DE69732521D1 - Ultraschallverwendung zum mischen von behandlungszusammensetzungen für durchgehenden löcher - Google Patents

Ultraschallverwendung zum mischen von behandlungszusammensetzungen für durchgehenden löcher

Info

Publication number
DE69732521D1
DE69732521D1 DE69732521T DE69732521T DE69732521D1 DE 69732521 D1 DE69732521 D1 DE 69732521D1 DE 69732521 T DE69732521 T DE 69732521T DE 69732521 T DE69732521 T DE 69732521T DE 69732521 D1 DE69732521 D1 DE 69732521D1
Authority
DE
Germany
Prior art keywords
treatment compositions
mixing treatment
continuous holes
ultrasonic use
ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69732521T
Other languages
English (en)
Other versions
DE69732521T2 (de
Inventor
Dean Garlough
Todd Carroll
Val Carano
Frank Polakovic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
Electrochemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrochemicals Inc filed Critical Electrochemicals Inc
Application granted granted Critical
Publication of DE69732521D1 publication Critical patent/DE69732521D1/de
Publication of DE69732521T2 publication Critical patent/DE69732521T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00Carbon; Compounds thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0085Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/423Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
DE69732521T 1996-01-29 1997-01-29 Ultraschallverwendung zum mischen von behandlungszusammensetzungen für durchgehenden löcher Expired - Lifetime DE69732521T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US59323296A 1996-01-29 1996-01-29
US593232 1996-01-29
PCT/US1997/001498 WO1997027142A1 (en) 1996-01-29 1997-01-29 Ultrasonic mixing of through hole treating compositions

Publications (2)

Publication Number Publication Date
DE69732521D1 true DE69732521D1 (de) 2005-03-24
DE69732521T2 DE69732521T2 (de) 2006-01-12

Family

ID=24373944

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69732521T Expired - Lifetime DE69732521T2 (de) 1996-01-29 1997-01-29 Ultraschallverwendung zum mischen von behandlungszusammensetzungen für durchgehenden löcher

Country Status (5)

Country Link
US (1) US6037020A (de)
EP (1) EP0877713B1 (de)
KR (1) KR100505173B1 (de)
DE (1) DE69732521T2 (de)
WO (1) WO1997027142A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19827529A1 (de) * 1998-06-22 1999-12-23 Schmid Gmbh & Co Geb Einrichtung zur Behandlung von Gegenständen, insbesondere Leiterplatten
JP4245713B2 (ja) * 1998-12-21 2009-04-02 東京エレクトロン株式会社 めっき装置、めっきシステム及びこれを用いためっき処理方法
US6440331B1 (en) * 1999-06-03 2002-08-27 Electrochemicals Inc. Aqueous carbon composition and method for coating a non conductive substrate
US6623787B2 (en) * 2001-07-26 2003-09-23 Electrochemicals Inc. Method to improve the stability of dispersions of carbon
DE102008007570A1 (de) * 2007-11-07 2009-05-20 Stangl Semiconductor Equipment Ag Vorrichtung und Verfahren zur Beschichtung einer Oberfläche
US20100034965A1 (en) * 2008-08-06 2010-02-11 Retallick Richard C Direct Metallization Process
US20110123728A1 (en) * 2009-11-25 2011-05-26 Ricoh Company, Ltd. Thin film manufacturing method and thin film element
US8506709B2 (en) 2010-04-02 2013-08-13 Advenira Enterprises, Inc. Roll coater having a recirculation loop for treating excess fluid
TWI531419B (zh) 2011-05-26 2016-05-01 艾德維尼拉企業公司 塗佈裝置
DE102011081327A1 (de) * 2011-08-22 2013-02-28 Gebr. Schmid Gmbh Vorrichtung zur Oberflächenbehandlung von Substraten
CN104105362A (zh) * 2014-07-08 2014-10-15 深圳华麟电路技术有限公司 黑孔水平生产线工艺流程及黑孔槽结构
US10986738B2 (en) * 2018-05-08 2021-04-20 Macdermid Enthone Inc. Carbon-based direct plating process

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1073197B (de) * 1955-06-28 1960-01-14
US3194681A (en) * 1960-12-22 1965-07-13 Ncr Co Process for plating through holes in a dielectric material
US3351539A (en) * 1965-04-06 1967-11-07 Branson Instr Sonic agitating method and apparatus
US3807704A (en) * 1972-11-13 1974-04-30 Phillips Petroleum Co Dispersing and mixing apparatus
SU1014158A1 (ru) * 1981-07-16 1983-04-23 Институт электроники АН БССР Способ изготовлени печатных плат
US4552781A (en) * 1984-04-09 1985-11-12 Westinghouse Electric Corp. Method utilizing ultrasonically induced cavitation to impregnate porous sheet passing through a resin bath
JPS6113688A (ja) * 1984-06-28 1986-01-21 福田金属箔粉工業株式会社 印刷回路用銅箔およびその製造方法
US4619741A (en) * 1985-04-11 1986-10-28 Olin Hunt Specialty Products Inc. Process for preparing a non-conductive substrate for electroplating
DE3741459C1 (de) * 1987-12-08 1989-04-13 Blasberg Oberflaechentech Verfahren zur Herstellung durchkontaktierter Leiterplatten
ATE87790T1 (de) * 1988-02-25 1993-04-15 Schmid Gmbh & Co Geb Vorrichtung zur behandlung von elektrischen leiterplatten.
JPH064482B2 (ja) * 1988-06-08 1994-01-19 三井鉱山株式会社 葉片状黒鉛粉末及びその製造方法
JPH02149694A (ja) * 1988-11-30 1990-06-08 Kobe Steel Ltd めっき方法
JPH06506984A (ja) * 1991-04-22 1994-08-04 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 炭素粒子で不導体を選択的にコーティングする方法及び当該方法での銅含有溶液の使用法
US5139642A (en) * 1991-05-01 1992-08-18 Olin Corporation Process for preparing a nonconductive substrate for electroplating
JPH06212441A (ja) * 1993-01-20 1994-08-02 Hitachi Cable Ltd 無電解メッキ方法及び無電解メッキ装置
US5389270A (en) * 1993-05-17 1995-02-14 Electrochemicals, Inc. Composition and process for preparing a non-conductive substrate for electroplating
US5476580A (en) * 1993-05-17 1995-12-19 Electrochemicals Inc. Processes for preparing a non-conductive substrate for electroplating

Also Published As

Publication number Publication date
EP0877713A4 (de) 2000-07-12
EP0877713A1 (de) 1998-11-18
WO1997027142A1 (en) 1997-07-31
DE69732521T2 (de) 2006-01-12
US6037020A (en) 2000-03-14
KR100505173B1 (ko) 2005-10-24
KR19990082092A (ko) 1999-11-15
EP0877713B1 (de) 2005-02-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: OMG ELECTRONIC CHEMICALS, INC. (N. D. GES. D. , US

8327 Change in the person/name/address of the patent owner

Owner name: OMG ELECTRONIC CHEMICALS, LLC (N. D. GES.D. ST, US