DE69809265T2 - Polierkissen fur einen halbleitersubstrat - Google Patents

Polierkissen fur einen halbleitersubstrat

Info

Publication number
DE69809265T2
DE69809265T2 DE69809265T DE69809265T DE69809265T2 DE 69809265 T2 DE69809265 T2 DE 69809265T2 DE 69809265 T DE69809265 T DE 69809265T DE 69809265 T DE69809265 T DE 69809265T DE 69809265 T2 DE69809265 T2 DE 69809265T2
Authority
DE
Germany
Prior art keywords
semiconductor substrate
polishing
polishing cushion
porous substrate
cushion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69809265T
Other languages
English (en)
Other versions
DE69809265D1 (de
Inventor
K Sevilla
B Kaufman
P Anjur
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials Inc
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Application granted granted Critical
Publication of DE69809265D1 publication Critical patent/DE69809265D1/de
Publication of DE69809265T2 publication Critical patent/DE69809265T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
DE69809265T 1997-04-18 1998-04-17 Polierkissen fur einen halbleitersubstrat Expired - Fee Related DE69809265T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US4564697P 1997-04-18 1997-04-18
US5256597P 1997-07-15 1997-07-15
PCT/US1998/007908 WO1998047662A1 (en) 1997-04-18 1998-04-17 Polishing pad for a semiconductor substrate

Publications (2)

Publication Number Publication Date
DE69809265D1 DE69809265D1 (de) 2002-12-12
DE69809265T2 true DE69809265T2 (de) 2003-03-27

Family

ID=26723048

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69809265T Expired - Fee Related DE69809265T2 (de) 1997-04-18 1998-04-17 Polierkissen fur einen halbleitersubstrat

Country Status (12)

Country Link
US (1) US6062968A (de)
EP (1) EP1011922B1 (de)
JP (1) JP2001522316A (de)
KR (1) KR20010006518A (de)
CN (1) CN1258241A (de)
AT (1) ATE227194T1 (de)
AU (1) AU7138198A (de)
DE (1) DE69809265T2 (de)
ES (1) ES2187960T3 (de)
IL (1) IL132412A0 (de)
TW (1) TW447027B (de)
WO (1) WO1998047662A1 (de)

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JP3291701B2 (ja) * 1997-11-17 2002-06-10 日本ミクロコーティング株式会社 研磨テープ
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JP3185753B2 (ja) 1998-05-22 2001-07-11 日本電気株式会社 半導体装置の製造方法
US6390890B1 (en) 1999-02-06 2002-05-21 Charles J Molnar Finishing semiconductor wafers with a fixed abrasive finishing element
US6354915B1 (en) * 1999-01-21 2002-03-12 Rodel Holdings Inc. Polishing pads and methods relating thereto
US6641463B1 (en) 1999-02-06 2003-11-04 Beaver Creek Concepts Inc Finishing components and elements
EP1043378B1 (de) * 1999-04-09 2006-02-15 Tosoh Corporation Formschleifprodukt und Benutzung in einer Polierscheibe
TWI228522B (en) * 1999-06-04 2005-03-01 Fuji Spinning Co Ltd Urethane molded products for polishing pad and method for making same
US6364749B1 (en) * 1999-09-02 2002-04-02 Micron Technology, Inc. CMP polishing pad with hydrophilic surfaces for enhanced wetting
JP4542647B2 (ja) * 1999-09-21 2010-09-15 東洋ゴム工業株式会社 研磨パッド
US6626740B2 (en) 1999-12-23 2003-09-30 Rodel Holdings, Inc. Self-leveling pads and methods relating thereto
JP2001198796A (ja) * 2000-01-20 2001-07-24 Toray Ind Inc 研磨方法
JP4591980B2 (ja) * 2000-02-22 2010-12-01 東洋ゴム工業株式会社 研磨パッド及びその製造方法
US6860802B1 (en) * 2000-05-27 2005-03-01 Rohm And Haas Electric Materials Cmp Holdings, Inc. Polishing pads for chemical mechanical planarization
US6964604B2 (en) * 2000-06-23 2005-11-15 International Business Machines Corporation Fiber embedded polishing pad
US6477926B1 (en) 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
US20050266226A1 (en) * 2000-11-29 2005-12-01 Psiloquest Chemical mechanical polishing pad and method for selective metal and barrier polishing
US6846225B2 (en) * 2000-11-29 2005-01-25 Psiloquest, Inc. Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor
US6383065B1 (en) 2001-01-22 2002-05-07 Cabot Microelectronics Corporation Catalytic reactive pad for metal CMP
US6840843B2 (en) 2001-03-01 2005-01-11 Cabot Microelectronics Corporation Method for manufacturing a polishing pad having a compressed translucent region
US6517426B2 (en) 2001-04-05 2003-02-11 Lam Research Corporation Composite polishing pad for chemical-mechanical polishing
JP2002326169A (ja) * 2001-05-02 2002-11-12 Nihon Micro Coating Co Ltd 接触子クリーニングシート及び方法
JP3664676B2 (ja) * 2001-10-30 2005-06-29 信越半導体株式会社 ウェーハの研磨方法及びウェーハ研磨用研磨パッド
US20030138201A1 (en) * 2002-01-18 2003-07-24 Cabot Microelectronics Corp. Self-aligned lens formed on a single mode optical fiber using CMP and thin film deposition
US6682575B2 (en) 2002-03-05 2004-01-27 Cabot Microelectronics Corporation Methanol-containing silica-based CMP compositions
US20030194959A1 (en) * 2002-04-15 2003-10-16 Cabot Microelectronics Corporation Sintered polishing pad with regions of contrasting density
US7677956B2 (en) 2002-05-10 2010-03-16 Cabot Microelectronics Corporation Compositions and methods for dielectric CMP
US20040171339A1 (en) * 2002-10-28 2004-09-02 Cabot Microelectronics Corporation Microporous polishing pads
US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
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US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7267607B2 (en) * 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
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US7435161B2 (en) * 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
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Also Published As

Publication number Publication date
TW447027B (en) 2001-07-21
KR20010006518A (ko) 2001-01-26
WO1998047662A1 (en) 1998-10-29
EP1011922B1 (de) 2002-11-06
US6062968A (en) 2000-05-16
EP1011922A1 (de) 2000-06-28
ATE227194T1 (de) 2002-11-15
ES2187960T3 (es) 2003-06-16
AU7138198A (en) 1998-11-13
CN1258241A (zh) 2000-06-28
JP2001522316A (ja) 2001-11-13
IL132412A0 (en) 2001-03-19
DE69809265D1 (de) 2002-12-12

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