DE69735361D1 - Harzverkapselte halbleiteranordnung und herstellungsverfahren dafür - Google Patents

Harzverkapselte halbleiteranordnung und herstellungsverfahren dafür

Info

Publication number
DE69735361D1
DE69735361D1 DE69735361T DE69735361T DE69735361D1 DE 69735361 D1 DE69735361 D1 DE 69735361D1 DE 69735361 T DE69735361 T DE 69735361T DE 69735361 T DE69735361 T DE 69735361T DE 69735361 D1 DE69735361 D1 DE 69735361D1
Authority
DE
Germany
Prior art keywords
resin
conductor arrangement
production therefor
encapsulated semi
encapsulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69735361T
Other languages
English (en)
Other versions
DE69735361T2 (de
Inventor
Tetsuya Otsuki
Kenzo Yoshimori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Application granted granted Critical
Publication of DE69735361D1 publication Critical patent/DE69735361D1/de
Publication of DE69735361T2 publication Critical patent/DE69735361T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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DE69735361T 1996-07-03 1997-06-27 Harzverkapselte halbleiteranordnung und herstellungsverfahren dafür Expired - Lifetime DE69735361T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP19278096 1996-07-03
JP19278096 1996-07-03
PCT/JP1997/002234 WO1998001907A1 (en) 1996-07-03 1997-06-27 Resin-encapsulated semiconductor device and method of manufacturing the same

Publications (2)

Publication Number Publication Date
DE69735361D1 true DE69735361D1 (de) 2006-04-27
DE69735361T2 DE69735361T2 (de) 2006-10-19

Family

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Application Number Title Priority Date Filing Date
DE69735361T Expired - Lifetime DE69735361T2 (de) 1996-07-03 1997-06-27 Harzverkapselte halbleiteranordnung und herstellungsverfahren dafür

Country Status (8)

Country Link
US (1) US6133623A (de)
EP (1) EP0848423B1 (de)
JP (1) JP3944913B2 (de)
KR (1) KR19990044365A (de)
CN (1) CN1132244C (de)
DE (1) DE69735361T2 (de)
TW (1) TW379850U (de)
WO (1) WO1998001907A1 (de)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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DE69735361T2 (de) 2006-10-19
EP0848423A1 (de) 1998-06-17
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CN1197546A (zh) 1998-10-28
JP3944913B2 (ja) 2007-07-18
WO1998001907A1 (en) 1998-01-15
EP0848423A4 (de) 1999-08-25
US6133623A (en) 2000-10-17
EP0848423B1 (de) 2006-03-01

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