DE69809437D1 - Verfahren und vorrichtung zur endpunktbestimmung beim chemischen polieren von halbleiterwafern - Google Patents

Verfahren und vorrichtung zur endpunktbestimmung beim chemischen polieren von halbleiterwafern

Info

Publication number
DE69809437D1
DE69809437D1 DE69809437T DE69809437T DE69809437D1 DE 69809437 D1 DE69809437 D1 DE 69809437D1 DE 69809437 T DE69809437 T DE 69809437T DE 69809437 T DE69809437 T DE 69809437T DE 69809437 D1 DE69809437 D1 DE 69809437D1
Authority
DE
Germany
Prior art keywords
wafer
endpoint
intensity
light beam
upper layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69809437T
Other languages
English (en)
Other versions
DE69809437T2 (de
Inventor
Singh Sandhu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Publication of DE69809437D1 publication Critical patent/DE69809437D1/de
Application granted granted Critical
Publication of DE69809437T2 publication Critical patent/DE69809437T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69809437T 1997-08-19 1998-08-19 Verfahren und vorrichtung zur endpunktbestimmung beim chemischen polieren von halbleiterwafern Expired - Lifetime DE69809437T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/914,570 US5910846A (en) 1996-05-16 1997-08-19 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
PCT/US1998/017218 WO1999009371A1 (en) 1997-08-19 1998-08-19 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers

Publications (2)

Publication Number Publication Date
DE69809437D1 true DE69809437D1 (de) 2002-12-19
DE69809437T2 DE69809437T2 (de) 2003-07-17

Family

ID=25434530

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69809437T Expired - Lifetime DE69809437T2 (de) 1997-08-19 1998-08-19 Verfahren und vorrichtung zur endpunktbestimmung beim chemischen polieren von halbleiterwafern

Country Status (8)

Country Link
US (3) US5910846A (de)
EP (1) EP1005626B1 (de)
JP (1) JP4205304B2 (de)
KR (1) KR100581177B1 (de)
AT (1) ATE227840T1 (de)
AU (1) AU9108998A (de)
DE (1) DE69809437T2 (de)
WO (1) WO1999009371A1 (de)

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Also Published As

Publication number Publication date
US5910846A (en) 1999-06-08
AU9108998A (en) 1999-03-08
KR100581177B1 (ko) 2006-05-22
KR20010023046A (ko) 2001-03-26
WO1999009371A1 (en) 1999-02-25
JP2001515283A (ja) 2001-09-18
ATE227840T1 (de) 2002-11-15
DE69809437T2 (de) 2003-07-17
US6108092A (en) 2000-08-22
EP1005626B1 (de) 2002-11-13
JP4205304B2 (ja) 2009-01-07
EP1005626A1 (de) 2000-06-07
US6191864B1 (en) 2001-02-20

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