DE69802146T2 - Umarbeitungsfähige Leiterplattenbestückung mit einem Flip-Chip - Google Patents

Umarbeitungsfähige Leiterplattenbestückung mit einem Flip-Chip

Info

Publication number
DE69802146T2
DE69802146T2 DE69802146T DE69802146T DE69802146T2 DE 69802146 T2 DE69802146 T2 DE 69802146T2 DE 69802146 T DE69802146 T DE 69802146T DE 69802146 T DE69802146 T DE 69802146T DE 69802146 T2 DE69802146 T2 DE 69802146T2
Authority
DE
Germany
Prior art keywords
reworkable
flip chip
pcb assembly
pcb
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69802146T
Other languages
English (en)
Other versions
DE69802146D1 (de
Inventor
Ching P Lo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DirecTV Group Inc
Original Assignee
Hughes Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Electronics Corp filed Critical Hughes Electronics Corp
Application granted granted Critical
Publication of DE69802146D1 publication Critical patent/DE69802146D1/de
Publication of DE69802146T2 publication Critical patent/DE69802146T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
DE69802146T 1997-07-08 1998-07-08 Umarbeitungsfähige Leiterplattenbestückung mit einem Flip-Chip Expired - Fee Related DE69802146T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/889,429 US5953210A (en) 1997-07-08 1997-07-08 Reworkable circuit board assembly including a reworkable flip chip

Publications (2)

Publication Number Publication Date
DE69802146D1 DE69802146D1 (de) 2001-11-29
DE69802146T2 true DE69802146T2 (de) 2002-03-14

Family

ID=25395075

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69802146T Expired - Fee Related DE69802146T2 (de) 1997-07-08 1998-07-08 Umarbeitungsfähige Leiterplattenbestückung mit einem Flip-Chip

Country Status (4)

Country Link
US (1) US5953210A (de)
EP (1) EP0891125B1 (de)
JP (1) JP2902397B2 (de)
DE (1) DE69802146T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6560108B2 (en) * 2000-02-16 2003-05-06 Hughes Electronics Corporation Chip scale packaging on CTE matched printed wiring boards
US6799628B1 (en) 2000-07-20 2004-10-05 Honeywell International Inc. Heat exchanger having silicon nitride substrate for mounting high power electronic components
US20020027294A1 (en) * 2000-07-21 2002-03-07 Neuhaus Herbert J. Electrical component assembly and method of fabrication
US6853087B2 (en) 2000-09-19 2005-02-08 Nanopierce Technologies, Inc. Component and antennae assembly in radio frequency identification devices
US20040087128A1 (en) * 2000-10-24 2004-05-06 Neuhaus Herbert J Method and materials for printing particle-enhanced electrical contacts
US6574861B1 (en) 2001-04-11 2003-06-10 Applied Micro Circuits Corporation System and method for solder ball rework
US7180165B2 (en) * 2003-09-05 2007-02-20 Sanmina, Sci Corporation Stackable electronic assembly
US7044620B2 (en) * 2004-04-30 2006-05-16 Guide Corporation LED assembly with reverse circuit board
US7718256B1 (en) 2006-04-05 2010-05-18 Northrop Grumman Corporation Thermal interface material for electronic assemblies
US8023267B2 (en) * 2009-06-19 2011-09-20 General Electric Company Avionics chassis
US8222541B2 (en) * 2009-06-19 2012-07-17 General Electric Company Avionics chassis
US8059409B2 (en) * 2009-06-19 2011-11-15 General Electric Company Avionics chassis
US7911796B2 (en) * 2009-06-19 2011-03-22 General Electric Company Avionics chassis
TWI387403B (zh) * 2009-07-29 2013-02-21 Castles Technology Co Ltd 改良之電子元件防護結構
JP6182916B2 (ja) * 2013-03-15 2017-08-23 日亜化学工業株式会社 発光装置の封止部材の取り外し方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4385202A (en) * 1980-09-25 1983-05-24 Texas Instruments Incorporated Electronic circuit interconnection system
GB8324839D0 (en) * 1983-09-16 1983-10-19 Lucas Ind Plc Mounting carrier for microelectronic silicon chip
US4698662A (en) * 1985-02-05 1987-10-06 Gould Inc. Multichip thin film module
US4711804A (en) * 1986-07-02 1987-12-08 General Electric Company Circuit board construction
US5151388A (en) * 1991-05-07 1992-09-29 Hughes Aircraft Company Flip interconnect
US5268048A (en) * 1992-12-10 1993-12-07 Hewlett-Packard Company Reworkable die attachment
US5602491A (en) * 1995-03-16 1997-02-11 Motorola, Inc. Integrated circuit testing board having constrained thermal expansion characteristics
US5685071A (en) * 1995-06-05 1997-11-11 Hughes Electronics Method of constructing a sealed chip-on-board electronic module
US5659203A (en) * 1995-06-07 1997-08-19 International Business Machines Corporation Reworkable polymer chip encapsulant
US5723369A (en) * 1996-03-14 1998-03-03 Lsi Logic Corporation Method of flip chip assembly
DE29621544U1 (de) * 1996-12-12 1998-04-09 Westermann Kg Schienengeführte Einbau-Schublade
US5757073A (en) * 1996-12-13 1998-05-26 International Business Machines Corporation Heatsink and package structure for wirebond chip rework and replacement

Also Published As

Publication number Publication date
US5953210A (en) 1999-09-14
JPH1174430A (ja) 1999-03-16
DE69802146D1 (de) 2001-11-29
EP0891125A1 (de) 1999-01-13
JP2902397B2 (ja) 1999-06-07
EP0891125B1 (de) 2001-10-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee