DE69716637T2 - Thermisch wiederaufbereitbare bindemittel für flip chips - Google Patents
Thermisch wiederaufbereitbare bindemittel für flip chipsInfo
- Publication number
- DE69716637T2 DE69716637T2 DE69716637T DE69716637T DE69716637T2 DE 69716637 T2 DE69716637 T2 DE 69716637T2 DE 69716637 T DE69716637 T DE 69716637T DE 69716637 T DE69716637 T DE 69716637T DE 69716637 T2 DE69716637 T2 DE 69716637T2
- Authority
- DE
- Germany
- Prior art keywords
- reprocessable
- binders
- thermal
- flip chips
- flip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011230 binding agent Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L73/00—Compositions of macromolecular compounds obtained by reactions forming a linkage containing oxygen or oxygen and carbon in the main chain, not provided for in groups C08L59/00 - C08L71/00; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G67/00—Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing oxygen or oxygen and carbon, not provided for in groups C08G2/00 - C08G65/00
- C08G67/02—Copolymers of carbon monoxide and aliphatic unsaturated compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/767,058 US5760337A (en) | 1996-12-16 | 1996-12-16 | Thermally reworkable binders for flip-chip devices |
PCT/EP1997/007156 WO1998027160A1 (en) | 1996-12-16 | 1997-12-15 | Thermally reworkable binders for flip-chip devices |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69716637D1 DE69716637D1 (de) | 2002-11-28 |
DE69716637T2 true DE69716637T2 (de) | 2003-03-13 |
Family
ID=25078357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69716637T Expired - Fee Related DE69716637T2 (de) | 1996-12-16 | 1997-12-15 | Thermisch wiederaufbereitbare bindemittel für flip chips |
Country Status (16)
Country | Link |
---|---|
US (1) | US5760337A (de) |
EP (1) | EP0944671B1 (de) |
JP (1) | JP2001506805A (de) |
KR (1) | KR20000069484A (de) |
CN (1) | CN1122083C (de) |
AU (1) | AU716191B2 (de) |
BR (1) | BR9713713A (de) |
CA (1) | CA2275366A1 (de) |
DE (1) | DE69716637T2 (de) |
HU (1) | HUP0000811A3 (de) |
ID (1) | ID21657A (de) |
IL (1) | IL130144A0 (de) |
MY (1) | MY118367A (de) |
TW (1) | TW513479B (de) |
WO (1) | WO1998027160A1 (de) |
ZA (1) | ZA9711196B (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004031920B4 (de) * | 2003-06-27 | 2005-11-17 | Samsung Electronics Co., Ltd., Suwon | Mehrchippackung und Herstellungsverfahren |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
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US7645899B1 (en) | 1994-09-02 | 2010-01-12 | Henkel Corporation | Vinyl compounds |
US5912282A (en) * | 1996-12-16 | 1999-06-15 | Shell Oil Company | Die attach adhesive compositions |
US6316528B1 (en) | 1997-01-17 | 2001-11-13 | Loctite (R&D) Limited | Thermosetting resin compositions |
US6274389B1 (en) | 1997-01-17 | 2001-08-14 | Loctite (R&D) Ltd. | Mounting structure and mounting process from semiconductor devices |
WO1999035187A1 (en) | 1998-01-07 | 1999-07-15 | Georgia Tech Research Corporation | Reworkable epoxy underfill encapsulants |
SG105450A1 (en) | 1998-07-02 | 2004-08-27 | Nat Starch Chem Invest | Allylated amide compounds and die attach adhesives prepared therefrom |
US6350840B1 (en) | 1998-07-02 | 2002-02-26 | National Starch And Chemical Investment Holding Corporation | Underfill encapsulants prepared from allylated amide compounds |
US6316566B1 (en) | 1998-07-02 | 2001-11-13 | National Starch And Chemical Investment Holding Corporation | Package encapsulant compositions for use in electronic devices |
US6057381A (en) * | 1998-07-02 | 2000-05-02 | National Starch And Chemical Investment Holding Corporation | Method of making an electronic component using reworkable underfill encapsulants |
US6281314B1 (en) | 1998-07-02 | 2001-08-28 | National Starch And Chemical Investment Holding Corporation | Compositions for use in the fabrication of circuit components and printed wire boards |
US6063828A (en) * | 1998-07-02 | 2000-05-16 | National Starch And Chemical Investment Holding Corporation | Underfill encapsulant compositions for use in electronic devices |
US6329832B1 (en) * | 1998-10-05 | 2001-12-11 | Micron Technology, Inc. | Method for in-line testing of flip-chip semiconductor assemblies |
US6543131B1 (en) * | 1999-03-10 | 2003-04-08 | Tessera, Inc. | Microelectronic joining processes with temporary securement |
US20040155364A1 (en) * | 1999-06-17 | 2004-08-12 | Takahisa Doba | Reworkable thermosetting resin compositions |
US7332218B1 (en) * | 1999-07-14 | 2008-02-19 | Eic Laboratories, Inc. | Electrically disbonding materials |
US20080196828A1 (en) * | 1999-07-14 | 2008-08-21 | Gilbert Michael D | Electrically Disbonding Adhesive Compositions and Related Methods |
US6403753B1 (en) | 2000-01-18 | 2002-06-11 | Sandia Corporation | Method of making thermally removable polyurethanes |
US6271335B1 (en) | 2000-01-18 | 2001-08-07 | Sandia Corporation | Method of making thermally removable polymeric encapsulants |
US6337384B1 (en) | 2000-01-18 | 2002-01-08 | Sandia Corporation | Method of making thermally removable epoxies |
US6255500B1 (en) | 2000-01-21 | 2001-07-03 | Loctite Corporation | Process for the epoxidation of diene esters |
US20050288458A1 (en) * | 2002-07-29 | 2005-12-29 | Klemarczyk Philip T | Reworkable thermosetting resin composition |
US7012120B2 (en) | 2000-03-31 | 2006-03-14 | Henkel Corporation | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent |
US6680436B2 (en) | 2000-07-12 | 2004-01-20 | Seagate Technology Llc | Reflow encapsulant |
US6657031B1 (en) | 2000-08-02 | 2003-12-02 | Loctite Corporation | Reworkable thermosetting resin compositions |
US6627683B1 (en) | 2000-09-05 | 2003-09-30 | Henkel Loctite Corporation | Reworkable thermosetting resin compositions and compounds useful therein |
US7108920B1 (en) | 2000-09-15 | 2006-09-19 | Henkel Corporation | Reworkable compositions incorporating episulfide resins |
JP2004523893A (ja) * | 2000-11-14 | 2004-08-05 | ヘンケル ロックタイト コーポレイション | ウェーハ塗布用融剤兼アンダーフィル材、ならびにそれを用いて製造された積層電子組立体 |
US6562663B2 (en) * | 2001-03-28 | 2003-05-13 | Motorola, Inc. | Microelectronic assembly with die support and method |
US6574861B1 (en) | 2001-04-11 | 2003-06-10 | Applied Micro Circuits Corporation | System and method for solder ball rework |
US20030019576A1 (en) * | 2001-06-27 | 2003-01-30 | Loctite Corporation | Electronic component removal method through application of infrared radiation |
US6572980B1 (en) | 2001-08-13 | 2003-06-03 | Henkel Loctite Corporation | Reworkable thermosetting resin compositions |
JP3723483B2 (ja) * | 2001-10-16 | 2005-12-07 | 日本電気株式会社 | 電子部品装置 |
US6887737B1 (en) | 2001-12-13 | 2005-05-03 | Henkel Corporation | Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom |
US6933361B2 (en) * | 2002-07-12 | 2005-08-23 | The Regents Of The University Of California | Thermally re-mendable cross-linked polymers |
JP3971995B2 (ja) * | 2002-12-25 | 2007-09-05 | 日本電気株式会社 | 電子部品装置 |
US6768209B1 (en) * | 2003-02-03 | 2004-07-27 | Micron Technology, Inc. | Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices |
JP2004307859A (ja) * | 2003-04-05 | 2004-11-04 | Rohm & Haas Electronic Materials Llc | 電子デバイス製造 |
US20070269659A1 (en) * | 2006-05-17 | 2007-11-22 | Eic Laboratories, Inc. | Electrically disbondable compositions and related methods |
US20070290378A1 (en) * | 2006-06-20 | 2007-12-20 | International Business Machines Corporation | Novel reworkable underfills for ceramic mcm c4 protection |
US20120018498A1 (en) * | 2010-07-20 | 2012-01-26 | Mediatek (Shenzhen) Inc. | Pre-solder method and rework method for multi-row qfn chip |
US8917510B2 (en) * | 2011-01-14 | 2014-12-23 | International Business Machines Corporation | Reversibly adhesive thermal interface material |
US8511369B2 (en) | 2011-04-18 | 2013-08-20 | International Business Machines Corporation | Thermally reversible crosslinked polymer modified particles and methods for making the same |
MX352032B (es) * | 2012-02-17 | 2017-11-07 | Valspar Sourcing Inc | Metodos y materiales para la funcionalizacion de polimeros y revestimientos que incluyen polimero funcionalizado. |
US9085719B2 (en) | 2013-03-18 | 2015-07-21 | International Business Machines Corporation | Thermally reversible thermal interface materials with improved moisture resistance |
JP6596412B2 (ja) | 2013-03-22 | 2019-10-23 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | ジエン/ジエノフィル対および補修性を有する熱硬化性樹脂組成物 |
US9193139B2 (en) * | 2013-05-30 | 2015-11-24 | Xerox Corporation | Reversible polymer adhesive composition |
US9545011B2 (en) | 2015-05-13 | 2017-01-10 | International Business Machines Corporation | Dry film solder mask composite laminate materials |
WO2017027525A1 (en) * | 2015-08-11 | 2017-02-16 | The Arizona Board Of Regents On Behalf Of The University Of Arizona | Method of forming of a robust network of epoxy material through diels-alder reaction |
US10723921B2 (en) | 2016-01-29 | 2020-07-28 | Arizona Board Of Regents On Behalf Of The University Of Arizona | Coumarin-modified epoxy adhesives |
KR101757584B1 (ko) | 2016-03-16 | 2017-07-12 | 전자부품연구원 | 재제조성 방열필름용 조성물 및 그의 제조방법 |
EP4220707A1 (de) * | 2022-01-31 | 2023-08-02 | Vrije Universiteit Brussel | Leitfähige selbstheilende kompositmaterialien |
Family Cites Families (12)
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US3979373A (en) * | 1975-06-13 | 1976-09-07 | Shell Oil Company | Polymeric furan derivative |
US4826932A (en) * | 1987-12-29 | 1989-05-02 | Shell Oil Company | Dioxolane containing polymer |
EP0340492A3 (de) * | 1988-05-02 | 1990-07-04 | International Business Machines Corporation | Konforme Versieglung und interplanare Verkapselung elektronischer Anordnungsstrukturen |
US5001542A (en) * | 1988-12-05 | 1991-03-19 | Hitachi Chemical Company | Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips |
JPH03247620A (ja) * | 1990-02-26 | 1991-11-05 | Sumitomo Chem Co Ltd | 熱硬化性樹脂組成物およびそれを用いた電子部品 |
US5121190A (en) * | 1990-03-14 | 1992-06-09 | International Business Machines Corp. | Solder interconnection structure on organic substrates |
US5120678A (en) * | 1990-11-05 | 1992-06-09 | Motorola Inc. | Electrical component package comprising polymer-reinforced solder bump interconnection |
US5274913A (en) * | 1991-10-25 | 1994-01-04 | International Business Machines Corporation | Method of fabricating a reworkable module |
US5233046A (en) * | 1991-11-04 | 1993-08-03 | Hay Allan S | Diarylacetylenes, enamines and acetylenic polymers and their production |
US5390082A (en) * | 1992-07-06 | 1995-02-14 | International Business Machines, Corp. | Chip carrier with protective coating for circuitized surface |
TW338044B (en) * | 1994-11-15 | 1998-08-11 | Shell Internattonale Res Mij B V | A cross linked resin |
US5659203A (en) * | 1995-06-07 | 1997-08-19 | International Business Machines Corporation | Reworkable polymer chip encapsulant |
-
1996
- 1996-12-16 US US08/767,058 patent/US5760337A/en not_active Expired - Fee Related
-
1997
- 1997-12-12 MY MYPI97006003A patent/MY118367A/en unknown
- 1997-12-12 ZA ZA9711196A patent/ZA9711196B/xx unknown
- 1997-12-15 WO PCT/EP1997/007156 patent/WO1998027160A1/en active IP Right Grant
- 1997-12-15 IL IL13014497A patent/IL130144A0/xx unknown
- 1997-12-15 JP JP52734498A patent/JP2001506805A/ja not_active Withdrawn
- 1997-12-15 ID IDW990524A patent/ID21657A/id unknown
- 1997-12-15 EP EP97953868A patent/EP0944671B1/de not_active Expired - Lifetime
- 1997-12-15 BR BR9713713-8A patent/BR9713713A/pt not_active Application Discontinuation
- 1997-12-15 KR KR1019997005333A patent/KR20000069484A/ko active IP Right Grant
- 1997-12-15 HU HU0000811A patent/HUP0000811A3/hu unknown
- 1997-12-15 AU AU57612/98A patent/AU716191B2/en not_active Ceased
- 1997-12-15 CA CA002275366A patent/CA2275366A1/en not_active Abandoned
- 1997-12-15 CN CN97180682A patent/CN1122083C/zh not_active Expired - Fee Related
- 1997-12-15 DE DE69716637T patent/DE69716637T2/de not_active Expired - Fee Related
- 1997-12-24 TW TW086119720A patent/TW513479B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004031920B4 (de) * | 2003-06-27 | 2005-11-17 | Samsung Electronics Co., Ltd., Suwon | Mehrchippackung und Herstellungsverfahren |
Also Published As
Publication number | Publication date |
---|---|
CA2275366A1 (en) | 1998-06-25 |
EP0944671B1 (de) | 2002-10-23 |
US5760337A (en) | 1998-06-02 |
CN1240465A (zh) | 2000-01-05 |
JP2001506805A (ja) | 2001-05-22 |
TW513479B (en) | 2002-12-11 |
AU5761298A (en) | 1998-07-15 |
IL130144A0 (en) | 2000-06-01 |
AU716191B2 (en) | 2000-02-24 |
EP0944671A1 (de) | 1999-09-29 |
ID21657A (id) | 1999-07-08 |
HUP0000811A3 (en) | 2001-05-28 |
HUP0000811A2 (en) | 2000-07-28 |
ZA9711196B (en) | 1998-06-23 |
MY118367A (en) | 2004-10-30 |
WO1998027160A1 (en) | 1998-06-25 |
KR20000069484A (ko) | 2000-11-25 |
BR9713713A (pt) | 2000-02-08 |
DE69716637D1 (de) | 2002-11-28 |
CN1122083C (zh) | 2003-09-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8339 | Ceased/non-payment of the annual fee |