DE69732521D1 - Ultraschallverwendung zum mischen von behandlungszusammensetzungen für durchgehenden löcher - Google Patents
Ultraschallverwendung zum mischen von behandlungszusammensetzungen für durchgehenden löcherInfo
- Publication number
- DE69732521D1 DE69732521D1 DE69732521T DE69732521T DE69732521D1 DE 69732521 D1 DE69732521 D1 DE 69732521D1 DE 69732521 T DE69732521 T DE 69732521T DE 69732521 T DE69732521 T DE 69732521T DE 69732521 D1 DE69732521 D1 DE 69732521D1
- Authority
- DE
- Germany
- Prior art keywords
- treatment compositions
- mixing treatment
- continuous holes
- ultrasonic use
- ultrasonic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US59323296A | 1996-01-29 | 1996-01-29 | |
US593232 | 1996-01-29 | ||
PCT/US1997/001498 WO1997027142A1 (en) | 1996-01-29 | 1997-01-29 | Ultrasonic mixing of through hole treating compositions |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69732521D1 true DE69732521D1 (de) | 2005-03-24 |
DE69732521T2 DE69732521T2 (de) | 2006-01-12 |
Family
ID=24373944
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69732521T Expired - Lifetime DE69732521T2 (de) | 1996-01-29 | 1997-01-29 | Ultraschallverwendung zum mischen von behandlungszusammensetzungen für durchgehenden löcher |
Country Status (5)
Country | Link |
---|---|
US (1) | US6037020A (de) |
EP (1) | EP0877713B1 (de) |
KR (1) | KR100505173B1 (de) |
DE (1) | DE69732521T2 (de) |
WO (1) | WO1997027142A1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19827529A1 (de) * | 1998-06-22 | 1999-12-23 | Schmid Gmbh & Co Geb | Einrichtung zur Behandlung von Gegenständen, insbesondere Leiterplatten |
JP4245713B2 (ja) * | 1998-12-21 | 2009-04-02 | 東京エレクトロン株式会社 | めっき装置、めっきシステム及びこれを用いためっき処理方法 |
US6440331B1 (en) * | 1999-06-03 | 2002-08-27 | Electrochemicals Inc. | Aqueous carbon composition and method for coating a non conductive substrate |
US6623787B2 (en) * | 2001-07-26 | 2003-09-23 | Electrochemicals Inc. | Method to improve the stability of dispersions of carbon |
DE102008007570A1 (de) * | 2007-11-07 | 2009-05-20 | Stangl Semiconductor Equipment Ag | Vorrichtung und Verfahren zur Beschichtung einer Oberfläche |
US20100034965A1 (en) * | 2008-08-06 | 2010-02-11 | Retallick Richard C | Direct Metallization Process |
US20110123728A1 (en) * | 2009-11-25 | 2011-05-26 | Ricoh Company, Ltd. | Thin film manufacturing method and thin film element |
US8506709B2 (en) | 2010-04-02 | 2013-08-13 | Advenira Enterprises, Inc. | Roll coater having a recirculation loop for treating excess fluid |
TWI531419B (zh) | 2011-05-26 | 2016-05-01 | 艾德維尼拉企業公司 | 塗佈裝置 |
DE102011081327A1 (de) * | 2011-08-22 | 2013-02-28 | Gebr. Schmid Gmbh | Vorrichtung zur Oberflächenbehandlung von Substraten |
CN104105362A (zh) * | 2014-07-08 | 2014-10-15 | 深圳华麟电路技术有限公司 | 黑孔水平生产线工艺流程及黑孔槽结构 |
US10986738B2 (en) * | 2018-05-08 | 2021-04-20 | Macdermid Enthone Inc. | Carbon-based direct plating process |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1073197B (de) * | 1955-06-28 | 1960-01-14 | ||
US3194681A (en) * | 1960-12-22 | 1965-07-13 | Ncr Co | Process for plating through holes in a dielectric material |
US3351539A (en) * | 1965-04-06 | 1967-11-07 | Branson Instr | Sonic agitating method and apparatus |
US3807704A (en) * | 1972-11-13 | 1974-04-30 | Phillips Petroleum Co | Dispersing and mixing apparatus |
SU1014158A1 (ru) * | 1981-07-16 | 1983-04-23 | Институт электроники АН БССР | Способ изготовлени печатных плат |
US4552781A (en) * | 1984-04-09 | 1985-11-12 | Westinghouse Electric Corp. | Method utilizing ultrasonically induced cavitation to impregnate porous sheet passing through a resin bath |
JPS6113688A (ja) * | 1984-06-28 | 1986-01-21 | 福田金属箔粉工業株式会社 | 印刷回路用銅箔およびその製造方法 |
US4619741A (en) * | 1985-04-11 | 1986-10-28 | Olin Hunt Specialty Products Inc. | Process for preparing a non-conductive substrate for electroplating |
DE3741459C1 (de) * | 1987-12-08 | 1989-04-13 | Blasberg Oberflaechentech | Verfahren zur Herstellung durchkontaktierter Leiterplatten |
ATE87790T1 (de) * | 1988-02-25 | 1993-04-15 | Schmid Gmbh & Co Geb | Vorrichtung zur behandlung von elektrischen leiterplatten. |
JPH064482B2 (ja) * | 1988-06-08 | 1994-01-19 | 三井鉱山株式会社 | 葉片状黒鉛粉末及びその製造方法 |
JPH02149694A (ja) * | 1988-11-30 | 1990-06-08 | Kobe Steel Ltd | めっき方法 |
JPH06506984A (ja) * | 1991-04-22 | 1994-08-04 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 炭素粒子で不導体を選択的にコーティングする方法及び当該方法での銅含有溶液の使用法 |
US5139642A (en) * | 1991-05-01 | 1992-08-18 | Olin Corporation | Process for preparing a nonconductive substrate for electroplating |
JPH06212441A (ja) * | 1993-01-20 | 1994-08-02 | Hitachi Cable Ltd | 無電解メッキ方法及び無電解メッキ装置 |
US5389270A (en) * | 1993-05-17 | 1995-02-14 | Electrochemicals, Inc. | Composition and process for preparing a non-conductive substrate for electroplating |
US5476580A (en) * | 1993-05-17 | 1995-12-19 | Electrochemicals Inc. | Processes for preparing a non-conductive substrate for electroplating |
-
1997
- 1997-01-29 DE DE69732521T patent/DE69732521T2/de not_active Expired - Lifetime
- 1997-01-29 WO PCT/US1997/001498 patent/WO1997027142A1/en active IP Right Grant
- 1997-01-29 EP EP97904098A patent/EP0877713B1/de not_active Expired - Lifetime
- 1997-01-29 KR KR10-1998-0705814A patent/KR100505173B1/ko not_active IP Right Cessation
- 1997-01-29 US US08/790,294 patent/US6037020A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0877713A4 (de) | 2000-07-12 |
EP0877713A1 (de) | 1998-11-18 |
WO1997027142A1 (en) | 1997-07-31 |
DE69732521T2 (de) | 2006-01-12 |
US6037020A (en) | 2000-03-14 |
KR100505173B1 (ko) | 2005-10-24 |
KR19990082092A (ko) | 1999-11-15 |
EP0877713B1 (de) | 2005-02-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: OMG ELECTRONIC CHEMICALS, INC. (N. D. GES. D. , US |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: OMG ELECTRONIC CHEMICALS, LLC (N. D. GES.D. ST, US |