1) | NO996113L (de) |
| WO (1) | WO1998057423A1 (de) |
Families Citing this family (57)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6593831B2 (en) | 1999-01-14 | 2003-07-15 | The Regents Of The University Of Michigan | Method and apparatus for filtering signals in a subsystem including a power amplifier utilizing a bank of vibrating micromechanical apparatus |
| US6713938B2 (en) | 1999-01-14 | 2004-03-30 | The Regents Of The University Of Michigan | Method and apparatus for filtering signals utilizing a vibrating micromechanical resonator |
| US6566786B2 (en) | 1999-01-14 | 2003-05-20 | The Regents Of The University Of Michigan | Method and apparatus for selecting at least one desired channel utilizing a bank of vibrating micromechanical apparatus |
| US6577040B2 (en) | 1999-01-14 | 2003-06-10 | The Regents Of The University Of Michigan | Method and apparatus for generating a signal having at least one desired output frequency utilizing a bank of vibrating micromechanical devices |
| US6424074B2 (en) | 1999-01-14 | 2002-07-23 | The Regents Of The University Of Michigan | Method and apparatus for upconverting and filtering an information signal utilizing a vibrating micromechanical device |
| US6600252B2 (en) | 1999-01-14 | 2003-07-29 | The Regents Of The University Of Michigan | Method and subsystem for processing signals utilizing a plurality of vibrating micromechanical devices |
| US6238946B1 (en) * | 1999-08-17 | 2001-05-29 | International Business Machines Corporation | Process for fabricating single crystal resonant devices that are compatible with integrated circuit processing |
| US6346030B1 (en) * | 2000-05-09 | 2002-02-12 | Sandia Corporation | Microdevice having interior cavity with high aspect ratio surface features and associated methods of manufacture and use |
| US6739190B2 (en) * | 2000-08-24 | 2004-05-25 | The Regents Of The University Of Michigan | Micromechanical resonator device |
| DE10065723A1 (de) * | 2000-12-29 | 2002-07-04 | Bosch Gmbh Robert | Anordnung zur Temperaturmessung und -regelung |
| US6568264B2 (en) * | 2001-02-23 | 2003-05-27 | Charles E. Heger | Wireless swimming pool water level system |
| US6600389B2 (en) * | 2001-05-30 | 2003-07-29 | Intel Corporation | Tapered structures for generating a set of resonators with systematic resonant frequencies |
| US6570468B2 (en) * | 2001-06-29 | 2003-05-27 | Intel Corporation | Resonator frequency correction by modifying support structures |
| EP1876608A3 (de) * | 2001-09-10 | 2008-04-16 | Microbridge Technologies Inc. | Verfahren zum effektiven Abgleichen von Widerständen mittels gepulster Erwärmung |
| AU2002325723A1 (en) * | 2001-09-10 | 2003-03-24 | Microbridge Technologies Inc. | Method for trimming resistors |
| US6630871B2 (en) * | 2001-09-28 | 2003-10-07 | Intel Corporation | Center-mass-reduced microbridge structures for ultra-high frequency MEM resonator |
| US7004015B2 (en) * | 2001-10-25 | 2006-02-28 | The Regents Of The University Of Michigan | Method and system for locally sealing a vacuum microcavity, methods and systems for monitoring and controlling pressure and method and system for trimming resonant frequency of a microstructure therein |
| DE10156257A1 (de) | 2001-11-09 | 2003-05-28 | Bosch Gmbh Robert | Mikromechanischer Resonator |
| US6605319B1 (en) * | 2002-02-11 | 2003-08-12 | Applied Materials, Inc. | Use of integrated polygen deposition and RTP for microelectromechanical systems |
| US7029829B2 (en) * | 2002-04-18 | 2006-04-18 | The Regents Of The University Of Michigan | Low temperature method for forming a microcavity on a substrate and article having same |
| US7025778B2 (en) * | 2002-06-07 | 2006-04-11 | Endovascular Technologies, Inc. | Endovascular graft with pressure, temperature, flow and voltage sensors |
| US7261733B1 (en) * | 2002-06-07 | 2007-08-28 | Endovascular Technologies, Inc. | Endovascular graft with sensors design and attachment methods |
| US7399313B2 (en) | 2002-06-07 | 2008-07-15 | Brown Peter S | Endovascular graft with separable sensors |
| WO2004013893A2 (en) * | 2002-08-01 | 2004-02-12 | Georgia Tech Research Corporation | Piezo electric on seminconductor on- insulator resonator |
| AU2003290513A1 (en) * | 2002-08-07 | 2004-04-08 | Georgia Tech Research Corporation | Capacitive resonators and methods of fabrication |
| JP4189637B2 (ja) * | 2002-09-19 | 2008-12-03 | 日本電気株式会社 | フィルタ、複合フィルタ、それらを搭載したフィルタ実装体、集積回路チップ、電子機器およびそれらの周波数特性変更方法 |
| US6930569B2 (en) * | 2003-07-31 | 2005-08-16 | Discera | Micromechanical resonator having short support beams |
| US6870444B1 (en) * | 2003-08-28 | 2005-03-22 | Motorola, Inc. | Electromechanical resonator and method of operating same |
| JP2007505543A (ja) * | 2003-09-10 | 2007-03-08 | コニンクリユケ フィリップス エレクトロニクス エヌ．ブイ． | 電気機械的トランスデューサおよび電気装置 |
| US6995622B2 (en) | 2004-01-09 | 2006-02-07 | Robert Bosh Gmbh | Frequency and/or phase compensated microelectromechanical oscillator |
| US7068125B2 (en) * | 2004-03-04 | 2006-06-27 | Robert Bosch Gmbh | Temperature controlled MEMS resonator and method for controlling resonator frequency |
| US7102467B2 (en) * | 2004-04-28 | 2006-09-05 | Robert Bosch Gmbh | Method for adjusting the frequency of a MEMS resonator |
| US7256107B2 (en) * | 2004-05-04 | 2007-08-14 | The Regents Of The University Of California | Damascene process for use in fabricating semiconductor structures having micro/nano gaps |
| JP4611127B2 (ja) * | 2004-06-14 | 2011-01-12 | パナソニック株式会社 | 電気機械信号選択素子 |
| US7176770B2 (en) * | 2004-08-24 | 2007-02-13 | Georgia Tech Research Corp. | Capacitive vertical silicon bulk acoustic resonator |
| US7918800B1 (en) * | 2004-10-08 | 2011-04-05 | Endovascular Technologies, Inc. | Aneurysm sensing devices and delivery systems |
| KR100610016B1 (ko) * | 2004-11-18 | 2006-08-08 | 삼성전자주식회사 | 반도체 디바이스 제조를 위한 불순물 원자 활성화 장치 및그 방법 |
| US7205867B2 (en) * | 2005-05-19 | 2007-04-17 | Robert Bosch Gmbh | Microelectromechanical resonator structure, and method of designing, operating and using same |
| US7337671B2 (en) | 2005-06-03 | 2008-03-04 | Georgia Tech Research Corp. | Capacitive microaccelerometers and fabrication methods |
| WO2007037150A1 (ja) * | 2005-09-27 | 2007-04-05 | Matsushita Electric Industrial Co., Ltd. | 共振器及びこれを用いたフィルタ |
| US7578189B1 (en) | 2006-05-10 | 2009-08-25 | Qualtre, Inc. | Three-axis accelerometers |
| US7767484B2 (en) | 2006-05-31 | 2010-08-03 | Georgia Tech Research Corporation | Method for sealing and backside releasing of microelectromechanical systems |
| US20080054759A1 (en) * | 2006-08-11 | 2008-03-06 | Farrokh Ayazi | Wafer-level encapsulation and sealing of electrostatic transducers |
| JP4977431B2 (ja) * | 2006-10-12 | 2012-07-18 | 三洋電機株式会社 | マイクロメカニカル共振器 |
| JP4965962B2 (ja) * | 2006-10-13 | 2012-07-04 | 学校法人立命館 | マイクロメカニカル共振器 |
| JP4337870B2 (ja) * | 2006-12-15 | 2009-09-30 | セイコーエプソン株式会社 | Ｍｅｍｓレゾネータ及びｍｅｍｓレゾネータの製造方法 |
| JP2009060173A (ja) * | 2007-08-29 | 2009-03-19 | Seiko Instruments Inc | 発振子及び該発振子を有する発振器 |
| JP5039959B2 (ja) * | 2007-08-31 | 2012-10-03 | セイコーインスツル株式会社 | 発振器 |
| JP4995675B2 (ja) * | 2007-09-10 | 2012-08-08 | セイコーインスツル株式会社 | 振動子デバイス及び発振器 |
| JP2009088854A (ja) * | 2007-09-28 | 2009-04-23 | Sanyo Electric Co Ltd | マイクロメカニカル共振器およびその製造方法 |
| WO2011026100A1 (en) | 2009-08-31 | 2011-03-03 | Georgia Tech Research Corporation | Bulk acoustic wave gyroscope with spoked structure |
| US8686508B2 (en) * | 2009-09-03 | 2014-04-01 | International Business Machines Corporation | Structures, methods and applications for electrical pulse anneal processes |
| US8542074B2 (en) | 2010-05-26 | 2013-09-24 | Panasonic Corporation | MEMS resonator |
| TWI511916B (zh) | 2012-06-28 | 2015-12-11 | Nat Univ Tsing Hua | 微機電共振震盪子結構及其驅動方法 |
| US9584092B2 (en) * | 2015-04-14 | 2017-02-28 | International Business Machines Corporation | Mechanical resonator with a spring-mass system comprising a phase-change material |
| EP3311486B1 (de) * | 2015-06-19 | 2020-12-02 | SiTime Corporation | Mikroelektromechanischer resonator |
| US10148244B1 (en) * | 2015-09-15 | 2018-12-04 | National Technology & Engineering Solutions Of Sandia, Llc | Trimming method for microresonators and microresonators made thereby |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5144184A (en) * | 1990-01-26 | 1992-09-01 | The Charles Stark Draper Laboratory, Inc. | Micromechanical device with a trimmable resonant frequency structure and method of trimming same |
| US5188983A (en) * | 1990-04-11 | 1993-02-23 | Wisconsin Alumni Research Foundation | Polysilicon resonating beam transducers and method of producing the same |
| US5451525A (en) * | 1992-02-14 | 1995-09-19 | Coulter Corporation | Method and materials for determining particle count in a flow cytometer |
| US5645684A (en) * | 1994-03-07 | 1997-07-08 | The Regents Of The University Of California | Multilayer high vertical aspect ratio thin film structures |
| DE4417132C2 (de) * | 1994-05-17 | 1996-08-14 | Ibm | Resonanter Meßwertaufnehmer und dessen Verwendung |
| US5451425A (en) * | 1994-09-13 | 1995-09-19 | The United States Of America As Represented By The Secretary Of The Army | Process for setting the frequency of a silicon microresonator |
| US5530342A (en) * | 1994-09-30 | 1996-06-25 | Rockwell International Corporation | Micromachined rate sensor comb drive device and method |
| US5696491A (en) * | 1995-06-07 | 1997-12-09 | Regents Of The University Of California | Self-excited microelectromechanical device |
| US5696591A (en) | 1996-01-05 | 1997-12-09 | Eastman Kodak Company | Apparatus and method for detecting longitudinally oriented flaws in a moving web |
| JP3604259B2 (ja) | 1997-06-12 | 2004-12-22 | 株式会社東芝 | 燃料交換機及びその制御装置 |
| US5870007A (en) * | 1997-06-16 | 1999-02-09 | Roxburgh Ltd. | Multi-dimensional physical actuation of microstructures |
-
1997
- 1997-06-13 US US08/874,785 patent/US5976994A/en not_active Expired - Lifetime
-
1998
- 1998-05-29 WO PCT/US1998/011028 patent/WO1998057423A1/en active IP Right Grant
- 1998-05-29 AU AU76050/98A patent/AU7605098A/en not_active Abandoned
- 1998-05-29 EP EP98923858A patent/EP0988695B1/de not_active Expired - Lifetime
- 1998-05-29 AT AT98923858T patent/ATE238630T1/de not_active IP Right Cessation
- 1998-05-29 CN CN98808039A patent/CN1271474A/zh active Pending
- 1998-05-29 JP JP50262099A patent/JP2002505046A/ja active Pending
- 1998-05-29 KR KR10-1999-7011646A patent/KR100370602B1/ko not_active IP Right Cessation
- 1998-05-29 DE DE69813805T patent/DE69813805T2/de not_active Expired - Lifetime
-
1999
- 1999-05-05 US US09/305,513 patent/US6169321B1/en not_active Expired - Lifetime
- 1999-12-10 NO NO996113A patent/NO996113L/no not_active Application Discontinuation
-
2008
- 2008-08-18 JP JP2008209628A patent/JP2009044741A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US5976994A (en) | 1999-11-02 |
| EP0988695A1 (de) | 2000-03-29 |
| KR100370602B1 (ko) | 2003-02-05 |
| WO1998057423A1 (en) | 1998-12-17 |
| JP2009044741A (ja) | 2009-02-26 |
| EP0988695B1 (de) | 2003-04-23 |
| ATE238630T1 (de) | 2003-05-15 |
| CN1271474A (zh) | 2000-10-25 |
| KR20010013636A (ko) | 2001-02-26 |
| NO996113D0 (no) | 1999-12-10 |
| US6169321B1 (en) | 2001-01-02 |
| JP2002505046A (ja) | 2002-02-12 |
| AU7605098A (en) | 1998-12-30 |
| DE69813805D1 (de) | 2003-05-28 |
| NO996113L (no) | 2000-02-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |