DE69806578T2 - Waferhaltevorrichtung - Google Patents

Waferhaltevorrichtung

Info

Publication number: DE69806578T2
Authority: DE; Germany
Prior art keywords: holding device; wafer holding; wafer; holding
Prior art date: 1997-01-23
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE69806578T

Other languages

English (en)

Other versions

DE69806578D1 (de

Inventor

W Foster

M Vyne

F Wengert

Der Jeugd A Van

R Jacobs

Bilsen B Van

Matthew Goodman

Glenn Hartmann

M Layton

W Halpin

R Hawkins

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

ASM America Inc

Original Assignee

ASM America Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1997-01-23

Filing date

1998-01-23

Publication date

2003-02-27

1998-01-23 Application filed by ASM America Inc filed Critical ASM America Inc

2002-08-22 Publication of DE69806578D1 publication Critical patent/DE69806578D1/de

2003-02-27 Application granted granted Critical

2003-02-27 Publication of DE69806578T2 publication Critical patent/DE69806578T2/de

2018-01-24 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

DE69806578T 1997-01-23 1998-01-23 Waferhaltevorrichtung Expired - Fee Related DE69806578T2 (de)

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
US78881797A	1997-01-23	1997-01-23
US3985097P	1997-03-05	1997-03-05
US08/923,241 US6113702A (en)	1995-09-01	1997-09-04	Wafer support system
PCT/US1998/001385 WO1998032893A2 (en)	1997-01-23	1998-01-23	Wafer support system

Publications (2)

Publication Number	Publication Date
DE69806578D1 DE69806578D1 (de)	2002-08-22
DE69806578T2 true DE69806578T2 (de)	2003-02-27

Family

ID=27365616

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
DE69835105T Expired - Fee Related DE69835105T2 (de)	1997-01-23	1998-01-23	System zur Temperaturreglung eines Wafers
DE69806578T Expired - Fee Related DE69806578T2 (de)	1997-01-23	1998-01-23	Waferhaltevorrichtung

Family Applications Before (1)

Application Number	Title	Priority Date	Filing Date
DE69835105T Expired - Fee Related DE69835105T2 (de)	1997-01-23	1998-01-23	System zur Temperaturreglung eines Wafers

Country Status (7)

Country	Link
US (7)	US6113702A (de)
EP (2)	EP1209251B1 (de)
JP (1)	JP4114016B2 (de)
KR (2)	KR100549998B1 (de)
AU (1)	AU6040498A (de)
DE (2)	DE69835105T2 (de)
WO (1)	WO1998032893A2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE102013106461A1 (de) *	2013-06-20	2014-12-24	Kgt Graphit Technologie Gmbh	Haltepin zum Halten von Wafern in Waferbooten und Verfahren zum Herstellen desselben

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2000
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DE102013106461A1 (de) *	2013-06-20	2014-12-24	Kgt Graphit Technologie Gmbh	Haltepin zum Halten von Wafern in Waferbooten und Verfahren zum Herstellen desselben
DE102013106461B4 (de) *	2013-06-20	2016-10-27	Kgt Graphit Technologie Gmbh	Haltestifte zum Halten von Wafern in Waferbooten und Verfahren zum Herstellen solcher Haltestifte

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Publication number	Publication date
US6343183B1 (en)	2002-01-29
US20030075274A1 (en)	2003-04-24
JP4114016B2 (ja)	2008-07-09
AU6040498A (en)	1998-08-18
DE69835105T2 (de)	2006-12-07
US20070131173A1 (en)	2007-06-14
KR100549998B1 (ko)	2006-02-08
KR20050053664A (ko)	2005-06-08
EP1209251A3 (de)	2002-06-26
US6454866B1 (en)	2002-09-24
KR20000070401A (ko)	2000-11-25
DE69835105D1 (de)	2006-08-10
EP0963459B1 (de)	2002-07-17
US20040198153A1 (en)	2004-10-07
DE69806578D1 (de)	2002-08-22
US6692576B2 (en)	2004-02-17
JP2001508599A (ja)	2001-06-26
US6113702A (en)	2000-09-05
US6491757B2 (en)	2002-12-10
US7655093B2 (en)	2010-02-02
WO1998032893A3 (en)	1998-11-12
WO1998032893A2 (en)	1998-07-30
EP1209251B1 (de)	2006-06-28
KR100539343B1 (ko)	2005-12-28
US20010054390A1 (en)	2001-12-27
EP1209251A2 (de)	2002-05-29
US7186298B2 (en)	2007-03-06
EP0963459A2 (de)	1999-12-15

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