DE69716498D1 - Packung für Mikrowellenschaltung - Google Patents

Packung für Mikrowellenschaltung

Info

Publication number
DE69716498D1
DE69716498D1 DE69716498T DE69716498T DE69716498D1 DE 69716498 D1 DE69716498 D1 DE 69716498D1 DE 69716498 T DE69716498 T DE 69716498T DE 69716498 T DE69716498 T DE 69716498T DE 69716498 D1 DE69716498 D1 DE 69716498D1
Authority
DE
Germany
Prior art keywords
pack
microwave switching
microwave
switching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69716498T
Other languages
English (en)
Other versions
DE69716498T2 (de
Inventor
Hiroshi Uematsu
Hiroshi Kudoh
Masanobu Urabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honda Motor Co Ltd
Original Assignee
Honda Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Motor Co Ltd filed Critical Honda Motor Co Ltd
Application granted granted Critical
Publication of DE69716498D1 publication Critical patent/DE69716498D1/de
Publication of DE69716498T2 publication Critical patent/DE69716498T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
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    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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DE69716498T 1996-03-27 1997-03-18 Packung für Mikrowellenschaltung Expired - Fee Related DE69716498T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7296896 1996-03-27
JP10961796A JP3638173B2 (ja) 1996-03-27 1996-04-30 マイクロ波回路用パッケージ

Publications (2)

Publication Number Publication Date
DE69716498D1 true DE69716498D1 (de) 2002-11-28
DE69716498T2 DE69716498T2 (de) 2003-02-27

Family

ID=26414104

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69716498T Expired - Fee Related DE69716498T2 (de) 1996-03-27 1997-03-18 Packung für Mikrowellenschaltung

Country Status (4)

Country Link
US (1) US5847453A (de)
EP (1) EP0798782B1 (de)
JP (1) JP3638173B2 (de)
DE (1) DE69716498T2 (de)

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US6064286A (en) * 1998-07-31 2000-05-16 The Whitaker Corporation Millimeter wave module with an interconnect from an interior cavity
WO2000042636A2 (en) * 1999-01-12 2000-07-20 Teledyne Technologies Incorporated Micromachined device and method of forming the micromachined device
US6507110B1 (en) 2000-03-08 2003-01-14 Teledyne Technologies Incorporated Microwave device and method for making same
US7334326B1 (en) 2001-06-19 2008-02-26 Amkor Technology, Inc. Method for making an integrated circuit substrate having embedded passive components
US6930256B1 (en) 2002-05-01 2005-08-16 Amkor Technology, Inc. Integrated circuit substrate having laser-embedded conductive patterns and method therefor
US6770822B2 (en) * 2002-02-22 2004-08-03 Bridgewave Communications, Inc. High frequency device packages and methods
US6831371B1 (en) * 2002-03-16 2004-12-14 Amkor Technology, Inc. Integrated circuit substrate having embedded wire conductors and method therefor
US9691635B1 (en) 2002-05-01 2017-06-27 Amkor Technology, Inc. Buildup dielectric layer having metallization pattern semiconductor package fabrication method
US7399661B2 (en) 2002-05-01 2008-07-15 Amkor Technology, Inc. Method for making an integrated circuit substrate having embedded back-side access conductors and vias
US6930257B1 (en) 2002-05-01 2005-08-16 Amkor Technology, Inc. Integrated circuit substrate having laminated laser-embedded circuit layers
US7028400B1 (en) 2002-05-01 2006-04-18 Amkor Technology, Inc. Integrated circuit substrate having laser-exposed terminals
US7548430B1 (en) 2002-05-01 2009-06-16 Amkor Technology, Inc. Buildup dielectric and metallization process and semiconductor package
US7633765B1 (en) 2004-03-23 2009-12-15 Amkor Technology, Inc. Semiconductor package including a top-surface metal layer for implementing circuit features
US7670962B2 (en) 2002-05-01 2010-03-02 Amkor Technology, Inc. Substrate having stiffener fabrication method
US6933603B2 (en) * 2002-07-11 2005-08-23 Teledyne Technologies Incorporated Multi-substrate layer semiconductor packages and method for making same
DE10317018A1 (de) * 2003-04-11 2004-11-18 Infineon Technologies Ag Multichipmodul mit mehreren Halbleiterchips sowie Leiterplatte mit mehreren Komponenten
US11081370B2 (en) 2004-03-23 2021-08-03 Amkor Technology Singapore Holding Pte. Ltd. Methods of manufacturing an encapsulated semiconductor device
US10811277B2 (en) 2004-03-23 2020-10-20 Amkor Technology, Inc. Encapsulated semiconductor package
US7145238B1 (en) 2004-05-05 2006-12-05 Amkor Technology, Inc. Semiconductor package and substrate having multi-level vias
US8826531B1 (en) 2005-04-05 2014-09-09 Amkor Technology, Inc. Method for making an integrated circuit substrate having laminated laser-embedded circuit layers
US7141989B1 (en) * 2006-04-10 2006-11-28 Freescale Semiconductor, Inc. Methods and apparatus for a MEMS varactor
US7589398B1 (en) 2006-10-04 2009-09-15 Amkor Technology, Inc. Embedded metal features structure
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US5847453A (en) 1998-12-08
EP0798782A2 (de) 1997-10-01
EP0798782B1 (de) 2002-10-23
EP0798782A3 (de) 1999-07-28
DE69716498T2 (de) 2003-02-27
JP3638173B2 (ja) 2005-04-13
JPH09321215A (ja) 1997-12-12

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